KR20200067571A - Manufacturing machine of form board with seperable paper and manufacturing method thereof - Google Patents

Manufacturing machine of form board with seperable paper and manufacturing method thereof Download PDF

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KR20200067571A
KR20200067571A KR1020180154578A KR20180154578A KR20200067571A KR 20200067571 A KR20200067571 A KR 20200067571A KR 1020180154578 A KR1020180154578 A KR 1020180154578A KR 20180154578 A KR20180154578 A KR 20180154578A KR 20200067571 A KR20200067571 A KR 20200067571A
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heating
roll
paper
foam board
added
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KR1020180154578A
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Korean (ko)
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공규택
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공규택
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B29/007—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a foam layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18—Paper- or board-based structures for surface covering
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/30—Multi-ply
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0221—Vinyl resin
    • B32B2266/0228—Aromatic vinyl resin, e.g. styrenic (co)polymers

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a form board manufacturing apparatus in which a preheating unit preheats a foam board fabric, a high frequency processing unit processes a surface of the foam board fabric by high frequency, paper is laminated while passing through a withdrawal roll, and a heating roll welds and attaches the paper to the foam board fabric. According to the present invention, a heating means (21) is added to the withdrawal roll and heating rolls are formed by multiple stages. The heating roll comprises: a first heating roll (11) having a surface heated at 115 to 125°C by heating the heating means (21) added to the withdrawal roll; a second heating roll (12) consecutively passing the form board passing through the withdrawal roll and added with a heating means (22) to heat the surface at 145 to 155°C; a third heating roll (13) consecutively passing the form board passing through the second heating roll (12) and added with a heating means (23) to heat the surface at 185 to 195°C; and a fourth roll (14) having a pressing roll function and added with a cooling means (24) to press and pass, at room temperature, the form board passing through the third heating roll. According to the present invention, quality is uniformed and the paper can be welded with the foam board without using a separate paper adhesive and can be separated, thereby enabling a user to perform separate garbage collection.

Description

합지종이 분리가 가능한 폼보드제조장치 및 방법{Manufacturing machine of form board with seperable paper and manufacturing method thereof}Manufacturing apparatus and method for separable paperboard separable paper and manufacturing method thereof

본 발명은 합지종이 분리가 가능한 폼보드제조장치 및 방법에 관한 것이다.The present invention relates to a foam board manufacturing apparatus and method capable of separating paper.

압출 폴리스티렌 수지 발포 보드는 연속적이고 효과적으로 제조할 수 있으며 다양한 장점(예: 단열성, 경량, 저흡수성 및 가공성)이 있으므로, 일반 주택뿐만 아니라 기타의 구조물용 단열재로서 폭넓게 이용되어 왔다.Extruded polystyrene resin foam boards can be manufactured continuously and effectively and have various advantages (eg, heat insulation, light weight, low water absorption, and processability), and thus have been widely used as insulation materials for general structures as well as general houses.

압출 폴리스티렌 수지 발포 보드는 폴리스티렌 수지, 발포 보드 및 기타의 첨가제를 압출기의 실린더에서 혼합 및 용융시키고, 생성된 용융 혼합물을 고압영역으로부터 저압영역으로 압출기의 압출 다이를 통하여 압출시킨 다음, 압출물을 계속 발포시키면서 성형장치를 통과시켜 제조하여 왔다. 그러나, 이렇게 하여 수득한 압출 발포보드는 압출 방향에 수직인 단면에서의 발포도가 균일하지 않으며, 발포 보드의 밀도분포와 기계적 강도분포가 불균일하다는 단점이 있다. 이는 압출 수지 혼합물의 온도가 높아서 보형성이 나쁘기 때문에, 이것을 냉각시키면서 성형장치에서 성형하고 압출물의 표면부가 압출물의 내부보다 급속히 냉각되어 표면부의 발포를 억제하기 때문이다. 따라서, 표면부의 밀도는 높으며 내부의 밀도는 낮다. 더우기, 성형장치에 의해 온도가 높은 압출 수지 혼합물을 냉각시키는 것은 혼합물의 전반적인 발포를 억제하므로, 압출 발포 보드의 바람직한 밀도에 악영향을 미친다.The extruded polystyrene resin foam board mixes and melts the polystyrene resin, foam board, and other additives in the cylinder of the extruder, extrudes the resulting melt mixture from the high pressure region to the low pressure region through the extruder's extrusion die, and then continues the extrudate. It has been manufactured by passing a molding apparatus while foaming. However, the obtained extruded foam board has the disadvantages that the foaming degree in the cross section perpendicular to the extrusion direction is not uniform, and the density distribution and the mechanical strength distribution of the foam board are non-uniform. This is because the extruded resin mixture has a high temperature and poor shape retention, so it is molded in a molding apparatus while cooling, and the surface of the extrudate is cooled faster than the inside of the extrudate to suppress foaming of the surface. Therefore, the density of the surface portion is high and the density inside is low. Moreover, cooling the high temperature extruded resin mixture by a molding apparatus suppresses the overall foaming of the mixture, thus adversely affecting the desired density of the extruded foam board.

그러므로, 압출물을 발포 및 냉각 후에 재가열하거나, 진공장치로 또는 열용량이 크고 상온에서 액체인 증기를 대기속으로 계속해서 보내는 공정이 제안되었다. 그러나, 이러한 공정에 따라 제조한 발포 보드 역시 발포 보드의 압출 방향에 수직인 단면에서의 밀도와 기계적 강도가 여전히 불균일하다. 그러므로 두꺼운 발포 보드의 절단형으로 사용하는 경우, 이러한 발포 보드는 구부러지고 심지어는 작은 온도변화에도 파쇄되므로, 단일 시트 형태로만 사용해야 한다. 이는 생산성을 매우 저조하게 하며 단가를 상승시킨다.Therefore, a process has been proposed in which the extrudate is reheated after foaming and cooling, or continuously sending a vapor, which is a liquid with a large heat capacity or at room temperature, to the atmosphere in a vacuum device. However, the foam board manufactured according to this process also has a non-uniform density and mechanical strength in a cross section perpendicular to the extrusion direction of the foam board. Therefore, when used as a cut of thick foam boards, these foam boards should be used only in the form of a single sheet because they are bent and even crushed even with small temperature changes. This makes productivity very low and increases the cost.

스티렌 수지 발포 보드 시트를 압출하면서 또는 압출 직후에 표면에서 ＂냉각시키고＂, 계속해서 또는 방치 후에, 표면에서 가열하여 발포시키는 공정이 문헌에 기술되어 있다[참조: 일본국 공개 특허공보 소56-99635호].The process of extruding a styrene resin foamed board sheet or cooling it on the surface immediately after extrusion, or continuously or after leaving it, and then heating and foaming it on the surface is described in the literature [See Japanese Patent Laid-Open No. 56-99635 number].

이는 공정에서, 수지를 압출하는 동안 또는 수지가 오리피스를 통과한 후에 오리피스 내의 선단에서 냉각함으로써 충분한 발포기능을 여전히 보유한 수지를 냉각시킨다. 그 결과로, 일단 냉각된 매우 두꺼운 발포 보드(즉,발포성 단열재)를 발포되도록 재가열할 때, 발포 보드 심층부까지 가열되지 않아 균일성 및 저밀도를 갖는 발포 보드를 수득하기가 어렵다. 예를 들면, 열 용량이 크고 열이 발포 보드 심층부까지 용이하게 투과할 수 있는 폴리스티렌 수지에 대한 기체투과성이 높은 증기를 사용하여 가열할 때, 저밀도는 얻을 수 있지만, 증기의 투과성이 향상됨에 따라 표면층과 심층부의 밀도분포는 불균일해진다. 더우기 이러한 증기에 의한 가열은 특정 시간 또는 높은 단가 또는 열손실을 야기하는 잔류 발포 보드의 응축액 제거 단계를 필요로 한다. 그리고 일단 냉각된 발포 보드(즉, 단열재)를 추가로 가열하는 단계는 비경제적이며 최종 제품의 단가 면에서 매우 불리하다.This cools the resin that still retains sufficient foaming capability in the process, either during extrusion of the resin or by cooling at the tip in the orifice after the resin has passed through the orifice. As a result, once reheated so that the cooled very thick foam board (ie, foam insulation) is foamed, it is difficult to obtain a foam board having uniformity and low density because it does not heat up to the deep part of the foam board. For example, when heating using a vapor having a high gas permeability to a polystyrene resin having a large heat capacity and easily allowing heat to penetrate deep into the foam board, low density can be obtained, but as the vapor permeability improves, the surface layer The density distribution of the and deep regions becomes non-uniform. Moreover, heating with this steam requires a certain time or step of removing the condensate of the residual foam board, which results in high cost or heat loss. And the step of additionally heating the cooled foam board (i.e., insulation) is uneconomical and very disadvantageous in terms of the cost of the final product.

