KR860004459A - 열처리 방법 - Google Patents
열처리 방법Info
- Publication number
- KR860004459A KR860004459A KR1019850007292A KR850007292A KR860004459A KR 860004459 A KR860004459 A KR 860004459A KR 1019850007292 A KR1019850007292 A KR 1019850007292A KR 850007292 A KR850007292 A KR 850007292A KR 860004459 A KR860004459 A KR 860004459A
- Authority
- KR
- South Korea
- Prior art keywords
- heat treatment
- treatment method
- heat
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/40—Arrangements of controlling or monitoring devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
- F27B9/3077—Arrangements for treating electronic components, e.g. semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59248889A JPS61127133A (ja) | 1984-11-26 | 1984-11-26 | 熱処理方法 |
JP59-248889 | 1984-11-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860004459A true KR860004459A (ko) | 1986-06-23 |
KR900000560B1 KR900000560B1 (ko) | 1990-01-31 |
Family
ID=17184950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850007292A KR900000560B1 (ko) | 1984-11-26 | 1985-10-04 | 열처리 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4678432A (ko) |
JP (1) | JPS61127133A (ko) |
KR (1) | KR900000560B1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0623935B2 (ja) * | 1988-02-09 | 1994-03-30 | 大日本スクリーン製造株式会社 | 再現性を高めた熱処理制御方法 |
US4846674A (en) * | 1988-02-10 | 1989-07-11 | Microdot Inc. | Method and apparatus for heating removably attachable heading tool dies |
US5273424A (en) * | 1990-03-23 | 1993-12-28 | Tokyo Electron Sagami Limited | Vertical heat treatment apparatus |
US5359693A (en) * | 1991-07-15 | 1994-10-25 | Ast Elektronik Gmbh | Method and apparatus for a rapid thermal processing of delicate components |
US5528018A (en) * | 1991-08-19 | 1996-06-18 | Henny Penny Corporation | Programmable load compensation method and apparatus for use in a food |
US5296683A (en) * | 1991-08-19 | 1994-03-22 | Henny Penny Corporation | Preheating method and apparatus for use in a food oven |
US5688422A (en) * | 1995-04-28 | 1997-11-18 | Henny Penny Corporation | Programmable fan control method and apparatus for use in a food oven |
JP3654684B2 (ja) * | 1995-05-01 | 2005-06-02 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
US6204484B1 (en) * | 1998-03-31 | 2001-03-20 | Steag Rtp Systems, Inc. | System for measuring the temperature of a semiconductor wafer during thermal processing |
US20080314892A1 (en) * | 2007-06-25 | 2008-12-25 | Graham Robert G | Radiant shield |
JP5751235B2 (ja) * | 2012-10-19 | 2015-07-22 | トヨタ自動車株式会社 | 電池用電極の製造方法及び装置 |
JP7288745B2 (ja) | 2018-09-13 | 2023-06-08 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP7080145B2 (ja) | 2018-09-20 | 2022-06-03 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP7199888B2 (ja) | 2018-09-20 | 2023-01-06 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3623712A (en) * | 1969-10-15 | 1971-11-30 | Applied Materials Tech | Epitaxial radiation heated reactor and process |
JPS53120075A (en) * | 1977-03-30 | 1978-10-20 | Shinku Riko Kk | Temperature control device |
JPS57147237A (en) * | 1981-03-06 | 1982-09-11 | Sony Corp | Heat treatment device |
JPS5870536A (ja) * | 1981-10-22 | 1983-04-27 | Fujitsu Ltd | レ−ザアニ−ル方法 |
EP0099878B1 (en) * | 1981-12-31 | 1989-03-22 | International Business Machines Corporation | Method for reducing oxygen precipitation in silicon wafers |
-
1984
- 1984-11-26 JP JP59248889A patent/JPS61127133A/ja active Granted
-
1985
- 1985-09-05 US US06/772,780 patent/US4678432A/en not_active Expired - Lifetime
- 1985-10-04 KR KR1019850007292A patent/KR900000560B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS61127133A (ja) | 1986-06-14 |
US4678432A (en) | 1987-07-07 |
JPH0230179B2 (ko) | 1990-07-04 |
KR900000560B1 (ko) | 1990-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19990123 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |