KR20210092511A - Resin chip transfer and repackaging device - Google Patents

Resin chip transfer and repackaging device Download PDF

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Publication number
KR20210092511A
KR20210092511A KR1020200006003A KR20200006003A KR20210092511A KR 20210092511 A KR20210092511 A KR 20210092511A KR 1020200006003 A KR1020200006003 A KR 1020200006003A KR 20200006003 A KR20200006003 A KR 20200006003A KR 20210092511 A KR20210092511 A KR 20210092511A
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KR
South Korea
Prior art keywords
storage tank
pipe
resin chips
resin
discharge pipe
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KR1020200006003A
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Korean (ko)
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이경택
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이경택
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Priority to KR1020200006003A priority Critical patent/KR20210092511A/en
Publication of KR20210092511A publication Critical patent/KR20210092511A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B1/00—Packaging fluent solid material, e.g. powders, granular or loose fibrous material, loose masses of small articles, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B1/30—Devices or methods for controlling or determining the quantity or quality or the material fed or filled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B1/00—Packaging fluent solid material, e.g. powders, granular or loose fibrous material, loose masses of small articles, in individual containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, or jars
    • B65B1/04—Methods of, or means for, filling the material into the containers or receptacles
    • B65B1/06—Methods of, or means for, filling the material into the containers or receptacles by gravity flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
    • B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
    • B65G53/24—Gas suction systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
    • B65G53/34—Details
    • B65G53/52—Adaptations of pipes or tubes
    • B65G53/54—Flexible pipes or tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/04—Bulk
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2812/00—Indexing codes relating to the kind or type of conveyors
    • B65G2812/16—Pneumatic conveyors
    • B65G2812/1608—Pneumatic conveyors for bulk material
    • B65G2812/1616—Common means for pneumatic conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2812/00—Indexing codes relating to the kind or type of conveyors
    • B65G2812/16—Pneumatic conveyors
    • B65G2812/1608—Pneumatic conveyors for bulk material
    • B65G2812/1691—Pumping systems

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Basic Packing Technique (AREA)

Abstract

The present invention relates to a device for transporting and repackaging resin chips which can conveniently transport and store transported resin chips which are a forming material for synthetic resin products to and in a storage tank when the resin chips are transported through various transport means, and repackage the resin chips in a ton bag after measuring the resin chips filled in the storage tank in a desired amount to distribute the resin chips. According to the present invention, a storage tank is installed on a support, and a vacuum pump is installed on the storage tank to discharge the inside air of the storage tank to generate suction power of outside air. A discharge pipe is installed on the lower end of the storage tank, and a measurement unit is installed below the discharge pipe to measure resin chips in fixed amounts. A supply hopper is connected to one side of the upper end of the storage tank by a transport pipe to transport the resin chips to the storage tank by suction power when the resin chips are supplied to the supply hopper, or a separate suction hose is installed to suck and transport resin chips filled in a storage container to the storage tank. A discharge pipe with an opening/closing valve is installed on the lower end of the storage tank, and a measurement unit is installed below the discharge pipe to package the resin chips filled in the storage tank in a ton bag after measuring the resin chips in fixed amounts.

Description

수지칩 이송 및 재포장장치{Resin chip transfer and repackaging device}Resin chip transfer and repackaging device

본 발명은 합성수지제품 성형소재인 수지칩이 여러 운송수단을 통하여 운송되어 오면, 운송되어온 수지칩을 간편하게 저장탱크로 이송저장하고, 저장탱크에 채워진 수지칩을 다시 원하는 량으로 계량한 다음 톤백(포대자루)에 재포장하여 유통할 수 있게 한 수지칩 이송 및 재포장장치에 관한 것이다.According to the present invention, when a resin chip, which is a molding material for a synthetic resin product, is transported through various transportation means, the transported resin chip is conveniently transferred to a storage tank, and the resin chip filled in the storage tank is again measured to a desired amount and then a ton bag (sack). It relates to a resin chip transport and repackaging device that can be repackaged and distributed in sacks).

일반적으로 합성수지제품을 성형하기 위한 수지칩은 톤백에 포장된 상태로 수입유통되거나, 컨테이너 등과 같은 운송수단을 통하여 생산공장으로 공급하게 된다.In general, resin chips for molding synthetic resin products are imported and distributed in a state of being packaged in ton bags, or supplied to production plants through transportation means such as containers.

그러나 수지칩을 원하는 정량으로 재포장하여 유통하고자 할 경우에는, 작업자가 일일히 계량하여 재포장하여야 함으로, 재포장에 많은 시간과 인력이 낭비될 뿐 아니라, 그에 따른 비용상승의 요인이 되는 것이었다.However, in the case of repackaging and distributing the resin chips in a desired quantity, the operator has to measure and repackage them every day, so a lot of time and manpower is wasted in repacking, which is a factor in cost increase.

관련한 선행기술을 검토하여 보면, 실용신안등록 제20-0339773호 "수지제품 성형을 위한 수지칩 공급통"(특허문헌 1)이 제공된바 있다.When examining the related prior art, Utility Model Registration No. 20-0339773 "Resin Chip Supply Cylinder for Molding Resin Products" (Patent Document 1) has been provided.

