KR890008249A - Curable composition containing bifunctional epoxy resin, multifunctional epoxy resin, bifunctional phenol and polyfunctional phenol - Google Patents
Curable composition containing bifunctional epoxy resin, multifunctional epoxy resin, bifunctional phenol and polyfunctional phenol Download PDFInfo
- Publication number
- KR890008249A KR890008249A KR1019880005136A KR880005136A KR890008249A KR 890008249 A KR890008249 A KR 890008249A KR 1019880005136 A KR1019880005136 A KR 1019880005136A KR 880005136 A KR880005136 A KR 880005136A KR 890008249 A KR890008249 A KR 890008249A
- Authority
- KR
- South Korea
- Prior art keywords
- component
- composition
- phenolic hydroxyl
- general formula
- epoxy resin
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims 17
- 239000003822 epoxy resin Substances 0.000 title claims 8
- 229920000647 polyepoxide Polymers 0.000 title claims 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims 6
- 230000001588 bifunctional effect Effects 0.000 title 2
- 150000001875 compounds Chemical class 0.000 claims 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- 239000003054 catalyst Substances 0.000 claims 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 2
- 150000002118 epoxides Chemical group 0.000 claims 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- -1 phenoxy hydroxyl Chemical group 0.000 claims 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 230000003197 catalytic effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 239000004843 novolac epoxy resin Substances 0.000 claims 1
- TWWBIMNLBUYJKB-UHFFFAOYSA-N phosphanyl acetate Chemical group CC(=O)OP TWWBIMNLBUYJKB-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/121,329 US4868059A (en) | 1987-11-16 | 1987-11-16 | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
US121,329 | 1987-11-16 | ||
US121329 | 2002-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890008249A true KR890008249A (en) | 1989-07-10 |
KR920001742B1 KR920001742B1 (en) | 1992-02-24 |
Family
ID=22395980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880005136A KR920001742B1 (en) | 1987-11-16 | 1988-05-03 | Curable compositions containing a difuctional epoxy resin poly-functional epoxy resin a difunctional phenol and poly functional phenol |
Country Status (10)
Country | Link |
---|---|
US (1) | US4868059A (en) |
EP (1) | EP0316509A3 (en) |
JP (1) | JP2716726B2 (en) |
KR (1) | KR920001742B1 (en) |
AU (1) | AU607989B2 (en) |
BR (1) | BR8802396A (en) |
CA (1) | CA1333732C (en) |
IL (1) | IL86138A (en) |
MX (1) | MX165339B (en) |
MY (1) | MY103263A (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0225174A3 (en) * | 1985-11-26 | 1989-04-12 | Sumitomo Chemical Company, Limited | Thermosetting resin composition and a composite material comprising the cured product of the resin composition as its matrix |
AU608627B2 (en) * | 1987-08-10 | 1991-04-11 | Dow Chemical Company, The | Curing agent compositions, laminating varnishes containing same and laminates prepared therefrom |
US5066735A (en) * | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
JPH0627181B2 (en) * | 1988-02-16 | 1994-04-13 | ソマール株式会社 | Flexible epoxy resin composition |
US4874669A (en) * | 1988-08-15 | 1989-10-17 | The Dow Chemical Company | Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol |
EP0379468B1 (en) * | 1989-01-20 | 1995-03-01 | Ciba-Geigy Ag | Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups |
US5661223A (en) * | 1989-04-25 | 1997-08-26 | Mitsubishi Denki Kabushiki Kaisha | Composition of phenolic resin-modified epoxy resin and straight chain polymer |
JPH0388818A (en) * | 1989-08-31 | 1991-04-15 | Sumitomo Chem Co Ltd | Hardener for epoxy resin |
JPH03139519A (en) * | 1989-10-25 | 1991-06-13 | Sumitomo Chem Co Ltd | Curing agent for epoxy resin |
JPH0832817B2 (en) * | 1990-08-17 | 1996-03-29 | 東邦レーヨン株式会社 | Low-smoke-producing phenolic resin prepreg and its manufacturing method |
JPH04103620A (en) * | 1990-08-24 | 1992-04-06 | Dow Chem Nippon Kk | Curable resin composition |
DE4110219A1 (en) * | 1991-03-28 | 1992-10-01 | Huels Troisdorf | METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN |
EP0507271A3 (en) * | 1991-04-03 | 1993-04-21 | The Dow Chemical Company | Epoxy resin compositions for use in electrical laminates |
JPH05239238A (en) * | 1991-08-26 | 1993-09-17 | Matsushita Electric Works Ltd | Production of prepreg and laminate made therefrom |
US5364925A (en) * | 1992-01-27 | 1994-11-15 | The Dow Chemical Company | Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates |
EP0589143B1 (en) * | 1992-09-21 | 1997-01-15 | Sumitomo Bakelite Company Limited | Epoxy resin composition based on diglycidylether of biphenyldiol |
TW251298B (en) * | 1993-01-12 | 1995-07-11 | Shell Internat Res Schappej Bv | |
US5439779A (en) * | 1993-02-22 | 1995-08-08 | International Business Machines Corporation | Aqueous soldermask |
GB9421405D0 (en) * | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
WO1996028511A1 (en) * | 1995-03-10 | 1996-09-19 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition |
TW354451B (en) * | 1995-09-18 | 1999-03-11 | Ibm | Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent |
US6486256B1 (en) | 1998-10-13 | 2002-11-26 | 3M Innovative Properties Company | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
US6512031B1 (en) * | 1999-04-15 | 2003-01-28 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition, laminate film using the same, and semiconductor device |
WO2001058978A1 (en) * | 2000-02-07 | 2001-08-16 | Nagoya Oilchemical Co., Ltd. | Resin composition, molding material, and molded object |
US7223477B2 (en) * | 2000-12-05 | 2007-05-29 | Alpha Coating Technologies, Llc | Coating powders having enhanced flexability |
US6537671B2 (en) | 2000-12-05 | 2003-03-25 | Alpha Coating Technologies, Llc | Coating powders having enhanced electrostatic chargeability |
EP1638378A4 (en) * | 2003-06-02 | 2009-12-02 | Panasonic Elec Works Co Ltd | Prepreg for printed wiring board and copper-clad laminated board |
US6855738B2 (en) | 2003-06-06 | 2005-02-15 | Dow Global Technologies Inc. | Nanoporous laminates |
CN101341182A (en) * | 2005-12-22 | 2009-01-07 | 陶氏环球技术公司 | a curable epoxy resin composition having a mixed catalyst system and laminates made therefrom |
EP3261814B1 (en) | 2015-02-27 | 2023-04-19 | Huntsman Advanced Materials Licensing (Switzerland) GmbH | A process for manufacturing a fiber reinforced composite article, the composite article obtained and the use thereof |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL133216C (en) * | 1964-09-22 | |||
US3738862A (en) * | 1971-11-08 | 1973-06-12 | Shell Oil Co | Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates |
US4322456A (en) * | 1972-03-13 | 1982-03-30 | The Dow Chemical Company | Process for coating substrates with high molecular weight epoxy resins |
US3931109A (en) * | 1972-03-13 | 1976-01-06 | The Dow Chemical Company | Process for coating substrates with high molecular weight epoxy resins |
GB1583539A (en) * | 1977-06-16 | 1981-01-28 | Du Pont | Epoxy resin powder coating composition |
US4186036A (en) * | 1978-08-25 | 1980-01-29 | The Dow Chemical Company | Weldable coating compositions |
JPS5819322A (en) * | 1981-07-27 | 1983-02-04 | Dainippon Ink & Chem Inc | Production of novel multifunctional epoxy resin |
US4440914A (en) * | 1981-10-19 | 1984-04-03 | Ciba-Geigy Corporation | Solid epoxy resin systems |
US4549000A (en) * | 1983-03-09 | 1985-10-22 | Vernicolor Ag | Thermosetting powder lacquer for covering weld seams |
US4604317A (en) * | 1984-10-05 | 1986-08-05 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
JPS61148228A (en) * | 1984-12-20 | 1986-07-05 | Ajinomoto Co Inc | One pack-type epoxy resin composition |
JPS61148226A (en) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | Solid epoxy resin for paint and laminated board |
JPS61246228A (en) * | 1985-04-24 | 1986-11-01 | Shin Kobe Electric Mach Co Ltd | Resin composition for laminate |
GB8519290D0 (en) * | 1985-07-31 | 1985-09-04 | Dow Chemical Rheinwerk Gmbh | Resin composition |
DE3700287A1 (en) * | 1986-01-10 | 1987-07-16 | Hitachi Chemical Co Ltd | EPOXY RESIN COMPOSITION FOR COPPER PLATED LAMINATES |
CA1288189C (en) * | 1986-01-20 | 1991-08-27 | Glenda C. Young | Epoxy resin composition |
CA1272345A (en) * | 1986-02-24 | 1990-07-31 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
-
1987
- 1987-11-16 US US07/121,329 patent/US4868059A/en not_active Expired - Fee Related
-
1988
- 1988-04-19 MY MYPI88000390A patent/MY103263A/en unknown
- 1988-04-20 IL IL86138A patent/IL86138A/en not_active IP Right Cessation
- 1988-04-20 CA CA000564596A patent/CA1333732C/en not_active Expired - Fee Related
- 1988-04-20 EP EP88106276A patent/EP0316509A3/en not_active Withdrawn
- 1988-04-21 AU AU15067/88A patent/AU607989B2/en not_active Ceased
- 1988-05-02 JP JP63107736A patent/JP2716726B2/en not_active Expired - Lifetime
- 1988-05-03 KR KR1019880005136A patent/KR920001742B1/en not_active IP Right Cessation
- 1988-05-11 BR BR8802396A patent/BR8802396A/en not_active Application Discontinuation
- 1988-05-12 MX MX011444A patent/MX165339B/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU607989B2 (en) | 1991-03-21 |
IL86138A (en) | 1991-08-16 |
BR8802396A (en) | 1989-05-23 |
CA1333732C (en) | 1994-12-27 |
MY103263A (en) | 1993-05-29 |
EP0316509A3 (en) | 1989-10-18 |
IL86138A0 (en) | 1988-11-15 |
EP0316509A2 (en) | 1989-05-24 |
MX165339B (en) | 1992-11-05 |
AU1506788A (en) | 1989-05-18 |
US4868059A (en) | 1989-09-19 |
JP2716726B2 (en) | 1998-02-18 |
JPH01153715A (en) | 1989-06-15 |
KR920001742B1 (en) | 1992-02-24 |
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