KR940004770A - 분리가능한 금속 결합 방법 - Google Patents
분리가능한 금속 결합 방법 Download PDFInfo
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- KR940004770A KR940004770A KR1019930016276A KR930016276A KR940004770A KR 940004770 A KR940004770 A KR 940004770A KR 1019930016276 A KR1019930016276 A KR 1019930016276A KR 930016276 A KR930016276 A KR 930016276A KR 940004770 A KR940004770 A KR 940004770A
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- South Korea
- Prior art keywords
- metallization
- solder
- metallized
- chip
- terminals
- Prior art date
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- 238000000034 method Methods 0.000 title claims 8
- 229910052751 metal Inorganic materials 0.000 title claims 2
- 239000002184 metal Substances 0.000 title claims 2
- 229910000679 solder Inorganic materials 0.000 claims abstract 24
- 239000007788 liquid Substances 0.000 claims abstract 6
- 238000002844 melting Methods 0.000 claims abstract 6
- 230000008018 melting Effects 0.000 claims abstract 6
- 239000002904 solvent Substances 0.000 claims abstract 5
- 238000001465 metallisation Methods 0.000 claims 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 230000004888 barrier function Effects 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000006193 liquid solution Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 7
- 238000004064 recycling Methods 0.000 abstract 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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Abstract
한 실시예에 있어서, 집적 회로 칩 또는 레이저 칩과 같은 전자 장치(10)의 하나 이사의 금속화된 결선 또는 칩 단자(8,9)가 전자 장치를 검사할 목적으로 결선 기판(20)의 하나 이상의 금속화된 기판 패드(21,22)에 일시적으로 결합된다. 금속화된 칩 단자의 구성은 금속화된 기판 패드의 구성과 적절히 다르다. 패드 및 단자는 솔더의 녹는점 이상의 온도와 압력하에서 그들간에 위치된 솔더(51,52)와 함께 배열되어 전기적으로 접속된다. 상기 솔더는 냉각되어지며, 전자 장치의 전기적 검사가 검사 회로로 부터 기판 패드를 통하여 칩 단자로 전기적인 엑세스에 의해 실행되어 진다.
다음에 솔더는 액체 용제에 담겨지는 동안 그 녹는점 이상으로 다시 가열되며, 이에 따라 액체 솔더는 금속화된 칩 단자를 적시게 하고 금속화된 기판 패드는 젖게하지 않으며, 상기 장치는 결선 기판으로부터 기계적인 힘(F)에 의해 부드럽게 떨어지도록 되며 이후 냉각되어진다. 이후에, 이 기판은 유사하고 적결하계 금속화된 단자를 가지는 다른 전자 장치를 검사하기 위해 재사용된다.
또다른 실시예에 있어서, 검사는 집적 회로 또는 레이저와 같은 칩 동작의 목적으로, 희망에 따라서는 실행될 수도 되지않을 수도 있으며, 상기 칩은 열-싱킹(heat-sinking) 또는 열-스프레딩(heat-spreading)서브마운트의 형태로 기판에 영구적으로 결합되도록 허용될 수 있으며, 서브마운트에 단지 일시적으로 결합되도록 하여 또다른 칩에 대한 서브마운트의 재활용 목적으로 서브마운트로 부터 멀어지게 될 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 따라 검사되는 전자 장치의 부분적인 입면도,
제2도는 본 발명의 한 실시예에 따라 전차 장치를 검사하기 위해 이용되는 검사 장치의 부분적인 입면도,
제3 내지 제6도는 본 발명의 한 실시예에 따라 제1도에 도시된 장치를 검사하는 여러 연속적 단계의 입면도.
Claims (5)
- 제1장치 (100)의 결선 단자(8 및 9) 셋상에 하나 또는 그 이 상의 국소화 금속화된 영역(각각 16 및 (7)의 제1셋 각각을 제2장치(200)의 패드(21 및 22)셋상에 위치된 하나 또는 그 이상의 금속화된 영역(각각 31 및 32)인 제2셋 각각의 개별 영역에 결합하는 방법으로 국소화된 영역 각각은 제1장치 금속화(12,13,14,15)를 가지고, 제2셋의 국소화된 영역 각각은 제1금속화와는 다른 제2금속화(23,24,25)를 가지게 되며, (a)제1셋의 금속화된 영역 각각에 개별 솔더볼(solder ball ; 18,19)을 형성하며, (b)각각의 그러한 솔더볼을 제2셋의 금속화된 영역인 개별 영역의 노출된 표면에 접촉하게 하고, (c)각각의 솔더볼이 평평화된 솔더볼이 되도록 하기 위하여 각각의 그러한 솔더볼을 그 녹는점보다 높은 제1온도로 가열하는 단계를 구비하는 결합 방법에 있어서, 제1 및 제2금속화는 각각 다른 제1 및 제2구성을 가지게 되어 단계(c)에 이어 각각 평평화된 솔더볼이 그 녹는점보다 낮은 제2온도로 냉각되고 이후에, 제2금속화를 제외한 제1금속화를 적시기 용이하게 하는 액체 용제에 담겨지는 동안 솔더의 녹는점보다 높은 제3온도로 가열되는 때에 평평화된 솔더볼 각각이 제1셋의 금속화된 영역 각각을 적시게 하지만 제2셋의 어떠한 금속화된 영역도 적시게 하지 않는 용해된 솔더볼이 되며, 그에 따라 용해된 솔더볼이 액체 용제에 담겨지는 동안 제1장치가 제2장치로부터 기계적으로 떨어져 나오게 되는 것을 특징으로 하는 결합 방법.
- 제1항에 있어서, 단계 (a)에 앞서 제1장치 금속화가, 함께 증착된 크롬-구리층(12)이 형성되도록, 단자를 도금하는 크롬 및 구리를 함께 증착하고, 그 위에 구리층(13)을 증착하며, 그 위에 금 또는 주석층(14)을 증착하는 단계를 구비함으로써 형성되어지며, 단계 (b)에 앞서 제2장치 금속화가, 패드를 도금하여, 텅스텐, 탄탈, 몰리브덴 또는 티타늄의 층(23)을 증착하는 단계를 구비함으로써 형성되는 것을 특징으로 하는 결합 방법.
- 제2항에 있어서, 단계 (b)에 앞서 제2장치 금속화가 각 패드를 도금하여, 구리를 포함하지 않는 금속 장벽층(23)을 형성하는 단계를 구비함으로써 형성되는 것을 특징으로 하는 결합 방법.
- 제1장치(100)의 결선단자(8 및 9)셋상에 하나 또는 그 이상의 국소화 금속화된 영역(각각 16 및 17)의 제1셋각각을 제2장치(200)의 패드(21 및 22)셋상에 위치된 하나 또는 그 이상의 금속화된 영역(각각 31 및 32)인 제2셋 각각의 개별 영역에 일시적으로 결합하는 방법으로, 국소화된 영역 각각은 제1장치 금속화(12,13,14,15)를 가지고, 제2셋의 국소화된 영역 각각은 제1금속화와는 다른 제2금속화(23,24,25)를 가지게 되며, 제1항의 단계(a),(b) 및 (c)를 구비하는 일시적 결합 방법에 있어서, 솔더에 의해 제2장치 금속화를 제외한 제1장치 금속화를 적시기 용이하게 하는 액체 용제에 각각의 평평화된 솔더볼을 담그며, 제1 및 제2금속화는 별개의 제1 및 제2구성을 가지고, 제2온도에서 액체 용제에 있는 솔더가 제1셋의 각 금속화된 영역을 적시게 하고 제2셋의 금속화된 영역은 적시지 않게 하기 위하여 솔더가 용해된 솔더가 되도록 솔더의 녹는점보다 높은 제2온도로 각 솔더볼을 가열하고, 솔더볼이 용해되어 이렇게 액체 용체에 담겨있는 동안 제2장치로부터 제1장치를 기계적으로 떨어지게 하는 단게를 구비하는 것을 특징으로하는 일시적 결합 방법.
- 제4항에 있어서, 단게 (a) 및 (b)사이에 녹이지는 못하지만 부드럽게 하기에는 충분한 온도로 각 솔더볼을 가열하는 단계를 구비하는 것을 특징으로 하는 일시적 결합 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP938,194 | 1992-08-28 | ||
US07/938,194 US5234149A (en) | 1992-08-28 | 1992-08-28 | Debondable metallic bonding method |
US938,194 | 1992-08-28 |
Publications (2)
Publication Number | Publication Date |
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KR940004770A true KR940004770A (ko) | 1994-03-15 |
KR0168463B1 KR0168463B1 (ko) | 1999-02-01 |
Family
ID=25471067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019930016276A KR0168463B1 (ko) | 1992-08-28 | 1993-08-21 | 분리가능한 금속 결합 방법 |
Country Status (6)
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---|---|
US (1) | US5234149A (ko) |
EP (1) | EP0587337B1 (ko) |
JP (1) | JP2641384B2 (ko) |
KR (1) | KR0168463B1 (ko) |
DE (1) | DE69325218T2 (ko) |
TW (1) | TW273038B (ko) |
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-
1992
- 1992-08-28 US US07/938,194 patent/US5234149A/en not_active Expired - Lifetime
- 1992-11-03 TW TW081108762A patent/TW273038B/zh active
-
1993
- 1993-08-20 DE DE69325218T patent/DE69325218T2/de not_active Expired - Fee Related
- 1993-08-20 EP EP93306643A patent/EP0587337B1/en not_active Expired - Lifetime
- 1993-08-20 JP JP5226731A patent/JP2641384B2/ja not_active Expired - Lifetime
- 1993-08-21 KR KR1019930016276A patent/KR0168463B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0168463B1 (ko) | 1999-02-01 |
JPH06268358A (ja) | 1994-09-22 |
JP2641384B2 (ja) | 1997-08-13 |
US5234149A (en) | 1993-08-10 |
DE69325218T2 (de) | 1999-11-11 |
EP0587337B1 (en) | 1999-06-09 |
EP0587337A1 (en) | 1994-03-16 |
TW273038B (ko) | 1996-03-21 |
DE69325218D1 (de) | 1999-07-15 |
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