KR890003269A - Flexible printed wiring board with multilayer pattern and manufacturing method - Google Patents

Flexible printed wiring board with multilayer pattern and manufacturing method Download PDF

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Publication number
KR890003269A
KR890003269A KR870012061A KR870012061A KR890003269A KR 890003269 A KR890003269 A KR 890003269A KR 870012061 A KR870012061 A KR 870012061A KR 870012061 A KR870012061 A KR 870012061A KR 890003269 A KR890003269 A KR 890003269A
Authority
KR
South Korea
Prior art keywords
layer
conductive patterns
undercoder
aperture
pattern
Prior art date
Application number
KR870012061A
Other languages
Korean (ko)
Other versions
KR920005462B1 (en
Inventor
미노루 다구마
Original Assignee
미도리가와 쓰네오
가부시기가이샤 미도리 마아크 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미도리가와 쓰네오, 가부시기가이샤 미도리 마아크 세이사꾸쇼 filed Critical 미도리가와 쓰네오
Publication of KR890003269A publication Critical patent/KR890003269A/en
Application granted granted Critical
Publication of KR920005462B1 publication Critical patent/KR920005462B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

내용 없음No content

Description

다층패턴을 가진 플렉시블 프린트배선판 및 그 제조방법Flexible printed wiring board with multilayer pattern and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도, 가-마는 본 발명에 따른 플렉시블 프린트 배선판의 제조공정을 표시한 설명도. 제2도는 점퍼링을 가진 플렉시블 프린트 배선판의 평면 설명도.1 is an explanatory diagram showing a manufacturing process of a flexible printed wiring board according to the present invention. 2 is a plan explanatory view of a flexible printed wiring board with jumper rings.

Claims (2)

절연성 기판상에 형성되어 복수의 도전패턴의 일부를 점퍼링하는 쌍으로 된 도전패턴의 단부를 스폿상 구경으로 노출시키고 그의 타부분을 제1의 언더코오드층으로 피복하며, 다음에 그의 위에 상기한 스폿항 구경보다도 큰 구경의 노출부를 또한 상기한 구경과 동심적으로 형성하는 제2의 언더코오드층을 마련하고, 다음에 그의 제2의 언더코오드층상에 상기한 쌍방의 구경내에 매설하여 쌍을 이룬 도전패턴을 연통하는 점퍼링패턴을 마련한 것을 특징으로 하는 다층패턴을 가진 플렉시블 프린트 배선판의 제조방법.The ends of the pair of conductive patterns formed on the insulating substrate to jump a part of the plurality of conductive patterns are exposed with spot-shaped apertures, and the other portions thereof are covered with a first undercod layer, and then the above described A second undercoder layer is formed which concentrically exposes the aperture larger than the spot port aperture concentrically with the above-described aperture, and is then buried in both apertures above the second undercoder layer and paired. A method for manufacturing a flexible printed wiring board having a multilayer pattern, comprising a jumper pattern for communicating a conductive pattern. 절연성 기판의 상면에 형성된 다수의 도전패턴과 그의 도전패턴중 점퍼링 하여야할 도전패턴의 단부를 노출하는 스폿상 구경을 형성하고, 타부의 도전패턴을 피복하는 제1의 언더코오드층과 상기한 스폿상 구경보다도 큰 구경인 노출부를 상기한 구경과 동심적으로 형성하여서 제1의 언더코오드층상에 층성되는 제2의 언더코오드층과 상기한 제1, 제2의 언터코오드층에 형성되는 구경내에 매설되어 쌍으로 된 도전패턴을 연통하는 점퍼링패턴과 해당 점퍼링패턴 및 제2의 언터코오드층상에 충성되는 평활절연층으로 되게 된 것을 특징으로 하는 다층패턴을 가진 플렉시블 프린트배선판.A first undercoat layer forming a plurality of conductive patterns formed on the upper surface of the insulating substrate, and spot-shaped apertures exposing end portions of the conductive patterns to be jumpered among the conductive patterns, and covering the conductive patterns of the other portions; The exposed portion, which is larger than the image aperture, is formed concentrically with the aperture described above, and is embedded in the aperture formed in the second undercoder layer formed on the first undercoder layer and the first and second undercoder layers. And a jumpering pattern communicating with a pair of conductive patterns, and a smoothing insulating layer that is lodged on the jumpering pattern and the second undercoder layer. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR8712061A 1987-07-14 1987-10-30 Flexible printed wiring board with multilayered pattern and manufacturing process KR920005462B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-175765 1987-07-14
JP62175765A JPS6419795A (en) 1987-07-14 1987-07-14 Flexible printed wiring board with multilayered pattern and manufacture thereof

Publications (2)

Publication Number Publication Date
KR890003269A true KR890003269A (en) 1989-04-13
KR920005462B1 KR920005462B1 (en) 1992-07-04

Family

ID=16001867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8712061A KR920005462B1 (en) 1987-07-14 1987-10-30 Flexible printed wiring board with multilayered pattern and manufacturing process

Country Status (2)

Country Link
JP (1) JPS6419795A (en)
KR (1) KR920005462B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395814B1 (en) * 2000-11-14 2003-08-27 삼성에스디아이 주식회사 An open-protected type flexible printed circuit
KR100494679B1 (en) * 1998-12-18 2005-09-26 비오이 하이디스 테크놀로지 주식회사 Flexible printed circuit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Formation of insulating layer of printed wiring board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517518B2 (en) * 1972-01-28 1980-05-12
JPS50135559A (en) * 1974-04-17 1975-10-27
JPS6149491A (en) * 1984-08-18 1986-03-11 松下電器産業株式会社 Ceramic multilayer circuit board
JPS6284975U (en) * 1985-11-18 1987-05-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100494679B1 (en) * 1998-12-18 2005-09-26 비오이 하이디스 테크놀로지 주식회사 Flexible printed circuit
KR100395814B1 (en) * 2000-11-14 2003-08-27 삼성에스디아이 주식회사 An open-protected type flexible printed circuit

Also Published As

Publication number Publication date
JPH0252432B2 (en) 1990-11-13
JPS6419795A (en) 1989-01-23
KR920005462B1 (en) 1992-07-04

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