KR920002163Y1 - Pin holder - Google Patents
Pin holder Download PDFInfo
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- KR920002163Y1 KR920002163Y1 KR2019890009212U KR890009212U KR920002163Y1 KR 920002163 Y1 KR920002163 Y1 KR 920002163Y1 KR 2019890009212 U KR2019890009212 U KR 2019890009212U KR 890009212 U KR890009212 U KR 890009212U KR 920002163 Y1 KR920002163 Y1 KR 920002163Y1
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- Prior art keywords
- pin
- plunge
- unit
- head
- pin holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
내용 없음.No content.
Description
제 1 도는 본 고안의 플런지업 유니트의 핀홀더의 사시도.1 is a perspective view of the pin holder of the plunge-up unit of the present invention.
제 2 도는 본 고안의 플런지업 유니트의 핀홀더의 측단면도.2 is a side cross-sectional view of the pin holder of the plunge-up unit of the present invention.
제 3 도는 본 고안의 플런지업 유니트의 핀홀더의 평면도.3 is a plan view of the pin holder of the plunge-up unit of the present invention.
제 4 도는 종래의 플런지업 유니트의 핀홀더의 측단면도.4 is a side cross-sectional view of a pin holder of a conventional plunge-up unit.
제 5 도는 종래의 플런지업 유니트의 핀홀더에 핀을 셋팅시키는 방식을 나타내는 도면이다.5 is a view showing a method of setting the pin in the pin holder of the conventional plunge-up unit.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 헤드 2 : 협지홈1: Head 2: Gripping groove
3 : 핀삽입구멍 4 : 고정편3: pin insertion hole 4: fixing piece
5 : 가이드구멍 7 : 가이드봉5: guide hole 7: guide rod
8 : 가압판8: pressure plate
본 고안은 플런지업 유니트의 핀홀더에 관한 것으로서, 보다 상세하게는 핀 교환이 용이하고, 다수개의 핀의 높이를 동일하게 셋팅시킬 수 있도록 한 플런지업 유니트의 핀홀더에 관한 것이다.The present invention relates to a pin holder of the plunge-up unit, and more particularly, to a pin holder of the plunge-up unit to facilitate pin exchange and to set the same height of a plurality of pins.
반도체 제조공정중에는 절단공정에 절단된 웨이퍼상의 개개의 칩을 마일러로 분리하여, 본딩 헤드가 용이하게 흡착할 수 있도록하는 칩 분리공정이 포함되어 있다.The semiconductor manufacturing process includes a chip separation process for separating the individual chips on the wafer cut in the cutting process with a mylar so that the bonding heads can be easily adsorbed.
이 고정에서는, 플런지업 유니트라 불리우는 승강운동수단이 승강운동을 하면서 웨이퍼상의 칩을 마일러라 불리우는 테이프로부터 칩을 분리하게 되는데, 이 플런지업 유니트의 승강로드의 끝단부에는 다수개의 핀이 셋팅되어 있는 핀홀더가 설치되어 있다.In this fixing, the lifting means, called the plunge-up unit, lifts and removes the chip from the tape called the mylar on the wafer, and a plurality of pins are set at the end of the lifting rod of the plunge-up unit. Pin holder is installed.
제 4 도는 종래의 플런지업 유니트의 핀홀더의 측단면도로서, 헤드부(A)에 종으로 뚫려진 구멍에는 다수개의 핀(B)가 삽입되어 셋트스크류(C)로 각각 고정설치되어 있다.4 is a side cross-sectional view of the pin holder of the conventional plunge-up unit, in which a plurality of pins B are inserted into the holes drilled longitudinally in the head portion A, and fixed to the set screws C, respectively.
이들핀(B)가 헤드부(A)에 고정되었을 때, 각각의 핀(B)의 끝단부의 높이가 동일하여야만 마일러에 의해 칩이 수평으로 들어 올려져 본딩헤드에 정확히 흡착되게 된다.When these pins B are fixed to the head portion A, the ends of the pins B must have the same height so that the chips are horizontally lifted by the mylar so that they can be correctly adsorbed to the bonding head.
종래에는 제 5 도에 도시한 바와 같이 걸림턱(D)가 양측면에 형성된 홈(E)를 갖는 지그(J)에 헤드부(A)에 다수개의 핀을 가고정시킨 상태로 하여 이 헤드부(A)를 홈(E)에 거꾸로 삽입시켜 이 헤드부(A)의 아래면이 걸림턱(D)에 닿는 상태로한 후, 셋트스크류(C)를 풀어 핀(B)가 홈(E)의 바닥면에 닿도록 하여 각각의 핀(B)의 길이를 일정하게 한 상태에서 셋트스크류(C)를 조이는 방식으로 고정시켰다.Conventionally, as shown in FIG. 5, a plurality of pins are temporarily fixed to the head portion A in the jig J having the grooves E formed on both sides of the locking jaw D. Insert A) upside down into the groove (E) so that the lower surface of the head (A) is in contact with the locking jaw (D), then loosen the set screw (C) and the pin (B) of the groove (E) The set screw (C) was fixed by tightening the set screw (C) while keeping the length of each pin (B) constant to reach the bottom surface.
그러나, 제 5a 도에 도시한 바와같이 셋트스크류(C)를 화살표방향으로 회전시켜 핀(B)를 고정시킬 때 셋트스크류(C)의 끝단부가 핀(B)의 외주면에 접촉된 상태로 회전을 하기 때문에 이 회전력에 의해 핀(B)는 윗쪽방향으로 이동되어 고정되게 된다.However, as shown in FIG. 5A, when the set screw C is rotated in the direction of the arrow to fix the pin B, the end of the set screw C is rotated in contact with the outer circumferential surface of the pin B. Therefore, the pin B is moved upward and fixed by this rotational force.
따라서, 이 경우 각각의 핀(B)의 높이가 서로 다르게 되는 문제점이 있으며, 또한 제 5b 도에 도시한 바와 같이 셋트 스크류(C)의 끝단부가 핀(B)에 직접 접촉되어 화살표 방향으로 미는 힘이 작용하기 때문에 핀(B)의 중심이 어긋나는 문제점이 있다.Therefore, in this case, there is a problem that the height of each pin (B) is different from each other, and as shown in FIG. 5B, the end of the set screw (C) is in direct contact with the pin (B) and pushes in the direction of the arrow. This action causes a problem that the center of the pin B is shifted.
상기한 문제점들은 플런지업 유니트가 구동하여 마일러로 부터 칩을 분리할 때 칩이 수평으로 들어 올려지지 않는 한요인이되고, 그로인해 칩이 수평으로 들어 올려지지 않게되면 본딩헤드(도시생략)가 칩을 흡착할 때 정확한 흡착을 하지 못하게 되며, 이로 인하여 본딩헤드에 칩이 흡착되어 본딩위치로 이송되어질 때 칩이 본딩헤드로부터 떨어져 나가지 않고 리드프레임에 본딩될 때 칩이 본딩헤드에 정확히 흡착되어 있지 않기 때문에 정확한 본딩을 기대할 수 없다.The above problems are a factor unless the chip is lifted horizontally when the plunge-up unit is driven to separate the chip from the mylar, so that the bonding head is not lifted horizontally (not shown). When the chip is adsorbed, the chip cannot be adsorbed correctly. As a result, when the chip is adsorbed to the bonding head and transferred to the bonding position, the chip is correctly adsorbed to the bonding head when the chip is bonded to the lead frame instead of being separated from the bonding head. You cannot expect accurate bonding because it is not.
그리고, 종래의 장치에 있어서는 핀(B)가 셋트 스크류(C)로 각각 고정되어 있기 때문에, 이를 교환하고자할 때에는 다수개의 셋트스크류(C)를 풀고 조여야 하므로 핀교환에 많은 시간이 소요되는 문제점이 있다.In the conventional apparatus, since the pins B are fixed with the set screws C, when replacing them, a plurality of set screws C need to be loosened and tightened. have.
본 고안은 상기한 바와같은 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 본 고안의 목적은 핀교환을 용이하게 함과 아울러 다수개의 핀의 높이를 일정하게 유지할 수 있는 플런지업 유니트의 핀홀더를 제공하는데 있다.The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to facilitate pin replacement and pin holder of the plunge-up unit that can maintain a constant height of a plurality of pins To provide.
상기한 바와같은 목적을 달성하기 위하여 본 고안은, 반원 형상의 핀삽입구멍이 안쪽면에 다수개 형성됨과 아울러 헤드부의 안쪽에 형성된 공간부와 연통하여 가이드 구멍이 바닥면에 뚫려진 협지홈이 헤드부의 윗쪽부 대향위치에 형성되고, 상기한 협지홈의 아래쪽에 수평으로 관통 설치되어진 가이드봉에 가압판의 아랫단부가 슬라이드 가능하게 삽입됨과 아울러 윗단부가 상기한 가이드구멍에 관통되어 상기한 고정편과 대향 설치되어 구성되는 플런지업 유니트의 핀홀더를 제공한다.In order to achieve the above object, the present invention provides a plurality of semicircular pin insertion holes formed in the inner surface, and a pinching groove having a guide hole drilled in the bottom surface in communication with a space formed inside the head. The lower end of the pressure plate is slidably inserted into the guide rod which is formed at the upper part of the upper part and is horizontally penetrated below the clamping groove, and the upper end is penetrated through the guide hole to face the fixing piece. It provides a pin holder of the plunge-up unit is configured.
이하 본 고안의 바람직한 실시예를 첨부한 도면에 따라 더욱 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
제 1 도는 본 고안의 플런지업 유니트의 핀홀더 사시도이고, 제 2 도는 본 고안의 플런지업 유니트의 핀홀더의 측단면도로 부호(1)은 헤드를 나타낸다.1 is a perspective view of the pin holder of the plunge-up unit of the present invention, and FIG. 2 is a side cross-sectional view of the pin holder of the plunge-up unit of the present invention.
헤드(1)의 윗쪽부에는 협지홈(2)가 대향 형성되어 있으며, 이 협지홈(2)의 수직면에는 반원형상의 핀삽입구멍(3)이 다수개 뚫려져 있고, 바닥면에는 수직면과 소정거리 이격되어 고정편(4)가 일체로 돌출 형성되어 있다.In the upper part of the head 1, a gripping groove 2 is formed to face each other, and a plurality of semicircular pin insertion holes 3 are drilled in the vertical surface of the gripping groove 2, and a vertical distance and a predetermined distance are provided in the bottom surface. The fixed piece 4 is integrally projected and spaced apart.
상기한 협지홈(2)의 바닥면에는 가이드 구멍(5)가 뚫어져 헤드(1)의 안쪽에 형성되어 있는 공간부(6)과 연통되어 있으며, 상기한 헤드(1)의 아래측에는 공간부(6)을 가로질러 가이드봉(7)이 관통 설치되어 있다.A guide hole 5 is drilled in the bottom surface of the gripping groove 2 so as to communicate with the space portion 6 formed inside the head 1, and below the head 1 a space portion ( The guide rod 7 penetrates across 6).
이 가이드봉(7)에는 가압판(8)의 아랫단부가 슬라이드 가능하게 삽입되어 있으며, 이 가압판(8)은 가이드구멍(5)를 관통하여 그 윗단부가 협지홈(2)에 위치되어 고정편(4)와 대향 설치되어 있다.The lower end of the pressure plate 8 is slidably inserted into the guide rod 7. The pressure plate 8 penetrates the guide hole 5, and the upper end thereof is positioned in the clamping groove 2 so that the fixing piece 4 ) Is installed opposite.
상기한 고정편(4)에는 가이드봉(7)과 수평방향으로 셋트스크류(9)가 나사 결합되어 관통되어 있다.The set screw (9) is screwed through the guide rod (7) in the horizontal direction.
이와같이 구성되는 본 고안은 다수개의 핀삽입구멍(3)에 이젝터핀(10)을 각각 삽입시키고, 셋트스크류(9)를 조이게 되면 가압판(8)이 가이드봉(7)을 따라 안쪽으로 이동되어 이젝터핀(10)을 밀게 된다.The present invention constituted as described above inserts the ejector pins 10 into the plurality of pin insertion holes 3, respectively, and tightens the set screw 9 so that the pressure plate 8 is moved inward along the guide rod 7 to eject the ejector. The pin 10 is pushed.
제 3 도는 가압판(8)에 의해 핀삽입구멍(3)에 이젝터핀(10)이 가압되어 있는 상태의 평면도로서, 다수개의 이 젝터핀(10)이 가압판(8)에 의해 동시에 가압되어 고정됨을 알 수 있다.3 is a plan view of the ejector pin 10 being pressed by the pressing plate 8 to the pin insertion hole 3, showing that the plurality of ejector pins 10 are simultaneously pressed and fixed by the pressing plate 8; Able to know.
이와같이 본 고안은 셋트스크류(9)의 조임으로 가압판(8)이 수평이동되어 다수개의 이젝터핀(10)에 직교방향으로 동시에 힘을 가하기 때문에 이젝터핀(10)은 핀삽입구멍(3)에 삽입된 상태로 고정된다.In this way, the ejector pin 10 is inserted into the pin insertion hole 3 because the pressure plate 8 is horizontally moved by tightening the set screw 9 to simultaneously apply a force to the ejector pins 10 in the orthogonal direction. Is fixed.
따라서 다수개의 이젝터핀(10)의 높이가 일정하게 고정된다.Therefore, the height of the plurality of ejector pins 10 is fixed constantly.
또한 본 고안의 핀홀더는 셋트스크류(9)의 조작만으로 다수개의 이젝터핀(10)을 고정시키거나, 고정력을 해지할 수 있어 핀고정과 교환이 용이하다.In addition, the pin holder of the present invention can fix a plurality of ejector pins 10 by only operating the set screw 9, or can release the fixing force, so pin fixing and exchange are easy.
이상 설명한 바와같이 본 고안은 별도의 지그를 사용하지 않고도 핀의 높이를 정확히 고정시킬 수 있으며, 다수개의 이젝터핀의 고정과 해지를 1개의 셋트스크류로 가능케함으로써, 핀고정과 교환이 용이하다.As described above, the present invention can accurately fix the height of a pin without using a separate jig, and by fixing and releasing a plurality of ejector pins with one set screw, pin fixing and exchange are easy.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019890009212U KR920002163Y1 (en) | 1989-06-29 | 1989-06-29 | Pin holder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019890009212U KR920002163Y1 (en) | 1989-06-29 | 1989-06-29 | Pin holder |
Publications (2)
Publication Number | Publication Date |
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KR910001604U KR910001604U (en) | 1991-01-24 |
KR920002163Y1 true KR920002163Y1 (en) | 1992-03-28 |
Family
ID=19287666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR2019890009212U KR920002163Y1 (en) | 1989-06-29 | 1989-06-29 | Pin holder |
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KR (1) | KR920002163Y1 (en) |
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1989
- 1989-06-29 KR KR2019890009212U patent/KR920002163Y1/en not_active IP Right Cessation
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Publication number | Publication date |
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KR910001604U (en) | 1991-01-24 |
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