KR930012636A - 열팽창을 규정(define)시킨 세라믹 복합재 - Google Patents

열팽창을 규정(define)시킨 세라믹 복합재 Download PDF

Info

Publication number
KR930012636A
KR930012636A KR1019920017540A KR920017540A KR930012636A KR 930012636 A KR930012636 A KR 930012636A KR 1019920017540 A KR1019920017540 A KR 1019920017540A KR 920017540 A KR920017540 A KR 920017540A KR 930012636 A KR930012636 A KR 930012636A
Authority
KR
South Korea
Prior art keywords
nitride
ceramic composite
vol
aluminum
group
Prior art date
Application number
KR1019920017540A
Other languages
English (en)
Inventor
란게 디트리히
에이혼 토마스
Original Assignee
헤르만, 외트커
엘렉트로 쉬멜즈버크 켐프텐 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 헤르만, 외트커, 엘렉트로 쉬멜즈버크 켐프텐 게엠베하 filed Critical 헤르만, 외트커
Publication of KR930012636A publication Critical patent/KR930012636A/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/593Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/593Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering
    • C04B35/5935Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering obtained by gas pressure sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15Ceramic or glass substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

이 발명은 전자구성부품의 기재로서 사용되는 열팽창을 규정시킨 세라믹복합재에 관한 것이다.
이 세라믹복합재의 열팽창계수는 실리콘의 열팽창계수에 대응된다. 그 세라믹복합재는 적어도 두결정상을 구성하되 하나의 결정 Si3N4상 이외에 둘째 결정상과 각각의 또다른 결정상을 각각 카바이드, 옥사이드 및 주기율표 4~6의 아족의 천이금속 니트리드, 알루미늄옥사이도, 보론 니트리드 및 알류미늄 니트리드로 구성되는 그룹에서 선택된 물질을 구비한다.

Description

열팽창을 규정(define)시킨 세라믹 복합재
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 온도 900℃에서 전자회로에 쓰이는 시판용 실리콘의 열팽창계수와 비교한 본 발명의 실시예1의 새로운 세라믹복합재의 열팽창계수의 그라프를 나타낸다.

Claims (10)

  1. 전자구성부품을 기재로서 실리콘의 열팽창계수에 대응되는 열팽창계수를 가진 세라믹 복합재.
  2. 제1항에 있어서, 적어도 두결정상을 구성하되, 하나의 Si2N4상 이외에 둘째 결정상과 각각의 또다른 결정상 각각은 카바이드, 옥사이드 및 주기율표 4~6아족 천이금속의 니트리드, 알루미늄 옥사이드, 보론 니트리드 및 알루미늄 니트리드로 구성되는 그룹에서 선택된 물질로 구성함을 특징으로하는 세라믹 복합재.
  3. 제2항에 있어서, 둘째 결정상과 또다른 결정상은 알루미늄 옥사이드, 보론 니트리드 또는 알루미늄 니트리드를 구성함을 특징으로하는 세라믹복합재.
  4. 전자구성부품용 기재로서, 실리쿤니트리드 94.9-27 vol%, 카바이드, 옥사이드 및 천이금속 니트리드, 알루미늄옥사이드, 보론니트리드 및 알루미늄 니트리드로 구성되는 구룹에서 선택된 적어도 하나의 물질 5-65vol%, 적어도 하나의 소결첨가제(sintering additive)0.1-8vol%를 포함하는 세라믹 복합재.
  5. 전자구성부품용기재로서 실리콘니트리드 95-65vol%, 알루미늄옥사이드, 보론니트리드 및 알루미늄 니트리드로 구성되는 그룹에서 선택된 적어도 하나의 물질5-30vol%, 적어도 하나의 소결첨가제 1-5%를 포함하는 세라믹 복합재.
  6. 전자구성부품을 기재로서, 실리콘 니트리드 83.5-80vol% 티타늄 니트리드 14-15vol%, 적어도 하나의 소결 첨가제 2.5-5vol%를 포함하는 세라믹복합재.
  7. 전자구성부품용 기재로서 실리콘니트리드로, 카바이드, 옥사이드및 천이금속 니트리드, 알루미늄 옥사이드, 보론니트리드 및 알루미늄 니트리드로 구성되는 그룹에서 선택된 적어도 하나의 물질과, 입자크기 10㎛미만의 분말로서 소결조제를 혼합시켜, 얻어진 혼합물을 성형시켜, 그 성형체를 그다음 질소함유대기압, 온도 1600℃~1950℃에서 소결시킨을 특징으로하는 세라믹 복합재의 제조방법.
  8. 기계적응력 측정용 저너자구성부품에서 청구범위 제1항 내지 제6항중 어느한항의 세라믹 복합재사용.
  9. 압력센서에 있어서 청구범위 제1항 내지 제6항중 어느한항의 세라믹 복합재사용.
  10. 칩(chip)과 기재를 납땜(soldering)에 의해 접속하는 전자구성부품에 있어서 청구범위 제1항 내지 제6항중 어느 한항의 세라믹복합재사용.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920017540A 1991-12-20 1992-09-25 열팽창을 규정(define)시킨 세라믹 복합재 KR930012636A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4142412.3 1991-12-20
DE4142412A DE4142412A1 (de) 1991-12-20 1991-12-20 Keramischer verbundwerkstoff mit definierter thermischer ausdehnung

Publications (1)

Publication Number Publication Date
KR930012636A true KR930012636A (ko) 1993-07-20

Family

ID=6447777

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920017540A KR930012636A (ko) 1991-12-20 1992-09-25 열팽창을 규정(define)시킨 세라믹 복합재

Country Status (5)

Country Link
EP (1) EP0548802A1 (ko)
JP (1) JPH05330920A (ko)
KR (1) KR930012636A (ko)
DE (1) DE4142412A1 (ko)
TW (1) TW203599B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4425312A1 (de) * 1994-07-18 1996-01-25 Bayer Ag Sinterwerkstoffe auf Basis von Si¶3¶N¶4¶/BN sowie Verfahren zu ihrer Herstellung
DE4435182C2 (de) * 1994-09-30 1997-08-14 Fraunhofer Ges Forschung Verfahren zur Herstellung eines hoch- und verschleißfesten BN-enthaltenden Si¶3¶N¶4¶-Werkstoffs, der Werkstoff und seine Verwendung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626770A (en) * 1979-08-06 1981-03-14 Sumitomo Electric Industries Ceramic material for gaassic
JPS6060983A (ja) * 1983-09-08 1985-04-08 株式会社デンソー セラミックヒ−タ及びその製造方法
DE3614141A1 (de) * 1985-06-19 1988-04-28 Hitachi Metals Ltd Leitfaehiger siliciumnitrid-sinterkoerper und verfahren zu seiner herstellung
JPS6230663A (ja) * 1985-08-02 1987-02-09 株式会社日立製作所 電子回路基板用材料
DE3623928A1 (de) * 1986-07-16 1988-01-21 Wabco Westinghouse Steuerung Einrichtung zum abdichten zweier relativ gegeneinander bewegbarer maschinenteile, insbesondere zum abdichten des kolbens eines arbeitszylinders

Also Published As

Publication number Publication date
EP0548802A1 (de) 1993-06-30
TW203599B (ko) 1993-04-11
JPH05330920A (ja) 1993-12-14
DE4142412A1 (de) 1993-06-24

Similar Documents

Publication Publication Date Title
KR890013759A (ko) 고열전도성 질화알루미늄소결체 및 그 제조법
WO2003021669A1 (fr) Materiau structural composite et procede de production dudit materiau
KR970006237A (ko) 질화규소질 소결체와 그 제조방법
EP0390598A3 (en) Metallized aluminum nitride substrate
KR930012636A (ko) 열팽창을 규정(define)시킨 세라믹 복합재
WO2002070419A3 (en) Multication doped alpha-beta sialon ceramics
KR890010933A (ko) 도전 세라믹 소결체
JPS61291480A (ja) 窒化アルミニウム製基材の表面処理組成物
JPS6077186A (ja) 金属化表面を有するセラミツクス焼結体
JPS61270262A (ja) 高熱伝導性窒化アルミニウム焼結体
JPS5864279A (ja) 非酸化物セラミツクス焼結体
JPS59207881A (ja) セラミツク焼結体およびその製造法
JPS61132580A (ja) 窒化物セラミツク体へのメタライズ方法
EP1195810A4 (en) SILICON-BASED ALUMINUM-CARBIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
CA2028244A1 (en) Aluminum nitride powder, sintered body and production thereof
JPH09209058A (ja) 高熱伝導性複合材料とその製造方法
JPH0272655A (ja) 実装部品
JPS6246512B2 (ko)
JPH02113561A (ja) 放熱用部品
JPS6252181A (ja) 窒化アルミニウム焼結体の製造方法
JPS63166765A (ja) 窒化アルミニウム質焼結体およびその製造方法
JPS63307168A (ja) 窒化アルミニウム質焼結体
JP2001102476A (ja) セラミックス基板およびその製造方法
JP2003023064A (ja) 低熱膨張高剛性セラミックスおよびその体積抵抗率の制御方法
JPS62275069A (ja) AlN系セラミツクスの製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application