KR890017781A - Dry Etching Equipment - Google Patents
Dry Etching Equipment Download PDFInfo
- Publication number
- KR890017781A KR890017781A KR1019890006274A KR890006274A KR890017781A KR 890017781 A KR890017781 A KR 890017781A KR 1019890006274 A KR1019890006274 A KR 1019890006274A KR 890006274 A KR890006274 A KR 890006274A KR 890017781 A KR890017781 A KR 890017781A
- Authority
- KR
- South Korea
- Prior art keywords
- ring
- dry etching
- etching apparatus
- reaction vessel
- holes
- Prior art date
Links
- 238000001312 dry etching Methods 0.000 title claims 7
- 238000001816 cooling Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제 1 도는 본 발명의 제 1 의 실시예의 단면도, 제 2 도는 본 발명의 제 2 의 실시예의 단면도, 제 3 도는 본 발명의 제 3 의 실시예의 단면도.1 is a cross-sectional view of a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a third embodiment of the present invention.
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63-117211 | 1988-05-13 | ||
JP88-117211 | 1988-05-13 | ||
JP63117211A JP2926711B2 (en) | 1988-05-13 | 1988-05-13 | Dry etching equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890017781A true KR890017781A (en) | 1989-12-18 |
KR930002675B1 KR930002675B1 (en) | 1993-04-07 |
Family
ID=14706142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890006274A KR930002675B1 (en) | 1988-05-13 | 1989-05-10 | Apparatus for dry etching |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2926711B2 (en) |
KR (1) | KR930002675B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7959984B2 (en) * | 2004-12-22 | 2011-06-14 | Lam Research Corporation | Methods and arrangement for the reduction of byproduct deposition in a plasma processing system |
JP5157199B2 (en) * | 2007-03-07 | 2013-03-06 | 東京エレクトロン株式会社 | Vacuum vessel, pressure vessel and sealing method thereof |
JP5282008B2 (en) * | 2009-10-26 | 2013-09-04 | 株式会社日立ハイテクノロジーズ | Vacuum processing equipment |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6012735A (en) * | 1983-07-01 | 1985-01-23 | Hitachi Ltd | Etching device |
JPS6146029A (en) * | 1984-08-10 | 1986-03-06 | Nec Corp | Plasma apparatus |
JPH051072Y2 (en) * | 1985-08-29 | 1993-01-12 | ||
JPH0528757Y2 (en) * | 1985-12-25 | 1993-07-23 | ||
JPS6393114A (en) * | 1986-10-08 | 1988-04-23 | Tokuda Seisakusho Ltd | Dry etching device |
-
1988
- 1988-05-13 JP JP63117211A patent/JP2926711B2/en not_active Expired - Lifetime
-
1989
- 1989-05-10 KR KR1019890006274A patent/KR930002675B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2926711B2 (en) | 1999-07-28 |
KR930002675B1 (en) | 1993-04-07 |
JPH01287285A (en) | 1989-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
GRNT | Written decision to grant | ||
E701 | Decision to grant or registration of patent right | ||
FPAY | Annual fee payment |
Payment date: 20080328 Year of fee payment: 16 |
|
EXPY | Expiration of term |