KR920700836A - 클래드(Clad)재의 가공 방법과 그 가공장치 - Google Patents

클래드(Clad)재의 가공 방법과 그 가공장치

Info

Publication number
KR920700836A
KR920700836A KR1019910701258A KR910701258A KR920700836A KR 920700836 A KR920700836 A KR 920700836A KR 1019910701258 A KR1019910701258 A KR 1019910701258A KR 910701258 A KR910701258 A KR 910701258A KR 920700836 A KR920700836 A KR 920700836A
Authority
KR
South Korea
Prior art keywords
clad material
processing device
processing method
material processing
processing
Prior art date
Application number
KR1019910701258A
Other languages
English (en)
Other versions
KR100219695B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2025272A external-priority patent/JP2562505B2/ja
Priority claimed from JP2527190A external-priority patent/JPH0818148B2/ja
Priority claimed from JP2025273A external-priority patent/JP2562506B2/ja
Application filed filed Critical
Publication of KR920700836A publication Critical patent/KR920700836A/ko
Application granted granted Critical
Publication of KR100219695B1 publication Critical patent/KR100219695B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53348—Running-length work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
    • Y10T29/53396—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together by friction fit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019910701258A 1990-02-06 1991-10-05 클래드재의 제조방법과 제조장치 KR100219695B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2-25272 1990-02-06
JP2-25273 1990-02-06
JP2025272A JP2562505B2 (ja) 1990-02-06 1990-02-06 加工用基準穴位置調整方法
JP2-25271 1990-02-06
JP2527190A JPH0818148B2 (ja) 1990-02-06 1990-02-06 スポット状部分クラッド材の製造方法およびその装置
JP2025273A JP2562506B2 (ja) 1990-02-06 1990-02-06 帯材の加工方法

Publications (2)

Publication Number Publication Date
KR920700836A true KR920700836A (ko) 1992-08-10
KR100219695B1 KR100219695B1 (ko) 1999-09-01

Family

ID=27284964

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701258A KR100219695B1 (ko) 1990-02-06 1991-10-05 클래드재의 제조방법과 제조장치

Country Status (5)

Country Link
US (1) US5295296A (ko)
EP (1) EP0466931B1 (ko)
KR (1) KR100219695B1 (ko)
DE (1) DE69128745T2 (ko)
WO (1) WO1991012109A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007866A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
US6088901A (en) * 1997-06-10 2000-07-18 Siemens Aktiengesellschaft Method for producing a carrier element for semiconductor chips
JP2000343144A (ja) * 1999-06-04 2000-12-12 Denso Corp プレス成形品の製造方法
WO2002019354A2 (en) * 2000-09-01 2002-03-07 Showa Denko K.K. Apparatus for producing capacitor element member
KR100465848B1 (ko) * 2003-05-07 2005-01-13 김병식 알루미늄 하니컴 복합 판넬의 연속적 제조 시스템
KR100770476B1 (ko) * 2003-06-10 2007-10-26 베아크 가부시끼가이샤 천공 장치 및 천공 방법
CN102441602A (zh) * 2011-09-23 2012-05-09 铜陵三佳山田科技有限公司 一种大规模集成电路冲流道模具定位装置
EP3308893A4 (en) * 2015-06-12 2019-01-16 Makino Milling Machine Co., Ltd. SMALL HOLE ELECTRIC DISCHARGE MACHINING MACHINE
KR101905694B1 (ko) * 2018-03-15 2018-11-30 김완선 판재가공장치 및 판재가공방법
US11701736B2 (en) 2021-09-30 2023-07-18 Wiegel Tool Works, Inc. Systems and methods for making a composite thickness metal part

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices
US3931922A (en) * 1972-01-29 1976-01-13 Ferranti, Limited Apparatus for mounting semiconductor devices
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
JPS5530859A (en) * 1978-08-25 1980-03-04 Nitto Electric Ind Co Ltd Method of making carrier tape for ic
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
JPS57176128U (ko) * 1981-04-30 1982-11-08
JPS59141389A (ja) * 1983-02-01 1984-08-14 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS59174287A (ja) * 1983-03-23 1984-10-02 Hitachi Cable Ltd 部分クラツド材の製造方法
JPS6087938A (ja) * 1983-10-19 1985-05-17 Rhythm Watch Co Ltd 薄板の加工方法
JPS60227456A (ja) * 1984-04-26 1985-11-12 Nec Corp 半導体装置用リ−ドフレ−ム
JPS6120361A (ja) * 1984-07-09 1986-01-29 Shinko Electric Ind Co Ltd 半導体装置用リ−ドフレ−ムの製造方法
JPS61167248U (ko) * 1985-04-02 1986-10-17
JPS60242632A (ja) * 1985-05-07 1985-12-02 Sanyo Electric Co Ltd 集積回路の多量製造方法
JPS6371926U (ko) * 1986-10-30 1988-05-13
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same
JPH01317633A (ja) * 1988-06-17 1989-12-22 Toshiba Corp プレス装置
JPH0651237B2 (ja) * 1989-04-21 1994-07-06 住友特殊金属株式会社 スポット状部分クラッド材の製造方法
JPH06102273B2 (ja) * 1989-06-02 1994-12-14 住友特殊金属株式会社 スポット状部分クラッド材の製造方法

Also Published As

Publication number Publication date
EP0466931A4 (ko) 1994-01-19
DE69128745D1 (de) 1998-02-26
EP0466931A1 (en) 1992-01-22
EP0466931B1 (en) 1998-01-21
WO1991012109A1 (en) 1991-08-22
DE69128745T2 (de) 1998-06-18
US5295296A (en) 1994-03-22
KR100219695B1 (ko) 1999-09-01

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