KR940008020A - Sputtering device for semiconductor device manufacturing - Google Patents

Sputtering device for semiconductor device manufacturing Download PDF

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Publication number
KR940008020A
KR940008020A KR1019920017905A KR920017905A KR940008020A KR 940008020 A KR940008020 A KR 940008020A KR 1019920017905 A KR1019920017905 A KR 1019920017905A KR 920017905 A KR920017905 A KR 920017905A KR 940008020 A KR940008020 A KR 940008020A
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KR
South Korea
Prior art keywords
wafer
air cylinder
manufacturing
heater table
cylinder actuator
Prior art date
Application number
KR1019920017905A
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Korean (ko)
Other versions
KR960002080B1 (en
Inventor
조경수
신철호
고철기
백종성
김헌도
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019920017905A priority Critical patent/KR960002080B1/en
Priority to JP5242844A priority patent/JPH06260417A/en
Publication of KR940008020A publication Critical patent/KR940008020A/en
Application granted granted Critical
Publication of KR960002080B1 publication Critical patent/KR960002080B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

본 발명은 반도체 소자 제조장차에 있어서, 반도체 제조공정중 웨이퍼에 금속박막을 증착시키는 반도체 소자제조용 스퍼터링 장치에 관한 것으로, 종래의 반도체 소자 제조용 스퍼터링 장치에 있어서, 웨이퍼가 고정된 상태에서 금속박막이 입혀짐으로 콘택의 측면부에는 금속박막이 도착되기가 어려워 금속박막이 극히 소량 존재하게되고, 이로인해 금속배선의 신뢰성을 크게 저하시키는 문제점을 해결하기위해 금속박막 증착시 웨이퍼를 일정각도 이내로 기울이고 또한 회전 가능토록 한 반도체 소자 제조용 스퍼터링 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus for manufacturing a semiconductor device, in which a metal thin film is deposited on a wafer during a semiconductor manufacturing process. In the conventional sputtering apparatus for manufacturing a semiconductor device, a metal thin film is coated while the wafer is fixed. Due to the load, it is difficult for the metal thin film to arrive at the side of the contact, so that a very small amount of the metal thin film exists, thereby allowing the wafer to be tilted and rotated within a certain angle during metal thin film deposition in order to solve the problem of significantly lowering the reliability of the metal wiring. It relates to a sputtering apparatus for manufacturing a semiconductor device.

Description

반도체 소자 제조용 스퍼터링 장치Sputtering device for semiconductor device manufacturing

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 따른 반도체 소자 제조용 스퍼터링 장치의 금속타켓부와 웨이퍼상의 콘택부의 확대도.2 is an enlarged view of a metal target portion and a contact portion on a wafer of the sputtering apparatus for manufacturing a semiconductor device according to the present invention.

제3도는 본 발명에 따른 반도체 소자 제조용 스터퍼링 장치의 종단면도.3 is a longitudinal sectional view of a stuffing apparatus for manufacturing a semiconductor device according to the present invention.

제4도는 제3도의 ''A''방향에서 본 반도체 소자 제조용 스퍼터링 장치의 종단면도.4 is a longitudinal cross-sectional view of a sputtering apparatus for manufacturing a semiconductor device, as viewed from the direction '' A '' of FIG.

Claims (3)

