KR880008730A - 플렉시블 인쇄회로 기판용 단자구조물 - Google Patents
플렉시블 인쇄회로 기판용 단자구조물 Download PDFInfo
- Publication number
- KR880008730A KR880008730A KR1019870007632A KR870007632A KR880008730A KR 880008730 A KR880008730 A KR 880008730A KR 1019870007632 A KR1019870007632 A KR 1019870007632A KR 870007632 A KR870007632 A KR 870007632A KR 880008730 A KR880008730 A KR 880008730A
- Authority
- KR
- South Korea
- Prior art keywords
- terminal
- insulating film
- flexible
- electrically conductive
- circuit board
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims 7
- 229920003002 synthetic resin Polymers 0.000 claims 3
- 239000000057 synthetic resin Substances 0.000 claims 3
- 229920005992 thermoplastic resin Polymers 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000012943 hotmelt Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/777—Coupling parts carrying pins, blades or analogous contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Contacts (AREA)
- Push-Button Switches (AREA)
- Insulated Conductors (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 부합되는 플렉시블 인쇄회로 기판의 단자구조물 부분 평면도.
제7도 및 8도는 본 발명 구조물의 플렉시블 인쇄회로 기판 단자를 제작하기 위한 프로세스를 설명한 도해도.
Claims (5)
- 열가소성 수지의 플렉시블 절연 필름과, 플렉시블 절연 필름상에 형성되는 전기 도전 패턴과, 단자 섹션을 배제하는 부분에서 플렉시블 절연 필름에 인가되는 합성 수지 절연 코팅을 가지는 플렉시블 인쇄회로 기판용 단자 구조물에 있어서, 단자 섹션에서 대응하는 한 전기 도전 패턴상에 배치되며, 상기 단자 섹션으로부터 예정된 거리만큼 외부로 돌출한 금속단자 부재와, 상기 금속 단자 부재 상부로 부터의 단자 섹션에 배치되는 열가소성 합성수지로 제조되며, 플렉시블 절연 필름과 그 특성에 있어서 동일한 단자 고착필름과, 상기 금속 단자 부재가 위치하는 부분을 배제하는 예정부분에서 함께 융합되는 플렉시블 절연 필름 및 단자 고착 필름을 구비하는 것을 특징으로 하는 플렉시블 인쇄회로 기판용 단자구조물.
- 제1항에 있어서, 상기 금속 단자 부재 각각은 한편 또는 양편에 형성되는 하나 또는 그 이상의 돌출부를 가지는 것을 특징으로 하는 플렉시블 인쇄회로 기판용 단자구조물.
- 열가소성 수지의 플렉시블 절연 필름과, 플렉시블 절연 필름상에 형성되는 전기 도전 패턴과, 단자 섹션을 배제하는 부분에서 플렉시블 절연 필름에 인가되는 합성수지 절연 코팅을 가지는 플렉시블 인쇄회로 기판용 단자구조물에 있어서, 단자 섹션에서 대응하는 전기 도전 패턴과 전기적으로 도전 접착하여 접촉되는 금속 단자 부재와, 상기 금속 단자 부재 상부로 부터의 단자섹션상에 배치되는 열가소성 수지로 제조되며, 플렉시블 절연 필름과 그 특성에 있어서 동일한 단자 고착 필름과, 상기 금속 단자 부재가 위치하는 부분을 배제하는 예정 부분에서 함께 융합되는 플렉시블 절연 필름 및 단자 고착 필름을 구비하는 것을 특징으로 하는 플렉시블 인쇄회로 기판용 단자구조물.
- 제3항에 있어서, 상기 전기 도전 접착제는 고온-용융 타입의 전기 도전 접착제인 것을 특징으로 하는 플렉시블 인쇄회로 기판용 단자구조물.
- 제3항에 있어서, 상기 금속 단자 부재 각각은 한편 또는 양편에 형성되는 하나 또는 그 이상의돌출부를 가지는 것을 특징으로 하는 플렉시블 인쇄회로 기판용 단자구조물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61-305904 | 1986-12-22 | ||
JP61305904A JPS63158711A (ja) | 1986-12-22 | 1986-12-22 | フレキシブルプリント基板の端子構造 |
JP305904 | 1986-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880008730A true KR880008730A (ko) | 1988-08-31 |
KR900008669B1 KR900008669B1 (ko) | 1990-11-26 |
Family
ID=17950698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870007632A KR900008669B1 (ko) | 1986-12-22 | 1987-07-15 | 플렉시블 인쇄회로 기판용 단자 구조물 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4815981A (ko) |
EP (1) | EP0272707B1 (ko) |
JP (1) | JPS63158711A (ko) |
KR (1) | KR900008669B1 (ko) |
DE (1) | DE3780783T2 (ko) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01129769U (ko) * | 1988-02-26 | 1989-09-04 | ||
JPH0269486U (ko) * | 1988-11-14 | 1990-05-25 | ||
US4929196A (en) * | 1989-08-01 | 1990-05-29 | Molex Incorporated | Insert molded filter connector |
JP2580333Y2 (ja) * | 1991-04-09 | 1998-09-10 | 帝国通信工業株式会社 | 電池ホルダの基板取付構造 |
JPH0685341B2 (ja) * | 1991-09-27 | 1994-10-26 | 帝国通信工業株式会社 | フレキシブル基板の端子構造 |
JPH07123060B2 (ja) * | 1992-10-07 | 1995-12-25 | 帝国通信工業株式会社 | 挟持型コネクタに接続されるフレキシブルケーブルの端子構造 |
US5350594A (en) * | 1993-01-25 | 1994-09-27 | Tech Spray, Inc. | Conformally coated faraday cage |
JPH06310839A (ja) * | 1993-04-27 | 1994-11-04 | Matsushita Electric Ind Co Ltd | フレキシブル印刷回路板への電子部品の実装方法 |
JP3011041B2 (ja) * | 1995-01-20 | 2000-02-21 | 住友電装株式会社 | 平型多心電線 |
JPH08335761A (ja) * | 1995-06-06 | 1996-12-17 | Matsushita Electric Ind Co Ltd | 電子部品の配線基板への装着方法およびこれを用いた照光式スイッチユニット |
DE19536131C2 (de) * | 1995-09-28 | 2002-05-02 | Saint Gobain Sekurit D Gmbh | Diversity-Antennenscheibe für Fahrzeuge mit Anschlußelementen |
US5794327A (en) * | 1996-03-05 | 1998-08-18 | Bird Electronic Corporation | Method for making copper electrical connections |
US5934933A (en) * | 1997-06-20 | 1999-08-10 | Cts Corporation | Snap lock membrane connector |
US6019271A (en) * | 1997-07-11 | 2000-02-01 | Ford Motor Company | Method for ultrasonic bonding flexible circuits |
US6573711B1 (en) * | 1998-01-08 | 2003-06-03 | Seagate Technology Llc | Paddle board with extended flexible leads |
US6164984A (en) * | 1999-04-01 | 2000-12-26 | Schreiner Etiketten Und Selbstkelbetechnik Gmbh & Co. | Electrical connecting element |
JP2003031916A (ja) * | 2001-07-19 | 2003-01-31 | Alps Electric Co Ltd | 印刷配線基板 |
AU2002316106A1 (en) * | 2002-06-14 | 2003-12-31 | Ace Tire And Parts, Inc. | Recyclable composite material and method of using composite |
JP3996067B2 (ja) * | 2003-01-30 | 2007-10-24 | 第一電子工業株式会社 | 電気コネクタに対するケーブルの接続構造 |
TWM270513U (en) * | 2004-11-26 | 2005-07-11 | Innolux Display Corp | Strengthening flexible printed circuit |
TWM290312U (en) * | 2005-10-28 | 2006-05-01 | Chicony Electronics Co Ltd | Flexible PCB with reinforcing board |
JPWO2007091357A1 (ja) * | 2006-02-10 | 2009-07-02 | シャープ株式会社 | 配線基板、この配線基板を備える液晶モジュールおよび表示装置 |
US20070221402A1 (en) * | 2006-03-22 | 2007-09-27 | Alex Huang | Soft wire bank joint device |
TW200742511A (en) * | 2006-04-21 | 2007-11-01 | Innolux Display Corp | Printed circuit board |
TWM314988U (en) * | 2006-12-29 | 2007-07-01 | Innolux Display Corp | Flexible printed circuit board |
US8143631B2 (en) | 2008-03-06 | 2012-03-27 | Metrospec Technology Llc | Layered structure for use with high power light emitting diode systems |