한편, 폼 보드 원판의 상하면에 종이를 붙여 만든 폼보드 원판을 만드는 예로는 도 1 과 같이 권취롤(1)에 감긴 폼보드 원판(2)을 인출롤(3)을 통하여 인출하고 이를 예열부(4)에서 예열하고, 폼보드 원판(2)의 상하면에 고주파 누름부(5)를 통한 누름 작용으로 표면을 가열하는 고주파 처리부(6)를 통과하고, 고주파 처리부(6)에서 표면처리된 고주파 처리 폼보드 원판(2-1)은 인출롤(7)을 통하여 인출되는 종이롤(8)을 통해 공급받은 종이(9)를 히팅롤(10)의 히팅으로 합체시켜 수득한다. (5-1)은 고주파 누름부(5)와의 누름 시 고주파를 발생토록 접지 전원을 인가받는 베이스롤 이다.On the other hand, as an example of making a foam board disc made by pasting paper on the upper and lower surfaces of the foam board disc, the foam board disc 2 wound around the take-up roll 1 as shown in FIG. 1 is pulled out through the take-off roll 3 and the preheating unit ( Pre-heating in 4), passing through the high-frequency processing unit 6 heating the surface by pressing action through the high-frequency pressing unit 5 on the upper and lower surfaces of the foam board original plate 2, and the high-frequency processing surface-treated by the high-frequency processing unit 6 The foam board original plate 2-1 is obtained by coalescing the paper 9 supplied through the paper roll 8 drawn through the draw roll 7 by the heating of the heating roll 10. (5-1) is a base roll that is applied with ground power to generate high frequency when pressed with the high frequency pressing unit (5).

그러나 이러한 방식은 폼보드 원판(2)을 예열부(4) 및 고주파 처리부(6)를 통과토록 함으로써 가열하여 추가 발포가 일어나므로 두께가 불균일하고, 이를 종이롤(8)에서 인출되는 종이(9)와 합체하도록 한 상태에서 히팅롤(10)로 히팅하므로, 종이와 합체하는 동안 고주파처리 폼보드원판(2-1)의 표면이 일부 냉각되어 종이와의 합체 특성이 일정하지 못하여 불균일한 표면을 가지는 문제점이 있고, 접착성이 저하되어 쉽게 종이가 분리되는 요인이 된다.However, in this method, since the foam is generated by heating the foam board original plate 2 through the preheating part 4 and the high-frequency processing part 6, the thickness is non-uniform, and the paper 9 drawn out from the paper roll 8 ), the surface of the high-frequency processing foam board 2-1 is partially cooled while coalescing with paper, so that the coalescence properties with the paper are not uniform, resulting in uneven surfaces. Branching has a problem, and the adhesiveness is deteriorated, which is a factor for easily separating paper.

이를 해소하려고 합지시 접착본드를 사용하기도 하나 환경공해를 유발하고, 합지된 종이가 분리되지 않아 폼보드 재사용이 어려운 문제가 있다.In order to solve this, an adhesive bond is used when laminating, but it causes environmental pollution, and it is difficult to reuse the foam board because the laminated paper is not separated.

본 발명은 이를 해결하고자 하는 것으로, 본 발명의 목적은 합지되는 종이를 3단계의 열처리와 최종 냉각처리를 통하여 융착되는 종이가 합지는 가능하고, 분리도 가능토록 하는 합지종이 분리가 가능한 폼보드제조장치 및 방법을 제공하려는 것이다.The present invention seeks to solve this, and the object of the present invention is to manufacture a paperboard capable of separating laminated paper so that the paper to be fused can be merged through three stages of heat treatment and final cooling treatment. It is intended to provide a device and method.

이를 위한 본원발명은 폼보드원단을 예열부에서 예열하고, 고주파 처리부에서 표면을 고주파처리하여 종이를 인출롤을 지나면서 합지하고, 이어 히팅롤에서 종이를 융착하여 붙이는 폼보 드제조장치로,The present invention for this purpose is a foam board fabrication device for preheating the foam board fabric in a preheating section, high-frequency treatment in a high-frequency processing section, laminating the paper as it passes through the draw roll, and then fusing and attaching the paper from the heating roll.

인출롤에 히팅수단을 부가하고,Add heating means to the draw roll,

히팅롤을 다단으로 설치하며,The heating roll is installed in multiple stages,

히팅롤은 인출롤에 부가한 히팅수단의 가열로 표면이 115~125℃로 가열되는 제 1히팅롤;The heating roll includes: a first heating roll having a heating surface of 115 to 125°C heated by a heating means added to the drawing roll;

제 1히팅롤을 지난 것을 이어 통과시키며 표면이 145~155℃로 가열되도록 히팅수단을 부가한 제 2히팅롤;A second heating roll having a heating means added so that the surface passes through the first heating roll and is heated to 145 to 155°C;

제 2히팅롤을 지난 것을 이어 통과시키며 185~195℃로 가열되도록 히팅수단을 부가한 제 3히팅롤; 및A third heating roll to which a heating means is added so that it passes through the second heating roll and is heated to 185 to 195°C; And

제 3히팅롤을 지난 것을 이어 상온 상태로 압착통과시키도록 냉각수단을 부가한 누름롤 기능의 제 4롤을 포함하여 구성한다.It comprises a fourth roll of a pressing roll function to which a cooling means is added so as to pass through the third heating roll in a compressed state at room temperature.

본원발명의 제조방법은, 롤 상의 폼보드 원단을 115~125℃로 1~2초 예열하는 예열공정;The manufacturing method of the present invention includes a preheating step of preheating the foam board fabric on the roll at 115 to 125°C for 1 to 2 seconds;

예열공정을 지난 폼보드원단을 상하에서 동시에 고주파처리하는 고주파처리공정;A high-frequency processing step of simultaneously performing high-frequency processing of the foam board fabric that has passed the preheating process at the top and bottom;

고주파 처리한 폼보드 상하에서 합지할 종이를 인출하여 합지하되, 115~125℃로 가열하는 기능이 부가된 인출롤인 제 1히팅롤을 통과시키는 제 1히팅공정;A first heating process of passing out a first heating roll, which is a drawing roll added with a function of heating to 115 to 125° C., while drawing and laminating paper to be laminated on top and bottom of the high-frequency treated foam board;

제 1히팅공정에 이어 145~155℃로 가열된 히팅롤을 통과하는 제 2히팅공정;A second heating process that passes through a heating roll heated to 145 to 155°C following the first heating process;

제 2히팅공정에 이어 185~195℃로 가열된 히팅롤을 통과하는 제 3히팅공정;및A third heating process passing through a heating roll heated to 185-195° C. following the second heating process; and

제 3히팅공정에 이어 상온으로 냉각되어, 합지된 폼보드원단 표면을 냉각 및 누름작용을 하여, 합지된 종이가 분리 가능토록 기능하는 냉각공정을 순차 수행한다.Following the third heating process, it is cooled to room temperature, and cools and presses the surface of the laminated foam board fabric to sequentially perform a cooling process in which the laminated paper functions to be separated.

이상과 같이 본원발명은 합지되는 종이를 3단계의 열처리와 최종 냉각처리를 통하여 융착되는 종이가 합지는 가능하고, 사용 후 재사용을 위한 합지 분리시 종이의 분리도 가능토록 하는 합지종이 분리가 가능한 폼보드제조장치 및 방법을 제공하므로, 폼보드원단 만의 회수가 가능하여 재생사용이 가능하고, 재생사용이 가능하므로 분리 수거가 가능하다.As described above, the present invention allows the paper to be fused through three stages of heat treatment and final cooling treatment. It is possible to separate the paper from the paper so that the paper can be separated when the paper is separated for reuse. Since the board manufacturing apparatus and method are provided, it is possible to recover only the foam board fabric, so it can be recycled and used.

도 1 은 일반적인 폼보드 제조장치 구성도,
도 2는 본 발명의 제조장치 확대도,
도 3은 본 발명의 제조장치 요부 확대도이다.1 is a typical form board manufacturing apparatus configuration,
Figure 2 is an enlarged view of the manufacturing apparatus of the present invention,
3 is an enlarged view of main parts of the manufacturing apparatus of the present invention.

이하 본원발명의 실시예를 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

폼보드원단을 예열부에서 예열하고, 고주파 처리부에서 표면을 고주파처리하여 종이를 인출롤을 지나면서 합지하고, 이어 히팅롤에서 종이를 융착하여 붙이는 폼보 드제조장치로,This is a foam board fabrication device that preheats the foam board fabric in the preheating section, high-frequency treatments the surface in the high-frequency processing section, and then bonds the paper as it passes through the draw roll.

인출롤에 히팅수단(21)을 부가하고,The heating means 21 is added to the draw roll,

히팅롤을 다단으로 설치하며,The heating roll is installed in multiple stages,

히팅롤은 인출롤에 부가한 히팅수단(21)의 가열로 표면이 115~125℃로 가열되는 제 1히팅롤(11);The heating roll includes a first heating roll 11 whose surface is heated to 115 to 125° C. by heating of the heating means 21 added to the drawing roll;

제 1히팅롤(11)을 지난 것을 이어 통과시키며 표면이 145~155℃로 가열되도록 히팅수단(22)을 부가한 제 2히팅롤(12);A second heating roll 12 to which the heating means 22 is added so that the surface passes through the first heating roll 11 and is heated to 145 to 155°C;

제 2히팅롤(12)을 지난 것을 이어 통과시키며 185~195℃로 가열되도록 히팅수단(23)을 부가한 제 3히팅롤(13); 및A third heating roll 13 to which heating means 23 are added so as to pass through the second heating roll 12 and to be heated to 185 to 195°C; And

제 3히팅롤(13)을 지난 것을 이어 상온 상태로 압착통과시키도록 냉각수단(24)을 부가한 누름롤 기능의 제 4롤(14)을 포함하여 구성한다.It comprises a fourth roll 14 of a pressing roll function to which a cooling means 24 is added so as to pass through the third heating roll 13 after passing through the pressure in a normal temperature state.

상기, 제4롤(14)의 표면은 15~26℃의 상온을 유지하도록 냉각수단(24)을 표면 근처에 부가하고, 냉각수단(24)은 냉각수 통로를 통하는 냉각수이거나 냉온처리가 가능한 열전모듈(Thermoelectric module)인 것을 예시할 수 있으나 이에 한정하지는 않는다.The surface of the fourth roll 14 adds cooling means 24 near the surface to maintain room temperature of 15 to 26°C, and the cooling means 24 is cooling water through a cooling water passage or a thermoelectric module capable of cold and hot treatment. (Thermoelectric module) may be exemplified, but is not limited thereto.

본원발명의 제조방법은,Manufacturing method of the present invention,

롤 상의 폼보드 원단을 115~125℃로 1~2초 예열하는 예열공정;A preheating process for preheating the foam board fabric on the roll to 115 to 125°C for 1 to 2 seconds;

예열공정을 지난 폼보드원단을 상하에서 동시에 고주파처리하는 고주파처리공정을 수행한다. A high-frequency treatment process is performed in which the foam board fabric that has passed the preheating process is subjected to high-frequency treatment at the same time.

본 발명에서 예열공정을 하는 것은 롤 상의 폼보드 원판(2)을 롤상으로 감을때의 급속 냉각으로 표면이 불균일한 것을 평면하게 이루어지도록 예열하는 것이다.In the present invention, the preheating process is to preheat the surface of the non-uniform surface to be flat due to rapid cooling when the foam board original plate 2 on the roll is wound onto the roll.

본 발명에서 고주파처리하는 것은 고주파누름부가 고주파를 발생시켜 폼보드가 절연물로 기능하여 절연물의 유전체 손실에 의한 발명 워리를 이용하는 것으로, 발명에 의하여 발포가 표면에서 이루어지면서 융착되고, 발포 융착된 형태를 도 2 및 도 3 에 일종의 파형 형태로 나타낸다.In the present invention, the high-frequency treatment is a high-frequency pressing unit generating high-frequency, and the foam board functions as an insulating material to use the invention wary due to the dielectric loss of the insulating material. 2 and 3 are shown in a form of a waveform.

고주파 처리한 폼보드 원판(2-1) 상하에서 합지할 종이(9)를 종이롤(8)에서 인출하여 합지하되, 115~125℃로 가열하는 히팅수단(21)이 내장된 인출롤인 제 1히팅롤(11)을 통과시키는 제 1히팅공정(S1)을 수행한다. 이 경우 전열히터 등의 히팅수단(21)을 통하여 표면이 115~125℃로 가열되므로 합지할 종이(9) 표면이 가열되어 고주파융착된 표면의 철부와 초기 융착이 이루어진다. 본 발명에서 제 1히팅롤(11)을 115~125℃로 가열하는것은 115℃ 미만이면 융착이 어렵고, 125℃를 초과하면 과열로 인한 표면과 내부의 발포에 차이가 생겨 균일한 보드 표면 유지가 어렵기 때문이다.The paper 9 to be laminated on the top and bottom of the high-frequency treated foam board 2-1 is pulled out from the paper roll 8 and laminated, but the first roll is a draw roll having a heating means 21 for heating to 115 to 125°C. A first heating process (S1) for passing the heating roll 11 is performed. In this case, since the surface is heated to 115 to 125° C. through a heating means 21 such as an electric heater, the surface of the paper 9 to be laminated is heated to perform initial welding with the iron portion of the high-frequency fused surface. In the present invention, heating the first heating roll 11 to 115 to 125°C is difficult to fuse when it is less than 115°C, and when it exceeds 125°C, there is a difference in surface and internal foaming due to overheating, thereby maintaining a uniform board surface. Because it is difficult.

제 1히팅공정(S1)에 이어 145~155℃로 가열시키는 히팅수단(22)이 내장된 제 2히팅롤(12)을 통과하는 제 2히팅공정(S2)을 수행한다. 이 경우 제 2히팅롤(12) 표면 온도가 1차 가열시의 제 1히팅롤(11)보다 높아서 폼보드 표면이 보다 더 융착되어 철부와의 융착 면적이 증대된다. 본 발명에서 제 2히팅롤(12)을 145~155℃로 가열하는것은 145℃ 미만이면 융착 면적 증대가 어려워 철부의 융착 상태가 불안정하게되고, 155℃를 초과하면 과열로 인한 철부의 융착이 과하게되어 종이 표면이 매끄럽지 못하게 된다.Subsequent to the first heating step (S1), a second heating step (S2) is performed through the second heating roll 12 having a heating means 22 for heating to 145 to 155°C. In this case, the surface temperature of the second heating roll 12 is higher than that of the first heating roll 11 at the time of primary heating, so that the surface of the foam board is fused more and the welding area with the iron portion is increased. In the present invention, heating the second heating roll 12 to 145 to 155°C makes it difficult to increase the fusion area if it is less than 145°C, making the fusion state of the iron parts unstable, and when it exceeds 155°C, fusion of the iron parts due to overheating is excessive. And the paper surface is not smooth.

제 2히팅공정(S2)에 이어 185~195℃로 가열시키는 히팅수단(23)이 내장된 제 3히팅롤(13)을 통과하는 제 3히팅공정(S3)을 수행한다. 이 경우 제 3히팅롤(13) 표면 온도가 2차 가열시의 제 2히팅롤(12)보다 높아서 폼보드 표면이 보다 더 융착되어 철부와의 융착 면적이 증대된다. 본 발명에서 제 3히팅롤(13)을 185~195℃로 가열하는것은 185℃ 미만이면 융착 면적 증대가 어려워 이후의 냉각 공정에서 분리홈의 확보가 어렵게 되고, 195℃를 초과하면 과열로 인한 철부의 융착이 과하게되어 종이 표면이 매끄럽지 못함과 동시에 냉각을 하여도 분리홈이 발생하지 않게된다.Following the second heating process (S2), a third heating process (S3) is passed through the third heating roll (13) having a heating means (23) for heating to 185-195°C. In this case, the surface temperature of the third heating roll 13 is higher than that of the second heating roll 12 during the second heating, so that the surface of the foam board is more fused, so that the welding area with the iron portion is increased. In the present invention, heating the third heating roll 13 to 185 to 195°C makes it difficult to increase the fusion area when it is less than 185°C, making it difficult to secure a separation groove in a subsequent cooling process, and when it exceeds 195°C, the iron portion due to overheating Since the fusion of the paper is excessive, the paper surface is not smooth and the separation groove does not occur even if it is cooled.

제 3히팅공정(S3)에 이어 상온으로 냉각되어, 합지된 폼보드원단 표면을 냉각 및 누름작용을 하여, 합지된 종이(9)가 분리 가능토록 15~26℃로 냉각되도록 기능하는 냉각공정(S4)을 순차 수행한다. 냉각공정(S4)을 수행하면, 냉각 공정(S4) 중에 제 4롤(14)의 표면에 의한 냉각열을 받아서 융착된 폼보드 표면보다는 종이(9)쪽이 더 빨라 냉각되며, 동시에 누름 작용을 하는 순간 녹아 있던 융착부분이 철부의 다른 표면으로 이동하면서 눌리어지고 종이에 의한 냉각열에 의하여 종이로는 융착부가 묻지 않고 철부 쪽으로만 붙게된다. 그리고 제 4롤(14)의 누름 작용이 지나면 다시 복원되면서 도 3의 누름 깊이로 종이의 이면이 내려갔다가 다시 실선위치로 복원하므로 철부와의 융착부가 분리홈 형태로 형성된다. 이는 수거 후 종이(9)를 분리시킬 때 쉽게 분리 가능토록 하는 공간을 제공하여(융착면적이 종이보다는 고주파가열된 폼보드원단(2-1)측이 커지도록 작용하여), 종이만 쉽게 분리 가능토록 기능한다.After the third heating process (S3), it is cooled to room temperature, and cools and presses the surface of the laminated foam board fabric, thereby cooling the laminated paper (9) to 15~26℃ so that it can be separated. S4) is performed sequentially. When the cooling process (S4) is performed, the paper (9) is cooled faster than the fused foam board surface by receiving cooling heat by the surface of the fourth roll (14) during the cooling process (S4), and simultaneously pressing At the moment, the melted fusion part is pressed while moving to the other surface of the iron part, and the heat of cooling by the paper causes the paper to stick only to the iron part without asking the fusion part. In addition, after the pressing action of the fourth roll 14 is restored, the back side of the paper is lowered to the pressing depth of FIG. 3 and then restored to the solid line position, so that the fusion portion with the iron portion is formed as a separation groove. This provides a space for easy separation when separating the paper (9) after collection (because the fused area acts so that the high-frequency heated foam board fabric (2-1) side is larger than the paper), only the paper can be easily separated. It functions forever.

본 발명의 제 4공정(S4)에서 15~26℃로 냉각하는 것은 15℃ 미만이면 과하게 냉각되어 융착부 전체가 냉각되어 폼보드표면이 균일하지 않게되고, 종이도 잘 분리되어 제품성이 낮게되고, 26℃를 초과하면 냉각 기능이 저하되어 분리홈의 형성이 일정하지 않아 종이 분리시 균일한 뷴리가 어렵게된다.In the fourth step (S4) of the present invention, cooling to 15 to 26°C is excessively cooled when the temperature is less than 15°C, so that the entire fusing part is cooled, so that the foam board surface becomes non-uniform and the paper is well separated, resulting in low productability. , When the temperature exceeds 26°C, the cooling function is deteriorated, and the formation of separation grooves is not uniform, making uniform bunry difficult when separating paper.

11;제 1히팅롤 12;제2 히팅롤 13;제 3히팅롤 14;제 4롤 21,22,23;히팅수단 24;냉각수단 11; 1st heating roll 12; 2nd heating roll 13; 3rd heating roll 14; 4th roll 21,22,23; heating means 24; cooling means

Claims (3)

폼보드원단을 예열부에서 예열하고, 고주파 처리부에서 표면을 고주파처리하여 종이를 인출롤을 지나면서 합지하고, 이어 히팅롤에서 종이를 융착하여 붙이는 폼보 드제조장치로,
인출롤에 히팅수단(21)을 부가하고,
히팅롤을 다단으로 설치하며,
히팅롤은 인출롤에 부가한 히팅수단(21)의 가열로 표면이 115~125℃로 가열되는 제 1히팅롤(11);
제 1히팅롤(11)을 지난 것을 이어 통과시키며 표면이 145~155℃로 가열되도록 히팅수단(22)을 부가한 제 2히팅롤(12);
제 2히팅롤(12)을 지난 것을 이어 통과시키며 185~195℃로 가열되도록 히팅수단(23)을 부가한 제 3히팅롤(13); 및
제 3히팅롤(13)을 지난 것을 이어 상온 상태로 압착통과시키도록 냉각수단(24)을 부가한 누름롤 기능의 제 4롤(14)을 포함하여 구성한 것을 특징으로 하는 합지종이 분리가 가능한 폼보드제조장치.
This is a foam board fabrication device that preheats the foam board fabric in the preheating section, high-frequency treatments the surface in the high-frequency processing section, and bonds the paper as it passes through the draw roll.
The heating means 21 is added to the draw roll,
The heating roll is installed in multiple stages,
The heating roll includes a first heating roll 11 whose surface is heated to 115 to 125° C. by heating of the heating means 21 added to the drawing roll;
A second heating roll 12 to which the heating means 22 is added so that the surface passes through the first heating roll 11 and is heated to 145 to 155°C;
A third heating roll 13 to which heating means 23 are added so as to pass through the second heating roll 12 and heat to 185 to 195°C; And
Foam paper separable foam, characterized in that it comprises a fourth roll (14) of a pressing roll function to add a cooling means (24) to pass through the third heating roll (13) in a compressed state at room temperature. Board manufacturing equipment.
제 1항에 있어서, 제4롤(14)의 표면은 15~26℃의 상온을 유지하도록 냉각수단(24)을 표면 근처에 부가하고, 냉각수단(24)은 냉각수 통로를 통하는 냉각수이거나 냉온처리가 가능한 열전모듈(Thermoelectric module)인 것을 특징으로 하는 합지종이 분리가 가능한 폼보드제조장치.
The method of claim 1, wherein the surface of the fourth roll (14) is added with cooling means (24) near the surface to maintain a normal temperature of 15 to 26°C, and the cooling means (24) is cooling water passing through the cooling water passage or cold treatment. A foam board manufacturing device capable of separating laminated paper, characterized by being a thermoelectric module.
롤 상의 폼보드 원단을 115~125℃로 1~2초 예열하는 예열공정;
예열공정을 지난 폼보드원단을 상하에서 동시에 고주파처리하는 고주파처리공정;
고주파 처리한 폼보드 상하에서 합지할 종이를 인출하여 합지하되, 115~125℃로 가열하는 기능이 부가된 인출롤인 제 1히팅롤을 통과시키는 제 1히팅공정;
제 1히팅공정에 이어 145~155℃로 가열된 히팅롤을 통과하는 제 2히팅공정;
제 2히팅공정에 이어 185~195℃로 가열된 히팅롤을 통과하는 제 3히팅공정;및
제 3히팅공정에 이어 상온으로 냉각되어, 합지된 폼보드원단 표면을 냉각 및 누름작용을 하여, 합지된 종이가 분리 가능토록 기능하는 냉각공정을 순차 수행하는 합지종이 분리가 가능한 폼보드제조방법.

A preheating process for preheating the foam board fabric on the roll to 115 to 125°C for 1 to 2 seconds;
A high-frequency processing step of simultaneously performing high-frequency processing of the foam board fabric that has passed the preheating process at the top and bottom;
A first heating process of passing out a first heating roll, which is a drawing roll added with a function of heating to 115 to 125° C., by drawing and laminating paper to be laminated on top and bottom of the high-frequency treated foam board;
A second heating process that passes through a heating roll heated to 145 to 155°C following the first heating process;
A third heating process that passes through a heating roll heated to 185-195° C. following the second heating process; and
After the third heating process, the paperboard is cooled to room temperature and cools and presses the surface of the laminated foam board fabric.

KR1020180154578A 2018-12-04 2018-12-04 Manufacturing machine of form board with seperable paper and manufacturing method thereof KR20200067571A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230023088A (en) * 2021-08-09 2023-02-17 공규택 A method for manufacturing a laminated detachable foam board with a constant thickness
KR102615526B1 (en) * 2022-09-28 2023-12-19 이종철 paper straw making device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230023088A (en) * 2021-08-09 2023-02-17 공규택 A method for manufacturing a laminated detachable foam board with a constant thickness
KR102615526B1 (en) * 2022-09-28 2023-12-19 이종철 paper straw making device

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