KR890008249A - Curable composition containing bifunctional epoxy resin, multifunctional epoxy resin, bifunctional phenol and polyfunctional phenol - Google Patents

Curable composition containing bifunctional epoxy resin, multifunctional epoxy resin, bifunctional phenol and polyfunctional phenol Download PDF

Info

Publication number
KR890008249A
KR890008249A KR1019880005136A KR880005136A KR890008249A KR 890008249 A KR890008249 A KR 890008249A KR 1019880005136 A KR1019880005136 A KR 1019880005136A KR 880005136 A KR880005136 A KR 880005136A KR 890008249 A KR890008249 A KR 890008249A
Authority
KR
South Korea
Prior art keywords
component
composition
phenolic hydroxyl
general formula
epoxy resin
Prior art date
Application number
KR1019880005136A
Other languages
Korean (ko)
Other versions
KR920001742B1 (en
Inventor
엘.위커 루이스
에이. 라슨 폴
Original Assignee
리챠드 지.웨터맨
더 다우 케미칼 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 리챠드 지.웨터맨, 더 다우 케미칼 캄파니 filed Critical 리챠드 지.웨터맨
Publication of KR890008249A publication Critical patent/KR890008249A/en
Application granted granted Critical
Publication of KR920001742B1 publication Critical patent/KR920001742B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

내용 없음No content

Description

이작용성 에폭시 수지, 다작용성 에폭시 수지, 이작용성 페놀 및 다작용성 페놀을 함유하는 경화성 조성물Curable composition containing bifunctional epoxy resin, multifunctional epoxy resin, bifunctional phenol and polyfunctional phenol

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (12)

