KR940008020A - Sputtering device for semiconductor device manufacturing - Google Patents
Sputtering device for semiconductor device manufacturing Download PDFInfo
- Publication number
- KR940008020A KR940008020A KR1019920017905A KR920017905A KR940008020A KR 940008020 A KR940008020 A KR 940008020A KR 1019920017905 A KR1019920017905 A KR 1019920017905A KR 920017905 A KR920017905 A KR 920017905A KR 940008020 A KR940008020 A KR 940008020A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- air cylinder
- manufacturing
- heater table
- cylinder actuator
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000004544 sputter deposition Methods 0.000 title abstract description 6
- 239000002184 metal Substances 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 abstract 4
- 238000000427 thin-film deposition Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
본 발명은 반도체 소자 제조장차에 있어서, 반도체 제조공정중 웨이퍼에 금속박막을 증착시키는 반도체 소자제조용 스퍼터링 장치에 관한 것으로, 종래의 반도체 소자 제조용 스퍼터링 장치에 있어서, 웨이퍼가 고정된 상태에서 금속박막이 입혀짐으로 콘택의 측면부에는 금속박막이 도착되기가 어려워 금속박막이 극히 소량 존재하게되고, 이로인해 금속배선의 신뢰성을 크게 저하시키는 문제점을 해결하기위해 금속박막 증착시 웨이퍼를 일정각도 이내로 기울이고 또한 회전 가능토록 한 반도체 소자 제조용 스퍼터링 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus for manufacturing a semiconductor device, in which a metal thin film is deposited on a wafer during a semiconductor manufacturing process. In the conventional sputtering apparatus for manufacturing a semiconductor device, a metal thin film is coated while the wafer is fixed. Due to the load, it is difficult for the metal thin film to arrive at the side of the contact, so that a very small amount of the metal thin film exists, thereby allowing the wafer to be tilted and rotated within a certain angle during metal thin film deposition in order to solve the problem of significantly lowering the reliability of the metal wiring. It relates to a sputtering apparatus for manufacturing a semiconductor device.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명에 따른 반도체 소자 제조용 스퍼터링 장치의 금속타켓부와 웨이퍼상의 콘택부의 확대도.2 is an enlarged view of a metal target portion and a contact portion on a wafer of the sputtering apparatus for manufacturing a semiconductor device according to the present invention.
제3도는 본 발명에 따른 반도체 소자 제조용 스터퍼링 장치의 종단면도.3 is a longitudinal sectional view of a stuffing apparatus for manufacturing a semiconductor device according to the present invention.
제4도는 제3도의 ''A''방향에서 본 반도체 소자 제조용 스퍼터링 장치의 종단면도.4 is a longitudinal cross-sectional view of a sputtering apparatus for manufacturing a semiconductor device, as viewed from the direction '' A '' of FIG.
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920017905A KR960002080B1 (en) | 1992-09-30 | 1992-09-30 | Sputtering apparatus for semiconductor device fabrication |
JP5242844A JPH06260417A (en) | 1992-09-30 | 1993-09-29 | Sputtering device for semiconductor element manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920017905A KR960002080B1 (en) | 1992-09-30 | 1992-09-30 | Sputtering apparatus for semiconductor device fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940008020A true KR940008020A (en) | 1994-04-28 |
KR960002080B1 KR960002080B1 (en) | 1996-02-10 |
Family
ID=19340379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920017905A KR960002080B1 (en) | 1992-09-30 | 1992-09-30 | Sputtering apparatus for semiconductor device fabrication |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH06260417A (en) |
KR (1) | KR960002080B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100336558B1 (en) * | 1999-10-01 | 2002-05-11 | 박종섭 | Apparatus for heating wafer |
KR20020057248A (en) * | 2000-12-30 | 2002-07-11 | 현대엘씨디주식회사 | Method for manufacturing orgarnic electroluminescent display |
KR100447323B1 (en) * | 2002-03-22 | 2004-09-07 | 주식회사 하이닉스반도체 | Method of physical vapor deposition in a semiconductor device |
CN114293156A (en) * | 2018-08-10 | 2022-04-08 | 东京毅力科创株式会社 | Film forming system and film forming method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100264742B1 (en) * | 1997-12-31 | 2000-09-01 | 김덕중 | Heating device for plasma surface plant |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60200518A (en) * | 1984-03-26 | 1985-10-11 | Hitachi Ltd | Sputtering device |
JPS63137160A (en) * | 1986-11-28 | 1988-06-09 | Hitachi Ltd | Vacuum deposition apparatus |
JPH01270321A (en) * | 1988-04-22 | 1989-10-27 | Anelva Corp | Sputtering device |
JP3050233B2 (en) * | 1989-11-30 | 2000-06-12 | 株式会社島津製作所 | Film forming equipment |
-
1992
- 1992-09-30 KR KR1019920017905A patent/KR960002080B1/en not_active IP Right Cessation
-
1993
- 1993-09-29 JP JP5242844A patent/JPH06260417A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100336558B1 (en) * | 1999-10-01 | 2002-05-11 | 박종섭 | Apparatus for heating wafer |
KR20020057248A (en) * | 2000-12-30 | 2002-07-11 | 현대엘씨디주식회사 | Method for manufacturing orgarnic electroluminescent display |
KR100447323B1 (en) * | 2002-03-22 | 2004-09-07 | 주식회사 하이닉스반도체 | Method of physical vapor deposition in a semiconductor device |
CN114293156A (en) * | 2018-08-10 | 2022-04-08 | 东京毅力科创株式会社 | Film forming system and film forming method |
Also Published As
Publication number | Publication date |
---|---|
KR960002080B1 (en) | 1996-02-10 |
JPH06260417A (en) | 1994-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960012349A (en) | Rotary Substrate Cleaner | |
KR920020597A (en) | Swivelable Shutter Device in Semiconductor Processing Room | |
KR940008020A (en) | Sputtering device for semiconductor device manufacturing | |
DE69423879D1 (en) | Plate valve | |
EP1059517A4 (en) | Pressure sensor | |
EP1072359A3 (en) | Semiconductor wafer polishing apparatus | |
US4323741A (en) | Mechanical deflection apparatus for sensing fluid pressure | |
JPS57124209A (en) | Flow meter | |
BE904369A (en) | TRANSFER AND LOADING DEVICE FOR HONEYCOMB STRUCTURES. | |
KR940009029A (en) | How to transfer the vacuum chamber and combinations thereof and at least one part | |
US6598758B2 (en) | Cup transfer device for vending machine | |
JP3297501B2 (en) | Cryopump | |
JPH1074816A (en) | Wafer transporting device | |
JP2631356B2 (en) | Gate valve device | |
JP2005236218A (en) | Transfer robot for semiconductor wafer, and treatment apparatus equipped with it | |
JPS6179084A (en) | Pneumatic operation valve | |
JPH05162095A (en) | Vacuum robot | |
JP2580222Y2 (en) | Exhaust device | |
JP2622523B2 (en) | Magnetic levitation transfer device | |
JPH05318350A (en) | Lifting mechanism of robot for vacuum use | |
JPS6027605B2 (en) | Portable conveyor with variable direction | |
JPH0528208Y2 (en) | ||
SU1702059A1 (en) | Pipe line elbow | |
WO2000030173A1 (en) | Conveyor system | |
SU1137066A1 (en) | Device for preventing tripping of crane boom |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050120 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |