KR920016540A - 반도체장치-캡슐화 에폭시 수지 조성물 - Google Patents

반도체장치-캡슐화 에폭시 수지 조성물 Download PDF

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Publication number
KR920016540A
KR920016540A KR1019920002977A KR920002977A KR920016540A KR 920016540 A KR920016540 A KR 920016540A KR 1019920002977 A KR1019920002977 A KR 1019920002977A KR 920002977 A KR920002977 A KR 920002977A KR 920016540 A KR920016540 A KR 920016540A
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epoxy resin
resin composition
semiconductor
weight
encapsulated
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KR1019920002977A
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KR0145332B1 (ko
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야스시 사와무라
도시히로 데시바
마사유끼 다나까
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원본미기재
도오레 가부시끼가이샤
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Priority claimed from JP3051591A external-priority patent/JP2501140B2/ja
Priority claimed from JP03032608A external-priority patent/JP3092176B2/ja
Application filed by 원본미기재, 도오레 가부시끼가이샤 filed Critical 원본미기재
Publication of KR920016540A publication Critical patent/KR920016540A/ko
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Publication of KR0145332B1 publication Critical patent/KR0145332B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체장치-캡슐화 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. (i)에폭시수지, (ⅱ)4,4´-디히드록시비페닐로 이루어지는 경화제와, (ⅲ)에폭시수지 조성물의 총중량을 기준으로 하여 충전제 70 내지 95중량%로 이루어지는 것을 특징으로 하는 반도체-켑슐화 에폭시 수지 조성물.
  2. 제1항에 있어서, 상기 에폭시 수지가 비페닐골격을 갖는 이관능성 에폭시 수지와 나프탈렌 골격을 갖는 이관능성 에폭시수지로 이루어지는 군으로부터 선정된 적어도 하나의 이관능성 에폭시수지로 이루어지며, 상기 충전제의 양이 에폭시수지 조성물의 총중량을 기준으로하여 75 내지 90중량%인 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
  3. 제2항에 있어서, 비페닐 골격을 갖는 이관능성 에폭시수지가 다음 일반식(I)로 표시되는 것을 특징으로 하는 반도체-캡슐화 에폭시 수지조성물.
    식에서, R1내지 R8각각은 수소원자, 할로겐원자 또는 1 내지 4개 탄소원자를 갖는 알킬기를 독립적으로 나타낸다.
  4. 제2항에 있어서, 나프탈렌 골격을 갖는 이관능성에폭시수지가 다음 일반식 (Ⅱ)으로 표시되는 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
    식에서, R11내지 R18의 둘은 2,3-에폭시프로폭시기를 나타내며, 나머지는 수소원자, 할로겐원자 또는 1내지 4개 탄소원자를 갖는 알킬기를 독립적으로 나타낸다.
  5. 제2항에 있어서, 이관능성 비페닐-골격에폭시수지 및 이관능성 나프탈렌-골격에폭시수지로부터 선정된 이관능성 에폭시수지 또는 수지들의 양이 에폭시수지 (i)의 중량을 기준으로하여 적어도 50중량%인 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
  6. 제1항에 있어서, 상기 경화제는 경하제 중량을 기준으로하여 4,4´-디히드록시 비페닐 5내지 90중량%로 이루어지는 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
  7. 제1항에 있어서, 상기 에폭시수지(i)의 양이 에폭시수지조성물의 총중량을 기준으로하여 3내지 25중량%인 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
  8. 제1항에 있어서, 상기 경화제의 양이 에폭시수지(i)에 대한 경화제의 화학 당량비가 0.5 내지 1.5범위내 이도록 정해지는 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
  9. 제1항에 있어서, 상기 경화제가 다음 일반식(Ⅲ)으로 표시된 페놀화합물로 더 이루어지는 것을 특징으로 하는 반도체-캡슐화 에폭시수지 조성물.
    식에서, R은 수소원자, 6내지 7개 탄소원자를 갖는 아릴기 또는 1내지 4개 탄소원자를 갖는 알킬기를 나타낸다.
  10. 제9항에 있어서, 상기 일반식(Ⅲ)의 페놀화합물의 양이 경화제의 중량을 기준으로하여 10내지 95중량%인 것을 특징으로 하는 반도체-캡슐화 에폭시수지조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920002977A 1991-02-26 1992-02-26 반도체장치-캡슐화 에폭시 수지 조성물 KR0145332B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP3051391 1991-02-26
JP91-30515 1991-02-26
JP91-30513 1991-02-26
JP3051591A JP2501140B2 (ja) 1991-02-26 1991-02-26 半導体封止用エポキシ樹脂組成物
JP91-32608 1991-02-27
JP03032608A JP3092176B2 (ja) 1991-02-27 1991-02-27 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR920016540A true KR920016540A (ko) 1992-09-25
KR0145332B1 KR0145332B1 (ko) 1998-07-15

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US (1) US5567749A (ko)
EP (1) EP0501734B1 (ko)
KR (1) KR0145332B1 (ko)
CA (1) CA2061801A1 (ko)
DE (1) DE69222670T2 (ko)

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Also Published As

Publication number Publication date
EP0501734B1 (en) 1997-10-15
US5567749A (en) 1996-10-22
CA2061801A1 (en) 1992-08-27
DE69222670D1 (de) 1997-11-20
EP0501734A3 (en) 1992-11-25
DE69222670T2 (de) 1998-03-12
EP0501734A2 (en) 1992-09-02
KR0145332B1 (ko) 1998-07-15

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