KR950023691A - Adhesive composition for printed circuit board - Google Patents

Adhesive composition for printed circuit board Download PDF

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Publication number
KR950023691A
KR950023691A KR1019940000116A KR19940000116A KR950023691A KR 950023691 A KR950023691 A KR 950023691A KR 1019940000116 A KR1019940000116 A KR 1019940000116A KR 19940000116 A KR19940000116 A KR 19940000116A KR 950023691 A KR950023691 A KR 950023691A
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KR
South Korea
Prior art keywords
adhesive composition
resin
epoxy resin
weight
printed circuit
Prior art date
Application number
KR1019940000116A
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Korean (ko)
Other versions
KR970008724B1 (en
Inventor
남동기
임무송
Original Assignee
최종인
두산전자 주식회사
성우경
두산기술원연구조합
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Application filed by 최종인, 두산전자 주식회사, 성우경, 두산기술원연구조합 filed Critical 최종인
Priority to KR1019940000116A priority Critical patent/KR970008724B1/en
Publication of KR950023691A publication Critical patent/KR950023691A/en
Application granted granted Critical
Publication of KR970008724B1 publication Critical patent/KR970008724B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 인쇄회로 기판용 동박 적층판의 제조에 있어서 동박을 배선기판에 결합시키기 위하여 사용되는 접착제 조성물에 관한 것으로, 좀 더 상세하게는 폴리비닐 부티랄 수지 40-60중량%, 레졸형 페놀수지 15-40중량%, 에폭시수지 5-30중량% 및 노블락 에폭시 변성 페놀수지 5-30중량%로 이루어진 인쇄회로 기판용 접착제 조성물에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition used to bond copper foil to a wiring board in the manufacture of a copper foil laminate for printed circuit boards. More particularly, the polyvinyl butyral resin 40-60 wt% It relates to an adhesive composition for a printed circuit board composed of -40% by weight, 5-30% by weight epoxy resin and 5-30% by weight of a noblock epoxy-modified phenol resin.

Description

인쇄회로 기판용 접착제 조성물Adhesive composition for printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (9)

폴리비닐 부티랄 수지 40-60중량%, 레졸형 페놀수지 15-40중량%, 에폭시수지 5-30중량% 및 노블락 에폭시 변성 페놀수지 5-30중량%로 이루어짐을 특징으로 하는 인쇄회로 기판용 접착제 조성물.Adhesive for printed circuit boards comprising 40-60% by weight of polyvinyl butyral resin, 15-40% by weight of resol type phenolic resin, 5-30% by weight of epoxy resin and 5-30% by weight of noblock epoxy-modified phenolic resin Composition. 제1항에 있어서, 상기 폴리비닐 부티랄 수지가 부티랄화도 60-75mol%이고, 중합도 1500-2500임을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition of claim 1, wherein the polyvinyl butyral resin has a butyralization degree of 60-75 mol% and a polymerization degree of 1500-2500. 제1항에 있어서, 상기 레졸형 페놀수지의 페놀(P)과 포름알데히드(F)의 몰비가 F/P=1.3-1.8이고, 알카리 촉매하에서 합성됨을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition for a printed circuit board according to claim 1, wherein the molar ratio of phenol (P) and formaldehyde (F) of the resol type phenol resin is F / P = 1.3-1.8, and is synthesized under an alkali catalyst. 제3항에 있어서, 상기 레졸형 페놀수지의 중량 평균 분자량이 1000-3000이고, 150℃에서 겔화시간이 50-150초임을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition for a printed circuit board according to claim 3, wherein the resol type phenol resin has a weight average molecular weight of 1000-3000 and a gelation time of 50-150 seconds at 150 ° C. 제1항에 있어서, 상기 에폭시수지가 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 페놀 노블락형 에폭시수지, 크레졸 노블락형 에폭시수지 및 고무변성 에폭시수지로 구성된 군으로부터 하나 또는 그 이상 선택됨을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The method of claim 1, wherein the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, phenol noblock type epoxy resin, cresol noblock type epoxy resin and rubber-modified epoxy resin. Adhesive composition for printed circuit boards. 제1항에 있어서, 상기 노블락 에폭시 변성 페놀수지가 페놀(P), 파라포름알데히드(F) 및 노블락에폭시 수지로 구성됨을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition for a printed circuit board according to claim 1, wherein the noblock epoxy-modified phenol resin is composed of phenol (P), paraformaldehyde (F), and a noblock epoxy resin. 제6항에 있어서, 상기 P와 F의 몰비가 P/F=0.7-1.5이고, 상기 노블락 에폭시 수지가 페놀 100중량부에 대하여 20-50중량부로 구성됨을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition for a printed circuit board according to claim 6, wherein the molar ratio of P and F is P / F = 0.7-1.5, and the noblock epoxy resin is 20-50 parts by weight based on 100 parts by weight of phenol. 제6항에 있어서, 상기 노블락 에폭시 수지가 페놀 노블락 에폭시 수지 및/또는 크레졸 노블락 에폭시 수지임을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition of claim 6, wherein the noblock epoxy resin is a phenol noblock epoxy resin and / or a cresol noblock epoxy resin. 제6항에 있어서, 상기 노블락 에폭시 변성 페놀수지의 중량 평균 분자량이 1000-3000이고, 겔화 시간이 150℃에서 100-150초 임을 특징으로 하는 인쇄회로 기판용 접착제 조성물.The adhesive composition of claim 6, wherein the weight average molecular weight of the noblock epoxy-modified phenol resin is 1000-3000, and the gelation time is 100-150 seconds at 150 ° C. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940000116A 1994-01-05 1994-01-05 Adhesive composition KR970008724B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940000116A KR970008724B1 (en) 1994-01-05 1994-01-05 Adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940000116A KR970008724B1 (en) 1994-01-05 1994-01-05 Adhesive composition

Publications (2)

Publication Number Publication Date
KR950023691A true KR950023691A (en) 1995-08-18
KR970008724B1 KR970008724B1 (en) 1997-05-28

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ID=19375298

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940000116A KR970008724B1 (en) 1994-01-05 1994-01-05 Adhesive composition

Country Status (1)

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KR (1) KR970008724B1 (en)

Also Published As

Publication number Publication date
KR970008724B1 (en) 1997-05-28

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