KR900008633A - 더블메탈배선방법 - Google Patents

더블메탈배선방법

Info

Publication number
KR900008633A
KR900008633A KR1019880015843A KR880015843A KR900008633A KR 900008633 A KR900008633 A KR 900008633A KR 1019880015843 A KR1019880015843 A KR 1019880015843A KR 880015843 A KR880015843 A KR 880015843A KR 900008633 A KR900008633 A KR 900008633A
Authority
KR
South Korea
Prior art keywords
metal wiring
double metal
wiring method
double
wiring
Prior art date
Application number
KR1019880015843A
Other languages
English (en)
Other versions
KR970007106B1 (ko
Inventor
김선종
Original Assignee
엘지반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체 주식회사 filed Critical 엘지반도체 주식회사
Priority to KR1019880015843A priority Critical patent/KR970007106B1/ko
Publication of KR900008633A publication Critical patent/KR900008633A/ko
Application granted granted Critical
Publication of KR970007106B1 publication Critical patent/KR970007106B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1019880015843A 1988-11-30 1988-11-30 더블메탈배선방법 KR970007106B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019880015843A KR970007106B1 (ko) 1988-11-30 1988-11-30 더블메탈배선방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880015843A KR970007106B1 (ko) 1988-11-30 1988-11-30 더블메탈배선방법

Publications (2)

Publication Number Publication Date
KR900008633A true KR900008633A (ko) 1990-06-03
KR970007106B1 KR970007106B1 (ko) 1997-05-02

Family

ID=19279718

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880015843A KR970007106B1 (ko) 1988-11-30 1988-11-30 더블메탈배선방법

Country Status (1)

Country Link
KR (1) KR970007106B1 (ko)

Also Published As

Publication number Publication date
KR970007106B1 (ko) 1997-05-02

Similar Documents

Publication Publication Date Title
DK137989A (da) Overgangsmetalforbindelser
DK317889A (da) Sproejtemetode
BR8906484A (pt) Controlador eletronico
ATA89385A (de) Leitungsdurchfuehrung
DK38790D0 (da) Stilladsmodul
KR900013335U (ko) 전자 계전기
ATA28089A (de) Metallegierung
DE68916020D1 (de) Auftragemethode.
DK1788A (da) Boreelement
DE68912648D1 (de) Bauverfahren.
KR900702433A (ko) 레퍼런스점 복귀방식
IT9020623A0 (it) procedimento
DE3850176D1 (de) Verdrahtungsverfahren.
KR900007491A (ko) 연속 처리 방법
KR890013292A (ko) 녹화기반 조성 공법
ATA31988A (de) Schmiermittel
KR900008633A (ko) 더블메탈배선방법
ATA239788A (de) Vorgefertigtes bauelement
DE3877180D1 (de) Dickenmessverfahren.
KR900000916U (ko) 감속기
KR900700643A (ko) 철-보론-실리콘 합금의 제조방법
KR880017974U (ko) 금속제 샷틀텐숀
SE8801266D0 (sv) Legering
SE8700072D0 (sv) Hopfellbar metstav
BR8702604A (pt) Metodo loterico

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20100726

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee