KR910010537A - Organic composite solid insulator and its manufacturing method - Google Patents
Organic composite solid insulator and its manufacturing method Download PDFInfo
- Publication number
- KR910010537A KR910010537A KR1019890016322A KR890016322A KR910010537A KR 910010537 A KR910010537 A KR 910010537A KR 1019890016322 A KR1019890016322 A KR 1019890016322A KR 890016322 A KR890016322 A KR 890016322A KR 910010537 A KR910010537 A KR 910010537A
- Authority
- KR
- South Korea
- Prior art keywords
- organic
- weight
- inorganic materials
- insulator
- organic polymer
- Prior art date
Links
- 239000012212 insulator Substances 0.000 title claims 10
- 239000007787 solid Substances 0.000 title claims 7
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000002131 composite material Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims 8
- 239000011147 inorganic material Substances 0.000 claims 8
- 239000011368 organic material Substances 0.000 claims 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 6
- 229920000620 organic polymer Polymers 0.000 claims 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims 4
- 238000001723 curing Methods 0.000 claims 4
- 229920006305 unsaturated polyester Polymers 0.000 claims 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 3
- 229910000077 silane Inorganic materials 0.000 claims 3
- 239000004408 titanium dioxide Substances 0.000 claims 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 2
- 239000002518 antifoaming agent Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000003085 diluting agent Substances 0.000 claims 2
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 claims 2
- 239000000049 pigment Substances 0.000 claims 2
- 239000004597 plastic additive Substances 0.000 claims 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims 1
- 239000004971 Cross linker Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/025—Other inorganic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Insulating Bodies (AREA)
- Insulators (AREA)
- Organic Insulating Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
내용 없음.No content.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
첨부도면은 5종의 크기를 갖는 실리카의 충전 모형도.The attached drawing is a filling model diagram of silica having five sizes.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1-5 : 서로 크기가 다른 실리카1-5: Silicas of different sizes
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890016322A KR920001722B1 (en) | 1989-11-10 | 1989-11-10 | Cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019890016322A KR920001722B1 (en) | 1989-11-10 | 1989-11-10 | Cable |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910010537A true KR910010537A (en) | 1991-06-29 |
KR920001722B1 KR920001722B1 (en) | 1992-02-24 |
Family
ID=19291518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890016322A KR920001722B1 (en) | 1989-11-10 | 1989-11-10 | Cable |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR920001722B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100323360B1 (en) * | 1997-06-09 | 2002-03-08 | 가네꼬 히사시 | Improved Silica Insulation Film with a Reduced Dielectric Constant and Method of Forming the Same |
KR20040006653A (en) * | 2002-07-13 | 2004-01-24 | 주식회사 대한트랜스 | Resin composition for coil insulation |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3404060B1 (en) * | 2017-05-19 | 2022-08-03 | Hitachi Energy Switzerland AG | Silicone rubber with ath filler |
KR102149902B1 (en) * | 2018-05-31 | 2020-08-31 | 주식회사 승진이앤아이 | Current transformer covering material, method for munufacturing current transformer covering material, method for covering current transformer using the same |
-
1989
- 1989-11-10 KR KR1019890016322A patent/KR920001722B1/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100323360B1 (en) * | 1997-06-09 | 2002-03-08 | 가네꼬 히사시 | Improved Silica Insulation Film with a Reduced Dielectric Constant and Method of Forming the Same |
US7056839B2 (en) | 1997-06-09 | 2006-06-06 | Nec Corporation | Method of forming a silica insulation film with a reduced dielectric constant |
KR20040006653A (en) * | 2002-07-13 | 2004-01-24 | 주식회사 대한트랜스 | Resin composition for coil insulation |
Also Published As
Publication number | Publication date |
---|---|
KR920001722B1 (en) | 1992-02-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090225 Year of fee payment: 18 |
|
EXPY | Expiration of term |