KR890008578Y1 - A vessel apparatus of plasma - Google Patents
A vessel apparatus of plasma Download PDFInfo
- Publication number
- KR890008578Y1 KR890008578Y1 KR2019870008402U KR870008402U KR890008578Y1 KR 890008578 Y1 KR890008578 Y1 KR 890008578Y1 KR 2019870008402 U KR2019870008402 U KR 2019870008402U KR 870008402 U KR870008402 U KR 870008402U KR 890008578 Y1 KR890008578 Y1 KR 890008578Y1
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- South Korea
- Prior art keywords
- door
- vacuum
- vacuum container
- plasma
- ceramic rod
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안에 따른 진공 용기의 이중 도어 장치.1 is a double door device of a vacuum vessel according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 본체 2 : 진공용기1: main body 2: vacuum container
3, 7, 9 : 오링 4 : 내부도어3, 7, 9: O-ring 4: Internal door
5, 11 : 구멍 6 : 수정유리5, 11 hole 6: crystal glass
8 : 볼엔드베어링 9 : 외부도어8: Ball End Bearing 9: Outer Door
10 : 세락믹로드 12 : 벨로우즈10: ceramic rod 12: bellows
13 : 플렌지 14 : 고정볼트13: flange 14: fixing bolt
본 고안은 반도체 제조 장치인 플라즈마 스트립퍼(Plasma Stripper)의 이중 도어 장치에 관한 것으로 특히 진공 용기내의 진공 상태를 완벽히 유지시키도록 한 이중 도어 장치에 관한 것이다. 일반적으로 플라즈마 스트립퍼는 반도체의 제조 공정중 산화규소(SiO2)의 웨이퍼 상면에 포토 레지스트(Photo Resist) 물질을 입혀 빛에 의해 일정 부분이 웨이퍼를 벗기는 작업을 하는 것으로, 이러한 작업을 하기 위해서는 플라즈마 스트립퍼에 진공 용기를 설치하여 그 내부에서 실행하도록 되어 있으나, 종래의 플라즈마 스트립퍼 장치에 있어 진공 용기의 도어 구조는 단일 도어 구조로 되어 있어 도어를 닫은 상태에서 작업을 행할시 진공 용기내의 진공 상태가 정확히 이루어지지 않아 제품의 불량이 많았으며 또한 진공 용기를 진공 상태로 유지시키기 위해서는 도어 외부에서 많은 부품을 사용하여 진공 용기를 봉해야 했으므로 많은 불편이 있었고 제조 원가가 상승하게 되었다.The present invention relates to a double door device of a plasma stripper, which is a semiconductor manufacturing device, and more particularly, to a double door device to maintain a vacuum state in a vacuum container completely. In general, the plasma stripper coats a photoresist material on the upper surface of the silicon oxide (SiO 2 ) wafer during the semiconductor manufacturing process to remove a portion of the wafer by light. In the conventional plasma stripper device, the door structure of the vacuum container has a single door structure, so that the vacuum state in the vacuum container is precisely performed when the door is closed. There were many defects of the product because it was not supported, and in order to keep the vacuum container in a vacuum state, it was necessary to seal the vacuum container using many parts from the outside of the door, which caused a lot of inconvenience and increased manufacturing costs.
이에 본 고안은 상기한 문제점을 개선시키기 위한 것으로 진공 용기의 도어 구조를 이중 도어로 하여 외부도어와 내부 도어 사이에 벨로우즈 호스를 설치시킨 것으로, 이하 그 기술 구성을 첨부된 도면에 따라 설명하면 다음과 같다.Therefore, the present invention is to improve the above-mentioned problems, and the bellows hose is installed between the outer door and the inner door by using the door structure of the vacuum container as a double door. Hereinafter, the technical configuration will be described with reference to the accompanying drawings. same.
본제(1) 내부의 진공용기(2) 입구부 주위에 오링(3)을 설치하고, 진공용기(2)의 입구에는 내부도어(4)가 볼엔드 베어링(8)에 의해 외부도어(9)와 연결되어 있으며, 내부도어(4)의 상측에는 구멍(5)을 뚫어 수정유리(6)를 오링(7)에 의해 설치하여 작업자가 수정유리(6)를 통해 진공 용기(2) 내부를 관찰할 수 있도록 하고, 상긴 외부도어(9)의 내면 중심 하부에는 반도체 웨이퍼를 올려 놓아 진공 용기 내에서 작업할 수 있도록 한 세라믹 로드(10)가 고정되어 있어 내부도어(4)의 구멍(11)을 통해 진공용기(2)내로 진입시키며, 이때 내부도어(4)의 구멍(11)은 세라믹로드(10)의 직경보다 크게하여 내부도어(4)가 볼엔드 베어링(8)에 의해 상하좌우로 유동될 수 있도록 하고, 상기 내부도어(4)의 구멍(11)은 세라믹 로드(10)의 직경보다 크게 되어 있어 도어를 닫아 작업할시에도 구멍(11)과 세라믹로드(10)의 틈새에 의해 진공용기(2)는 진공 상태를 유지할 수 없으므로 내부도어(4)의 구멍(11) 주위면과 외부도어(9)의 세라믹로드(10) 고정부위 사이에 얇은 스테인레스 호스로 되어 상하 좌우 원활히 움직일 수 있는 벨로우즈(12)를 설치하여 그 양단에 플렌지(13)를 형성시켜 오링(15)과 고정볼트(14)로서 각각 고정시키도록 구성한 것으로, 상기 기술 구성의 동작 상태 및 작용 효과를 도면에 따라 설명하면 다음과 같다.The O-ring 3 is provided around the inlet of the vacuum container 2 inside the main body 1, and the inner door 4 is provided at the inlet of the vacuum container 2 by the ball-end bearing 8 to the outer door 9. Is connected to the upper side of the inner door (4) by drilling a hole (5) to install the crystal glass (6) by the O-ring (7), the operator observes the inside of the vacuum container (2) through the crystal glass (6) In the lower portion of the inner center of the upper outer door 9, a ceramic rod 10 is fixed to place a semiconductor wafer to work in a vacuum container, thereby opening the hole 11 of the inner door 4. It enters into the vacuum vessel 2 through the hole 11 of the inner door 4 is larger than the diameter of the ceramic rod 10 so that the inner door 4 flows up, down, left and right by the ball end bearing 8. The opening 11 of the inner door 4 is larger than the diameter of the ceramic rod 10 so that the door can be closed even when the door is closed. Since the vacuum container 2 cannot maintain the vacuum state due to the gap between the hole 11 and the ceramic rod 10, the ceramic rod 10 of the periphery of the hole 11 of the inner door 4 and the outer door 9 can be maintained. It is configured to be fixed as O-ring 15 and fixing bolts 14 by forming a flange 13 at both ends by installing a bellows 12 that can be moved smoothly up and down and left and right by a thin stainless hose between the fixing portion, Operation state and effect of the above described technical configuration will be described with reference to the drawings.
외부도어(9)는 볼엔드 베어링(8)에 의해 내부도어(4)와 연결되어 있으며 하측으로는 세라믹 로드(10)와 연결되면 있어 작업 완료시 전기적인 조작에 의해 외부도어(9)를 열게되어 외부도어(9)는 본체(1)의 전면 방향인 A방향으로 이동하게 되어 진공용기(2)의 입구를 막고있던 내부도어(4)와 세라믹로드(10)를 이동시키게 된다.The outer door 9 is connected to the inner door 4 by the ball end bearing 8 and to the lower side of the outer door 9 so as to open the outer door 9 by electrical manipulation when the work is completed. Thus, the outer door 9 moves in the direction A of the front surface of the main body 1 to move the inner door 4 and the ceramic rod 10 which are blocking the inlet of the vacuum container 2.
그리고 이 상태에서 작업시에는 진공요기(2)를 빠져나온 세라믹로드(10)의 상면에 가공하고저 하는 반도체 웨이퍼를 올려놓고 전기적인 조작에 의해 도어를 닫게 되면 외부도어(9)는 상기 A방향과 반대 방향으로 이동되어 세라믹 로드(10)가 진공용기(2)내로 진입하게 되며 내부도어(4)는 진공용기(2)의 입구를 막게된다.In this state, when the semiconductor wafer is processed and placed on the upper surface of the ceramic rod 10 which has escaped from the vacuum ware 2 and the door is closed by an electrical operation, the outer door 9 is in the A direction. The ceramic rod 10 is moved into the vacuum vessel 2 by moving in the opposite direction, and the inner door 4 blocks the inlet of the vacuum vessel 2.
이때, 오링(3)은 내부도어(4)가 닫힐시 완충작용을 하게 되며 완전히 닫힌 후에는 진공용기(2)의 누출상태를 방지하도록 실링(Sealing) 역할을 하게 되고, 오링(7)(15)도 각각의 체결 부위에서 진공용기(2)의 누출상태를 방지하는 실링 역할을 하도록 되어 있다.At this time, the O-ring (3) is to act as a buffer when the inner door (4) is closed, and after it is completely closed to act as a sealing (Sealing) to prevent the leakage state of the vacuum container (2), O-ring (7) (15) ) Also serves to seal the leakage of the vacuum container (2) at each fastening portion.
따라서 본 고안은 이상의 설명에서와 같이 진공용기의 도어 구조를 이중으로 하여 진공용기의 진공 상태를 완벽하게 유지시켜 제품의 불량을 방지시켰으며 또한 그 구조가 간단하게 구성되어 있어 저가로 제조할 수 있는 효과를 갖게 된다.Therefore, the present invention doubles the door structure of the vacuum container as described above to perfectly maintain the vacuum state of the vacuum container to prevent product defects, and also the structure is simple to manufacture at low cost Will have an effect.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019870008402U KR890008578Y1 (en) | 1987-05-28 | 1987-05-28 | A vessel apparatus of plasma |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019870008402U KR890008578Y1 (en) | 1987-05-28 | 1987-05-28 | A vessel apparatus of plasma |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR880022724U KR880022724U (en) | 1988-12-27 |
| KR890008578Y1 true KR890008578Y1 (en) | 1989-11-30 |
Family
ID=19263471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019870008402U KR890008578Y1 (en) | 1987-05-28 | 1987-05-28 | A vessel apparatus of plasma |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR890008578Y1 (en) |
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1987
- 1987-05-28 KR KR2019870008402U patent/KR890008578Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR880022724U (en) | 1988-12-27 |
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