(A)필수적으로(1)분자당(평균)2개 이하의 인접한 에폭사이드 그룹을 갖는 하나 이상의 에폭시 수지 5 내지 96중량%: 및 (2)분자당(평균)2개 이상의 인접한 에폭사이드 그룹을 갖는 하나 이상의 에폭시 수지 95 내지 5중량%로 구성된 에폭시-함유 성분: 및 (B)필수적으로(1)분자당 평균 2개 이하의 페놀성 히드록실 그룹을 갖는 하나 이상의 페놀성 히드록실-함유 화합물 10 내지 70중량%: 및 (2)분자당 평균 2개 이상의 페놀성 히드록실 그룹을 갖는 하나 이상의 페놀성 히드록실-함유 화합물 90 내지 30중량%로 구성된 페놀성 히드록실-함유 성분으로 이루어지며, 성분(A) 및 (B)가 각각의 에폭시 그룹에 대한 페놀성 히드록실 그룹의 비가 0.75:1 내지 1.2:1이 되도록 하는 양으로 존재하는 조성물.(A) 5 to 96% by weight of at least one epoxy resin having (1) up to two adjacent epoxide groups per molecule (average): and (2) at least two adjacent epoxide groups per molecule (average) Epoxy-containing components consisting of 95 to 5% by weight of one or more epoxy resins having: and (B) essentially one or more phenolic hydroxyl-containing compounds having an average of up to two phenolic hydroxyl groups per molecule (10) To 70% by weight: and (2) a phenolic hydroxyl-containing component consisting of 90 to 30% by weight of at least one phenolic hydroxyl-containing compound having an average of at least two phenolic hydroxyl groups per molecule, The composition wherein (A) and (B) are present in an amount such that the ratio of phenolic hydroxyl groups to each epoxy group is from 0.75: 1 to 1.2: 1. 제1항에 있어서, (a)성분(A-1)이 하기 일반식(Ⅰ) 또는 (Ⅱ)의 에폭시 수지 또는 이러한 에폭시 수지의 혼합물이고, (b)성분(A-2)이 하기 일반식(Ⅲ) 또는 (Ⅳ)의 에폭시 수지 또는 이러한 에폭시 수지의 혼합물이며, (c)성분(B-1)이 하기 일반식(Ⅴ) 또는 (Ⅵ)의 페놀성 히드록실-함유 화합물 또는 이러한 페놀성 히드록실-함유 화합물의 혼합물이고, (d)성분(B-2)가 하기 일반식(Ⅶ) 또는 (Ⅷ)의 페녹성 히드록실-함유 화합물 또는 이러한 페놀성 히드록실-함유 화합물의 혼합물인 조성물.(A) Component (A-1) is an epoxy resin of following General formula (I) or (II), or a mixture of such epoxy resins, (b) Component (A-2) is a following general formula Epoxy resin of (III) or (IV) or a mixture of such epoxy resins, (c) Component (B-1) is a phenolic hydroxyl-containing compound of the following general formula (V) or (VI), or such phenolic A composition of hydroxyl-containing compounds, wherein (d) component (B-2) is a phenoxy hydroxyl-containing compound of formula (VII) or (iii) or a mixture of such phenolic hydroxyl-containing compounds . 상기식에서 A는 각각 독립적으로 C1내지 C10의 2가 히드로카르빌그룹, -S-, -S-S-, -SO-, -SO2-, -CO- 또는 -O-이며, A'는 각각 독립적으로 C1내지 C10의 2가 히드로카르빌 그룹이고, R은 각각 독립적으로 수소 또는 C1내지 C3의 알킬그룹이며, R'는 각각 독립적으로 수소 또는 C1내지 C10의 히드로카르빌 그룹이고, x는 각각 독립적으로 수소, C1내지 C10의 알킬 그룹 또는 할로겐이며, m은 0,1 내지 7이고, m'는 0 내지 3이며, n은 각각 독립적으로 0 또는 1이고, n'는 0 내지 10이다.Wherein A is independently a C 1 to C 10 divalent hydrocarbyl group, -S-, -SS-, -SO-, -SO 2- , -CO- or -O-, and A 'are each Independently a divalent hydrocarbyl group of C 1 to C 10 , each R is independently hydrogen or an alkyl group of C 1 to C 3 , and each R ′ is independently hydrogen or a hydrocarbyl of C 1 to C 10 And x is each independently hydrogen, an alkyl group or halogen of C 1 to C 10 , m is 0,1 to 7, m 'is 0 to 3, n is each independently 0 or 1, n 'Is 0 to 10. 제2항에 있어서, (a)성분(A-1)이 n이 1이고 n'가 0 내지 2인 일반식(Ⅱ)의 디글리시딜 에테르이고, (b)성분(A-2)가 m이 1 내지 5인 일반식(Ⅲ)의 폴리글리시딜 에테르이며, (c)성분(B-1)이 n이 1인 일반식(Ⅵ)의 페놀성 히드록실-함유 화합물이고, (d)성분(B-2)가 m이 0,1 내지 7인 일반식(Ⅶ)의 페놀성 히드록실-함유 화합물인 조성물.The diglycidyl ether of the general formula (II) according to claim 2, wherein (a) component (A-1) is n is 1 and n 'is 0 to 2, and (b) component (A-2) is m is a polyglycidyl ether of the general formula (III) having 1 to 5, (c) component (B-1) is a phenolic hydroxyl-containing compound of the general formula (VI) wherein n is 1, (d The component (B-2) is a phenolic hydroxyl-containing compound of general formula (m) whose m is 0,1-7. 제3항에 있어서, (a)성분(A-1)이 n이 1이고 n'가 0 내지 2인 일반식(Ⅱ)의 디글리시딜 에테르이고, (b)성분(A-2)가 페놀-포름알데히드 노볼락 에폭시 수지의폴리글리시딜 에테르이며, (c)성분(B-1)이 비스페놀 A또는 테트라브로모비스페놀 A이고, (d)성분(B-2)가 페놀-포름알데히드 노볼락 수지인 조성물.The diglycidyl ether of the general formula (II) according to claim 3, wherein (a) component (A-1) is n is 1 and n 'is 0 to 2, and (b) component (A-2) is Polyglycidyl ether of a phenol-formaldehyde novolac epoxy resin, (c) component (B-1) is bisphenol A or tetrabromobisphenol A, and (d) component (B-2) is phenol-formaldehyde The composition is a novolak resin. 제1항에 있어서, 성분(A)와 (B)의 반응을 수행하기 위한 하나 이상의 촉매(C)의 촉매량을 추가로 함유하는 조성물.The composition of claim 1 further comprising a catalytic amount of at least one catalyst (C) for carrying out the reaction of components (A) and (B). 제5항에 있어서, 촉매가 포스포늄 화합물, 이미다졸 또는 이의 혼합물인 조성물.The composition of claim 5 wherein the catalyst is a phosphonium compound, imidazole or mixtures thereof. 제6항에 있어서, 촉매가 1:0.9 내지 1:1.25의 몰비의 4급 포스포늄 아세테이트, 아세트산 착물: 플루오로 붕산, 2-메틸이미다졸 또는 이의 혼합물인 조성물.The composition of claim 6 wherein the catalyst is a quaternary phosphonium acetate, acetic acid complex: fluoroboric acid, 2-methylimidazole or mixtures thereof in a molar ratio of 1: 0.9 to 1: 1.25. 제1항에 있어서, 안정화제를 추가로 함유하는 조성물.The composition of claim 1 further comprising a stabilizer. 제5항 내지 제7항중 어느 한항에 있어서, 총 조성물의 1 내지 75중량%의 양으로 하나 이상의 용매(D)를 추가로 함유하는 조성물.8. The composition of any one of claims 5 to 7, further comprising at least one solvent (D) in an amount of 1 to 75% by weight of the total composition. 제5항 내지 제7항중 어느 한항의 조성물을 경화시켜 수득한 제품.An article obtained by curing the composition of any one of claims 5-7. 제9항의 조성물로 침지시킨 기질 재표의 하나 이상의 층을 경화시켜 수득한 적층판.A laminate obtained by curing one or more layers of the substrate table immersed in the composition of claim 9. 제11항에 있어서, 전기 전도성 재표의 외층을 갖는 적층판.The laminate of claim 11 having an outer layer of electrically conductive material. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019880005136A 1987-11-16 1988-05-03 Curable compositions containing a difuctional epoxy resin poly-functional epoxy resin a difunctional phenol and poly functional phenol KR920001742B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/121,329 US4868059A (en) 1987-11-16 1987-11-16 Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US121,329 1987-11-16
US121329 2002-04-12