웨이퍼(1)의 하부면이 웨이퍼 회전 샤프터(17)에 흡입, 압착 되게 하는 터보펌프(18)와, 상기 터보펌프가 작동하여 웨이퍼가 상기 웨이퍼 회전샤프트(17)에 밀착되게한 상태에서 웨이퍼를 기울이게 하기 위해 상기 웨이퍼와 웨이퍼 회전 샤프트(17)를 포함하고 있는 히터테이블(22)을 미는 에어실린더 엑튜에이터(12)와, 상기 에어실린더 엑튜에이터로 공기압에 의해 히터테이블 한쪽 옆면을 밀게하는 공기압의 연결관인 에어라인(13)과, 이 에어라인과 한쪽 끝 단부에서 접속되고, 다른쪽 한 단부는 히터테이블(22)의 한쪽 옆면에 부착되어 에어실린더 엑튜에이터의 이송통로가 되는 벨로우즈(9)와 연결함과 동시에 에어실린더 에튜에이터를 포함하고 있는 에어실린더(11)와, 상기 에어실린더 상부에 부착되어 에어실린더 엑튜에이터의 이송 거리를 감지하는 자계센서(14)와, 히터테이블(22)내에 설치되어 웨이퍼에 회전을 걸어주는 인코더 모터(15)와, 상기 인코더 모터(15)로부터 회전력을 웨이퍼에 전달하는 벨트(16)와, 에어실린더 엑튜에이터(12)의 작용을 히터테이블(22)이 기울어질때 회전 중심축을 이루고, 히터테이블 양쪽 옆면과 접합되어 있는 로테이션(20)과 상기 로테이션바아(20)의 양끝 단부와 연결되어 히터테이블을 포함한 쳄버벽(8) 전체의 무게를 지지하고 있는 지지대(21)로 구성된 것으로 특징으로 하는 반도체 소자 제조용 스터퍼링 장치.A turbopump 18 which allows the lower surface of the wafer 1 to be sucked and compressed by the wafer rotation shafter 17, and the turbopump is operated to bring the wafer into close contact with the wafer rotation shaft 17 An air cylinder actuator 12 that pushes the heater table 22 including the wafer and the wafer rotation shaft 17 to tilt the air pressure, and an air pressure that pushes one side of the heater table by air pressure with the air cylinder actuator An air line 13 which is a connection pipe of the bellows, and a bellows 9 which is connected to the air line at one end thereof, and the other end is attached to one side of the heater table 22 to serve as a transfer passage of the air cylinder actuator. And connected to the air cylinder 11 including an air cylinder actuator and a person attached to the upper air cylinder to sense the transport distance of the air cylinder actuator Sensor 14, an encoder motor 15 installed in the heater table 22 to rotate the wafer, a belt 16 for transmitting rotational force from the encoder motor 15 to the wafer, and an air cylinder actuator A chamber wall including a heater table is connected to both ends of the rotation bar 20 and the rotation bar 20 which are connected to both sides of the heater table when the heater table 22 is inclined, and the action of (12). (8) A stuffing device for manufacturing a semiconductor element, characterized by comprising a support (21) that supports the entire weight. 제1항에 있어서, 상기 에어실린더(11)상부에 설치된 자계센서(14)는 에어실린더 엑튜에이터(12)의 이동거리를 감지하여 웨이퍼(1)의 기울어짐의 범위를 조정 하되, 30°이내가 되도록 한 것을 특징으로 하는 반도체 소자 제조용 스터러핑 장치.According to claim 1, wherein the magnetic field sensor 14 is installed on the air cylinder 11, the sensing distance of the air cylinder actuator 12 to adjust the range of inclination of the wafer 1, within 30 ° A stuffing device for manufacturing a semiconductor device, characterized in that the 제1항에 있어서, 상기 인코더 모터(15)는 회전방향이 시계방향 또는 반시계 방향으로의 회전이 가능하도록 한 것을 특징으로 하는 반도체 소자 제조용 스터퍼링 장치.The stuffing device for manufacturing a semiconductor device according to claim 1, wherein the encoder motor (15) enables rotation in a clockwise or counterclockwise direction. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920017905A 1992-09-30 1992-09-30 Sputtering apparatus for semiconductor device fabrication KR960002080B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019920017905A KR960002080B1 (en) 1992-09-30 1992-09-30 Sputtering apparatus for semiconductor device fabrication
JP5242844A JPH06260417A (en) 1992-09-30 1993-09-29 Sputtering device for semiconductor element manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920017905A KR960002080B1 (en) 1992-09-30 1992-09-30 Sputtering apparatus for semiconductor device fabrication

Publications (2)

Publication Number Publication Date
KR940008020A true KR940008020A (en) 1994-04-28
KR960002080B1 KR960002080B1 (en) 1996-02-10

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ID=19340379

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920017905A KR960002080B1 (en) 1992-09-30 1992-09-30 Sputtering apparatus for semiconductor device fabrication

Country Status (2)

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JP (1) JPH06260417A (en)
KR (1) KR960002080B1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100336558B1 (en) * 1999-10-01 2002-05-11 박종섭 Apparatus for heating wafer
KR20020057248A (en) * 2000-12-30 2002-07-11 현대엘씨디주식회사 Method for manufacturing orgarnic electroluminescent display
KR100447323B1 (en) * 2002-03-22 2004-09-07 주식회사 하이닉스반도체 Method of physical vapor deposition in a semiconductor device
CN114293156A (en) * 2018-08-10 2022-04-08 东京毅力科创株式会社 Film forming system and film forming method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100264742B1 (en) * 1997-12-31 2000-09-01 김덕중 Heating device for plasma surface plant

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200518A (en) * 1984-03-26 1985-10-11 Hitachi Ltd Sputtering device
JPS63137160A (en) * 1986-11-28 1988-06-09 Hitachi Ltd Vacuum deposition apparatus
JPH01270321A (en) * 1988-04-22 1989-10-27 Anelva Corp Sputtering device
JP3050233B2 (en) * 1989-11-30 2000-06-12 株式会社島津製作所 Film forming equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100336558B1 (en) * 1999-10-01 2002-05-11 박종섭 Apparatus for heating wafer
KR20020057248A (en) * 2000-12-30 2002-07-11 현대엘씨디주식회사 Method for manufacturing orgarnic electroluminescent display
KR100447323B1 (en) * 2002-03-22 2004-09-07 주식회사 하이닉스반도체 Method of physical vapor deposition in a semiconductor device
CN114293156A (en) * 2018-08-10 2022-04-08 东京毅力科创株式会社 Film forming system and film forming method

Also Published As

Publication number Publication date
KR960002080B1 (en) 1996-02-10
JPH06260417A (en) 1994-09-16

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