상기 특허문헌 1의 기술내용을 검토하여 보면, 사출기나 압출기와 같은 성형기 상부에 구성된 사이크론으로 성형재료를 공급하기 위한 수지칩 공급통의 개량에 관한 것으로서, 특히 공급통에 채워진 수지칩이 바닥에 잔류하는 일없이 완전하게 공급되게 함과 동시에, 공급통에 공급을 위한 호스가 착탈식으로 결합구성되게 하여 필요에 따라 결합 혹은 분리되게 하므로서 공급통 내에 수지칩을 채워넣는 작업 등이 용이하게 이루어질 수 있도록 한 것으로서, 본체 내측 하단에 하향경사진 경사안내판을 용착구성하되, 중앙에 관통공을 구성하고 관통공 직하방에 석션파이프를 연결하고, 상기 관통공 직상부에는 깔대기형 제어커버를 위치시켜 일정량의 수지칩이 순차적으로 공급되게 한 것이다.When examining the technical contents of Patent Document 1, it relates to the improvement of the resin chip supply cylinder for supplying the molding material with a cyclone configured on the upper part of a molding machine such as an injection machine or an extruder, and in particular, the resin chips filled in the supply cylinder are placed on the floor. To ensure that the supply is completely supplied without any residue, and at the same time, the hose for supply is detachably coupled to the supply barrel so that it can be combined or separated as needed, so that the operation of filling the resin chip in the supply barrel can be easily accomplished. As one thing, a downward inclined guide plate is welded to the inner bottom of the main body, a through hole is formed in the center, a suction pipe is connected directly below the through hole, and a funnel-type control cover is placed directly above the through hole to obtain a certain amount of The resin chips were sequentially supplied.

상기 특허문헌 1의 경우 공급통에 채워진 수지칩이 성형기 일측에 구성된 호퍼 건조기로 공급되게 하는 것으로서, 컨테이너나 톤백 등에 채워진 수지칩을 별도의 저장탱크에 이송하고, 저장탱크에 채워진 수지칩을 정량으로 계량하여 재포장하는 수단은 결여되어 있다.In the case of Patent Document 1, the resin chips filled in the supply barrel are supplied to the hopper dryer configured on one side of the molding machine, and the resin chips filled in containers or tonbags are transferred to a separate storage tank, and the resin chips filled in the storage tank are quantitatively measured. Means of measuring and repackaging are lacking.

실용신안등록 제20-0339773호 "수지제품 성형을 위한 수지칩 공급통"Utility Model Registration No. 20-0339773 "Resin Chip Supply Cylinder for Molding Resin Products"

본 발명은 합성수지제품 성형소재인 수지칩이 여러 운송수단을 통하여 운송되어 오면, 운송되어 온 수지칩을 간편하게 저장탱크로 이송저장하고, 저장탱크에 채워진 수지칩을 다시 원하는 량으로 계량한 다음 톤백에 재포장하여 유통할 수 있게 한 수지칩 이송 및 재포장장치에 관한 것이다.According to the present invention, when a resin chip, which is a molding material for a synthetic resin product, is transported through various transportation means, the transported resin chip is conveniently transported and stored in a storage tank, and the resin chip filled in the storage tank is again measured to a desired amount and then placed in a ton bag It relates to a resin chip transport and repackaging device that can be repackaged and distributed.

상기 과제를 해결하기 위한 수단으로서, 본 발명은 지지대 상에 저장탱크를 설치하고, 상기 저장탱크에 진공펌프를 설치하여 저장탱크의 내부공기를 배기시켜 외부공기의 흡입력이 발생되게 하고, 저장탱크 하단부에는 배출관을 설치하고, 배출관 아랫쪽에는 계량부를 설치하여 수지칩을 정량으로 계량할 수 있게 하고, 저장탱크 상단 일측에는 공급호퍼와 이송관으로 연결되게 하여, 공급호퍼에 수지칩을 공급하면 흡입력에 의해 수지칩이 저장탱크로 이송되게 하거나, 별도의 흡입호스를 설치하여 저장통에 채워진 수지칩을 저장탱크로 흡입, 이송되게 하고, 저장탱크 하단부에는 개폐변이 설치된 배출관을 설치하고, 배출관 아랫쪽에는 계량부를 설치하여 저장탱크에 채워진 수지칩을 정량으로 계량한 다음 톤백에 포장되게 한 것이다.As a means for solving the above problems, the present invention installs a storage tank on a support, and installs a vacuum pump in the storage tank to exhaust the internal air of the storage tank to generate a suction force of external air, and the lower end of the storage tank A discharge pipe is installed at the bottom of the discharge pipe, a metering part is installed at the bottom of the discharge pipe to measure the resin chips quantitatively, and the upper side of the storage tank is connected to the supply hopper and the transfer pipe. When the resin chips are supplied to the supply hopper, the Allow the resin chips to be transferred to the storage tank, or install a separate suction hose to suck and transfer the resin chips filled in the storage tank to the storage tank, install a discharge pipe with an opening/closing valve at the lower end of the storage tank, and install a metering unit at the bottom of the discharge pipe The resin chips filled in the storage tank were measured quantitatively and then packaged in a ton bag.