Publications (2)

Publication Number Publication Date
KR890008249A true KR890008249A (en) 1989-07-10
KR920001742B1 KR920001742B1 (en) 1992-02-24

Family

ID=22395980

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880005136A KR920001742B1 (en) 1987-11-16 1988-05-03 Curable compositions containing a difuctional epoxy resin poly-functional epoxy resin a difunctional phenol and poly functional phenol

Country Status (10)

Country Link
US (1) US4868059A (en)
EP (1) EP0316509A3 (en)
JP (1) JP2716726B2 (en)
KR (1) KR920001742B1 (en)
AU (1) AU607989B2 (en)
BR (1) BR8802396A (en)
CA (1) CA1333732C (en)
IL (1) IL86138A (en)
MX (1) MX165339B (en)
MY (1) MY103263A (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0225174A3 (en) * 1985-11-26 1989-04-12 Sumitomo Chemical Company, Limited Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix
AU608627B2 (en) * 1987-08-10 1991-04-11 Dow Chemical Company, The Curing agent compositions, laminating varnishes containing same and laminates prepared therefrom
US5066735A (en) * 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
JPH0627181B2 (en) * 1988-02-16 1994-04-13 ソマール株式会社 Flexible epoxy resin composition
US4874669A (en) * 1988-08-15 1989-10-17 The Dow Chemical Company Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol
EP0379468B1 (en) * 1989-01-20 1995-03-01 Ciba-Geigy Ag Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups
US5661223A (en) * 1989-04-25 1997-08-26 Mitsubishi Denki Kabushiki Kaisha Composition of phenolic resin-modified epoxy resin and straight chain polymer
JPH0388818A (en) * 1989-08-31 1991-04-15 Sumitomo Chem Co Ltd Hardener for epoxy resin
JPH03139519A (en) * 1989-10-25 1991-06-13 Sumitomo Chem Co Ltd Curing agent for epoxy resin
JPH0832817B2 (en) * 1990-08-17 1996-03-29 東邦レーヨン株式会社 Low-smoke-producing phenolic resin prepreg and its manufacturing method
JPH04103620A (en) * 1990-08-24 1992-04-06 Dow Chem Nippon Kk Curable resin composition
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
EP0507271A3 (en) * 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
JPH05239238A (en) * 1991-08-26 1993-09-17 Matsushita Electric Works Ltd Production of prepreg and laminate made therefrom
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
EP0589143B1 (en) * 1992-09-21 1997-01-15 Sumitomo Bakelite Company Limited Epoxy resin composition based on diglycidylether of biphenyldiol
TW251298B (en) * 1993-01-12 1995-07-11 Shell Internat Res Schappej Bv
US5439779A (en) * 1993-02-22 1995-08-08 International Business Machines Corporation Aqueous soldermask
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
WO1996028511A1 (en) * 1995-03-10 1996-09-19 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
TW354451B (en) * 1995-09-18 1999-03-11 Ibm Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent
US6486256B1 (en) 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
US6512031B1 (en) * 1999-04-15 2003-01-28 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition, laminate film using the same, and semiconductor device
WO2001058978A1 (en) * 2000-02-07 2001-08-16 Nagoya Oilchemical Co., Ltd. Resin composition, molding material, and molded object
US7223477B2 (en) * 2000-12-05 2007-05-29 Alpha Coating Technologies, Llc Coating powders having enhanced flexability
US6537671B2 (en) 2000-12-05 2003-03-25 Alpha Coating Technologies, Llc Coating powders having enhanced electrostatic chargeability
EP1638378A4 (en) * 2003-06-02 2009-12-02 Panasonic Elec Works Co Ltd Prepreg for printed wiring board and copper-clad laminated board
US6855738B2 (en) 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
CN101341182A (en) * 2005-12-22 2009-01-07 陶氏环球技术公司 a curable epoxy resin composition having a mixed catalyst system and laminates made therefrom
EP3261814B1 (en) 2015-02-27 2023-04-19 Huntsman Advanced Materials Licensing (Switzerland) GmbH A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL133216C (en) * 1964-09-22
US3738862A (en) * 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
US4322456A (en) * 1972-03-13 1982-03-30 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
US3931109A (en) * 1972-03-13 1976-01-06 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
GB1583539A (en) * 1977-06-16 1981-01-28 Du Pont Epoxy resin powder coating composition
US4186036A (en) * 1978-08-25 1980-01-29 The Dow Chemical Company Weldable coating compositions
JPS5819322A (en) * 1981-07-27 1983-02-04 Dainippon Ink & Chem Inc Production of novel multifunctional epoxy resin
US4440914A (en) * 1981-10-19 1984-04-03 Ciba-Geigy Corporation Solid epoxy resin systems
US4549000A (en) * 1983-03-09 1985-10-22 Vernicolor Ag Thermosetting powder lacquer for covering weld seams
US4604317A (en) * 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
JPS61148228A (en) * 1984-12-20 1986-07-05 Ajinomoto Co Inc One pack-type epoxy resin composition
JPS61148226A (en) * 1984-12-21 1986-07-05 Toto Kasei Kk Solid epoxy resin for paint and laminated board
JPS61246228A (en) * 1985-04-24 1986-11-01 Shin Kobe Electric Mach Co Ltd Resin composition for laminate
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
DE3700287A1 (en) * 1986-01-10 1987-07-16 Hitachi Chemical Co Ltd EPOXY RESIN COMPOSITION FOR COPPER PLATED LAMINATES
CA1288189C (en) * 1986-01-20 1991-08-27 Glenda C. Young Epoxy resin composition
CA1272345A (en) * 1986-02-24 1990-07-31 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol

Also Published As

Publication number Publication date
AU607989B2 (en) 1991-03-21
IL86138A (en) 1991-08-16
BR8802396A (en) 1989-05-23
CA1333732C (en) 1994-12-27
MY103263A (en) 1993-05-29
EP0316509A3 (en) 1989-10-18
IL86138A0 (en) 1988-11-15
EP0316509A2 (en) 1989-05-24
MX165339B (en) 1992-11-05
AU1506788A (en) 1989-05-18
US4868059A (en) 1989-09-19
JP2716726B2 (en) 1998-02-18
JPH01153715A (en) 1989-06-15
KR920001742B1 (en) 1992-02-24

Similar Documents

Publication Publication Date Title
KR890008249A (en) Curable composition containing bifunctional epoxy resin, multifunctional epoxy resin, bifunctional phenol and polyfunctional phenol
KR880007590A (en) Glycidyl ether of fluorene-containing bisphenol
KR880001760A (en) Improved Cationic Epoxy Resin Compositions
KR890010094A (en) Flexible Treated Epoxy Resin Composition
KR880005166A (en) Thermally stable capped thermoplastic phenolic resin
US5066735A (en) Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4687832A (en) Novel epoxy resin compositions
KR900003286A (en) Curable Compositions Containing Epoxy Resin, Bifunctional Phenolic and Multifunctional Phenolic
GB1515140A (en) Process for preparing water-dilutable heat-curing coating compositions
KR910004698A (en) Improved epoxy resin composition and preparation method thereof
KR920701362A (en) Polyphenylene Oxide / Hybrid Epoxy Resin System For Electrical Laminates
KR880701749A (en) Halogenated Epoxy Resin and Improved Resin Prepared therefrom
US5405931A (en) Epoxy resin compositions for use in electrical laminates
MY101760A (en) Controlled film build epoxy coatings applied by cathodic electrodeposition
KR930017972A (en) Triglycidyl Isocyanurate Epoxy Resin
KR900003315A (en) Resin composition for cationic electrodeposition paint
KR900004796A (en) Epoxy Resin Containing Phosphonium Catalyst
KR870007980A (en) Curable Compositions Containing Polyepoxides and Halogenated Bisphenols
GB1488241A (en) Process for preparing water-dilutable coating composition
KR910003034A (en) Pigment dispersant
KR100225739B1 (en) Epoxy resin composition for use in electrical laminates
KR890003873A (en) Curing Agent Composition, Laminated Varnish Containing the Same, and Laminates Prepared therefrom
KR870007955A (en) Process for preparing epoxy or phenoxy resins with low aliphatic halide content
KR900000402A (en) Monocarboxylic Acid Derivatives of Aromatic Epoxy Resins
US4959425A (en) Laminating varnish composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol and a solvent

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19941223

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee