KR880003744A - 비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 - Google Patents

비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 Download PDF

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Publication number
KR880003744A
KR880003744A KR870010115A KR870010115A KR880003744A KR 880003744 A KR880003744 A KR 880003744A KR 870010115 A KR870010115 A KR 870010115A KR 870010115 A KR870010115 A KR 870010115A KR 880003744 A KR880003744 A KR 880003744A
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KR
South Korea
Prior art keywords
liquid
substrate
film
centipoise
photopolymerizable
Prior art date
Application number
KR870010115A
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English (en)
Inventor
라우 티트-퀭
버나도 코우언 에이브러햄
Original Assignee
도늘드 에이 호우즈
이 아이 듀우판 디 네모아 앤드 캄파니
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Application filed by 도늘드 에이 호우즈, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 도늘드 에이 호우즈
Publication of KR880003744A publication Critical patent/KR880003744A/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/155—Nonresinous additive to promote interlayer adhesion in element

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (19)

  1. 하기단계(a)-(d)로 이루어진, 기판에 관중합성 필름을 적층하기 위한 방법;(a) 표준 대기압상태에서 100℃이상의 비점을 갖고 부가 중합화에 의해 고급중합체를 형성할 수 있는 적어도 하나의 에틸렌형기를 함유하고 근본적으로 적어도 하나의 비가스성인 에틸렌형으로 불포화된 화합물로 구성되며 화학선 방사에 본질적으로 비감광성인 액체를 기판 표면이나 미리 형성된 비액체의 광중합성 필름 표면에 적용시키는 단계;(b) 적용된 액체를 통하여 적층도중에 초과한 양의 액체가 존재하여 적층된 기판 및 필름의 적어도 하나의 가장자리를 따라 나오게 되고 액체를 통하여 필름에 기판의 부착이 이루어지는 기판 및 미리형성된 비액체의 광중합성 필름을 적층하는 단계;(c) 상형성을 위해 광중합성 필름 및 액체를 화학선 방사에 노출시키는 단계;(d) 광중합성 필름 및 액체의 노출되지 않은 영역을 기판으로부터 제거시키는 단계.
  2. 제1항에 있어서, 기판이 도드라진 릴리이프인 방법.
  3. 제2항에 있어서, 액체의 점도가 400 센티포이즈 보다 크지 않은 방법.
  4. 제1항에 있어서, 액체의 점도가 200 센티포이즈 보다 크지 않은 방법.
  5. 제4항에 있어서, 액체의 점도 범위가 5 내지 50 센티포이즈인 방법.
  6. 제1항에 있어서, 15분 보다 짧은 유지시간이 단계(c) 및 (d) 사이에 존재하는 방법.
  7. 제1항에 있어서, 기판이 다수의 호울을 갖는 방법.
  8. 제1항에 있어서, 초과한 양의 액체가 상기한 (b) 및 (c) 단계에서 제거되는 방법.
  9. 제8항에 있어서, 다른 액체의 분무가 이 액체를 제거하는 데 사용되는 방법.
  10. 제8항에 있어서, 다른 액체가 친수성인 방법.
  11. 제8항에 있어서, 다른 액체가 물로 이루어진 방법.
  12. 제1항에 있어서, 기판이 본질적으로 평평한 방법.
  13. 제1항에 있어서, 액체의 본질적으로 열가교결합체가 없는 방법.
  14. 제1항에 있어서, 액체가 열가교결합체를 함유하는 방법.
  15. 제1항에 있어서, 광중합성 필름이 납땜 마스크이고 (d) 단계에 이어 기판의 일부분을 노출시키고 노출된 필름을 용융된 납땜과 접촉시키는 방법.
  16. 제1항에 있어서, 화합물이 적어도 하나의 에틸렌형 말단기를 갖고 있는 방법.
  17. 제15항에 있어서, 화합물이 적어도 두개의 에틸렌형 말단기를 갖고 있는 방법.
  18. 제1항에 있어서, 적어도 두 액체층이 (a) 단계에 적용되는 방법.
  19. 제1항에 있어서, 액체가 (a) 단계에서 기판 표면 및 필름 표면에 적용되는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870010115A 1986-09-12 1987-09-11 비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법 KR880003744A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US906442 1986-09-12
US06/906,442 US4698294A (en) 1986-09-12 1986-09-12 Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer

Publications (1)

Publication Number Publication Date
KR880003744A true KR880003744A (ko) 1988-05-30

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ID=25422456

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870010115A KR880003744A (ko) 1986-09-12 1987-09-11 비감광성 중간 액체층을 사용하여 기판상에서 광중합성 필름을 적층하는 방법

Country Status (7)

Country Link
US (1) US4698294A (ko)
EP (1) EP0260590B1 (ko)
JP (1) JPS6374051A (ko)
KR (1) KR880003744A (ko)
CN (1) CN1029426C (ko)
BR (1) BR8704705A (ko)
DE (1) DE3788479T2 (ko)

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Also Published As

Publication number Publication date
CN1029426C (zh) 1995-08-02
EP0260590A3 (en) 1989-11-08
EP0260590A2 (en) 1988-03-23
CN87106837A (zh) 1988-06-01
BR8704705A (pt) 1988-04-26
US4698294A (en) 1987-10-06
JPS6374051A (ja) 1988-04-04
EP0260590B1 (en) 1993-12-15
DE3788479D1 (de) 1994-01-27
DE3788479T2 (de) 1994-06-23

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