KR920020624A - 반도체 웨이퍼 처리장치 - Google Patents

반도체 웨이퍼 처리장치 Download PDF

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Publication number
KR920020624A
KR920020624A KR1019920006076A KR920006076A KR920020624A KR 920020624 A KR920020624 A KR 920020624A KR 1019920006076 A KR1019920006076 A KR 1019920006076A KR 920006076 A KR920006076 A KR 920006076A KR 920020624 A KR920020624 A KR 920020624A
Authority
KR
South Korea
Prior art keywords
circuit pattern
wafer
optical system
semiconductor wafer
wafer processing
Prior art date
Application number
KR1019920006076A
Other languages
English (en)
Other versions
KR960011930B1 (ko
Inventor
고우끼 쯔까다
Original Assignee
아오이 죠이찌
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이찌, 가부시끼가이샤 도시바 filed Critical 아오이 죠이찌
Publication of KR920020624A publication Critical patent/KR920020624A/ko
Application granted granted Critical
Publication of KR960011930B1 publication Critical patent/KR960011930B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

내용 없음

Description

반도체 웨이퍼 처리장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 발명 원리도,
제2도는 본 발명의 실시예에 관한 반도체 웨이퍼 처리장치의 구성도,
제3도는 본 발명의 실시예에 관한 웨이퍼 위치 맞춤 상태도.

Claims (1)

  1. 회로 패턴이 형성된 웨이퍼(1)의 단면 가공처리에 사용되는 반도체 웨이퍼 처리장치에 있어서, 상기 웨이퍼를 탑재하여 XY방향으로 이동 가능한 조정용 스테이지부(2), 상기 조정용 스테이지부의 상방에서 상기 웨이퍼의 회로 패턴의 동일점을 관찰 가능한 여러 종류의 광학 배율을 갖는 활성 광학계(3), 상기 촬상 광학계에서의 회로 패턴 반사광을 수광하여 전기신호로 변환하는 광전변환부(4), 상기 광전 변환부에서 전기신호에 의해 회로 패턴의 중심위치를 인식하는 패턴인식 처리부(5) 및 상기 촬상 광하계의 여러 종류의 광학 배율에서 상대적으로 저배율의 광학계부터 차례로 선택하여 상기 패턴 인식 처리부에서 인식된 회로 패턴의 위치 변이량에 기초하여 상기 조정용 스테이지부에 탑재되어 있는 웨이퍼를 XY방향으로 이동시켜 회로 패턴 중심위치를 필요한 회수만큼 위치 보정하는 제어부(6)을 포함하는 것을 특징으로 하는 반도체 웨이퍼 처리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920006076A 1991-04-19 1992-04-11 반도체 웨이퍼 처리 장치 KR960011930B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8863491A JP3029694B2 (ja) 1991-04-19 1991-04-19 半導体ウエハ処理装置
JP91-088634 1991-04-19

Publications (2)

Publication Number Publication Date
KR920020624A true KR920020624A (ko) 1992-11-21
KR960011930B1 KR960011930B1 (ko) 1996-09-04

Family

ID=13948247

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920006076A KR960011930B1 (ko) 1991-04-19 1992-04-11 반도체 웨이퍼 처리 장치

Country Status (3)

Country Link
US (1) US5264919A (ko)
JP (1) JP3029694B2 (ko)
KR (1) KR960011930B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100243193B1 (ko) * 1996-10-28 2000-03-02 윤종용 웨이퍼 식별 코드 인식방법 및 그 장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621813A (en) * 1993-01-14 1997-04-15 Ultratech Stepper, Inc. Pattern recognition alignment system
JPH09306977A (ja) * 1996-05-14 1997-11-28 Komatsu Ltd ウエハ検査装置等におけるウエハの位置決め方法
EP1182508B1 (de) * 2000-08-14 2012-12-12 Vistec Electron Beam GmbH Verfahren zum Belichten eines aus mehreren Ebenen bestehenden Layouts auf einem Wafer
US6996264B2 (en) * 2002-10-18 2006-02-07 Leco Corporation Indentation hardness test system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244803A (ja) * 1984-05-21 1985-12-04 Disco Abrasive Sys Ltd 自動精密位置合せシステム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100243193B1 (ko) * 1996-10-28 2000-03-02 윤종용 웨이퍼 식별 코드 인식방법 및 그 장치

Also Published As

Publication number Publication date
KR960011930B1 (ko) 1996-09-04
US5264919A (en) 1993-11-23
JPH04320333A (ja) 1992-11-11
JP3029694B2 (ja) 2000-04-04

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