KR950006911B1 - Adhesive composition for dicing tape - Google Patents
Adhesive composition for dicing tape Download PDFInfo
- Publication number
- KR950006911B1 KR950006911B1 KR1019940038837A KR19940038837A KR950006911B1 KR 950006911 B1 KR950006911 B1 KR 950006911B1 KR 1019940038837 A KR1019940038837 A KR 1019940038837A KR 19940038837 A KR19940038837 A KR 19940038837A KR 950006911 B1 KR950006911 B1 KR 950006911B1
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- dicing tape
- tape
- adhesive composition
- pressure
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Abstract
Description
제1도는 본 발명의 일실시예에 의한 다이싱테이프의 제조방법을 개략적으로 도시한 블록다이어 그램이다.1 is a block diagram schematically showing a method of manufacturing a dicing tape according to an embodiment of the present invention.
본 발명은 다이싱테이프용 점착제 조성물에 관한 것으로, 특히 테이프 기재와의 친화력이 향상됨과 동시에 적절한 점착력을 구비하여 반도체 웨이퍼의 조립 작업 효율을 향상시킬 수 있는 다이싱테이프용 점착제 조성물에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition for dicing tape, and more particularly, to an adhesive composition for dicing tape capable of improving the affinity for assembly of a semiconductor wafer by providing an appropriate affinity with a tape substrate.
일반적으로 다이싱테이프는 반도체 웨이퍼를 일시적으로 부착시킨 다음, 다이싱블레이드로써 각각의 칩으로 절단시키는 데 사용된 것으로, 다이싱테이프에 반도체 웨이퍼를 부착하는 방법은 연질 PVC테이프에 반도체웨이퍼를 열압착식으로 부착하거나, 혹은 점착제가 도포된 테이프에다 반도체 웨이퍼를 눌러 접착제의 점착력을 이용하여 일시 부착하는 방법이 사용되고 있다.In general, a dicing tape is used to temporarily attach a semiconductor wafer and then cut it into individual chips with a dicing blade. A method of attaching a semiconductor wafer to a dicing tape is thermocompression bonding of a semiconductor wafer to a soft PVC tape. A method of adhering by a method or pressing a semiconductor wafer on a tape coated with an adhesive and temporarily applying the adhesive using an adhesive force is used.
그런데, 점착제가 도포된 테이프(이하 다이싱테이프라 한다)에 반도체 웨이퍼를 일시 부착하여 각각의 칩으로 절단하는 다이싱 작업을 하는 경우, 이에 사용되는 다이싱테이프는 다이싱블레이드로써 절단 작업을 할 때에는 반도체 웨이퍼와 절단된 칩이 분리되지 않도록 견고하게 고정지지할 수 있도록 점착력이 충분히 커야 하고, 절단 작업 후 마운팅 공정에서는 다이싱테이프로부터 칩을 쉽게 분리시킬 수 있도록 점착력이 약화되는 상반된 특성을 가져야 한다.By the way, in the case of dicing operation in which the semiconductor wafer is temporarily attached to an adhesive-coated tape (hereinafter referred to as a dicing tape) and cut into individual chips, the dicing tape used therein can be cut with a dicing blade. In this case, the adhesive force should be large enough so that the semiconductor wafer and the cut chip can be firmly fixed so as not to be separated. In the mounting process after cutting, the adhesive force is weakened so that the chip can be easily separated from the dicing tape. .
종래 PVC테이프를 기재로 한 다이싱테이프는 고무계 또는 아크릴계 점착제를 도포한 것이 대부분으로서, 또 반도체웨이퍼 및 절단된 칩을 부착력을 높여주기 위해 과량의 점착제가 도포되어 사용중 여분의 점착제가 묻어 나온다거나 칩에 점착제가 달라붙게 되어 별도의 공정에서 이들 점착제를 제거하여야 하는 등 번거로울 뿐만 아니라, 다이싱 작업 중 반도체 웨이퍼 및 칩의 지지력이 불량하다는 결점이 있었다.Conventional dicing tapes based on PVC tape are coated with rubber or acrylic adhesives, and excess adhesive is applied to increase adhesion between semiconductor wafers and cut chips. In addition, it is cumbersome to adhere the adhesives to the adhesives and to remove these adhesives in a separate process, and also has a disadvantage of poor bearing capacity of the semiconductor wafer and the chips during the dicing operation.
이와같은 결점을 해결하기 위해, 다이싱공정중에는 점착력이 커서 반도체웨이퍼를 견고하게 부착지지하고, 다이싱공정 후에는 칩을 쉽게 분리시킬 수 있도록 하고, 칩 취출공정에서는 점착력을 감소시키는 다이싱테이프용 점착제 조성물의 제조기술이 제안되어 있다. 예컨대 일본국 특허공개 소 61-243878호에는 플라스틱 필름으로 된 테이프기재층과 에틸렌-초산비닐공중합체로된 점착제층 사이에 음이온계 계면 활성제를 함유한 에틸렌 공중합체로 된 제 1중간층 및 폴리에틸렌으로 된 제 2중간층이 갖춰진 구성으로 되어, 절단 작업 후 가열처리에 의해 점착층의 점착강도를 저하시켜 칩을 쉽게 취출할 수 있는 다이싱테이프의 기술이 제안되어 있다.In order to solve this drawback, during the dicing process, the adhesive force is large, so that the semiconductor wafer is firmly attached, and after the dicing process, the chip can be easily separated and the dicing tape is reduced in the chip taking-out process. The manufacturing technique of an adhesive composition is proposed. For example, Japanese Patent Application Laid-Open No. 61-243878 discloses a first intermediate layer made of ethylene copolymer containing an anionic surfactant between a tape base layer made of plastic film and an adhesive layer made of ethylene-vinyl acetate copolymer, and an agent made of polyethylene. The technique of the dicing tape which consists of a structure equipped with two intermediate | middle layers and which can pull out a chip | tip easily by lowering the adhesive strength of an adhesion layer by heat processing after a cutting operation | work is proposed.
또한, 일본국 특허공개 소 62-16543호에는 신전성(伸展性) 플라스틱 베이스의 테이프기재의 한쪽면에 소정의 평균입경을 갖는 충진제와 점착제가 배합된 점착층을 갖추고, 절단작업 후 테이프기재를 인장시키면 점착층의 두께가 얇아짐으로써 입자형 충진제가 점착층 표면으로 노출 또는 돌출되면서 점착층의 점착력을 저하시켜, 테이프기재로 부터 칩을 취출하기 쉽도록 된 다이싱 필름에 관한 기술이 제안되어 있고, 또 일본국 특허공개 평 1-297483호로 PVC라던가 폴리에틸렌프탈레이트, 폴리에틸렌, 폴리올레핀, 또는 폴리프로필렌 등의 재질로써 자외선 투과성을 갖는 테이프기재 표면에, 자외선을 조사하면 경화되어 점착성이 상실되는 고무계 또는 아크릴계 점착제가 도포된 점착제층을 구비하고, 이 점착제층의 반대쪽 테이프기재 표면에 자외선 조사여부를 확인할 수 있는 변색재료층이 적층된 구조로 되어, 절단작업 후 상기 테이프기재 뒷면에 자외선을 조사하여 상기 점착제를 경화시킴으로써 반도체 웨이퍼와 점착제층의 접착강도를 저하시켜 테이프기재로부터 칩을 쉽게 취출할 수 있음과 동시에 변색재료층의 변색 상태로 자외선조사 여부를 쉽게 확인할 수 있는 자외선조사형 다이싱테이프에 관한 기술이 제안되어 있다.In addition, Japanese Patent Application Laid-Open No. 62-16543 has a pressure-sensitive adhesive layer containing a filler and an adhesive having a predetermined average particle diameter on one side of a tape-based tape base of an extensible plastic base. When tensioning, the thickness of the pressure-sensitive adhesive layer becomes thin, so that the particulate filler is exposed or protruded onto the surface of the pressure-sensitive adhesive layer, thereby reducing the adhesive force of the pressure-sensitive adhesive layer, and a technique related to a dicing film which makes it easier to take out chips from a tape substrate has been proposed. In addition, Japanese Patent Application Laid-open No. Hei 1-297483 has a material such as PVC, polyethylene phthalate, polyethylene, polyolefin, or polypropylene. A pressure-sensitive adhesive layer is provided, and ultraviolet light is applied to the surface of the tape base opposite to the pressure-sensitive adhesive layer. It has a structure in which the discoloration material layer which can confirm whether it is laminated, and irradiates ultraviolet rays to the back side of the tape base material after cutting to harden the pressure-sensitive adhesive to lower the adhesive strength of the semiconductor wafer and the pressure-sensitive adhesive layer, thereby easily taking out chips from the tape base material. At the same time, a technique has been proposed for an ultraviolet irradiated dicing tape that can easily check whether or not ultraviolet light is irradiated in a discolored state of the discolored material layer.
그러나, 상기와 같은 종래 기술은 테이프 기재와 점착층 사이에 가열작업에 의해 점착강도가 저하되도록 된 소정 조성의 중간층이 갖춰지거나, 또는 테이프 기재의 한쪽면에 소정 입자 직경의 충진제라던가 자외선 조사에 의해 경화성을 갖는 점착제 및 자외선 조사여부를 확인하도록 변색재료층이 적층된은 등 별도의 구성요소를 부가함으로써 그 제조공정이 번거롭고, 별도의 가열 또는 자외선 조사 설비가 필요로 하여 제조원가를 저감시킬 수 없다고 하는 결점이 있었다.However, the prior art as described above is provided with an intermediate layer of a predetermined composition such that the adhesive strength is lowered by a heating operation between the tape substrate and the adhesive layer, or by one side of the tape substrate such as a filler having a predetermined particle diameter or by ultraviolet irradiation. By adding a separate component such as a layer having a discolorable material layer laminated to check whether the adhesive has a curable adhesive and ultraviolet rays, the manufacturing process is cumbersome, and a separate heating or ultraviolet ray irradiation facility is required to reduce the manufacturing cost. There was a flaw.
따라서, 본 발명은 상기와 같은 제반 결점을 해결하기 위해 발명된 것으로, 본 발명의 주된 목적은 다이싱공정 및 마운팅공정에서 요구되는 상반된 점착특성을 만족하도록 최적의 점착력을 갖는 다이싱테이프용 점착제 조성물을 제공하는 데 있다.Therefore, the present invention has been invented to solve the above-mentioned shortcomings, the main object of the present invention is an adhesive composition for dicing tape having an optimum adhesive force to satisfy the opposing adhesive properties required in the dicing process and mounting process To provide.
상기와 같은 목적을 달성하기 위하여 본 발명은 부틸아크릴레이트 22-26중량%와, 2-에틸헥실 아크릴레이트 10.15-11.15중량%와, 메틸 메타 아크릴레이트 4.0-6.6중량%와, 2-하이드록시 에틸메타 아크릴레이트 5.36-6.85중량%와, 비닐 아크릴레이트 4.30-6.52중량%와, 벤젠 4-12중량%와, 에틸아세테이트 38-42중량%와, 벤졸퍼록사이드 0.1중량%를 혼합한 것을 특징으로 한다.In order to achieve the above object, the present invention provides 22-26% by weight of butyl acrylate, 10.15-11.15% by weight of 2-ethylhexyl acrylate, 4.0-6.6% by weight of methyl methacrylate, 2-hydroxyethyl 5.36-6.85% by weight of methacrylate, 4.30-6.52% by weight of vinyl acrylate, 4-12% by weight of benzene, 38-42% by weight of ethyl acetate, and 0.1% by weight of benzol peroxide. .
또한, 본 발명은 모노머로서 부틸 아크릴레이트(Butyl Acrylate) 22-26중량%와, 2-에틸헥실 아크릴레이트(2-Ethyl Hexyl Acrylate) 10.5-11.15중량%와, 메틸 메타 아크릴레이트(Methyl Metha Acrylate) 4.0-6.6중량%와, 2-하이드록시 에틸 메타 아크릴레이트(2-Hydroxy Ethyl Metha Acrylate) 5.36-6.85중량%와, 비닐 아크릴레이트(Vinyl Acrylate) 4.3-6.52중량%와, 벤젠 4-12중량%를 각각 계량하여 모노머탱크에 투입하고, 벤졸 퍼록사이드(Benzol Peroxide) 0.1중량 촉매하에서 2시간동안 충분히 교반시킨 뒤, 이 모노머 혼합물 200kg을 에틸 아세테이트(Ethyl acetate) 38-42중량%가 함유된 용제 200kg이 채워진 반응기에 5시간에 걸쳐 소량씩 적하(滴下)하면서 70-75℃ 온도에서 40-50rpm 속도로 교반시킨다. 이때 반응기 내에 N2개스등과 같은 환원성 또는 불활성 개스를 공급하여 발생된 기체를 치환하면서 교반속도 60-100rpm으로 충분히 교반시켜 중합반응을 진행시켜서 중합반응물을 얻는다.In addition, the present invention is 22-26% by weight butyl acrylate (Butyl Acrylate), 10.5-11.15% by weight 2-ethylhexyl acrylate (Methyl Metha Acrylate) 4.0-6.6% by weight, 5.36-6.85% by weight of 2-Hydroxy Ethyl Metha Acrylate, 4.3-6.52% by weight of vinyl acrylate (Vinyl Acrylate), and 4-12% by weight of benzene. And weighed each into a monomer tank, and stirred for 2 hours under a 0.1 weight catalyst of Benzol Peroxide. Then, 200 kg of the monomer mixture was 200 kg of a solvent containing 38-42% by weight of ethyl acetate. The reactor is stirred at a rate of 40-50 rpm at a temperature of 70-75 ° C. while being dripped in small portions over 5 hours. At this time, while supplying a reducing or inert gas such as N 2 gas in the reactor to replace the gas generated while stirring sufficiently at a stirring speed of 60-100rpm to proceed with the polymerization reaction to obtain a polymerization reaction.
다음 상기와 같이 반응기에서 혼합된 중합 혼합물을 50℃정도의 온도까지 급냉시켜 점착제의 점성이 상승되는 것을 억제한 뒤 이를 서어비스탱크에 투입하고, 상기 서어비스탱크에 경화제로서 2-하이드록시 에틸메타 아크릴레이트와, 촉매제로서 트리 크렉실 포스페이트(Tri Crexyl Phosphate), 안티몬계 경화촉진제를 소정량 첨가하여 상온에서 90분정도 경화작업을 실시한다.Next, the polymerization mixture mixed in the reactor was quenched to a temperature of about 50 ° C. to prevent the viscosity of the pressure-sensitive adhesive from rising, and then it was put in a service tank, and 2-hydroxy ethyl methacrylate as a curing agent in the service tank. Then, a predetermined amount of Tri Crexyl Phosphate and an antimony-based curing accelerator are added as a catalyst, and curing is performed at room temperature for about 90 minutes.
이와같이 제조된 점착제 조성물을 점착제 도포기에 충전해서 기제조된 테이프기재 또는 전사지에 소정두께로 도포한 다이싱 테이프를 제조한 다음, 점착제 조성물이 도포된 전사지를 자외선에 의해 경화 및 스팀 건조 작업을 실시한 뒤, 권취롤에 감아서 다이싱테이프를 제조하였다.After filling the pressure-sensitive adhesive composition prepared in this way into a pressure-sensitive adhesive applicator to prepare a dicing tape coated with a predetermined thickness on the tape base or transfer paper, and then the transfer paper coated with the pressure-sensitive adhesive composition is cured by ultraviolet rays and steam-dried. And wound around a take-up roll to prepare a dicing tape.
상기와 같은 방법으로 제조된 본 발명 점착제조성물은 용제인 에틸아세테이트가 충전된 반응기에 소정원료 혼합물을 소량씩 적하하면서 중하 반응을 일으켜 접착제의 성분 물질이 망상 결합구조를 갖도록 함으로써 PVC 테이프 기재와의 친화력이 향상되어 적정한 점도를 유지할 수 있었다.The pressure-sensitive adhesive composition of the present invention prepared by the above method is a dropwise reaction by dropping a small amount of a predetermined raw material mixture into a reactor filled with ethyl acetate, which is a solvent, so that the component material of the adhesive has a network-bonded structure, thereby having affinity with the PVC tape substrate. This improved and maintained an appropriate viscosity.
이하, 본 발명의 실시예에 대하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail.
[실시예 1]Example 1
본 발명의 1실시예에 따른 원료를 중량%로 나타내면 다음과 같다.When the raw material according to an embodiment of the present invention in weight% is as follows.
부틸아크릴레이트 26중량%Butyl acrylate 26% by weight
2-에틸헥실 아크릴레이트 10.15중량%10.15% by weight of 2-ethylhexyl acrylate
2-하이드록시 에틸 메타 아크릴레이트 6.85중량%6.85% by weight of 2-hydroxyethyl methacrylate
비닐 아크릴레이트 4.30중량%Vinyl acrylate 4.30% by weight
메틸 메타 아크릴레이트 6.6중량%6.6% by weight methyl methacrylate
벤젠 8중량%Benzene 8 wt%
에틸 아세테이트 38중량%38% by weight ethyl acetate
이들 원료를 각각 모노머 탱크에 펌핑하여 투입하고, 상기 모노모탱크에 촉매제로서 벤졸 퍼록사이드 0.1중량%를 첨가하여 2시간 정도 충분히 교반시킨다.These raw materials are pumped into a monomer tank, respectively, 0.1 weight% of benzol peroxide as a catalyst is added to the said monomo tank, and it fully stirs for about 2 hours.
다음에, 상기 혼합물 200kg을 에틸아세테이트 42중량%가 함유된 용제 200kg이 채워진 반응기에 5시간에 걸쳐 소량씩 적하하면서 교반시킨다. 이때 반응기의 온도는 70-75℃정도이고 교반속도는 40-50rpm이었다. 시간이 지남에 따라 반응열이 발생되므로 교반속도를 60-100rpm으로 증가시킴과 동시에 반응기 내부로 N2개스등과 같은 환원성 또는 불활성 개스를 공급하여 반응기내에 발생된 개스를 치환시키면서 5시간 정도 더 교반시키면서 중합 반응을 행하였다.Next, 200 kg of the mixture was added dropwise to the reactor filled with 200 kg of solvent containing 42% by weight of ethyl acetate in small portions over 5 hours. At this time, the temperature of the reactor was about 70-75 ℃ and the stirring speed was 40-50rpm. As the heat of reaction is generated over time, the stirring speed is increased to 60-100rpm and at the same time, a reducing or inert gas such as N 2 gas is supplied into the reactor to replace the gas generated in the reactor while stirring for another 5 hours. The polymerization reaction was performed.
이어서, 상기와 같이 교반된 혼합물을 1-2hr에 걸쳐 비교적 급속히 냉각시킴으로써 중합 반응을 중지시킨 뒤, 서어비스 탱크에 공급한다. 다음에, 서어비스 탱크에 공급된 혼합물 100중량%에 대하여 경화제를 투입하여 소정의 점착력을 부여하는 바, 즉, 경화제로서 2-하이드록시 에틸메타 아크릴레이트 4중량%를 첨가하여 상온에서 90분정도 경화작업을 실시한다. 상기 경화제를 첨가한 후 경화촉진제 트리크랙셀 포스페이트를 소량첨가한 다음, 상기와 같이 경화작업을 해도 된다.The reaction mixture is then cooled relatively rapidly over 1-2 hr to stop the polymerization reaction and then fed to the service tank. Next, a curing agent is added to 100% by weight of the mixture supplied to the service tank to impart a predetermined adhesive force. That is, 4 weight% of 2-hydroxyethyl methacrylate is added as a curing agent and cured at room temperature for about 90 minutes. Do the work. After adding the said hardening | curing agent, a small amount of hardening accelerator tricraxel phosphate may be added, and you may harden | cure as mentioned above.
상기와 같은 제조된 점착제를 접착제 조성물을 도포기에 충전하여 테이프기재 또는 전사지에다 소정두께로 도포시켜서 다이싱용 테이프를 제조한 다음, 자외선 램프하에서 80-110℃온도로 경화 반응을 진행시킨 뒤 스팀으로 가열 건조시키고 롤에 권취시킨다.The pressure-sensitive adhesive prepared above was filled with an adhesive composition to an applicator, and then applied to a tape base or transfer paper to a predetermined thickness to prepare a dicing tape. Then, the curing reaction was performed at 80-110 ° C. under an ultraviolet lamp, followed by heating with steam. Dry and wind up on rolls.
여기서, 본 발명의 1실시예에 따른 점착제를 100±5℃ 온도에서 2시간 유지시킨 후 무게감량을 측정하여 비휘발분(Non-Volatility)을 조사한 결과, 비휘발분이 54중량%였고, 그 점도는 20℃ 온도에서 10,000-15,000cps이었으며, 이러한 1실시예에 따른 점착제를 PVC재질의 테이프기재에 도포하여 다이싱테이프를 제조해서 점착력을 측정한 결과, 접착력이 20-30gf/㎠로서 점착력이 다소 약하기는 하나 사용상의 문제는 없었다.Here, after maintaining the pressure-sensitive adhesive according to an embodiment of the present invention at 100 ± 5 ℃ temperature for 2 hours to determine the weight loss by measuring the non-volatile content (Non-Volatility), the non-volatile content was 54% by weight, the viscosity is It was 10,000-15,000cps at a temperature of 20 ° C, and the adhesive was measured by applying a pressure-sensitive adhesive according to this embodiment to a tape material of PVC material to prepare a dicing tape. There was no problem in use.
[실시예 2]Example 2
본 발명의 제 2실시예에 따른 원료를 중량%로 나타내면 다음과같다.The raw material according to the second embodiment of the present invention is expressed as weight% as follows.
부틸아크릴레이트 22중량%Butyl acrylate 22% by weight
2-에틸헥실 아크릴레이트 11.15중량%11.15% by weight of 2-ethylhexyl acrylate
2-하이드록시 에틸 메타 아크릴레이트 6.85중량%6.85% by weight of 2-hydroxyethyl methacrylate
비닐 아크릴레이트 5.9중량%5.9% by weight of vinyl acrylate
메틸 메타 아크릴레이트 4.0중량%Methyl methacrylate 4.0 wt%
벤젠 12중량%Benzene 12% by weight
에틸 아세테이트 38중량%38% by weight ethyl acetate
벤졸 퍼록사이드 0.1중량%0.1% by weight of benzol peroxide
이들 원료를 상기 1실시예와 동일한 방법으로 제조하여 얻은 점착제조성물은 비휘발분이 50중량%이었고, 그 점도는 20℃에서 32,500cps였고, 이 점착제 조성물은 도포한 다이싱 테이프의 점착력은 100~150gf/㎠였다.The pressure-sensitive adhesive composition obtained by preparing these raw materials in the same manner as in Example 1 had a nonvolatile content of 50% by weight, the viscosity of which was 32,500 cps at 20 ° C, and the pressure-sensitive adhesive force of the dicing tape coated with this pressure-sensitive adhesive composition was 100-150 gf. / Cm 2.
[실시예 3]Example 3
본 발명의 제 3실시예에 따른 원료를 중량%로 나타내면 다음과 같다.When the raw material according to the third embodiment of the present invention is represented by weight%, it is as follows.
부틸아크릴레이트 26중량%Butyl acrylate 26% by weight
2-에틸헥실 아크릴레이트 10.15중량%10.15% by weight of 2-ethylhexyl acrylate
2-하이드록시 에틸 메타 아크릴레이트 6.85중량%6.85% by weight of 2-hydroxyethyl methacrylate
비닐 아크릴레이트 4.30중량%Vinyl acrylate 4.30% by weight
메틸 메타 아크릴레이트 6.6중량%6.6% by weight methyl methacrylate
벤젠 4중량%Benzene 4 wt%
에틸 아세테이트 42중량%42% by weight of ethyl acetate
벤졸 퍼록사이드 0.1중량%0.1% by weight of benzol peroxide
이들 원료를 실시예 1과 동일한 방법으로 제조하여 얻은 점착제조성물은 비휘발분이 50중량%이었고, 그 점도는 20℃에서 32,500cps, 이 점착제 조성물은 PVC재질의 비닐기재에 도포하여 다이싱테이프를 제조해서 점착력을 측정하였더니 100~150gf/㎠였다.The pressure-sensitive adhesive composition obtained by preparing these raw materials in the same manner as in Example 1 was 50% by weight of non-volatile content, the viscosity is 32,500cps at 20 ℃, this pressure-sensitive adhesive composition was applied to a vinyl vinyl material PVC to produce a dicing tape It was 100-150 gf / cm 2 when the adhesive force was measured.
이상 설명한 바와 같이 본 발명은, 소정량으로 계량된 점착제 원료를 모노머탱크에서 균일하게 혼합한 뒤, 이를 용제가 채워진 반응기에 소량씩 적하하면서 공급하여 중합 반응을 서서히 진행시킨 뒤, 경화제와 경화촉진제를 첨가하여 점착제의 성분 물질들 간에 망상의 결합구조를 갖는 점착제 조성물을 제조한 다음 비닐기재에 도포해서 다이싱 테이프를 제조하였더니, 비닐기재와의 친화력을 향상시킴은 물론 뛰어난 점착력이 있었다.As described above, in the present invention, the pressure-sensitive adhesive raw material measured in a predetermined amount is uniformly mixed in a monomer tank, and then is supplied dropwise to the reactor filled with a small amount, and the polymerization reaction is gradually progressed. When added to prepare a pressure-sensitive adhesive composition having a network-like bonding structure between the component materials of the pressure-sensitive adhesive and then applied to a vinyl substrate to produce a dicing tape, there was an excellent adhesion as well as improving the affinity with the vinyl substrate.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940038837A KR950006911B1 (en) | 1991-12-29 | 1994-12-29 | Adhesive composition for dicing tape |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR9111348 | 1991-12-29 | ||
| KR1019940038837A KR950006911B1 (en) | 1991-12-29 | 1994-12-29 | Adhesive composition for dicing tape |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910011348A Division KR950004579B1 (en) | 1991-07-04 | 1991-07-04 | Process for the preparation of composition dicing-tape-adehesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR950006911B1 true KR950006911B1 (en) | 1995-06-26 |
Family
ID=19316783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940038837A KR950006911B1 (en) | 1991-12-29 | 1994-12-29 | Adhesive composition for dicing tape |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR950006911B1 (en) |
-
1994
- 1994-12-29 KR KR1019940038837A patent/KR950006911B1/en not_active IP Right Cessation
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1060989C (en) | Method of making packaged hot melt adhesive | |
| CN102027085B (en) | Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer | |
| US6277481B1 (en) | Adhesive composition and adhesive sheet | |
| EP3327098B1 (en) | Adhesive resin layer and adhesive resin film | |
| JP5966581B2 (en) | Double-sided adhesive tape and method for producing the same | |
| KR101351627B1 (en) | Adhesive composition | |
| EP3239259B1 (en) | Adhesive resin layer and adhesive resin film | |
| JPH04114075A (en) | Hot melt pressure-sensitive adhesive based on acrylate | |
| JP6787900B2 (en) | Adhesive sheet | |
| CN103492466A (en) | Substrate film and method for manufacturing same | |
| JP5100902B1 (en) | Adhesive tape for semiconductor wafer surface protection | |
| TW202033701A (en) | Film adhesive composite sheet, and method of producing semiconductor device | |
| US20110052911A1 (en) | Adhesive tape with a viscoelastic polyolefin backing | |
| JPS6116839A (en) | Manufacture of release paper | |
| JPH0995600A (en) | Thermosetting composition, composition for preparing the same and thermosetting film adhesive | |
| JP3007733B2 (en) | Manufacturing method of pressure sensitive adhesive tape | |
| JP2877678B2 (en) | Double-sided adhesive tape | |
| KR102099538B1 (en) | Dual curing type adhesive tape | |
| KR950006911B1 (en) | Adhesive composition for dicing tape | |
| CN115926690A (en) | Viscosity-reducing adhesive composition, viscosity-reducing adhesive tape and preparation method thereof | |
| KR950004579B1 (en) | Process for the preparation of composition dicing-tape-adehesive | |
| WO2016151912A1 (en) | Dicing sheet, method for producing dicing sheet, and method for producing molded chip | |
| JP4297319B2 (en) | Adhesive tape | |
| KR101318198B1 (en) | Method for preparing a photocrosslinked-type psa including siloxane modified acrylate, and a composition thereof | |
| KR20090053062A (en) | Adhesive tape for dicing and die bond |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A107 | Divisional application of patent | ||
| A201 | Request for examination | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 19990503 Year of fee payment: 6 |
|
| LAPS | Lapse due to unpaid annual fee |