KR850005137A - 반도체소자 제조방법 - Google Patents

반도체소자 제조방법 Download PDF

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KR850005137A
KR850005137A KR1019840008065A KR840008065A KR850005137A KR 850005137 A KR850005137 A KR 850005137A KR 1019840008065 A KR1019840008065 A KR 1019840008065A KR 840008065 A KR840008065 A KR 840008065A KR 850005137 A KR850005137 A KR 850005137A
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semiconductor device
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semiconductor
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KR1019840008065A
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번랑 데이비드 (외 2)
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오레그 이. 앨버
아메리칸 텔리폰 앤드 텔레그라프 캄파니
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Publication of KR850005137A publication Critical patent/KR850005137A/ko

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Abstract

내용 없음

Description

반도체소자 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 와이어가 가열되어 볼이 형성된 후에 있어서, 와이어 본드장치의 부분도.
제2도는 본 발명에 따른 본드의 부분도.
도면부호에 대한 설명
1:가이드장치, 3:와이어, 5:볼, 7:합금영역

Claims (12)

  1. 반도체소자에 전기적 접촉형성을 포함하는 반도체소자 제조방법에 있어서, 접촉물질의 용융온도 가까이에서 안내부에 의해 위치된 선의 단부에 상기 접촉물질을 제공하는 단계와, 소정의 접촉점에서 상기 접촉물질이 접촉되는 단계로 이루어진 것을 특징으로 하는 반도체 소자 제조방법.
  2. 제1항에 따른 방법에 있어서, 상기 접촉물질을 제공하기 이전에 상기 선의 단부상에서 상기 선물질을 포함하는 볼을 형성하는 단계로 이루어진 것을 특징으로 하는 반도체 소자 제조방법.
  3. 제2항에 따르는 방법에 있어서, 상기 형성이 상기 선을 녹이기에 충분한 온도로 가열되어 이루어지는 것을 특징으로 하는 반도체소자 제조방법.
  4. 제3항에 따르는 방법에 있어서, 상기 가열이 토치에 노출되어 이루어지는 것을 특징으로 하는 반도체소자 제조방법.
  5. 선행의 1 내지 4항에 따르는 방법에 있어서, 상기 접촉물질이 최소한 하나의 접촉금속을 포함하는 것을 특징으로 하는 반도체소자 제조방법.
  6. 제5항에 따르는 방법에 있어서, 상기 선의 단부에 용제를 부가하는 단계로 이루어진 것을 특징으로 하는 반도체소자 제조방법.
  7. 선행의 1 내지 5항에 따르는 방법에 있어서, 상기 접촉점이 금속화층을 포함하는 것을 특징으로 하는 반도체소자 제조방법.
  8. 제7항에 따르는 방법에 있어서, 상기 접촉점이 상기 금속화층 밑에서 반도체물질를 포함하는 것을 특징으로 하는 반도체소자 제조방법.
  9. 선행의 1 내지 6항에 따르는 방법에 있어서, 상기 접촉점이 반도체를 포함하는 것을 특징으로 하는 반도체소자 제조방법.
  10. 제8 혹은 9항에 따르는 방법에 있어서, 상기 반도체가 4족과 3-5족과 2-6족의 합성 반도체 그룹에서 선택된 것을 특징으로 하는 반도체 소자 제조방법.
  11. 선행의 5 내지 10항에 따르는 방법에 있어서, 상기 접촉금속제공단계가 용탕에서 이루어지는 것을 특징으로 하는 반도체소자 제조방법.
  12. 선행의 1 내지 11항에 따르는 방법에 있어서, 상기 선이 접촉물질의 용융점이상의 온도에 있는 것을 특징으로 하는 반도체소자 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840008065A 1983-12-19 1984-12-18 반도체소자 제조방법 KR850005137A (ko)

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US56316883A 1983-12-19 1983-12-19
US563168 1983-12-19

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KR850005137A true KR850005137A (ko) 1985-08-21

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KR (1) KR850005137A (ko)
CA (1) CA1220877A (ko)
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US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US4948030A (en) * 1989-01-30 1990-08-14 Motorola, Inc. Bond connection for components
US5683255A (en) * 1993-12-03 1997-11-04 Menze; Marion John Radio frequency connector assembly
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US6828668B2 (en) 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US5830782A (en) * 1994-07-07 1998-11-03 Tessera, Inc. Microelectronic element bonding with deformation of leads in rows
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US5798286A (en) * 1995-09-22 1998-08-25 Tessera, Inc. Connecting multiple microelectronic elements with lead deformation
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US6429112B1 (en) 1994-07-07 2002-08-06 Tessera, Inc. Multi-layer substrates and fabrication processes
US6361959B1 (en) 1994-07-07 2002-03-26 Tessera, Inc. Microelectronic unit forming methods and materials
US6133072A (en) * 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
US20060186179A1 (en) * 2005-02-23 2006-08-24 Levine Lee R Apparatus and method for bonding wires

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NL221946A (ko) * 1955-05-23
GB1434833A (en) * 1972-06-02 1976-05-05 Siemens Ag Solder carrying electrical connector wires

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GB2151529B (en) 1987-09-30
GB8431490D0 (en) 1985-01-23
SG16088G (en) 1988-07-08
GB2151529A (en) 1985-07-24
CA1220877A (en) 1987-04-21
IL73844A0 (en) 1985-03-31
JPS60154537A (ja) 1985-08-14

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