KR920020624A - 반도체 웨이퍼 처리장치 - Google Patents
반도체 웨이퍼 처리장치 Download PDFInfo
- Publication number
- KR920020624A KR920020624A KR1019920006076A KR920006076A KR920020624A KR 920020624 A KR920020624 A KR 920020624A KR 1019920006076 A KR1019920006076 A KR 1019920006076A KR 920006076 A KR920006076 A KR 920006076A KR 920020624 A KR920020624 A KR 920020624A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit pattern
- wafer
- optical system
- semiconductor wafer
- wafer processing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 4
- 230000003287 optical effect Effects 0.000 claims 6
- 238000003384 imaging method Methods 0.000 claims 2
- 238000003909 pattern recognition Methods 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
- H01J37/3045—Object or beam position registration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 발명 원리도,
제2도는 본 발명의 실시예에 관한 반도체 웨이퍼 처리장치의 구성도,
제3도는 본 발명의 실시예에 관한 웨이퍼 위치 맞춤 상태도.
Claims (1)
- 회로 패턴이 형성된 웨이퍼(1)의 단면 가공처리에 사용되는 반도체 웨이퍼 처리장치에 있어서, 상기 웨이퍼를 탑재하여 XY방향으로 이동 가능한 조정용 스테이지부(2), 상기 조정용 스테이지부의 상방에서 상기 웨이퍼의 회로 패턴의 동일점을 관찰 가능한 여러 종류의 광학 배율을 갖는 활성 광학계(3), 상기 촬상 광학계에서의 회로 패턴 반사광을 수광하여 전기신호로 변환하는 광전변환부(4), 상기 광전 변환부에서 전기신호에 의해 회로 패턴의 중심위치를 인식하는 패턴인식 처리부(5) 및 상기 촬상 광하계의 여러 종류의 광학 배율에서 상대적으로 저배율의 광학계부터 차례로 선택하여 상기 패턴 인식 처리부에서 인식된 회로 패턴의 위치 변이량에 기초하여 상기 조정용 스테이지부에 탑재되어 있는 웨이퍼를 XY방향으로 이동시켜 회로 패턴 중심위치를 필요한 회수만큼 위치 보정하는 제어부(6)을 포함하는 것을 특징으로 하는 반도체 웨이퍼 처리장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8863491A JP3029694B2 (ja) | 1991-04-19 | 1991-04-19 | 半導体ウエハ処理装置 |
JP91-088634 | 1991-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920020624A true KR920020624A (ko) | 1992-11-21 |
KR960011930B1 KR960011930B1 (ko) | 1996-09-04 |
Family
ID=13948247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920006076A KR960011930B1 (ko) | 1991-04-19 | 1992-04-11 | 반도체 웨이퍼 처리 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5264919A (ko) |
JP (1) | JP3029694B2 (ko) |
KR (1) | KR960011930B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100243193B1 (ko) * | 1996-10-28 | 2000-03-02 | 윤종용 | 웨이퍼 식별 코드 인식방법 및 그 장치 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5621813A (en) * | 1993-01-14 | 1997-04-15 | Ultratech Stepper, Inc. | Pattern recognition alignment system |
JPH09306977A (ja) * | 1996-05-14 | 1997-11-28 | Komatsu Ltd | ウエハ検査装置等におけるウエハの位置決め方法 |
EP1182508B1 (de) * | 2000-08-14 | 2012-12-12 | Vistec Electron Beam GmbH | Verfahren zum Belichten eines aus mehreren Ebenen bestehenden Layouts auf einem Wafer |
US6996264B2 (en) * | 2002-10-18 | 2006-02-07 | Leco Corporation | Indentation hardness test system |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60244803A (ja) * | 1984-05-21 | 1985-12-04 | Disco Abrasive Sys Ltd | 自動精密位置合せシステム |
-
1991
- 1991-04-19 JP JP8863491A patent/JP3029694B2/ja not_active Expired - Fee Related
-
1992
- 1992-03-30 US US07/860,436 patent/US5264919A/en not_active Expired - Lifetime
- 1992-04-11 KR KR1019920006076A patent/KR960011930B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100243193B1 (ko) * | 1996-10-28 | 2000-03-02 | 윤종용 | 웨이퍼 식별 코드 인식방법 및 그 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR960011930B1 (ko) | 1996-09-04 |
US5264919A (en) | 1993-11-23 |
JPH04320333A (ja) | 1992-11-11 |
JP3029694B2 (ja) | 2000-04-04 |
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FPAY | Annual fee payment |
Payment date: 20030901 Year of fee payment: 8 |
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