KR930014913A - Electrobond of Wire Bonder - Google Patents

Electrobond of Wire Bonder Download PDF

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Publication number
KR930014913A
KR930014913A KR1019910023985A KR910023985A KR930014913A KR 930014913 A KR930014913 A KR 930014913A KR 1019910023985 A KR1019910023985 A KR 1019910023985A KR 910023985 A KR910023985 A KR 910023985A KR 930014913 A KR930014913 A KR 930014913A
Authority
KR
South Korea
Prior art keywords
wire bonder
electrobond
electroid
wire
tip
Prior art date
Application number
KR1019910023985A
Other languages
Korean (ko)
Other versions
KR940008316B1 (en
Inventor
안태귀
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019910023985A priority Critical patent/KR940008316B1/en
Priority to JP4340202A priority patent/JPH05243315A/en
Publication of KR930014913A publication Critical patent/KR930014913A/en
Application granted granted Critical
Publication of KR940008316B1 publication Critical patent/KR940008316B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음No content

Description

와이어본더의 일렉트로이드Electrobond of Wire Bonder

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 통상적인 일렉트로이드의 장착 구조를 보인 측면도.1 is a side view showing a mounting structure of a conventional electroroid.

제2도는 본 발명에 의한 링형 일렉트로이드의 장착 구조를 보인 측면도.2 is a side view showing the mounting structure of the ring-shaped electroid according to the present invention.

제3도는 본 발명에 의한 링형 일렉트로이드의 요부 구조를 상세하게 보이는 제2도의 A부 저면도.FIG. 3 is a bottom view of the A portion of FIG. 2 showing in detail the main structure of the ring-shaped electroid according to the present invention. FIG.

제4도는 본 발명에 의한 링형 일렉트로이드의 전기적인 회로도.4 is an electrical circuit diagram of a ring type electroid according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 금선(Gold wire) 2 : 캐필러리(Capillary)1: Gold wire 2: Capillary

10 : 일렉트로이드의 링형 팁10: ring tip of an electroid

Claims (2)

통상적인 와이어본더에 있어서, 금선(1)을 공급하는 캐필러리(2)와 인접하게 배치되어 고전압을 발생시켜 스파크 방전을 야기시키는 일렉트로이드의 팁(10)을 링형 구조로 하여, 금선(1)과의 간극이 항상 일정하게 유지되도록 함과 아울러 2점 이상에서 스파크 방전이 일어나도록 한 것임을 특징으로 하는 와이어본더의 일렉트로이드.In a conventional wire bonder, a gold wire (1) has a ring-shaped structure in which the tip (10) of the electroid is disposed adjacent to the capillary (2) supplying the gold wire (1) to generate a high voltage and cause spark discharge. The gap between the wire bonder and the wire bonder is characterized by the fact that the gap is always kept constant and spark discharge occurs at two or more points. 제1항에 있어서, 상기 팁(10)은 다각형 구조인 것임을 특징으로 하는 와이어본더의 일렉트로이드.2. The electroid of claim 1, wherein the tip is a polygonal structure. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910023985A 1991-12-23 1991-12-23 Electrode of wire bonder KR940008316B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019910023985A KR940008316B1 (en) 1991-12-23 1991-12-23 Electrode of wire bonder
JP4340202A JPH05243315A (en) 1991-12-23 1992-12-21 Electrode of wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910023985A KR940008316B1 (en) 1991-12-23 1991-12-23 Electrode of wire bonder

Publications (2)

Publication Number Publication Date
KR930014913A true KR930014913A (en) 1993-07-23
KR940008316B1 KR940008316B1 (en) 1994-09-12

Family

ID=19325639

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910023985A KR940008316B1 (en) 1991-12-23 1991-12-23 Electrode of wire bonder

Country Status (2)

Country Link
JP (1) JPH05243315A (en)
KR (1) KR940008316B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004064033A (en) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc Bonding wire
JP2005123499A (en) * 2003-10-20 2005-05-12 Sumitomo Electric Ind Ltd Bonding wire and integrated circuit device using it
JP6327420B2 (en) 2015-03-31 2018-05-23 本田技研工業株式会社 Clutch control device

Also Published As

Publication number Publication date
KR940008316B1 (en) 1994-09-12
JPH05243315A (en) 1993-09-21

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