US8851356B1 (en) * | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US8007286B1 (en) | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
JP2010061923A (ja) | 2008-09-02 | 2010-03-18 | Three M Innovative Properties Co | 電気接続方法及び電気接続された接続構造体 |
JP5323668B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本メクトロン株式会社 | 照明装置及びその製造方法 |
FR2967308A1 (fr) * | 2010-11-06 | 2012-05-11 | Johnson Controls Tech Co | Dispositif de raccordement electrique flexible entre un composant electrique et une carte imprimee, systeme, et procede de montage d'un systeme. |
JP6585031B2 (ja) * | 2014-03-27 | 2019-10-02 | 株式会社村田製作所 | 携帯機器 |
US9570872B2 (en) * | 2014-05-05 | 2017-02-14 | Jeffrey D. Carnevali | Docking station having connector preload and isolator system |
TWI477216B (zh) * | 2014-06-09 | 2015-03-11 | Chipbond Technology Corp | 可撓式基板 |
JP6986347B2 (ja) * | 2016-01-20 | 2021-12-22 | Fdk株式会社 | ラミネート型蓄電素子およびラミネート型蓄電素子の実装方法 |
JP2019036616A (ja) * | 2017-08-14 | 2019-03-07 | 住友電気工業株式会社 | フレキシブルプリント配線板 |
JP6832313B2 (ja) * | 2018-07-23 | 2021-02-24 | 矢崎総業株式会社 | フレキシブルプリント配線板のコネクタ取付構造 |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3762946A (en) * | 1971-10-21 | 1973-10-02 | Minnesota Mining & Mfg | Small particle loaded electrically conductive adhesive tape |
JPS50158179U (ko) * | 1974-06-17 | 1975-12-27 | ||
JPS52156395A (en) * | 1976-06-21 | 1977-12-26 | Advanced Circuit Tech | Jumper cable and method of manufacture thereof |
US4357750A (en) * | 1976-06-21 | 1982-11-09 | Advanced Circuit Technology Inc. | Jumper cable |
US4188714A (en) * | 1978-04-17 | 1980-02-19 | Teledyne Electro-Mechanisms | Rigid termination for flexible printed circuits |
JPS5824031B2 (ja) * | 1978-07-17 | 1983-05-18 | 松下電器産業株式会社 | 印刷配線板 |
JPS58116272U (ja) * | 1982-01-30 | 1983-08-08 | 日本メクトロン株式会社 | 可撓性回路基板 |
JPS58116271U (ja) * | 1982-01-30 | 1983-08-08 | 日本メクトロン株式会社 | 可撓性回路基板 |
JPS58147904A (ja) * | 1982-02-25 | 1983-09-02 | シャープ株式会社 | ケ−ブル |
JPS594096A (ja) * | 1982-06-30 | 1984-01-10 | 日本メクトロン株式会社 | 異種回路基板相互の接続方法 |
JPS6099566U (ja) * | 1983-12-10 | 1985-07-06 | アルプス電気株式会社 | プリント基板端子部の接続構造 |
JPS60113665U (ja) * | 1984-01-05 | 1985-08-01 | 昭和電工株式会社 | 混成集積回路用基板 |
JPS6119192A (ja) * | 1984-07-05 | 1986-01-28 | キヤノン株式会社 | プリント基板接合構造 |
FR2568419B1 (fr) * | 1984-07-27 | 1986-09-05 | Commissariat Energie Atomique | Microconnecteur a haute densite de contacts. |
US4589584A (en) * | 1985-01-31 | 1986-05-20 | International Business Machines Corporation | Electrical connection for polymeric conductive material |
JPS61201298U (ko) * | 1985-06-05 | 1986-12-17 |
-
1986
- 1986-12-22 JP JP61305904A patent/JPS63158711A/ja active Granted
-
1987
- 1987-07-15 EP EP87201354A patent/EP0272707B1/en not_active Expired - Lifetime
- 1987-07-15 US US07/073,826 patent/US4815981A/en not_active Expired - Lifetime
- 1987-07-15 DE DE8787201354T patent/DE3780783T2/de not_active Expired - Lifetime
- 1987-07-15 KR KR1019870007632A patent/KR900008669B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0464122B2 (ko) | 1992-10-14 |
DE3780783T2 (de) | 1993-01-07 |
US4815981A (en) | 1989-03-28 |
EP0272707B1 (en) | 1992-07-29 |
EP0272707A2 (en) | 1988-06-29 |
DE3780783D1 (de) | 1992-09-03 |
KR900008669B1 (ko) | 1990-11-26 |
EP0272707A3 (en) | 1989-10-18 |
JPS63158711A (ja) | 1988-07-01 |
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