KR880700624A - 무선주파수 간섭 차폐 봉입체 및 그 제조방법 - Google Patents

무선주파수 간섭 차폐 봉입체 및 그 제조방법

Info

Publication number
KR880700624A
KR880700624A KR1019860700426A KR860700426A KR880700624A KR 880700624 A KR880700624 A KR 880700624A KR 1019860700426 A KR1019860700426 A KR 1019860700426A KR 860700426 A KR860700426 A KR 860700426A KR 880700624 A KR880700624 A KR 880700624A
Authority
KR
South Korea
Prior art keywords
layer
enclosure
group
manufacturing
radio frequency
Prior art date
Application number
KR1019860700426A
Other languages
English (en)
Other versions
KR900004543B1 (ko
Inventor
비. 헤이두 쥬안
더블유. 바스텐벡 에드윈
Original Assignee
쥬안 헤이두
엔손 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쥬안 헤이두, 엔손 인코포레이티드 filed Critical 쥬안 헤이두
Publication of KR880700624A publication Critical patent/KR880700624A/ko
Application granted granted Critical
Publication of KR900004543B1 publication Critical patent/KR900004543B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
    • Y10T428/1314—Contains fabric, fiber particle, or filament made of glass, ceramic, or sintered, fused, fired, or calcined metal oxide, or metal carbide or other inorganic compound [e.g., fiber glass, mineral fiber, sand, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
    • Y10T428/1317—Multilayer [continuous layer]
    • Y10T428/1321—Polymer or resin containing [i.e., natural or synthetic]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1355—Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
    • Y10T428/1359—Three or more layers [continuous layer]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemically Coating (AREA)
  • Waveguide Aerials (AREA)
  • Superheterodyne Receivers (AREA)
  • Catalysts (AREA)
  • Waveguides (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Wrappers (AREA)
  • Conductive Materials (AREA)
  • Soft Magnetic Materials (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Details Of Aerials (AREA)

Abstract

내용 없음

Description

무선주파수 간섭 차폐 봉입체 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 전자기/무선 주파수 자폐를 갖는 부품 또는 봉입체를 제조하는 방법에 있어서, (1) 적합한 전기적 비전도성 봉입체를 선택하고, (2) 니켈, 구리, 철, 코발트, 금, 은 , 백금, 팔라듐 및 이들의 조합으로 구성되는 그룹에서 선택한 것으로서 제 1 층에 분포된 활성 금속 입자를 갖는 유체 유기 결합체를 포함하는 제 1 층을 봉입체의 적어도 한면에 적용한 다음, (3) 무전해 니켈, 무전해 구리 및 이들의 조합으로 구성되는 그룹에서 선택한 금속으로된 제 2 층을 제 1 층에 부착시켜 10KHz 이상의 주파수를 가는 전자기 방사선에 대해 적어도 40데시벨의 차폐를 갖는 봉입체를 제조하는 것을 특징으로 하는 무선 주파수 간섭 차폐 봉입체의 제조방법.
  2. 제 1 항에 있어서, 비전도성 봉입체는 아크릴로니트라이트-부타딘-스티렌(ABS)과 같은 성형성 합성 유기 폴리머 재료, 폴리스티렌, 폴리페닐렌 옥사이드, 폴리카본 등과 같은 다른 합성 유기 폴리머재료, 강화 폴리머 재료 및 유리, 세라믹, 유리섬유, 강화 세라믹, 가압 섬유판 또는 이들로부터 만들어진 합성재료와 같은 다른 유전체 재료로 구성되는 그룹으로부터 제조되는 것을 특징으로 하는 무선 주파수 간섭 차폐 봉입체의 제조방법.
  3. 제 1 항에 있어서, 제 1 층은 건조시에 결합제에 대한 금속의 비율이 적어도 50%인 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  4. 제 1 항에 있어서, 입자는 크기가 0.5내지 10미크론의 범위인 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  5. 제 1 항에 있어서, 단계(2)에서 코팅의 두께는 적어도 12.5미크론인 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  6. 제 1 항에 있어서, 제 1 층은 적어도 금속 입자의 일부가 노출될 수 있도록 코팅에서 유기 결합체를 적어도 부분적으로 제거하기 위하여 식각하는 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  7. 제 6 항에 있어서, 금속입자는 제 1 항의 단계(3)의 실시전에 그 표면을 산성용액으로 린스하여 탈산시키는 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  8. 제 1 항에 있어서, 무전해 부착은 그 두께가 40내지 200미크론의 범위인 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  9. 제 1 항에 있어서, 단계(3)후에 제 2 층은 니켈, 구리, 아연, 주석 또는 이들의 합금으로 구성되는 그룹에서 선택한 금속으로 전착된 적어도 하나의 제 3 층으로 코팅되는 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체의 제조방법.
  10. 전자기/무선 주파수 차폐를 갖는 부품 또는 봉입체에 있어서, (1) 적합한 전기적 비전도성 봉입체를 선택하고, (2) 니켈, 구리, 철, 코발트, 금, 은, 백금, 팔라듐 및 이들의 조합으로 구성되는 그룹에서 선택한 것으로서 제 1 층에 분포된 활성 금속 입자를 갖는 유체 유기 결합체를 포함하는 제 1 층을 봉입체의 적어도 한면에 적용한 다음, (3) 무전해 니켈, 무전해 구리 및 이들의 조합으로 구성되는 그룹에서 선택한 금속으로 된 제 2 층을 제 1 층에 부착시켜 10KHz 이상의 주파수를 갖는 전자기 방사선에 대해 적어도 40데시벨의 차폐를 갖는 봉입체를 제조하는 방법에 의해 제조된 것을 특징으로 하는 무선주파수 간섭 차폐 봉입체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860700426A 1984-11-06 1985-11-05 무선주파수 간섭 차폐 봉입체 및 그 제조방법 KR900004543B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US668.753 1984-11-06
US06/668,753 US4663240A (en) 1984-11-06 1984-11-06 RFI shielded plastic articles and process for making same
US668753 1984-11-06
PCT/US1985/002188 WO1986002882A1 (en) 1984-11-06 1985-11-05 Rfi shielded plastic articles and process for making same

Publications (2)

Publication Number Publication Date
KR880700624A true KR880700624A (ko) 1988-03-15
KR900004543B1 KR900004543B1 (ko) 1990-06-29

Family

ID=24683579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860700426A KR900004543B1 (ko) 1984-11-06 1985-11-05 무선주파수 간섭 차폐 봉입체 및 그 제조방법

Country Status (16)

Country Link
US (1) US4663240A (ko)
EP (1) EP0200772B1 (ko)
JP (1) JPS62500344A (ko)
KR (1) KR900004543B1 (ko)
AT (1) ATE70491T1 (ko)
AU (1) AU573929B2 (ko)
BR (1) BR8507026A (ko)
CA (1) CA1234515A (ko)
DE (1) DE3584971D1 (ko)
DK (1) DK167471B1 (ko)
ES (1) ES8705740A1 (ko)
GB (1) GB2183253B (ko)
HK (1) HK38090A (ko)
IL (1) IL76958A (ko)
MX (1) MX159537A (ko)
WO (1) WO1986002882A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100291895B1 (ko) * 1997-10-20 2001-06-01 이철재 전자렌지의 전자파 차폐 장치

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0694592B2 (ja) * 1986-04-22 1994-11-24 日産化学工業株式会社 無電解メッキ法
US4759466A (en) * 1986-08-14 1988-07-26 Apple Computer, Inc. EMI seam for enclosures
US4911981A (en) * 1987-06-16 1990-03-27 Schnur Joel M Metal clad lipid microstructures
US4997674A (en) * 1987-06-30 1991-03-05 Akzo America Inc. Conductive metallization of substrates via developing agents
US4831210A (en) * 1987-12-02 1989-05-16 Macdermid, Incorporated Shields for electromagnetic radiation
US4829432A (en) * 1987-12-28 1989-05-09 Eastman Kodak Company Apparatus for shielding an electrical circuit from electromagnetic interference
US5059485A (en) * 1988-06-08 1991-10-22 Akzo America Inc. Conductive metallization of substances without developing agents
JPH0777301B2 (ja) * 1988-11-04 1995-08-16 北川工業株式会社 電磁気シールド用筐体
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US5076841A (en) * 1990-05-31 1991-12-31 Shipley Company Inc. Coating composition
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
JPH051323U (ja) * 1991-06-25 1993-01-14 松下電工株式会社 キツチン装置
US5360941A (en) * 1991-10-28 1994-11-01 Cubic Automatic Revenue Collection Group Magnetically permeable electrostatic shield
US5455117A (en) * 1992-10-27 1995-10-03 Kansai Paint Co., Ltd. Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method
FR2705211B1 (fr) * 1993-05-21 1996-07-26 Maurice Melois Etui pour objet sensible aux effets magnétiques, électromagnétiques et électrostatique, et procédé de fabrication correspondant.
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
DE69508911T2 (de) * 1994-11-28 1999-10-07 Toshiba Kawasaki Kk Gehäuse mit elektromagnetischer Abschirmung
JP3022226B2 (ja) * 1994-12-08 2000-03-15 大伸化学株式会社 無電解めっき法における触媒化方法
US5546281A (en) 1995-01-13 1996-08-13 Methode Electronics, Inc. Removable optoelectronic transceiver module with potting box
US5717533A (en) * 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
US5596487A (en) * 1995-07-31 1997-01-21 Motorola, Inc. Apparatus for RF shielding radio circuitry
JP3385163B2 (ja) * 1995-09-04 2003-03-10 吉野電化工業株式会社 電磁波シールド及びその形成方法
US5968600A (en) * 1995-09-15 1999-10-19 Egyptian Lacquer Mfg. Co. EMI/RFI-shielding coating
US5744232A (en) * 1996-07-11 1998-04-28 Northrop Grumman Corporation Low loss, thick film metallizations for multilayer microwave packaging
US6188174B1 (en) * 1996-10-01 2001-02-13 Nisshinbo Insustries, Inc. Electromagnetic radiation shield panel and method of producing the same
US5926366A (en) * 1996-11-15 1999-07-20 Digital Equipment Corporation Tab and slot disk drive vibration reduction structure
US6018125A (en) * 1996-11-15 2000-01-25 Collins; Pat Eliot High frequency EMI shield with air flow for electronic device enclosure
US5858509A (en) * 1996-11-15 1999-01-12 Digital Equipment Corporation Attenuating vibrations in a mounting shelf for multiple disk drives
IT1294510B1 (it) * 1997-04-18 1999-04-12 Gianfranco Natali Procedimento per la costruzione di strutture in lamiera metallica preprotetta, stabilizzate con saldature.
DE19812880A1 (de) 1998-03-24 1999-09-30 Bayer Ag Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung
US6203333B1 (en) 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
US6179627B1 (en) 1998-04-22 2001-01-30 Stratos Lightwave, Inc. High speed interface converter module
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
JP3456473B2 (ja) * 2000-11-16 2003-10-14 日本電気株式会社 携帯電話機筐体
US6776826B1 (en) * 2001-07-27 2004-08-17 Gbn Technologies, Inc. Composition and method for electroless plating of non-conductive substrates
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
JP5095909B2 (ja) * 2003-06-24 2012-12-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 触媒組成物および析出方法
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
US20050109522A1 (en) * 2003-11-25 2005-05-26 Midcon Cables Co., L.L.C., Joplin, Mo Conductive TEFLON film tape for EMI/RFI shielding and method of manufacture
US8094007B2 (en) * 2004-06-17 2012-01-10 Honeywell International Inc. Alarm status voice annunciation using broadcast band transmissions
US7326367B2 (en) * 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
DE102005043242A1 (de) 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
US7740725B2 (en) * 2006-04-05 2010-06-22 E.I. Du Pont De Nemours And Company Thick film conductor paste composition for LTCC tape in microwave applications
TWI470041B (zh) 2008-06-09 2015-01-21 Basf Se 用於施加金屬層之分散液
DE102013002487A1 (de) * 2013-02-13 2014-08-14 Volkswagen Aktiengesellschaft Oberflächenstruktur, Verfahren zu ihrer Herstellung sowie Werkstück und Gerät mit einer derartigen Oberflächenstruktur
US9484680B2 (en) * 2013-06-12 2016-11-01 Intel Corporation Radio frequency interference shield

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3745045A (en) * 1971-01-06 1973-07-10 R Brenneman Electrical contact surface using an ink containing a plating catalyst
JPS5724456Y2 (ko) * 1977-09-09 1982-05-27
US4447492A (en) * 1977-11-21 1984-05-08 Occidental Chemical Corporation Articles having an electrically conductive surface
JPS5582499A (en) * 1978-12-15 1980-06-21 Sharp Kk Radio wave shielding plate
JPS55145400A (en) * 1979-05-01 1980-11-12 Nisshin Steel Co Ltd Method of fabricating both magnetic and electromagnetic shield components
US4507359A (en) * 1980-12-22 1985-03-26 Chomerics, Inc. Electromagnetic shielding
BR8400825A (pt) * 1983-03-21 1985-02-26 Stauffer Chemical Co Laminado retardador de chama,processo para a blindagem de uma peca eletronica e laminado util na blindagem de uma peca eletronica contra a interferencia eletronica
US4493912A (en) * 1983-08-15 1985-01-15 General Electric Company Electromagnetic wave attenuating composition
GB8501086D0 (en) * 1985-01-16 1985-02-20 Canning W Materials Ltd Metal coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100291895B1 (ko) * 1997-10-20 2001-06-01 이철재 전자렌지의 전자파 차폐 장치

Also Published As

Publication number Publication date
GB2183253A (en) 1987-06-03
EP0200772B1 (en) 1991-12-18
AU5060485A (en) 1986-06-03
US4663240A (en) 1987-05-05
EP0200772A4 (en) 1987-04-14
GB2183253B (en) 1988-10-05
GB8616377D0 (en) 1986-08-13
DK320886D0 (da) 1986-07-04
KR900004543B1 (ko) 1990-06-29
DE3584971D1 (de) 1992-01-30
WO1986002882A1 (en) 1986-05-22
ES548551A0 (es) 1987-05-01
JPS62500344A (ja) 1987-02-05
MX159537A (es) 1989-06-29
ES8705740A1 (es) 1987-05-01
DK167471B1 (da) 1993-11-01
DK320886A (da) 1986-07-04
IL76958A0 (en) 1986-04-29
ATE70491T1 (de) 1992-01-15
IL76958A (en) 1990-09-17
CA1234515A (en) 1988-03-29
EP0200772A1 (en) 1986-11-12
JPH0262960B2 (ko) 1990-12-27
AU573929B2 (en) 1988-06-23
BR8507026A (pt) 1987-01-06
HK38090A (en) 1990-05-25

Similar Documents

Publication Publication Date Title
KR880700624A (ko) 무선주파수 간섭 차폐 봉입체 및 그 제조방법
US4514586A (en) Method of using a shielding means to attenuate electromagnetic radiation in the radio frequency range
US2897409A (en) Plating process
SE8107157L (sv) Material for skermning av elektromagnetisk energi
EP0107863A3 (en) A shielding material of electromagnetic waves
KR960030457A (ko) 금속다공체의 제조방법, 전지용 전극기판의 제조방법, 및 전지용 전극기판
US3884771A (en) Process of producing resinous board having a rough surface usable for firmly supporting thereon a printed circuit
EP0259754A2 (de) Flexible Schaltungen
EP0026211A1 (en) PROCESS FOR THE DRY SENSITIZATION OF AN INSULATING SURFACE.
US3052957A (en) Plated circuit process
EP1017068A3 (en) Process for forming device comprising metallized magnetic substrates
JPS61210183A (ja) 重合体表面に金属被覆を設ける方法
FR2554303B1 (fr) Substrats metallisables pour circuits imprimes et leur procede de preparation
EP0195332A2 (de) Elektrische Leiterplatten
DE2700868A1 (de) Verfahren zur herstellung von gedruckten schaltungsplatten mit schichtwiderstaenden
US3628990A (en) Electroless plating pretreatment method
DE3510201A1 (de) Elektrische leiterplatten
JPS6018997A (ja) 電磁波シ−ルド用成形体およびその製造方法
DE19937284B4 (de) Elektrisch leitender Mehrschichtaufbau
US2959532A (en) Apparatus and method for the electrodeposition of rare metals
JPH06268390A (ja) 電磁波遮蔽ケース
EP0195612A2 (en) Printed circuit arrangement
DE2811150A1 (de) Verfahren zur herstellung von leiterplatten mit metalleinlage
JPH03125499A (ja) 外装ケース
KR970018810A (ko) 발포니켈 박전극 및 그 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20040611

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee