KR900002440A - 피가공물 가열이송장치 - Google Patents

피가공물 가열이송장치 Download PDF

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Publication number
KR900002440A
KR900002440A KR1019890009411A KR890009411A KR900002440A KR 900002440 A KR900002440 A KR 900002440A KR 1019890009411 A KR1019890009411 A KR 1019890009411A KR 890009411 A KR890009411 A KR 890009411A KR 900002440 A KR900002440 A KR 900002440A
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KR
South Korea
Prior art keywords
heat transfer
cover
workpiece
heat
transfer device
Prior art date
Application number
KR1019890009411A
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English (en)
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KR920005800B1 (ko
Inventor
노부도 야마자끼
히로시 우시끼
겐지 기다구보
Original Assignee
야스구모 다께시
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 야스구모 다께시, 가부시끼가이샤 신가와 filed Critical 야스구모 다께시
Publication of KR900002440A publication Critical patent/KR900002440A/ko
Application granted granted Critical
Publication of KR920005800B1 publication Critical patent/KR920005800B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Reciprocating Conveyors (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Tunnel Furnaces (AREA)

Abstract

내용 없음.

Description

피가공물 가열이송장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예를 나타내며, (a)는 평면도, (b)는 (a)의 A-A선 단면도.
제2도는 본 발명의 다른 실시예를 나타내는 단면도.

Claims (3)

  1. 피가공물을 가열하는 히트블록 위쪽에 덮개를 설치한 피가공물 가열이송장치에 있어서, 상기 덮개의 중앙부에 개구부를 설치하고, 상기 개구부를 덮도록 투명한 내열판을 설치한 것을 특징으로 하는 피가공물 가열이송장치.
  2. 피가공물을 가열하는 히트블록의 위쪽을 덮도록 덮개를 설치한 피가공물 가열이송장치에 있어서, 상기 덮개는 투명한 내열판으로 이루어지는 것을 특징으로 하는 피가공물 가열이송장치.
  3. 제1항 또는 제2항에 있어서, 상기 투명한 내열판을 내열유리로 이루어지는 것을 특징으로 하는 피가공물 가열이송장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890009411A 1988-07-04 1989-07-03 피가공물 가열이송장치 KR920005800B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63166544A JPH0793337B2 (ja) 1988-07-04 1988-07-04 ワーク加熱送り装置
JP63-166544 1988-07-04
JP88-166544 1988-07-04

Publications (2)

Publication Number Publication Date
KR900002440A true KR900002440A (ko) 1990-02-28
KR920005800B1 KR920005800B1 (ko) 1992-07-18

Family

ID=15833241

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890009411A KR920005800B1 (ko) 1988-07-04 1989-07-03 피가공물 가열이송장치

Country Status (3)

Country Link
US (1) US4975050A (ko)
JP (1) JPH0793337B2 (ko)
KR (1) KR920005800B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM468013U (zh) * 2013-07-18 2013-12-11 Pram Technology Inc 電子業製程共用式可拆裝替換之打線熱板
CN104668693B (zh) * 2015-01-22 2016-05-18 福建省万达汽车玻璃工业有限公司 一种舌片自动焊接及检测流水线
CN107976071B (zh) * 2017-12-20 2023-08-01 大连重工机电设备成套有限公司 分体补偿式宽布料铁合金炉下料嘴

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900145A (en) * 1972-10-13 1975-08-19 John C Diepeveen Apparatus for incremental movement of die frame
US3800716A (en) * 1973-02-16 1974-04-02 R Berger Furnace closure
US3859041A (en) * 1974-01-21 1975-01-07 Ney Co J M Muffle furnace with sighting assembly
US3980028A (en) * 1975-05-30 1976-09-14 Leon Ginsburg Interchangeable see-through and opaque inserts for muffle furnace
JPS5645040A (en) * 1979-09-21 1981-04-24 Hitachi Ltd Wire bonding apparatus
US4732313A (en) * 1984-07-27 1988-03-22 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing semiconductor device
US4763826A (en) * 1986-05-14 1988-08-16 Kulicke And Soffa Ind., Inc. Automatic wire feed system
US4765531A (en) * 1987-05-14 1988-08-23 Kulicke And Soffa Industries Inc. Quick change work station apparatus for automatic wire bonders
US4855007A (en) * 1988-06-03 1989-08-08 Motorola Inc. Automatic die attach workholder

Also Published As

Publication number Publication date
JPH0793337B2 (ja) 1995-10-09
US4975050A (en) 1990-12-04
KR920005800B1 (ko) 1992-07-18
JPH0216743A (ja) 1990-01-19

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