KR910007114A - 몰드다이의 플런저 구조 - Google Patents

몰드다이의 플런저 구조 Download PDF

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Publication number
KR910007114A
KR910007114A KR1019890013190A KR890013190A KR910007114A KR 910007114 A KR910007114 A KR 910007114A KR 1019890013190 A KR1019890013190 A KR 1019890013190A KR 890013190 A KR890013190 A KR 890013190A KR 910007114 A KR910007114 A KR 910007114A
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KR
South Korea
Prior art keywords
mold die
plunger structure
tip
plunger
housing
Prior art date
Application number
KR1019890013190A
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English (en)
Other versions
KR0140702B1 (ko
Inventor
장근용
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019890013190A priority Critical patent/KR0140702B1/ko
Publication of KR910007114A publication Critical patent/KR910007114A/ko
Application granted granted Critical
Publication of KR0140702B1 publication Critical patent/KR0140702B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음

Description

몰드다이의 플런저 구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명을 갖는 몰드다이의 어셈블리 개략도.
제 2 도는 본 발명의 일부 파쇄 단면도.

Claims (1)

  1. 몰드다이의 폿트(1)내를 승, 하강하는 플런저(2)의 팁(3)과 하우징(4)내의 후크 (5)와 스크류(6)를 통해 연결함과 함께 팁(3)의 상측 외주 나사부(3a)에는 로크너트 (7)를 설치하여 팁(3)을 하우징(4)에 고정시키도록 됨을 특징으로 하는 몰드다이의 플런저 구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
KR1019890013190A 1989-09-12 1989-09-12 몰드다이의 플런저 구조 KR0140702B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890013190A KR0140702B1 (ko) 1989-09-12 1989-09-12 몰드다이의 플런저 구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890013190A KR0140702B1 (ko) 1989-09-12 1989-09-12 몰드다이의 플런저 구조

Publications (2)

Publication Number Publication Date
KR910007114A true KR910007114A (ko) 1991-04-30
KR0140702B1 KR0140702B1 (ko) 1998-07-15

Family

ID=19289864

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890013190A KR0140702B1 (ko) 1989-09-12 1989-09-12 몰드다이의 플런저 구조

Country Status (1)

Country Link
KR (1) KR0140702B1 (ko)

Also Published As

Publication number Publication date
KR0140702B1 (ko) 1998-07-15

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