KR950008647A - Adhesive composition for flexible printed circuit board - Google Patents

Adhesive composition for flexible printed circuit board Download PDF

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Publication number
KR950008647A
KR950008647A KR1019930018998A KR930018998A KR950008647A KR 950008647 A KR950008647 A KR 950008647A KR 1019930018998 A KR1019930018998 A KR 1019930018998A KR 930018998 A KR930018998 A KR 930018998A KR 950008647 A KR950008647 A KR 950008647A
Authority
KR
South Korea
Prior art keywords
weight
printed circuit
adhesive composition
flexible printed
circuit board
Prior art date
Application number
KR1019930018998A
Other languages
Korean (ko)
Inventor
임대우
김정락
조재은
장경호
Original Assignee
박홍기
제일합섬 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박홍기, 제일합섬 주식회사 filed Critical 박홍기
Priority to KR1019930018998A priority Critical patent/KR950008647A/en
Priority to JP6223515A priority patent/JP2625646B2/en
Publication of KR950008647A publication Critical patent/KR950008647A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • C09J133/20—Homopolymers or copolymers of acrylonitrile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

본 발명은 아크릴로니트릴 10∼45중량%, 탄소수 8이하인 알킬아크릴레이트 40∼70중량% 및 에폭시와 반응할 수 있는 관능기 1종이상을 갖은 올레핀 화합물 2∼15중량%로 중합된 아크릴공증합수지 100중량%(고형분기준)에 대하여 100∼300의 에폭시 당량을 갖는 다관능기의 에폭시수지 10∼30중량%와 200∼900의 에폭시 당량을 갖고 브롬의 함량이 30∼70중량%인 브롬화 에폭시수지 10∼90중량%를 혼합한 것을 특징으로 하는 유연성 인쇄회로기판용 접착제 조성물에 관한 것이다.The present invention is an acrylic copolymer resin polymerized with 10 to 45% by weight of acrylonitrile, 40 to 70% by weight of alkyl acrylate having 8 or less carbon atoms, and 2 to 15% by weight of an olefin compound having at least one functional group capable of reacting with epoxy. Brominated epoxy resin 10 having 30 to 70% by weight of epoxy resin of 10 to 30% by weight of polyfunctional group having epoxy equivalent of 100 to 300 to 100% by weight (based on solids) and epoxy equivalent of 200 to 900. The adhesive composition for flexible printed circuit boards which mixes -90 weight%.

Description

유연성 인쇄회로기판용 접착제 조성물Adhesive composition for flexible printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

아크릴공증합 수지 100중량%(고형분기준)에 대하여 다관능기의 에폭시 수지 10∼30중량%와 브롬화 에폭시수지 10∼90중량%를 혼합한 것을 특징으로 하는 인쇄회로기판용 접착제 조성물Adhesive composition for printed circuit boards, characterized in that 10 to 30% by weight of a polyfunctional epoxy resin and 10 to 90% by weight of brominated epoxy resin are mixed with respect to 100% by weight of acrylic co-polymerized resin (solid content basis). 제1항에 있어서, 아크릴공중합 수지는 아크릴로니트릴 10∼45중량%, 탄소수 8이하인 알킬아크릴레이트 40∼70중량% 및 에폭시와 반응할 수 있는 관능기 1종이상을 갖는 올레핀 화합물 2∼15중량% 중합된 것임을 특징으로 하는 유연성 인쇄회로기판용 접착제 조성물.According to claim 1, The acrylic copolymer resin is 10 to 45% by weight of acrylonitrile, 40 to 70% by weight of alkyl acrylate having 8 or less carbon atoms, and 2 to 15% by weight of olefin compound having at least one functional group capable of reacting with epoxy. Adhesive composition for a flexible printed circuit board, characterized in that the polymerized. 제1항에 있어서, 다관능 에폭시수지는 100∼300의 에폭시 당량을 갖고,브롬화 에폭시수지는 200∼900의 에폭시 당량을 가지며 브롬의 함량이 30∼70중량%인 것임을 특징으로 하는 유연성 인쇄회로기판용 접착제 조성물.The flexible printed circuit board of claim 1, wherein the polyfunctional epoxy resin has an epoxy equivalent of 100 to 300, the brominated epoxy resin has an epoxy equivalent of 200 to 900, and the bromine content is 30 to 70 wt%. Adhesive composition for. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930018998A 1993-09-20 1993-09-20 Adhesive composition for flexible printed circuit board KR950008647A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019930018998A KR950008647A (en) 1993-09-20 1993-09-20 Adhesive composition for flexible printed circuit board
JP6223515A JP2625646B2 (en) 1993-09-20 1994-09-19 Adhesive composition for flexible printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930018998A KR950008647A (en) 1993-09-20 1993-09-20 Adhesive composition for flexible printed circuit board

Publications (1)

Publication Number Publication Date
KR950008647A true KR950008647A (en) 1995-04-19

Family

ID=19363992

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930018998A KR950008647A (en) 1993-09-20 1993-09-20 Adhesive composition for flexible printed circuit board

Country Status (2)

Country Link
JP (1) JP2625646B2 (en)
KR (1) KR950008647A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290171A (en) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd Adhesive film for semiconductor and semiconductor device
JP4947905B2 (en) * 2005-02-04 2012-06-06 株式会社日本触媒 Resin composition for optical semiconductor encapsulation
JP4977343B2 (en) * 2005-08-05 2012-07-18 アキレス株式会社 Acrylic resin composition and sheet-like molded body using the same
DE102007016950A1 (en) * 2007-04-05 2008-10-09 Tesa Ag Thermally crosslinking polyacrylates and process for their preparation
US10294341B2 (en) 2016-01-13 2019-05-21 Lg Chem, Ltd. Thermosetting resin composition for semiconductor package and prepreg using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037791A (en) * 1988-09-09 1991-01-14 Mitsubishi Petrochem Co Ltd Adhesive composition for sticking foil
JPH03221578A (en) * 1990-01-26 1991-09-30 Sumitomo Electric Ind Ltd Adhesive composition for flexible printed wiring board

Also Published As

Publication number Publication date
JP2625646B2 (en) 1997-07-02
JPH07300577A (en) 1995-11-14

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application