KR930020614A - Metal wall formation method of electronic component package - Google Patents

Metal wall formation method of electronic component package Download PDF

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Publication number
KR930020614A
KR930020614A KR1019920012099A KR920012099A KR930020614A KR 930020614 A KR930020614 A KR 930020614A KR 1019920012099 A KR1019920012099 A KR 1019920012099A KR 920012099 A KR920012099 A KR 920012099A KR 930020614 A KR930020614 A KR 930020614A
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KR
South Korea
Prior art keywords
plate
metal
bent
forming
electronic component
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Application number
KR1019920012099A
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Korean (ko)
Other versions
KR960003764B1 (en
Inventor
다까하루 미야모또
쓰도무 히구찌
후미오 미야가와
Original Assignee
이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
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Publication date
Priority claimed from JP4084779A external-priority patent/JPH0590433A/en
Application filed by 이노우에 사다오, 신꼬오 덴기 고오교오 가부시끼가이샤 filed Critical 이노우에 사다오
Publication of KR930020614A publication Critical patent/KR930020614A/en
Application granted granted Critical
Publication of KR960003764B1 publication Critical patent/KR960003764B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Led Device Packages (AREA)

Abstract

메틸측병형성용 띠판(10)을 틀모양으로 절곡하여 띠판(10)의 양단부를 맞닿게하여 기밀로 경납 땜질한다.The methyl side bottle-forming strip plate 10 is bent into a frame shape to abut both ends of the strip plate 10 to be brazed in airtight.

그와 동시에 틀모양으로 절곡한 띠판(10)의 하단개구부를 메탈저판(30)으로 봉하고, 그 메탈저판(30)을 띠판(10)의 하단개구부주연에 기밀로 경납땜질한다. 틀모양으로 절곡하기전의 띠판(10)에는 세라믹 단자 부착용 구멍(20)을 설비해둔다.At the same time, the lower end opening of the band plate 10 bent in a frame shape is sealed with the metal bottom plate 30, and the metal bottom plate 30 is brazed to the periphery of the lower end opening of the band plate 10 in an airtight manner. The plate 10 before the bending in the shape of a frame is provided with a hole for attaching the ceramic terminal 20.

이와같이하면 전자부품을 패키지의 메탈벽을 노력과 시간이 걸리지 않고 용이하고 또한 신속하게 형성할 수 있다.In this way, the electronic component can be easily and quickly formed on the metal wall of the package without effort and time.

Description

전자부품용 패키지의 메탈벽형성 방법Metal wall formation method of electronic component package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 제1메탈형성방법의 형성공정을 나타낸 평면도.1 is a plan view showing a forming process of the first metal forming method of the present invention.

제4도는 본 발명의 제1메탈벽 형성방법의 형성공정을 나타낸 사시도.4 is a perspective view showing a forming process of the first metal wall forming method of the present invention.

제5도는 본 발명의 제1메틸벽형성공정을 나타낸 사시도.5 is a perspective view showing a first methyl wall forming process of the present invention.

Claims (6)

메탈측벽 형성용 띠판을 틀모양으로 절곡하는 공정과, 그 틀모양으로 절곡한 띠판의 양단부를 맞닿게 하여 기밀접합하는 공정과, 상기 틀모양으로 절곡한 띠판의 하단개구부를 메탈저판으로 봉하는 공정과, 그 메틸저판을 상기 띠판의 하단개구부주연에 기밀접하는 공정과, 상기 틀 모양으로 절고하기전의 띠판 또는 상기 띠판의 하단 개구부를 봉하기 전의 메탈저판에 세라믹 단자 부착용, 리드 봉입부착용 또는 광파이버 관통용등의 구멍을 설비하는 공정을 포함하는 것을 특징으로 하는 전자부품용 패키지의 메탈벽 형성방법.A step of bending the metal side wall forming strip to form a frame, a step of contacting both ends of the band plate bent to form a frame and hermetically sealing, and a step of sealing the lower opening of the band plate bent into a frame with a metal bottom plate And a step of hermetically contacting the methyl base plate with the lower periphery of the opening of the band plate, and for attaching a ceramic terminal to the metal base plate before sealing the band plate or the bottom opening of the band plate before stiffening to the frame shape, for attaching a lead seal or for penetrating optical fiber. A method for forming a metal wall of a package for an electronic component, comprising the step of providing holes such as the above. 제1항에 있어서, 상기 틀 모양으로 절곡하는 띠판의 절곡개소 내측에 홈을 파서 설비하게 하는 전자부품용 패키지의 메탈벽 형성방법.The method for forming a metal wall of an electronic component package according to claim 1, wherein a groove is dug in the inside of the bent portion of the strip plate bent in the frame shape. 메탈측벽 형성용 띠판이고 그 하단측연에 메탈저판을 연속하여 이어져 되는 띠판을 메탈저판을 제외하고 틀모양으로 절곡하는 공정과, 그 틀모양으로 절곡하는 띠판 방향으로 상기 메틸저판을 절곡하여 그 메탈저판으로 상기 틀모양으로 절곡한 띠판의 하단개구부를 봉하는 공정과, 상기 틀모양으로 절곡한 띠판의 양단부를 맞닿게하여 기밀 접합하는 공정과, 상기 메탈 저판을 상기 틀모양으로 절곡한 띠판의 하단 개구부주연에 기밀 접합하는 공정과, 상기 틀모양으로 절곡하기전에 띠판 또는 상기 띠판방향으로 절곡하기전의 메틸저판에 세락믹 단자부착용, 리드봉입부착용 또는 광파이버 관통용등의 구멍을 설비하는 공정을 포함하는 것을 특징으로 하는 전자부품용 패키지의 메탈벽 형성방법.A metal plate is formed by forming a band plate for forming a metal side wall and continuing a metal bottom plate at a lower edge thereof, except for the metal base plate, and bending the methyl base plate in the direction of the band plate bending in the form of the metal base plate. A step of sealing the lower end opening of the band plate bent into a frame shape, a step of contacting both ends of the band plate bent into a frame shape to be hermetically bonded, and a bottom opening of the band plate bent into the frame shape. Airtight bonding to the periphery, and a step of installing holes such as for attaching a ceramic terminal, for attaching a lead, or for penetrating an optical fiber to a strip plate or a methyl base plate before bending in the direction of the strip plate before bending in the frame shape. A method of forming a metal wall of a package for an electronic component. 제3항에 있어서, 상기 틀 모양으로 절곡하는 띠판의 절곡개소 내측 또는 메탈 저판을 띠는 방향으로 절곡하는 절곡개소 내측에 홈을 파서 설비하게 하는 전자 부품용 패키지의 메탈벽 형성방법.The method for forming a metal wall of an electronic component package according to claim 3, wherein a groove is formed by digging a groove inside the bent portion of the band plate bent in the frame shape or inside the bent portion bent in the direction of the metal bottom plate. 제1~4항중 어느 한항에 있어서 상기 틀모양으로 절곡하는 띠판의 단부측연을 제거하여 띠판의 양단부가 맞닿는 매소측연에 접합재가 괴이는 곳을 설비한 전자부품용 패키지 메탈벽 형성방법.The method for forming a package metal wall for an electronic component according to any one of claims 1 to 4, wherein an end side edge of the strip plate that is bent into the frame shape is removed and a bonding material is tucked at each side edge where both ends of the strip plate abut. 제1~5항중 어느 한항에 있어서, 상기 띠판의 양단부와 메틸저판과 띠판의 하단개구부 주연을 경납땜질에 의해서 각각 기밀접합하는 전자부품용 패키지의 메탈벽 형성방법.6. The method for forming a metal wall of an electronic component package according to any one of claims 1 to 5, wherein the ends of the band plate, the periphery of the methyl bottom plate, and the periphery of the lower end opening of the band plate are each hermetically sealed by brazing. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920012099A 1992-03-06 1992-07-08 Process for making a package for accommodating electronic elements KR960003764B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4084779A JPH0590433A (en) 1991-07-08 1992-03-06 Method of forming metal side wall of electronic part package
JP92-84779 1992-03-06

Publications (2)

Publication Number Publication Date
KR930020614A true KR930020614A (en) 1993-10-20
KR960003764B1 KR960003764B1 (en) 1996-03-22

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KR1019920012099A KR960003764B1 (en) 1992-03-06 1992-07-08 Process for making a package for accommodating electronic elements

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755254B1 (en) * 2005-06-27 2007-09-05 후지쯔 가부시끼가이샤 Electronic component package including joint material having higher heat conductivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755254B1 (en) * 2005-06-27 2007-09-05 후지쯔 가부시끼가이샤 Electronic component package including joint material having higher heat conductivity

Also Published As

Publication number Publication date
KR960003764B1 (en) 1996-03-22

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