KR880012136A - Insulation Structure of Printed Board - Google Patents

Insulation Structure of Printed Board Download PDF

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Publication number
KR880012136A
KR880012136A KR1019880002601A KR880002601A KR880012136A KR 880012136 A KR880012136 A KR 880012136A KR 1019880002601 A KR1019880002601 A KR 1019880002601A KR 880002601 A KR880002601 A KR 880002601A KR 880012136 A KR880012136 A KR 880012136A
Authority
KR
South Korea
Prior art keywords
circuit elements
mentioned
printed
board
circuit board
Prior art date
Application number
KR1019880002601A
Other languages
Korean (ko)
Inventor
마사또 이누마다
Original Assignee
아오이 죠이찌
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이찌, 가부시끼가이샤 도시바 filed Critical 아오이 죠이찌
Publication of KR880012136A publication Critical patent/KR880012136A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음No content

Description

프린트 기판의 절연구조Insulation Structure of Printed Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 한 실시예의 평면도,1 is a plan view of one embodiment of the present invention,

제2도는 같은 실시예의 측면도,2 is a side view of the same embodiment,

제3도는 절연판의 사시도.3 is a perspective view of an insulating plate.

Claims (3)

기판(1)위에 배치된 회로요소(2)(4)를 구비한 프린트 기판에 있어서, 전술한 기판상의 회로요소는 필요하게 되는 절연거리 이하의 간격으로 배치되어 있고, 더욱이 이 회로요소간에, 회로요소간 차폐용 절연판(5)(6)을 프린트 기판의 양면에 걸쳐 돌출시키는 것에 의해 전술한 기판 양면에 있어서, 전술한 회로요소간의 필요하게 되는 절연거리를 확보하는 확보하는 것을 특징으로 하는 프린트 기판의 절연구조.In a printed board having circuit elements (2) (4) arranged on a substrate (1), the circuit elements on the substrate described above are arranged at intervals less than or equal to the required insulation distance, and further, between the circuit elements. A printed circuit board which ensures the required insulation distance between the above-described circuit elements on both sides of the above-mentioned substrate by protruding the insulating plates 5 and 6 for inter-element shielding on both sides of the printed board. Insulation structure. 제1항에 있어서, 전술한 회로요소간 차폐용 절연판(5)(6)은 더욱이 전술한 프린트 기판의 한쪽면에 이것을 덮도록 대항 배치된 프린트 기판면 절연용 절연판(7)을 구비하고 있는 것을 특징으로 하는 프린트 기판의 절연구조.The method of claim 1, wherein the insulating plate (5) and (6) for shielding between the above-mentioned circuit elements are further provided with an insulating plate (7) for insulating the printed circuit board surface disposed so as to cover it on one side of the above-described printed board. Insulation structure of a printed circuit board characterized by the above-mentioned. 제1항 또는 제2항에 있어서, 전술한 프린트 기판(1)은, 전술한 회로요소간에 설치된 뚫어진 구멍(1a)(1b)을 구비하고 있고, 이 뚫어진 구멍을 끼워서 통하게 하여 전술한 회로요소간 차폐용 절연판이 돌출 되어 있는 것을 특징으로 하는 프린트 기판의 절연구조.The above-mentioned printed circuit board 1 is provided with the perforated holes 1a and 1b provided between the above-mentioned circuit elements, Comprising: The said perforated hole is made to pass through the above-mentioned circuit elements. An insulating structure of a printed circuit board, characterized in that the shielding insulating plate protrudes. ※참고사항:최초출원 내용에 의하여 공개하는 것임.※ Note: This is to be disclosed based on the first application.
KR1019880002601A 1987-03-13 1988-03-12 Insulation Structure of Printed Board KR880012136A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-56639 1987-03-13
JP62056639A JPH0770797B2 (en) 1987-03-13 1987-03-13 Printed circuit board insulation structure

Publications (1)

Publication Number Publication Date
KR880012136A true KR880012136A (en) 1988-11-03

Family

ID=13032903

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880002601A KR880012136A (en) 1987-03-13 1988-03-12 Insulation Structure of Printed Board

Country Status (2)

Country Link
JP (1) JPH0770797B2 (en)
KR (1) KR880012136A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015070147A (en) * 2013-09-30 2015-04-13 東芝シュネデール・インバータ株式会社 Heat radiation structure of mounting component mounted on circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834770Y2 (en) * 1978-12-25 1983-08-04 松下電器産業株式会社 printed circuit board equipment

Also Published As

Publication number Publication date
JPH0770797B2 (en) 1995-07-31
JPS63224289A (en) 1988-09-19

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application