KR850004171A - Vacuum processing unit and device - Google Patents

Vacuum processing unit and device Download PDF

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Publication number
KR850004171A
KR850004171A KR1019840007476A KR840007476A KR850004171A KR 850004171 A KR850004171 A KR 850004171A KR 1019840007476 A KR1019840007476 A KR 1019840007476A KR 840007476 A KR840007476 A KR 840007476A KR 850004171 A KR850004171 A KR 850004171A
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South Korea
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vacuum
sample
chamber
conveying apparatus
buffer chamber
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KR1019840007476A
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Korean (ko)
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KR900004872B1 (en
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히 유다까 가께 (외 5)
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미다 가쓰시게
가부시기 가이샤 히다찌 세이사꾸쇼
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Publication of KR850004171A publication Critical patent/KR850004171A/en
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Publication of KR900004872B1 publication Critical patent/KR900004872B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/03—Pressure vessels, or vacuum vessels, having closure members or seals specially adapted therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Process Working Machines And Systems (AREA)

Abstract

내용 없음No content

Description

진공처리 유니트 및 장치Vacuum processing unit and device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 의한 진공 처리 유니트의 한 실시예를 나타낸 평면도.1 is a plan view showing one embodiment of a vacuum processing unit according to the present invention.

제2도는 제1도의 진공처리 유니트의 시료 반송 장치의 사시구성도.2 is a perspective configuration diagram of a sample carrying device of the vacuum processing unit of FIG.

제3도는 제1도의 진공처리 유니트를 2유니트 연설한 진공처를 장치의 시료 반송 장치의 사시구성도.FIG. 3 is a perspective configuration diagram of a sample conveying apparatus of a vacuum unit in which two vacuum units of the vacuum processing unit of FIG.

제4도(a) 내지 제4도(c)는 2 유니트 진공 처리장치에서의 시료리모드.4 (a) to 4 (c) show a sample mode in a two unit vacuum processing apparatus.

제5도(a), 제5(b)도는 3 유니트 진공처리 장치에서의 다른 시료 처리모드도.5 (a) and 5 (b) show another sample processing mode in the three-unit vacuum processing apparatus.

제6도는 본 발명의 진공처리 유니트의 다른 실시예를 나타내는 평면도이다.6 is a plan view showing another embodiment of the vacuum processing unit of the present invention.

Claims (7)

진공 배기 가능한 버퍼실과, 그 버퍼실에 연통 가능하게 설치된 처리실과, 상기 버퍼실 안에 설치된 제1의 시료반송 장치와, 그 제1의 시료반송 장치에 대응하여 상기 버퍼실에 설치된 진공 개폐장치와, 상기 버퍼실에 진공 개폐장치를 통해 구비 설치된 진공 예비실과, 그 진공예비실 및 상기 제1의 시료반송장치와의 사이에서 상기 진공 개폐장치를 통하여 시료를 반송하는 제2의 시료반송장치와, 상기 제1의 시료반송 장치 및 처리실과의 사이에서 상기 시료를 반송하는 제3의 시료반송장치를 구비한 것을 특징으로 하는 진공 처리 유니트.A buffer chamber capable of vacuum evacuation, a processing chamber provided in communication with the buffer chamber, a first sample carrying apparatus provided in the buffer chamber, a vacuum opening and closing apparatus provided in the buffer chamber in correspondence with the first sample carrying apparatus, A vacuum preliminary chamber provided in the buffer chamber via a vacuum switchgear, a second sample transfer device for transferring a sample through the vacuum switchgear between the vacuum reserve chamber and the first sample transfer device; And a third sample transfer device for transferring the sample between the first sample transfer device and the processing chamber. 제1항에 있어서, 상기 제1의 시료 반송장치 및 상기 제2의 시료반송장치 및 상기 제2의 시료반송장치를 상기 시료를 피처리면 상부면을 향한 수평자세로 반송 가능한 장치로 한 것을 특징으로 하는 진공처리 유니트The said 1st sample conveying apparatus, the said 2nd sample conveying apparatus, and the said 2nd sample conveying apparatus are set as the apparatus which can convey the said sample in a horizontal position toward the upper surface of a to-be-processed surface. Vacuum processing unit 제2항에 있어서, 상기 제1의 시료 반송장치 및 상기 제2의 시료 반송장치를 벨트 반송장치로 하고, 상기 제3의 시료 반송장치를 아암 반송장치로 한 것을 특징으로 하는 진공 처리 유니트.The vacuum processing unit according to claim 2, wherein the first sample conveying apparatus and the second sample conveying apparatus are used as a belt conveying apparatus, and the third sample conveying apparatus is used as an arm conveying apparatus. 제3항에 있어서, 상기 아암 반송장치를 시료 재치기구와, 그 시료 재치기구가 일단에 설치된 동작 평면이 다른 2개의 아암과, 그 아암을 그 타단을 중심으로 하여 각각 부분 회동시키는 회동 장치로서 구성한 것을 특징으로 하는 진공 처리 유니트.4. The arm conveying apparatus according to claim 3, wherein the arm conveying apparatus is configured as a sample placing mechanism, two arms having different working planes provided at one end thereof, and a rotating device for partially rotating the arm around the other end. Vacuum processing unit, characterized in that. 제1항에 있어서, 상기 진공 개폐장치를 제1의 진공 개폐장치와, 제2의 진공 개폐장치로서 구성하고, 상기 제1의 시료 반송장치에 대응하여 상기 버퍼실에 상기 제1의 진공 개폐장치를 설치하고 상기 제1의 진공 개폐장치를 통하여 상기 진공예비실을 상기 버퍼실에 구비설치한 것을 특징으로 하는 진공 처리 유니트.The said vacuum switchgear is comprised as a 1st vacuum switchgear and a 2nd vacuum switchgear, Comprising: The said 1st vacuum switchgear in the said buffer chamber corresponding to the said 1st sample conveying apparatus. And a vacuum reserve chamber is provided in the buffer chamber through the first vacuum switch. 제1항에 있어서, 상기 진공 개폐장치를 상기 제1의 시료 반송장치에 대응하여 상기 버퍼실에 설치된 제1의 진공 개폐장치로 하고, 제1의 진공 개폐장치를 통해 상기 진공 예비실을 상기버퍼실에 구비설치한 것을 특징으로 하는 진공 처리 유니트.2. The buffer according to claim 1, wherein the vacuum switchgear is a first vacuum switchgear installed in the buffer chamber corresponding to the first sample transfer device, and the vacuum preliminary chamber is connected to the buffer through a first vacuum switchgear. A vacuum processing unit, which is provided in the chamber. 진공 배기 가능한 버퍼실과, 그 버퍼실에 연통가능하게 설치된 처리실과, 상기 버퍼실 안에 설치된 제1의 시료 반송장치와, 그 제1의 시료 반송장치에 대응하여 상기 버퍼실에 설치된 진공 개폐장치와, 상기 버퍼실에 진공 개폐장치를 거쳐서 구비 설치된 진공 예비실과, 그 진공예비실과 상기 제1의 시료 반송장치와의 사이에서, 상기 진공 개폐장치를 통하여 시료를 반송하는 제2의 시료 반송장치와, 상기 제1의 시료반송 장치 및 상기 처리실과의 사이에서 시료를 반송하는 제3의 시료 반송장치를 구비한 진공처리 유니트를 상기 제1의 시료 반송 장치에 대응하여 상기 버퍼실에 설치된 상기 진공 개폐장치를 통해서 적어도 2 유니트를 연설한 것을 특징으로 하는 진공 처리장치.A buffer chamber capable of vacuum evacuation, a processing chamber provided in communication with the buffer chamber, a first sample conveying apparatus provided in the buffer chamber, a vacuum switching device provided in the buffer chamber in correspondence with the first sample conveying apparatus, A vacuum preliminary chamber provided in the buffer chamber via a vacuum switchgear, a second sample transfer device for transferring a sample through the vacuum switchgear between the vacuum reserve chamber and the first sample transfer device, and A vacuum processing unit including a first sample carrying device and a third sample carrying device for transferring a sample between the processing chamber and the vacuum opening / closing device provided in the buffer chamber corresponding to the first sample carrying device. A vacuum processing apparatus, characterized in that at least two units are addressed through. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019840007476A 1983-11-28 1984-11-28 Dry etching method KR900004872B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP58222004A JPH06105742B2 (en) 1983-11-28 1983-11-28 Vacuum processing method and device
JP?58-22200 1983-11-28
JP58-222004 1983-11-28

Publications (2)

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KR850004171A true KR850004171A (en) 1985-07-01
KR900004872B1 KR900004872B1 (en) 1990-07-08

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US (1) US4824309A (en)
JP (1) JPH06105742B2 (en)
KR (1) KR900004872B1 (en)
DE (1) DE3442844C2 (en)

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JPS57134946A (en) * 1981-02-16 1982-08-20 Toshiba Corp Carrying device for semiconductor substrate
JPS57149748A (en) * 1981-03-12 1982-09-16 Anelva Corp Treating device for substrate
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US4619573A (en) * 1984-03-09 1986-10-28 Tegal Corporation Article transport apparatus

Also Published As

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JPH06105742B2 (en) 1994-12-21
DE3442844C2 (en) 1996-02-22
JPS60115216A (en) 1985-06-21
US4824309A (en) 1989-04-25
DE3442844A1 (en) 1985-06-05
KR900004872B1 (en) 1990-07-08

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