KR900013018A - Silicon polyimide precursor composition - Google Patents

Silicon polyimide precursor composition

Info

Publication number: KR900013018A
Authority: KR; South Korea
Prior art keywords: polyimide precursor; precursor composition; silicon polyimide; silicon; composition
Prior art date: 1989-02-02

Application number

KR1019900001150A

Other languages

Korean (ko)

Other versions

KR930004942B1 (en

Inventor

고우이치 구니무네

류지 고바야시

Original Assignee

칫소 가부시끼가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-02-02

Filing date

1990-02-01

Publication date

1990-09-03

1990-02-01 Application filed by 칫소 가부시끼가이샤 filed Critical 칫소 가부시끼가이샤

1990-09-03 Publication of KR900013018A publication Critical patent/KR900013018A/en

1993-06-10 Application granted granted Critical

1993-06-10 Publication of KR930004942B1 publication Critical patent/KR930004942B1/en

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/02—Polysilicates

KR1019900001150A 1989-02-02 1990-02-01 Silicon polyimide precursor composition KR930004942B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP22497		1989-02-02
JP1022497A JP2619515B2 (en)	1989-02-02	1989-02-02	Silicon polyimide precursor composition

Publications (2)

Publication Number	Publication Date
KR900013018A true KR900013018A (en)	1990-09-03
KR930004942B1 KR930004942B1 (en)	1993-06-10

Family

ID=12084381

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019900001150A KR930004942B1 (en)	1989-02-02	1990-02-01	Silicon polyimide precursor composition

Country Status (6)

Country	Link
US (1)	US5071908A (en)
EP (1)	EP0381506B1 (en)
JP (1)	JP2619515B2 (en)
KR (1)	KR930004942B1 (en)
DE (1)	DE69029413T2 (en)
SG (1)	SG44540A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04351666A (en) *	1991-05-29	1992-12-07	Shin Etsu Chem Co Ltd	Curable resin composition and protective film for electronic component
JPH04351667A (en) *	1991-05-29	1992-12-07	Shin Etsu Chem Co Ltd	Curable resin composition and protective film for electronic component
JP3227892B2 (en) *	1993-04-20	2001-11-12	チッソ株式会社	Silicon-containing polyamic acid derivative and photosensitive resin composition using the same
JP3004583U (en) *	1994-02-15	1994-11-22	相云李	Stone polishing machine
JP3731229B2 (en) *	1995-10-20	2006-01-05	チッソ株式会社	Polyamide acid, polyimide film, liquid crystal alignment film using the same, and liquid crystal display element
US5962113A (en) *	1996-10-28	1999-10-05	International Business Machines Corporation	Integrated circuit device and process for its manufacture
US20230167252A1 (en) *	2020-03-24	2023-06-01	Toray Industries, Inc.	Resin film, method for producing same, resin composition, display and method for producing same
CN112143000B (en) *	2020-08-17	2022-10-11	永丰航盛电子有限公司	Preparation method of all-organic PI/PVDF film composite material
CN114539535B (en) *	2020-11-25	2023-04-07	中蓝晨光化工研究设计院有限公司	Single-component room-temperature-cured elastoplastic silicone resin containing acylamino and preparation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3948835A (en) *	1973-06-07	1976-04-06	Ciba-Geigy Corporation	Silicon-modified prepolymers
US3950308A (en) *	1973-06-07	1976-04-13	Ciba-Geigy Corporation	Crosslinked polymers containing siloxane groups
JPS591423B2 (en) *	1977-12-29	1984-01-12	鐘淵化学工業株式会社	Room temperature curable composition
JPS61108627A (en) *	1984-11-02	1986-05-27	Chisso Corp	Soluble polyimidesiloxane precursor and its production
US4499252A (en) *	1984-03-28	1985-02-12	Nitto Electric Industrial Co., Ltd.	Process for producing polyimide precursor
JPH0617474B2 (en) *	1985-05-31	1994-03-09	チッソ株式会社	Method for producing highly adhesive silicon-containing polyamic acid
US4609700A (en) *	1985-06-19	1986-09-02	Chisso Corporation	Soluble imide oligomer and a method for producing the same
JP2609256B2 (en) *	1987-07-21	1997-05-14	鐘淵化学工業株式会社	Curable composition
EP0316154B1 (en) *	1987-11-10	1995-02-08	Chisso Corporation	Silicon-containing polyimide precursor, cured product therefrom, and preparation thereof

1989
- 1989-02-02 JP JP1022497A patent/JP2619515B2/en not_active Expired - Lifetime
1990
- 1990-01-24 US US07/469,780 patent/US5071908A/en not_active Expired - Lifetime
- 1990-02-01 SG SG1996001874A patent/SG44540A1/en unknown
- 1990-02-01 DE DE69029413T patent/DE69029413T2/en not_active Expired - Fee Related
- 1990-02-01 EP EP90301079A patent/EP0381506B1/en not_active Expired - Lifetime
- 1990-02-01 KR KR1019900001150A patent/KR930004942B1/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
EP0381506A3 (en)	1993-02-03
EP0381506A2 (en)	1990-08-08
JPH02202950A (en)	1990-08-13
JP2619515B2 (en)	1997-06-11
DE69029413T2 (en)	1997-05-15
KR930004942B1 (en)	1993-06-10
SG44540A1 (en)	1997-12-19
DE69029413D1 (en)	1997-01-30
EP0381506B1 (en)	1996-12-18
US5071908A (en)	1991-12-10

Legal Events

Date	Code	Title	Description
1990-02-01	A201	Request for examination
1993-05-18	G160	Decision to publish patent application
1993-08-30	E701	Decision to grant or registration of patent right
1993-10-25	GRNT	Written decision to grant
1997-06-04	FPAY	Annual fee payment	Payment date: 19970604 Year of fee payment: 5
1998-06-11	LAPS	Lapse due to unpaid annual fee

Publication	Publication Date	Title
NO175484C (en)	1994-10-19	Silicon carbide - abrasive
BR8700056A (en)	1987-12-01	ORGANOPOLYSILOXAN COMPOSITION
KR920701529A (en)	1992-08-11	Silicon single crystal manufacturing equipment
DK348089A (en)	1990-01-15	SEMICONDUCTOR COMPOSITION
DE69013631T2 (en)	1995-05-24	Single crystal silicon.
KR900013018A (en)	1990-09-03	Silicon polyimide precursor composition
KR880701017A (en)	1988-04-13	Semiconductor device
DE69033794D1 (en)	2001-10-18	Semiconductor device
DE69031609D1 (en)	1997-11-27	Semiconductor device
DE3751971D1 (en)	1997-01-16	Spreader
DE69029226D1 (en)	1997-01-09	Semiconductor device
KR890005864A (en)	1989-05-17	Semiconductor device
KR890004438A (en)	1989-04-22	Semiconductor device
RO95836A (en)	1988-10-30	ERBICIDA LICHIDA COMPOSITION
DE69025825D1 (en)	1996-04-18	Semiconductor device
DE69027586D1 (en)	1996-08-01	Semiconductor device
KR900015287A (en)	1990-10-26	Semiconductor device
KR900012356A (en)	1990-08-03	Semiconductor device
KR880701456A (en)	1988-07-27	Semiconductor device
DK230888A (en)	1988-06-16	DEVICE FOR CONVENTIONAL TRADEOERS
KR910013564A (en)	1991-07-31	Semiconductor device
KR900019258A (en)	1990-12-24	Semiconductor device
KR880003791U (en)	1988-04-14	Semiconductor device
KR910002001A (en)	1991-01-31	Master-slice type semiconductor device
KR910011122U (en)	1991-07-29	Form fastening device