본 발명은 지지대 상에 저장탱크를 설치하고, 상기 저장탱크에 진공펌프를 설치하여 저장탱크의 내부공기를 배기시켜 외부공기의 흡입력이 발생되게 하고, 저장탱크 하단부에는 배출관을 설치하고, 배출관 아랫쪽에는 계량부를 설치하여 수지칩을 정량으로 계량할 수 있게 하고, 저장탱크 상단 일측에는 공급호퍼와 이송관으로 연결되게 하여, 공급호퍼에 수지칩을 공급하면 흡입력에 의해 수지칩이 저장탱크로 이송되게 하거나, 별도의 흡입호스를 설치하여 저장통에 채워진 수지칩을 저장탱크로 흡입, 이송되게 하고, 저장탱크 하단부에는 개폐변이 설치된 배출관을 설치하고, 배출관 아랫쪽에는 계량부를 설치하여 저장탱크에 채워진 수지칩을 정량으로 계량한 다음 톤백에 포장되게 한 다음 유통할 수 있게 되는 등의 효과가 있는 것이다.The present invention installs a storage tank on a support, installs a vacuum pump in the storage tank to exhaust the internal air of the storage tank to generate a suction force of external air, and installs a discharge pipe at the lower end of the storage tank, and at the bottom of the discharge pipe A metering unit is installed so that the resin chips can be measured quantitatively, and the upper side of the storage tank is connected to the supply hopper and the transfer pipe. When the resin chips are supplied to the supply hopper, the resin chips are transferred to the storage tank by suction force or , a separate suction hose is installed to suck and transport the resin chips filled in the storage tank to the storage tank, and a discharge pipe with an opening/closing valve is installed at the bottom of the storage tank, and a metering part is installed at the bottom of the discharge pipe to measure the resin chips filled in the storage tank. It has the effect of being able to be distributed after being weighed and then packaged in a ton bag.

도 1 : 본 발명 장치의 개략구성도
도 2 : 본 발명 장치에 구성된 공급호퍼부의 사시도
도 3 : 본 발명 장치에 구성된 흡입구 부분의 단면구성도1 : Schematic configuration diagram of the device of the present invention
Figure 2: A perspective view of the supply hopper part configured in the device of the present invention
3 is a cross-sectional view of the inlet portion configured in the device of the present invention

이하 본 발명의 실시예를 첨부도면에 따라 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에서 제공하고자 하는 수지칩 이송 및 재포장장치(10)의 개략구성도로서, 충진공간(21)이 형성된 저장탱크(20)와, 저장탱크(20)의 충진공간(21)에 채워진 공기를 배기시켜 흡입력을 유지시키기 위한 진공펌프(60)와, 저장탱크(20)의 충진공간(21)에 흡입수단을 이용하여 수지칩(A)을 이송하기 위한 공급호퍼(30) 및 흡입구(50)와, 저장탱크(20)에 채워진 수지칩(A)을 계량하고 재포장하기 위한 계량부(80)로 구성된다.1 is a schematic configuration diagram of a resin chip transport and repackaging apparatus 10 to be provided in the present invention, a storage tank 20 having a filling space 21 formed therein, and a filling space 21 of the storage tank 20 A vacuum pump 60 for evacuating the air filled in to maintain suction power, and a supply hopper 30 for transferring the resin chips A to the filling space 21 of the storage tank 20 by using a suction means, and It is composed of a suction port 50 and a metering unit 80 for measuring and repackaging the resin chips A filled in the storage tank 20 .

저장탱크(20)는 지지대(22)를 통하여 일정높이에 설치되며, 내부에는 충진공간(21)이 형성되고, 아랫쪽에는 경사면(24)이 형성된 하단부(23)를 구성한다.The storage tank 20 is installed at a predetermined height through the support 22 , a filling space 21 is formed therein, and a lower end 23 having an inclined surface 24 formed therein.

하단부(23)에는 개폐변(25)이 형성된 배출관(26)을 구성하고, 저장탱크(20) 측면에는 투시창(27)이 설치된다.The lower end 23 constitutes a discharge pipe 26 having an opening/closing side 25 formed thereon, and a see-through window 27 is installed on the side of the storage tank 20 .

상기 저장탱크(20) 상부에 걸름망(61)이 형성된 흡기구(62)를 구성하고, 상기 흡기구(62) 일측에 흡기관(63)을 설치하여 진공펌프(60)와 연결되게 함으로서, 진공펌프(60)를 작동시키면 저장탱크(20)의 충진공간(21)에 위치한 공기가 외부로 배출되면서 저장탱크(20)의 충진공간(21) 내부기압이 떨어지게 한다.By constructing an intake port 62 having a sieving net 61 formed on the upper portion of the storage tank 20, and installing an intake pipe 63 on one side of the intake port 62 to be connected to the vacuum pump 60, the vacuum pump ( When the 60) is operated, the air located in the filling space 21 of the storage tank 20 is discharged to the outside, and the internal atmospheric pressure of the filling space 21 of the storage tank 20 is decreased.

수지칩(A)을 저장탱크(20)의 충진공간(21)으로 이송시키기 위한 이송수단은, 운송되어 온 수지칩(A)의 운송형태에 따라 공급호퍼(30)를 이용하거나, 흡입구(50)를 이용할 수 있다. The transport means for transporting the resin chips (A) to the filling space (21) of the storage tank (20) uses the supply hopper (30) or the suction port (50) depending on the transport mode of the transported resin chips (A). ) can be used.

먼저 공급호퍼(30)를 이용한 수지칩(A)의 이송수단을 설명한다.First, the conveying means of the resin chip (A) using the supply hopper (30) will be described.

지지체(31) 상에 유입구(32)가 형성된 유입관(33)을 설치하고, 상기 유입관(33)은 흡입관(34)을 통하여 저장탱크(20) 측면 상단부에 연결되게 하되, 유입구(32)는 차단마개(34)에 의해 필요에 따라 개폐되게 한다.Install the inlet pipe 33 with the inlet 32 formed on the support 31, and the inlet pipe 33 is connected to the upper end of the side of the storage tank 20 through the suction pipe 34, but the inlet 32 is opened and closed as necessary by the blocking stopper (34).

유입관(33) 상단에는 공급관(35)을 설치하고, 공급관(35) 상단에는 공급호퍼(30)를 설치하되, 공급관(35)에는 개폐판(36)에 의해 공급관(35)을 개폐하거나, 개폐량을 조절할 수 있게 한 개폐구(37)가 설치된다.A supply pipe 35 is installed at the upper end of the inlet pipe 33, and a supply hopper 30 is installed at the upper end of the supply pipe 35, but the supply pipe 35 opens and closes the supply pipe 35 by an opening/closing plate 36, An opening/closing opening 37 capable of adjusting the opening/closing amount is installed.

또다른 예로서 흡입구(50)를 이용한 수지칩(A)의 이송수단을 설명한다.As another example, the conveying means of the resin chip (A) using the suction port 50 will be described.

저장탱크(20) 측면 상단부에 보조흡입관(51)을 설치하고, 보조흡입관(51) 하단에 굴곡이 자유로운 흡입호스(52)를 연결구(53)를 통하여 착탈식으로 연결하고, 흡입호스(52) 하단에는 흡입구(50)가 구성된다.The auxiliary suction pipe 51 is installed at the upper end of the side of the storage tank 20, and a flexible suction hose 52 is connected to the lower end of the auxiliary suction pipe 51 in a detachable way through the connector 53, and the suction hose 52 is at the bottom. The suction port 50 is configured.

상기 흡입구(50)에는 외부관(71)과 내부관(72)으로 구성된 U형통기관(70)을 결속밴드(55)로 결속고정하되, 외부관(71)의 공기유입구(73)는 흡입호스(52) 외면에 위치하고, 내부관(72)의 공기배출구(74)는 흡입호스(52)의 흡입공(58) 내면에 위치되게 한다.A U-shaped vent pipe 70 composed of an external pipe 71 and an internal pipe 72 is fixed to the suction port 50 by a binding band 55, but the air inlet 73 of the external pipe 71 is a suction hose (52) is located on the outer surface, the air outlet 74 of the inner tube 72 to be located on the inner surface of the suction hole 58 of the suction hose (52).

또한 U형통기관(70)의 절곡단부(75)는 흡입호스(52)의 단부(54)보다 아랫쪽으로 돌출되게 구성한다.In addition, the bent end 75 of the U-shaped vent pipe 70 is configured to protrude downward than the end 54 of the suction hose 52 .

저장탱크(20) 하단에 위치하는 계량부(80)는 다음과 같이 구성된다.The metering unit 80 located at the lower end of the storage tank 20 is configured as follows.

저장탱크(20)의 배출관(26) 직하방에 체인컨베이어(81)를 설치하고, 체인컨베이어(81) 일측에는 실린더(도시안됨)에 의해 승강하는 계량기(82)를 설치하고, 상기 계량기(82) 상에 마대자루, 즉 톤백(88)을 안치시킨 다음, 배출관(26)을 통하여 낙하하는 수지칩(A)이 톤백(88)에 채워지게 하고, 톤백(88)에 채워진 수지칩(A)은 계량기(82)를 통하여 계량되게 한다.A chain conveyor 81 is installed directly below the discharge pipe 26 of the storage tank 20, and a meter 82 elevating by a cylinder (not shown) is installed on one side of the chain conveyor 81, and the meter 82 ) on the sackcloth, that is, the tone bag 88, and then the resin chips A falling through the discharge pipe 26 are filled in the tone bag 88, and the resin chips A filled in the tone bag 88 is metered through the meter 82 .

이와 같이 구성된 본 발명의 수지칩 이송 및 재포장장치(10)를 이용한 수지칩(A)의 이송과 재포장은 다음과 같이 된다.The transfer and repackaging of the resin chips A using the resin chip transfer and repackaging apparatus 10 of the present invention configured as described above are as follows.

수지칩(A)의 이송은, 계량, 재포장하고자 하는 수지칩(A)을 저장탱크(20)의 충진공간(21)으로 채워넣는 작업이고, 재포장은 저장탱크(20)에 채워진 수지칩(A)을 톤백(88)에 일정량씩 채운 다음 재포장하는 것이다.The transfer of the resin chip (A) is an operation of filling the resin chip (A) to be measured and repackaged into the filling space 21 of the storage tank 20 , and the repacking is the resin chip filled in the storage tank 20 . (A) is to fill the ton bag 88 by a certain amount and then repackage.

수지칩(A)을 저장탱크(20)의 충진공간(21)에 채워넣는 수단은 공급호퍼(30)를 이용하거나, 흡입구(50)를 이용할 수 있다.The means for filling the resin chip A into the filling space 21 of the storage tank 20 may use the supply hopper 30 or the suction port 50 .

먼저 공급호퍼(30)를 이용한 수지칩(A)의 이송수단을 설명한다.First, the conveying means of the resin chip (A) using the supply hopper (30) will be described.

공급호퍼(30)를 통하여 수지칩(A)을 이송하고자 할 경우에는 저장탱크(20) 설치된 보조흡입관(51)으로부터 흡입호스(52)를 분리시킨 다음 보조흡입관(51) 하단부를 밀폐시키고, 동시에 저장탱크(20) 하단에 위치한 배출관(26)도 개폐변(25)을 통하여 밀폐시킨 다음, 진공펌프(60)를 작동시킨다.If you want to transfer the resin chip (A) through the supply hopper 30, separate the suction hose 52 from the auxiliary suction pipe 51 installed in the storage tank 20, and then seal the lower end of the auxiliary suction pipe 51, and at the same time The discharge pipe 26 located at the bottom of the storage tank 20 is also sealed through the opening/closing valve 25 , and then the vacuum pump 60 is operated.

상기에서와 같이 진공펌프(60)를 작동시키면 저장탱크(20)의 충진공간(21)에 위치한 내부공기는 흡기구(62), 흡기관(63) 및 배기구(64)를 통하여 외부로 배출되므로 저장탱크(20)의 내부기압이 현저히 떨어지게 된다.When the vacuum pump 60 is operated as described above, the internal air located in the filling space 21 of the storage tank 20 is discharged to the outside through the intake port 62 , the intake pipe 63 , and the exhaust port 64 . The internal atmospheric pressure of the tank 20 is significantly reduced.

저장탱크(20)의 충진공간(21) 내부기압이 떨어지면, 기압차이에 의해 외부공기가 공급호퍼(30)와 연결된 유입관(33) 및 흡입관(34)을 통하여 저장탱크(20)의 충진공간(21)으로 빨려들게 되고, 이때 공급호퍼(30)에는 자연스럽게 흡입력이 발생하게 된다.When the internal atmospheric pressure of the filling space 21 of the storage tank 20 drops, the external air is supplied through the inlet pipe 33 and the suction pipe 34 connected to the supply hopper 30 due to the difference in atmospheric pressure into the filling space of the storage tank 20 . (21), and at this time, a suction force is naturally generated in the supply hopper (30).

상기한 상태에서 공급호퍼(30)에 수지칩(A)을 공급하게 되면, 공기흡입력에 의해 수지칩(A)이 흡입관(34)을 통하여 저장탱크(20)의 충진공간(21)에 채워지게 된다.When the resin chip (A) is supplied to the supply hopper (30) in the above state, the resin chip (A) is filled in the filling space (21) of the storage tank (20) through the suction pipe (34) by the air suction force. do.

이때 공급호퍼(30)에 수지칩(A)을 공급하는 수단은, 컨테이너를 통하여 운송되어 온 수지칩이나 기타 다른 운송수단을 통하여 운송되어 온 수지칩(A)등 다양한 형태의 운송수단을 통하여 운송되어 온 수지칩(A)이 적용될 수 있다.At this time, the means for supplying the resin chips (A) to the supply hopper (30) is transported through various types of transportation means such as resin chips (A) that have been transported through containers or resin chips (A) that have been transported through other transport means. A resin chip (A) that has been used can be applied.

수지칩(A)의 이송시 공급호퍼(30)에 설치된 개폐구(37)의 개폐판(36) 조절을 통하여, 공급관(35)의 개폐량을 조절하면 저장탱크(20)로 이송되는 수지칩(A)의 량을 조절할 수 있다.When the resin chip (A) is transported, when the opening/closing amount of the supply pipe 35 is adjusted through the control of the opening/closing plate 36 of the opening/closing port 37 installed in the supply hopper 30, the resin chip transferred to the storage tank 20 ( The amount of A) can be adjusted.

상기와 같은 수단을 통하여 저장탱크(20)의 충진공간(21)에 적량의 수지칩(A)이 채워지면 공급호퍼(30)를 통한 수지칩(A)의 이송작업을 진행하면서, 재포장작업을 동시에 진행하게 된다.When an appropriate amount of the resin chip (A) is filled in the filling space (21) of the storage tank (20) through the means as described above, the resin chip (A) is transferred through the supply hopper (30) while the repacking operation is carried out will proceed simultaneously.

상기에서 적량의 수지칩(A)이란, 저장탱크(20)의 충진공간(21)에 수지칩이 채워진 상태에서, 배출관(26)의 개폐변(25)을 개방시키더라도, 수지칩(A)이 자중에 의해 떨어지면서 톤백(88)에 채워지되, 외부공기가 배출관(26)을 통하여 충진공간(21)으로 유입되는 현상이 일어나지 않을 정도이면 된다.In the above, the appropriate amount of the resin chip (A) is the resin chip (A) even when the opening/closing valve 25 of the discharge pipe 26 is opened in a state in which the resin chip is filled in the filling space 21 of the storage tank 20 . While falling by its own weight, it is filled in the tone bag 88 , as long as the phenomenon of external air flowing into the filling space 21 through the discharge pipe 26 does not occur.

상기에서와 같이 적량의 수지칩(A)이 저장탱크(20)에 채워지면 수지칩(A)의 이송작업과 재포장작업을 동시에 진행하게 되며, 재포장작업은 다음과 같이 된다.As described above, when an appropriate amount of the resin chips (A) is filled in the storage tank (20), the transfer operation and the repackaging operation of the resin chips (A) are simultaneously performed, and the repackaging operation is as follows.

즉 계량부(80)의 체인컨베이어(81) 일측에 설치된 계량기(82) 상에 파렛트(86)를 얻고, 그 위에 톤백(88)을 안치한 다음 톤백(88)의 입구를 저장탱크(20) 하단에 위치한 배출관(26) 입구에 고정시킨다.That is, a pallet 86 is obtained on the meter 82 installed on one side of the chain conveyor 81 of the weighing unit 80, the tone bag 88 is placed thereon, and then the inlet of the tone bag 88 is placed at the bottom of the storage tank 20. It is fixed to the inlet of the discharge pipe (26) located in the

이때 톤백(88)은 별도의 지지수단을 통하여 파렛트(86) 상에 안정적으로 위치될 수 있게 하고, 동시에 계량기(82)가 실린더에 의해 상승하여 계량을 준비하게 된다.At this time, the tone bag 88 can be stably positioned on the pallet 86 through a separate support means, and at the same time, the meter 82 rises by the cylinder to prepare for weighing.

상기한 상태에서 배출관(26)의 개폐변(25)을 개방시키면, 저장탱크(20)에 채워진 수지칩(A)이 자중에 의해 톤백(88)으로 낙하하여 채워지게 되고, 일정량이 채워지면, 계량기(82)가 하강하여 파렛트(86)는 체인컨베이어(81) 상에 안치되고, 동시에 개폐변(25)이 배출관(26)을 차단하여 수지칩(A)의 공급을 중단시키게 된다.When the opening/closing valve 25 of the discharge pipe 26 is opened in the above state, the resin chip A filled in the storage tank 20 falls into the tone bag 88 by its own weight and is filled, and when a certain amount is filled, As the meter 82 descends, the pallet 86 is placed on the chain conveyor 81 , and at the same time, the opening/closing valve 25 blocks the discharge pipe 26 to stop the supply of the resin chips A.

수지칩(A)이 정량으로 계량포장된 톤백(88)은 파렛트(86)와 함께 체인컨베이어(81)를 따라 외부로 이동, 밀봉시키면 정량으로 계량된 수지칩(A)의 재포장이 완료된다.When the ton bag 88 in which the resin chips (A) are weighed and packaged is moved to the outside along the chain conveyor 81 together with the pallet 86 and sealed, the repackaging of the quantitatively measured resin chips (A) is completed. .

상기와 같은 작업의 반복으로 저장탱크(20)에 채워진 수지칩(A)을 연속하여 재포장하게 된다.By repeating the above operations, the resin chips A filled in the storage tank 20 are continuously repackaged.

상기에서와 같이 공급호퍼(30)를 이용한 수지칩(A)의 이송은 저장탱크(20)가 주로 실내작업장에 위치하고 있기 때문에, 컨테이너와 같이 대형운송차량이 실내작업장 내에 진입할 수 없을 경우, 공급호퍼(30)를 운송차량진입이 가능한 실외에 설치하여, 흡입관(34)을 통하여 수지칩(A)을 실내에 위치한 저장탱크(20)로 간편하게 이송시킬 수 있다.As described above, the transfer of the resin chips A using the supply hopper 30 is performed when the storage tank 20 is mainly located in the indoor workshop, so a large transport vehicle such as a container cannot enter the indoor workshop. By installing the hopper 30 outdoors where a transport vehicle can enter, the resin chip A can be easily transferred to the storage tank 20 located indoors through the suction pipe 34 .

흡입구(50)를 이용한 수지칩(A)의 이송은 다음과 같다.The transfer of the resin chip A using the suction port 50 is as follows.

흡입구(50)를 이용한 수지칩(A)의 이송은, 별도의 용기나 톤백에 채워진 수지칩을 정량으로 재포장하고자 할 때 실내작업장에서 간편하게 사용할 수 있다.The transfer of the resin chip A using the suction port 50 can be conveniently used in an indoor workshop when it is desired to repackage the resin chips filled in a separate container or ton bag in a quantitative manner.

먼저 진공탱크(20) 상부측면에 설치된 보조흡입관(51)에 흡입호스(52)를 연결하고, 동시에 개폐변(25)을 통하여 배출관(26)을 차단하고, 또한 공급호퍼(30)의 공급관(35)과, 유입관(33)의 유입구(32)를 개폐판(36) 및 차단마개(34)로 차단하여 흡입관(34)을 통하여 외부공기가 저장탱크(20) 내로 유입되지 않게 한다.First, connect the suction hose 52 to the auxiliary suction pipe 51 installed on the upper side of the vacuum tank 20, and at the same time block the discharge pipe 26 through the opening/closing valve 25, and also the supply pipe of the supply hopper 30 ( 35) and the inlet 32 of the inlet pipe 33 are blocked with the opening/closing plate 36 and the blocking stopper 34 to prevent external air from flowing into the storage tank 20 through the suction pipe 34.

상기한 상태에서 진공펌프(60)를 작동시키면 저장탱크(20)의 충진공간(21)에 위치한 공기가 흡기구(62), 흡기관(63) 및 배기구(64)를 통하여 외부로 배출되므로 저장탱크(20) 내부에는 기압이 떨어지게 되고, 따라서 기압차이에 의해 흡입호스(52)의 흡입공(58)을 통하여 외부공기가 저장탱크(20)의 충진공간(21)으로 빨려들면서 흡입력이 발생된다.When the vacuum pump 60 is operated in the above state, the air located in the filling space 21 of the storage tank 20 is discharged to the outside through the intake port 62 , the intake pipe 63 , and the exhaust port 64 , so the storage tank (20) Inside the air pressure is dropped, so the suction force is generated as the outside air is sucked into the filling space 21 of the storage tank 20 through the suction hole 58 of the suction hose 52 due to the pressure difference.

수지칩의 이송을 위하여 흡입구(50)를 수지칩이 담겨진 용기나 톤백 등에 밀어넣으면 흡입호스(52)의 흡입공(58)으로 빨려드는 외부공기의 흡입력에 의해 수지칩(A)도 함께 흡입되므로, 저장용기나 별도의 톤백에 담겨진 수지칩을 간단하게 저장탱크(20)의 충진공간(21)으로 이송저장된다.When the suction port 50 is pushed into a container or tone bag containing the resin chips for the transfer of the resin chips, the resin chips A are also sucked by the suction force of the external air sucked into the suction holes 58 of the suction hose 52. , the resin chips contained in a storage container or a separate ton bag are simply transferred and stored in the filling space 21 of the storage tank 20 .

이때 흡입호스(52) 하단에 설치된 U형통기관(70)은 흡입호스(52)를 통하여 과다한 량의 수지칩(A)이 흡입되어 막히는 현상을 방지함과 동시에, 흡입호스(52)의 단부(54)가 흡입력에 의해 바닥에 흡착되어 수지칩(A)의 이송작업을 방해하는 현상을 방지하게 된다.At this time, the U-shaped vent pipe 70 installed at the lower end of the suction hose 52 prevents the excessive amount of resin chips A being sucked through the suction hose 52 to prevent clogging, and at the same time, the end of the suction hose 52 ( 54) is adsorbed to the floor by the suction force to prevent the phenomenon of interfering with the transfer operation of the resin chip (A).

즉 흡입호스(52) 하단에 결속고정된 U형통기관(70)의 내부관(72)에 구성된 공기배출구(74)는 흡입호스(52)의 흡입공(58) 내에 위치하고, 외부관(71)에 구성된 공기유입구(73)는 흡입호스(52) 외면에 위치하게 된다.That is, the air outlet 74 configured in the inner tube 72 of the U-shaped vent pipe 70 that is bound and fixed to the lower end of the suction hose 52 is located in the suction hole 58 of the suction hose 52, and the outer tube 71 The air inlet 73 configured in the suction hose 52 is located on the outer surface.

따라서 공기배출구(74)가 형성된 내부관(72)의 체적만큼 흡입호스(52)의 흡입공(58)을 통하여 유입되는 수지칩(A)의 흡입이 제어되므로 막힘현상을 방지하게 되고, 특히 외부관(71)에 형성된 공기유입구(73)는 외부에 위치하면서 공기를 흡입호스(52) 내부로 공급하게 되므로 흡입호스(52)를 통한 수지칩(A)의 원활한 이송이 이루어지게 된다.Therefore, since the suction of the resin chip (A) flowing through the suction hole 58 of the suction hose 52 is controlled by the volume of the inner tube 72 in which the air outlet 74 is formed, the clogging phenomenon is prevented, and in particular, the external The air inlet 73 formed in the pipe 71 is positioned outside and supplies air to the inside of the suction hose 52 , so that the resin chip A is smoothly transferred through the suction hose 52 .

또한 U형통기관(70)의 절곡단부(75)는 흡입호스(52)의 단부(54)보다 돌출되어 있어 흡입호스(52)의 흡입공(58)이 바닥에 접하더라도, 돌출구성된 U형통기관(70)의 절곡단부(75)에 의해 막히지 않고 틈이 발생하게 되므로, 흡입공(58)의 막힘현상없이 수지칩(A)을 흡입할 수 있게 된다.In addition, the bent end 75 of the U-shaped vent pipe 70 protrudes from the end 54 of the suction hose 52, so even if the suction hole 58 of the suction hose 52 is in contact with the floor, the U-shaped vent pipe is configured to protrude. Since a gap is generated without being blocked by the bent end portion 75 of 70 , the resin chip A can be sucked without clogging the suction hole 58 .

흡입구(50)를 통하여 저장탱크(20)의 충진공간(21)에 채워진 수지칩(A)은, 배출관(26)을 통하여 계량부(80)에 설치된 톤백(88)에 정량으로 계량, 재포장되며 재포장수단은 공급호퍼(30)를 이용한 수지칩의 이송, 포장에서 설명한바와 같다.The resin chips A filled in the filling space 21 of the storage tank 20 through the suction port 50 are quantitatively measured and repackaged in the ton bag 88 installed in the metering unit 80 through the discharge pipe 26 . The repackaging means is the same as described in the transport and packaging of the resin chips using the supply hopper 30 .

이상에서 설명한 바와 같이 본 발명의 수지칩 이송 및 재포장장치는, 외부에서 컨테이너나 톤백된 여러형태의 운송수단을 통하여 운송되어 온 수지칩을, 진공흡입수단을 통하여 저장탱크(20)로 채워넣고, 저장탱크(20)에 채어진 수지칩을 신속용이하게 톤백(88)에 정량으로 계량하여 재포장할 수 있게 된다.As described above, the resin chip transport and repackaging device of the present invention fills the resin chips transported from the outside through containers or various types of toned-back transport means into the storage tank 20 through a vacuum suction means, , it is possible to quickly and easily measure the resin chips filled in the storage tank 20 in a quantitative amount in the ton bag 88 to be repackaged.

(10)--수지칩 이송 및 재포장장치
(20)--저장탱크 (21)--충진공간
(22)--지지대 (23)--하단부
(24)--경사면 (25)--개폐변
(26)--배출관 (27)--투시창
(30)--공급호퍼 (31)--지지체
(32)--유입구 (33)--유입관
(34)--차단마개 (35)--공급관
(36)--개폐판 (37)--개폐구
(50)--흡입구 (51)--보조흡입관
(52)--흡입호스 (53)--연결구
(54)--단부 (55)--결속밴드
(58)--흡입공 (60)--진공펌프
(61)--걸름망 (62)--흡기구
(63)--흡기관 (64)--배기구
(70)--U형통기관 (71)--외부관
(72)--내부관 (73)--공기유입구
(74)--공기배출구 (75)--절곡단부
(80)--계량부 (81)--체인컨베이어
(82)--계량기 (88)--톤백(10)--Resin chip transfer and repackaging device
(20)--Storage tank (21)--Filling space
(22)--Support (23)--Lower
(24)--Slope (25)--Switch
(26)--Exhaust pipe (27)--Sight window
(30)--Supply hopper (31)--Support
(32)--Inlet (33)--Inlet pipe
(34)--Blocking plug (35)--Supply pipe
(36)--Switch plate (37)--Switch opening
(50)--Suction port (51)--Auxiliary suction pipe
(52)--Suction hose (53)--Connector
(54)--End (55)--Bundling Band
(58)--Suction hole (60)--Vacuum pump
(61)--Silver mesh (62)--Intake port
(63)--Intake pipe (64)--Exhaust port
(70)--U-shaped vent pipe (71)--External pipe
(72)--Inner pipe (73)--Air inlet
(74)--Air outlet (75)--Bent end
(80)--Weighing part (81)--Chain conveyor
(82)--Weigher (88)--Tonback

Claims (3)

수지칩 이송 및 재포장장치를 구성함에 있어서, 충진공간(21)이 형성된 저장탱크(20) 상부에 진공펌프(60)와 연결된 흡기관(63)를 설치하고, 저장탱크(20) 상단 일측에 흡입관(34)을 설치하되, 상기 흡입관(34)은 공급호퍼(30)가 설치된 유입관(33)과 연결하고, 상기 공급호퍼(30)는 개폐구(37)에 의해 공급관(35)의 개폐량이 조절되게 하고, 저장탱크(20) 하단에는 개폐변(25)이 형성된 배출관(26)을 구성하고, 상기 배출관(26) 직하방에 계량부(80)를 설치함으로서, 배출관(26)을 통하여 배출되는 수지칩이 톤백에 정량으로 계량포장되게 함을 특징으로 하는 수지칩 이송 및 재포장장치.In configuring the resin chip transfer and repackaging device, an intake pipe 63 connected to the vacuum pump 60 is installed on the upper portion of the storage tank 20 in which the filling space 21 is formed, and at one side of the upper end of the storage tank 20 . A suction pipe 34 is installed, but the suction pipe 34 is connected to the inlet pipe 33 in which the supply hopper 30 is installed, and the supply hopper 30 has an opening and closing amount of the supply pipe 35 by the opening and closing port 37. The discharge pipe 26 having an opening and closing valve 25 is formed at the lower end of the storage tank 20, and the metering part 80 is installed directly below the discharge pipe 26, so that the discharge pipe 26 is discharged through the discharge pipe 26. A resin chip transport and repackaging device, characterized in that the resin chips to be used are measured and packaged in a ton bag. 수지칩 이송 및 재포장장치를 구성함에 있어서, 충진공간(21)이 형성된 저장탱크(20) 상부에 진공펌프(60)와 연결된 흡기관(63)을 설치하고, 저장탱크(20) 상단 일측에 흡입구(50)가 형성된 흡입호스(52)를 설치하고, 저장탱크(20) 하단에 개폐변(25)이 형성된 배출관(26)을 구성하고, 상기 배출관(26) 직하방에 계량부(80)를 설치함으로서, 배출관(26)을 통하여 배출되는 수지칩이 톤백에 정량으로 계량포장되게 함으로 특징으로 하는 수지칩 이송 및 재포장장치.In configuring the resin chip transfer and repackaging device, the intake pipe 63 connected to the vacuum pump 60 is installed on the upper portion of the storage tank 20 in which the filling space 21 is formed, and at one side of the upper end of the storage tank 20 . A suction hose 52 having a suction port 50 is installed, a discharge pipe 26 having an opening/closing valve 25 formed at the lower end of the storage tank 20 is configured, and a metering unit 80 is directly below the discharge pipe 26. A resin chip transport and repackaging device, characterized in that by installing a resin chip discharged through the discharge pipe (26), the resin chips are measured and packaged in a ton bag in a quantitative manner. 제2항에 있어서, 흡입호스(52) 하단에 구성된 흡입구(50)에 공기유입구(73)가 형성된 외부관(71)과, 공기배출구(74)가 형성된 내부관(72)으로 구성된 U형통기관(70)을 설치하되, 외부관(71)은 흡입호스(52) 외면에, 내부관(72)은 흡입호스(52) 내면에 각각 위치되게 함을 특징으로 하는 수지칩 이송 및 재포장장치.3. The U-shaped vent pipe according to claim 2, wherein an outer pipe 71 having an air inlet 73 formed in the suction port 50 formed at the lower end of the suction hose 52, and an inner pipe 72 having an air outlet 74 formed therein. (70) is installed, but the outer tube 71 is positioned on the outer surface of the suction hose 52, and the inner tube 72 is positioned on the inner surface of the suction hose 52, respectively.
KR1020200006003A 2020-01-16 2020-01-16 Resin chip transfer and repackaging device KR20210092511A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200339773Y1 (en) 2003-10-23 2004-01-24 신장교 Resin chip box supplying for forming resin products

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200339773Y1 (en) 2003-10-23 2004-01-24 신장교 Resin chip box supplying for forming resin products

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