KR850005137A - 반도체소자 제조방법 - Google Patents
반도체소자 제조방법 Download PDFInfo
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- KR850005137A KR850005137A KR1019840008065A KR840008065A KR850005137A KR 850005137 A KR850005137 A KR 850005137A KR 1019840008065 A KR1019840008065 A KR 1019840008065A KR 840008065 A KR840008065 A KR 840008065A KR 850005137 A KR850005137 A KR 850005137A
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- 239000004065 semiconductor Substances 0.000 title claims 8
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 238000000034 method Methods 0.000 claims 12
- 239000000463 material Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000001465 metallisation Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 와이어가 가열되어 볼이 형성된 후에 있어서, 와이어 본드장치의 부분도.
제2도는 본 발명에 따른 본드의 부분도.
도면부호에 대한 설명
1:가이드장치, 3:와이어, 5:볼, 7:합금영역
Claims (12)
- 반도체소자에 전기적 접촉형성을 포함하는 반도체소자 제조방법에 있어서, 접촉물질의 용융온도 가까이에서 안내부에 의해 위치된 선의 단부에 상기 접촉물질을 제공하는 단계와, 소정의 접촉점에서 상기 접촉물질이 접촉되는 단계로 이루어진 것을 특징으로 하는 반도체 소자 제조방법.
- 제1항에 따른 방법에 있어서, 상기 접촉물질을 제공하기 이전에 상기 선의 단부상에서 상기 선물질을 포함하는 볼을 형성하는 단계로 이루어진 것을 특징으로 하는 반도체 소자 제조방법.
- 제2항에 따르는 방법에 있어서, 상기 형성이 상기 선을 녹이기에 충분한 온도로 가열되어 이루어지는 것을 특징으로 하는 반도체소자 제조방법.
- 제3항에 따르는 방법에 있어서, 상기 가열이 토치에 노출되어 이루어지는 것을 특징으로 하는 반도체소자 제조방법.
- 선행의 1 내지 4항에 따르는 방법에 있어서, 상기 접촉물질이 최소한 하나의 접촉금속을 포함하는 것을 특징으로 하는 반도체소자 제조방법.
- 제5항에 따르는 방법에 있어서, 상기 선의 단부에 용제를 부가하는 단계로 이루어진 것을 특징으로 하는 반도체소자 제조방법.
- 선행의 1 내지 5항에 따르는 방법에 있어서, 상기 접촉점이 금속화층을 포함하는 것을 특징으로 하는 반도체소자 제조방법.
- 제7항에 따르는 방법에 있어서, 상기 접촉점이 상기 금속화층 밑에서 반도체물질를 포함하는 것을 특징으로 하는 반도체소자 제조방법.
- 선행의 1 내지 6항에 따르는 방법에 있어서, 상기 접촉점이 반도체를 포함하는 것을 특징으로 하는 반도체소자 제조방법.
- 제8 혹은 9항에 따르는 방법에 있어서, 상기 반도체가 4족과 3-5족과 2-6족의 합성 반도체 그룹에서 선택된 것을 특징으로 하는 반도체 소자 제조방법.
- 선행의 5 내지 10항에 따르는 방법에 있어서, 상기 접촉금속제공단계가 용탕에서 이루어지는 것을 특징으로 하는 반도체소자 제조방법.
- 선행의 1 내지 11항에 따르는 방법에 있어서, 상기 선이 접촉물질의 용융점이상의 온도에 있는 것을 특징으로 하는 반도체소자 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56316883A | 1983-12-19 | 1983-12-19 | |
US563168 | 1983-12-19 |
Publications (1)
Publication Number | Publication Date |
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KR850005137A true KR850005137A (ko) | 1985-08-21 |
Family
ID=24249378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019840008065A KR850005137A (ko) | 1983-12-19 | 1984-12-18 | 반도체소자 제조방법 |
Country Status (6)
Country | Link |
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JP (1) | JPS60154537A (ko) |
KR (1) | KR850005137A (ko) |
CA (1) | CA1220877A (ko) |
GB (1) | GB2151529B (ko) |
IL (1) | IL73844A0 (ko) |
SG (1) | SG16088G (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5189507A (en) * | 1986-12-17 | 1993-02-23 | Raychem Corporation | Interconnection of electronic components |
US4955523A (en) * | 1986-12-17 | 1990-09-11 | Raychem Corporation | Interconnection of electronic components |
US4948030A (en) * | 1989-01-30 | 1990-08-14 | Motorola, Inc. | Bond connection for components |
US5683255A (en) * | 1993-12-03 | 1997-11-04 | Menze; Marion John | Radio frequency connector assembly |
US5455390A (en) * | 1994-02-01 | 1995-10-03 | Tessera, Inc. | Microelectronics unit mounting with multiple lead bonding |
US6828668B2 (en) | 1994-07-07 | 2004-12-07 | Tessera, Inc. | Flexible lead structures and methods of making same |
US5830782A (en) * | 1994-07-07 | 1998-11-03 | Tessera, Inc. | Microelectronic element bonding with deformation of leads in rows |
US6117694A (en) * | 1994-07-07 | 2000-09-12 | Tessera, Inc. | Flexible lead structures and methods of making same |
US5688716A (en) | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
US5798286A (en) * | 1995-09-22 | 1998-08-25 | Tessera, Inc. | Connecting multiple microelectronic elements with lead deformation |
US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US6429112B1 (en) | 1994-07-07 | 2002-08-06 | Tessera, Inc. | Multi-layer substrates and fabrication processes |
US6361959B1 (en) | 1994-07-07 | 2002-03-26 | Tessera, Inc. | Microelectronic unit forming methods and materials |
US6133072A (en) * | 1996-12-13 | 2000-10-17 | Tessera, Inc. | Microelectronic connector with planar elastomer sockets |
US20060186179A1 (en) * | 2005-02-23 | 2006-08-24 | Levine Lee R | Apparatus and method for bonding wires |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL221946A (ko) * | 1955-05-23 | |||
GB1434833A (en) * | 1972-06-02 | 1976-05-05 | Siemens Ag | Solder carrying electrical connector wires |
-
1984
- 1984-12-13 CA CA000470019A patent/CA1220877A/en not_active Expired
- 1984-12-13 GB GB08431490A patent/GB2151529B/en not_active Expired
- 1984-12-17 IL IL73844A patent/IL73844A0/xx unknown
- 1984-12-18 KR KR1019840008065A patent/KR850005137A/ko not_active Application Discontinuation
- 1984-12-19 JP JP59266538A patent/JPS60154537A/ja active Pending
-
1988
- 1988-03-04 SG SG160/88A patent/SG16088G/en unknown
Also Published As
Publication number | Publication date |
---|---|
GB2151529B (en) | 1987-09-30 |
GB8431490D0 (en) | 1985-01-23 |
SG16088G (en) | 1988-07-08 |
GB2151529A (en) | 1985-07-24 |
CA1220877A (en) | 1987-04-21 |
IL73844A0 (en) | 1985-03-31 |
JPS60154537A (ja) | 1985-08-14 |
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