KR950000143Y1 - Loading tube of semiconductor package - Google Patents

Loading tube of semiconductor package Download PDF

Info

Publication number
KR950000143Y1
KR950000143Y1 KR2019910023066U KR910023066U KR950000143Y1 KR 950000143 Y1 KR950000143 Y1 KR 950000143Y1 KR 2019910023066 U KR2019910023066 U KR 2019910023066U KR 910023066 U KR910023066 U KR 910023066U KR 950000143 Y1 KR950000143 Y1 KR 950000143Y1
Authority
KR
South Korea
Prior art keywords
tube
packages
package
support
plug
Prior art date
Application number
KR2019910023066U
Other languages
Korean (ko)
Other versions
KR930016231U (en
Inventor
현인호
Original Assignee
삼성전자 주식회사
김광호
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사, 김광호 filed Critical 삼성전자 주식회사
Priority to KR2019910023066U priority Critical patent/KR950000143Y1/en
Publication of KR930016231U publication Critical patent/KR930016231U/en
Application granted granted Critical
Publication of KR950000143Y1 publication Critical patent/KR950000143Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음.No content.

Description

반도체패키지 적층용 튜브Semiconductor Package Stacking Tube

제1도는 종래 튜브구조를 나타낸 단면도.1 is a cross-sectional view showing a conventional tube structure.

제2도는 본 고안 튜브의 분해도.2 is an exploded view of the tube of the present invention.

제3도는 본 고안 튜브에 패키지가 적층되는 모양을 나타낸 도면이다.3 is a view showing a shape in which the package is laminated to the tube of the present invention.

본 고안은 반도체패키지 적층용 튜브에 관한 것으로, 특히 패키지가 손상을 입지않고 적층되도록 튜브의 플러그 중앙에 구멍을 뚫어 지지대를 삽입시킨 반도체패키지 적층용 튜브에 관한 것이다.The present invention relates to a tube for stacking semiconductor packages, and more particularly, to a tube for stacking semiconductor packages in which a support is inserted into a hole in the center of a plug of the tube so that the package is stacked without damage.

일반적으로 반도체 제조공정중 웨이퍼상태의 디바이스를 패키징(Packaging)하는 어셈블리(Assembly) 공정은 제품의 출하포장과 밀접한 관계가 있는 공정으로 어셈블리공정의 최종단계에서 포밍(Forming)된 패키지는 캐리어(carrier)로 운반되어 테스트를 거친 다음 캐리어에 놓여진 상태로 패킹(packing)되어 출하된다.In general, the assembly process of packaging a wafer state device in the semiconductor manufacturing process is closely related to the shipping and packaging of the product. The package formed at the final stage of the assembly process is a carrier. They are transported to the factory, tested and then packed and shipped in the carrier.

여기서 사용되는 캐리어는 크게 플라스틱 튜브와 트레이(tray) 및 테이프/릴(Tape ＆ Reel)로 구분할 수 있으며, 튜브패킹(tube packing) 방식은 인접한 패키지의 상호 접촉으로 인하여 발생되는 리이드의 휘어짐(lead bent)과 같은 문제가 발생될 우려가 없는 DIP(Dual inling package), SOJ(Small outline j-bend), ZIP(Zigzag inline package), PLCC(Plastic leaded chip carrier) 그리고 SOP(Small outline package)와 같은 패키지에 적용되며, 리이드(Lead)가 4방향으로 뻗어있는 걸윙타입(Gullwing type)의 표면실장용 패키지인 QFP(Quad flat package)나, 외부리드(External lead)의 취약성으로 리이드의 휘어짐(Lead bent)이 생길 염려가 있는 TSOP(Thin small outline package)와 같은 패키지는 트레이(Tray)나 테이프/릴(Tape ＆ Reel)을 사용하여 어셈블리 공정의 최종단계에서 출하포장된다.The carriers used here are largely divided into plastic tubes, trays, and tapes & reels, and tube packing is a lead bent caused by mutual contact of adjacent packages. Packages such as dual inling package (DIP), small outline j-bend (SOJ), zigzag inline package (ZIP), plastic leaded chip carrier (PLC), and small outline package (SOP) It is applied to QF (Quad flat package), a surface package of Gullwing type with lead extending in 4 directions, or lead bent due to weakness of external lead. Packages such as these thin small outline packages (TSOPs) are shipped and packaged at the end of the assembly process using trays or tapes & reels.

그리고 트레이(Tray)를 사용하여 트레이내에 패키지를 적층할 때는 트레이당 50∼60개의 패키지만을 적층시킬 수 있으며, 그 보다 많은 패키지는 하나의 트레이에 적층시킬 수 없었다.When stacking packages in a tray using a tray, only 50 to 60 packages can be stacked per tray, and more packages cannot be stacked in one tray.

따라서 하나의 포장용기에 많은량의 패키지를 적층하기 위해서는 TSOP 같은 미세피치 패키지의 캐리어로 트레이를 사용하지 않고 제1도에 나타낸 바와 같이 플라스틱으로 된 본체(1)와 위, 아래부분을 막는 플러그(2)로 구성된 튜브를 사용하여야만 하는데, 이 경우 패키지 상호간의 접촉으로 리이드의 휘어짐(Lead bent)이 문제점으로 대두되게 된다.Therefore, in order to stack a large amount of packages in one packaging container, as shown in FIG. 1 without using a tray as a carrier of a fine pitch package such as TSOP, the main body 1 made of plastic and plugs for blocking the upper and lower portions ( The tube consisting of 2) must be used. In this case, lead bent is a problem due to contact between packages.

본 고안은 상기한 종래 튜브가 갖는 결점을 해결하기 위해 안출한 것으로, 튜브플러그의 중앙에 구멍을 뚫어 지지대를 설치함으로써 패키지가 튜브속 동공내에 적층될 때 손상(리이드이 휘어짐)을 입지 않도록 하며 트레이 대신에 튜브를 사용 하나의 튜브에 많은 량의 패키지를 적층할 수 있으므로 패킹에 드는 비용을 대폭 절감시킬 수 있는 반도체패키지 적층용 튜브를 제공함에 그 목적이 있다.The present invention was devised to solve the drawbacks of the conventional tube described above, and by installing a support by drilling a hole in the center of the tube plug, it prevents damage (lead bend) when the package is stacked in the pupil in the tube and instead of the tray. It is an object of the present invention to provide a tube for stacking semiconductor packages that can greatly reduce the cost of packing since a large amount of packages can be stacked in one tube.

상기한 목적을 달성하기 위한 본 고안은 패키지를 적층하기 위해 내부에 사각통형의 동공이 형성된 튜브본체(1)와, 상기 튜브본체(1)의 상하단에 마개로서 설치되는 상. 하플러그(2)와, 상기 플러그(2)를 관통하여 튜브본체(1) 내부로 삽입되는 포밍머신에 장착된 지지대(3)로 구성됨을 특징으로 한다.The present invention for achieving the above object is a tube body (1) having a rectangular cylindrical hole formed therein for stacking the package, and the upper and lower ends of the tube body (1) installed as a stopper. It is characterized in that it consists of a lower plug (2), and a support (3) mounted to the forming machine is inserted into the tube body (1) through the plug (2).

이하, 본 고안의 작용 및 효과를 첨부도면을 참조하여 상세하게 설명한다.Hereinafter, the operation and effects of the present invention will be described in detail with reference to the accompanying drawings.

제1도는 종래 플라스틱 튜브의 구조를 나타낸 단면도이고, 제2도는 본 고안 튜브의 구조를 나타낸 단면도로서, 튜브의 아랫부분에 있는 플러그(2)의 중앙에 뚫린 구멍으로 포밍머신(Forming machine)의 언로딩(unloading)부분에 장착된 지지대(3)가 삽입되며, 지지대(3)의 윗부분에 포밍(Forming)완료된 패키지가 적층되고, 패키지가 하나씩 적층될 때마다 지지대는 한 단계식 아래로 이동하여 마침내는 튜브본체(1)밖으로 빠져나오게 된다.1 is a cross-sectional view showing the structure of a conventional plastic tube, Figure 2 is a cross-sectional view showing the structure of the tube of the present invention, the hole in the center of the plug (2) in the lower portion of the tube forming the forming machine (forming machine) The support (3) mounted on the unloading part is inserted, and the formed package is stacked on the upper part of the support (3), and each time the packages are stacked one by one, the support moves down one step to finally The tube comes out of the body (1).

이때 플러그(2)의 선단과 지지대(3)의 선단은 경사가 져 있기 때문에 패키지는 비스듬하게 적층되어 지게되며, 이는 사용자가 편리하게 사용토록 하기 위함이다.At this time, the tip of the plug 2 and the tip of the support 3 are inclined so that the packages are stacked obliquely, which is intended to be conveniently used by the user.

제3도는 본 고안 튜브에 캐피지가 비스듬하게 적층되어 있는 모양을 나타낸 것이다.3 shows a shape in which the capacities are obliquely stacked on the tube of the present invention.

이상에서 설명한 바와 같이 작용하는 본 고안을 TSOP와 같은 미세피치 패키지(Fine pitch package)의 캐리어로 사용하는 트레이(Tray)대신에 사용하면 트레이 사용시보다 더 많은 수의 패키지를 한개의 튜브에 패킹(packing)할 수 있어서 패킹에 소요되는 비용을 대폭 절감할 수 있는 효과를 얻을 수 있다.When the present invention, which works as described above, is used instead of the tray used as a carrier of a fine pitch package such as TSOP, a larger number of packages are packed in one tube than when the tray is used. As a result, the cost of packing can be greatly reduced.

Claims (3)

내부에 사각통형의 동공이 형성된 튜브본체(Tube body, 1)와 상기 튜브본체(1)의 상하단에 마개로서 설치되는 상. 하플러그(plug, 2)및, 상기 플러그(2)를 관통하여 튜브본체(1) 내부로 삽입되는 지지대(3)로 구성된 반도체패키지 적층용 튜브.The tube body (Tube body, 1) is formed as a stopper in the upper and lower ends of the tube body (1) formed with a rectangular cylindrical shape therein. A tube for stacking semiconductor packages comprising a plug (2) and a support (3) penetrating the plug (2) and inserted into the tube body (1). 제1항에 있어서, 상기 상. 하플러그(2)에는 지지대(3)가 관통하도록 중앙에 뚫려 있음을 특징으로 하는 반도체패키지 적층용 튜브.The phase of claim 1 wherein said phase. The half plug 2 is a tube for stacking semiconductor packages, characterized in that the support (3) is perforated in the center. 제1항에 있어서, 상기 지지대(3)는 선단이 경사져 있는 것임을 특징으로 하는 반도체 패키지 적층용 튜브.The tube for stacking semiconductor packages according to claim 1, wherein the support (3) is inclined at its tip.
KR2019910023066U 1991-12-20 1991-12-20 Loading tube of semiconductor package KR950000143Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910023066U KR950000143Y1 (en) 1991-12-20 1991-12-20 Loading tube of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910023066U KR950000143Y1 (en) 1991-12-20 1991-12-20 Loading tube of semiconductor package

Publications (2)

Publication Number Publication Date
KR930016231U KR930016231U (en) 1993-07-28
KR950000143Y1 true KR950000143Y1 (en) 1995-01-10

Family

ID=19324867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910023066U KR950000143Y1 (en) 1991-12-20 1991-12-20 Loading tube of semiconductor package

Country Status (1)

Country Link
KR (1) KR950000143Y1 (en)

Also Published As

Publication number Publication date
KR930016231U (en) 1993-07-28

Similar Documents

Publication Publication Date Title
US5957293A (en) Tray to ship ceramic substrates and ceramic BGA packages
US7395932B2 (en) Carrier tape for electronic components
US5555488A (en) Integrated circuit device having improved post for surface-mount package
KR950000143Y1 (en) Loading tube of semiconductor package
US3524541A (en) Package for small and delicate devices
US4180161A (en) Carrier structure integral with an electronic package and method of construction
US7061108B2 (en) Semiconductor device and a method for securing the device in a carrier tape
US5447229A (en) Cot/tab protective shipping apparatus and method
JPH1159725A (en) Transfer tape for electronic parts and containing method of electronic parts
EP0036907B1 (en) Multi-lead plug-in type package for circuit element
KR100226108B1 (en) Tray for storing bga semiconductor package
KR100210329B1 (en) Tube for packing semiconductor package
KR940008242Y1 (en) Tray for package cover
KR100292664B1 (en) Carrier Tape for Semiconductor Package
US5702005A (en) PLLC/LCC tube
KR100389828B1 (en) Tray for packing of surface mounting semiconductor package
JP2002211680A (en) Semiconductor storing member
SU572403A1 (en) Holder for transportation and packing of articles liable to damage
JPH07149393A (en) Electronic component transfer tape
KR20110010496U (en) Carrier tape for packaging semiconductor
JPH08324677A (en) Container
KR950005155Y1 (en) Custody instrument for semiconductor elements
JPH0543126A (en) Carrier type for emboss tape
KR20000000676A (en) Tape packing box for semiconductor package
SU1648841A1 (en) Bottle packing

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20011207

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee