KR900008633A - 더블메탈배선방법 - Google Patents
더블메탈배선방법Info
- Publication number
- KR900008633A KR900008633A KR1019880015843A KR880015843A KR900008633A KR 900008633 A KR900008633 A KR 900008633A KR 1019880015843 A KR1019880015843 A KR 1019880015843A KR 880015843 A KR880015843 A KR 880015843A KR 900008633 A KR900008633 A KR 900008633A
- Authority
- KR
- South Korea
- Prior art keywords
- metal wiring
- double metal
- wiring method
- double
- wiring
- Prior art date
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880015843A KR970007106B1 (ko) | 1988-11-30 | 1988-11-30 | 더블메탈배선방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880015843A KR970007106B1 (ko) | 1988-11-30 | 1988-11-30 | 더블메탈배선방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900008633A true KR900008633A (ko) | 1990-06-03 |
KR970007106B1 KR970007106B1 (ko) | 1997-05-02 |
Family
ID=19279718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880015843A KR970007106B1 (ko) | 1988-11-30 | 1988-11-30 | 더블메탈배선방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970007106B1 (ko) |
-
1988
- 1988-11-30 KR KR1019880015843A patent/KR970007106B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR970007106B1 (ko) | 1997-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20100726 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |