KR20190129001A - Primer composition and optical semiconductor device using the same - Google Patents
Primer composition and optical semiconductor device using the same Download PDFInfo
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- KR20190129001A KR20190129001A KR1020190051935A KR20190051935A KR20190129001A KR 20190129001 A KR20190129001 A KR 20190129001A KR 1020190051935 A KR1020190051935 A KR 1020190051935A KR 20190051935 A KR20190051935 A KR 20190051935A KR 20190129001 A KR20190129001 A KR 20190129001A
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- KR
- South Korea
- Prior art keywords
- optical semiconductor
- primer composition
- acid ester
- semiconductor device
- group
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Abstract
Description
본 발명은, 광반도체 소자를 실장한 기판과, 상기 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물을 접착하는 프라이머 조성물 및 해당 프라이머 조성물을 사용한 광반도체 장치에 관한 것이다.This invention relates to the primer composition which adhere | attaches the board | substrate which mounted the optical semiconductor element, the hardened | cured material of the addition reaction curable silicone composition which seals the said optical semiconductor element, and the optical semiconductor device using this primer composition.
광반도체 장치로서 알려진 발광 다이오드(LED) 램프는, 기판에 실장된 LED를 투명한 수지를 포함하는 밀봉재로 밀봉한 구성이다. 이 밀봉재로서는, 종래부터 에폭시 수지 베이스의 조성물이 범용되고 있었다.The light emitting diode (LED) lamp known as an optical semiconductor device is a structure which sealed the LED mounted on the board | substrate with the sealing material containing transparent resin. As this sealing material, the composition of the epoxy resin base was conventionally used.
그러나, 에폭시 수지 베이스의 밀봉재에서는, 최근의 반도체 패키지의 소형화나 LED의 고휘도화에 따른 발열량의 증대나 광의 단파장화에 의해 크래킹이나 황변이 발생하기 쉬워, 신뢰성의 저하를 초래하고 있었다.However, in the epoxy resin-based sealing material, cracking and yellowing are liable to occur due to the increase in the amount of heat generated due to the recent miniaturization of the semiconductor package, the high brightness of the LED, and the short wavelength of the light, resulting in a decrease in reliability.
그래서, 우수한 내열성을 갖는다는 점에서, 밀봉재로서 실리콘 조성물이 사용되고 있다(특허문헌 1). 특히, 부가 반응 경화형의 실리콘 조성물은, 가열에 의해 단시간에 경화되기 때문에 생산성이 양호하고, LED의 밀봉재로서 적합하다(특허문헌 2).Therefore, a silicone composition is used as a sealing material from the point which has the outstanding heat resistance (patent document 1). In particular, since an addition reaction hardening type silicone composition hardens in a short time by heating, productivity is favorable and it is suitable as a sealing material of LED (patent document 2).
그러나, LED를 실장하는 기판(수지나 전극)과, 부가 반응 경화형 실리콘 조성물의 경화물을 포함하는 밀봉재와의 접착성은 충분하다고는 할 수 없는 것이다.However, the adhesiveness between the board | substrate (resin and electrode) which mounts LED, and the sealing material containing hardened | cured material of an addition reaction hardening type silicone composition is not necessarily sufficient.
또한, 실리콘 조성물은, 일반적으로 기체 투과성이 우수하기 때문에, 외부 환경으로부터의 영향을 받기 쉽다. LED 램프가 대기 중의 황 화합물이나 배기 가스 등에 노출되면, 황 화합물 등이 실리콘 조성물의 경화물을 투과하여, 해당 경화물로 밀봉된 기판 상의 금속 전극, 특히 Ag 전극을 경시적으로 부식하여 흑변시킨다. 이에 대한 대책으로서 SiH를 함유한 아크릴산에스테르의 중합체, 또는 아크릴산에스테르와의 공중합체, 메타크릴산에스테르와의 공중합체, 아크릴산에스테르와 메타크릴산에스테르와의 공중합체나, 폴리실라잔 화합물을 사용함으로써 흑변을 억제하는 프라이머(특허문헌 3 내지 5)가 개발되고 있다. 그러나, SiH를 함유한 아크릴 중합체를 사용하면, 프라이머막의 내열성이 불충분하며, 최근의 높은 전류가 흐르는 반도체 소자 주변에서 수지가 열화되어버린다. 이에 비해 폴리실라잔 화합물은 내열성이 우수하긴 하지만, 형성되는 막이 단단하기 때문에, 멀티 칩이라 불리는 광반도체 소자가 다수 탑재되어 있는 실장 기판 상에 도포하면 막이 깨지기 쉽다.Moreover, since a silicone composition is generally excellent in gas permeability, it is easy to be influenced from an external environment. When the LED lamp is exposed to sulfur compounds, exhaust gases and the like in the atmosphere, sulfur compounds and the like penetrate the cured product of the silicone composition, and the metal electrode on the substrate sealed with the cured product, in particular, the Ag electrode is corroded over time and blackened. As a countermeasure, by using a polymer of acrylate ester containing SiH, a copolymer of acrylate ester, a copolymer of methacrylate ester, a copolymer of acrylate ester and methacrylic acid ester or a polysilazane compound Primers (
본 발명은, 상기 문제를 해결하기 위해 이루어진 것이며, 광반도체 소자를 실장한 기판과, 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물과의 접착성을 향상시킴과 함께, 기판 상에 형성된 금속 전극의 부식을 방지하고, 또한 프라이머 자신의 내열성·가요성을 향상시키는 프라이머 조성물 및 해당 프라이머 조성물을 사용한 광반도체 장치를 제공하는 것을 목적으로 한다.The present invention has been made to solve the above problems, and improves the adhesion between the substrate on which the optical semiconductor element is mounted and the cured product of the addition reaction curable silicone composition for sealing the optical semiconductor element, and is formed on the substrate. An object of the present invention is to provide a primer composition which prevents corrosion of a metal electrode and further improves heat resistance and flexibility of the primer itself, and an optical semiconductor device using the primer composition.
상기 과제를 달성하기 위해, 본 발명에서는,In order to achieve the above object, in the present invention,
광반도체 소자를 실장한 기판과, 상기 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물을 접착하는 프라이머 조성물로서,As a primer composition which adhere | attaches the board | substrate which mounted the optical semiconductor element, and the hardened | cured material of the addition reaction curable silicone composition which seals the said optical semiconductor element,
(A) 1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, 1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽을 포함하는 공중합체와,(A) At least one of the acrylic acid ester and methacrylic acid ester which has one or more SiH groups in 1 molecule, and at least one of the acrylic acid ester and methacrylic acid ester which has one or more alkoxy groups in 1 molecule, and does not have a SiH group and an alkoxy group A copolymer comprising at least one of an acrylic acid ester and a methacrylic acid ester,
(B) 용제(B) solvent
를 함유하는 것인 프라이머 조성물을 제공한다.It provides a primer composition containing.
이러한 프라이머 조성물이면, 광반도체 소자를 실장한 기판과, 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물과의 접착성을 향상시키게 됨과 함께, 기판 상에 형성된 금속 전극의 부식을 방지하고, 또한 프라이머 자신의 내열성·가요성을 향상시키게 된다.Such primer composition improves the adhesion between the substrate on which the optical semiconductor element is mounted and the cured product of the addition reaction curable silicone composition for sealing the optical semiconductor element, and prevents corrosion of the metal electrode formed on the substrate. In addition, the heat resistance and flexibility of the primer itself are improved.
또한, 상기 (B) 성분의 배합량이, 상기 프라이머 조성물 전체의 70질량% 이상인 것이 바람직하다.Moreover, it is preferable that the compounding quantity of the said (B) component is 70 mass% or more of the said primer composition.
(B) 성분을 70질량% 이상 함유함으로써, 작업성이 보다 양호한 프라이머 조성물이 된다.By containing 70 mass% or more of (B) components, it becomes a primer composition with more workability | operativity.
또한, 상기 프라이머 조성물이,In addition, the primer composition,
(C) 실란 커플링제(C) silane coupling agent
를 더 함유하는 것이 바람직하다.It is preferable to contain more.
이와 같이 실란 커플링제를 함유함으로써, 기판과 부가 반응 경화형 실리콘 조성물의 경화물과의 접착성을 보다 향상시키는 프라이머 조성물이 된다.Thus, by containing a silane coupling agent, it becomes a primer composition which improves the adhesiveness of the board | substrate and the hardened | cured material of an addition reaction curable silicone composition further.
또한, 본 발명은, 광반도체 소자를 실장한 기판과, 상기 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물이, 상기 프라이머 조성물에 의해 접착된 것인 광반도체 장치를 제공한다.Moreover, this invention provides the optical semiconductor device by which the board | substrate which mounted the optical semiconductor element and the hardened | cured material of the addition reaction hardening type silicone composition which seals the said optical semiconductor element are adhere | attached with the said primer composition.
이러한, 본 발명의 프라이머 조성물을 사용한 광반도체 장치이면, 기판과 부가 반응 경화형 실리콘 조성물의 경화물이 견고하게 접착되어 있으며, 기판 상에 형성된 금속 전극의 부식도 방지할 수 있기 때문에, 높은 신뢰성을 갖는 것이 된다.In such an optical semiconductor device using the primer composition of the present invention, since the substrate and the cured product of the addition reaction curable silicone composition are firmly adhered to each other and corrosion of the metal electrode formed on the substrate can be prevented, it has high reliability. It becomes.
또한, 상기 광반도체 소자는 발광 다이오드로 할 수 있다.The optical semiconductor element may be a light emitting diode.
이와 같이, 본 발명의 광반도체 장치는, 발광 다이오드용으로서 적합하게 사용할 수 있다.Thus, the optical semiconductor device of this invention can be used suitably for light emitting diodes.
또한, 상기 기판의 구성 재료는, 폴리아미드, 섬유 강화 플라스틱, 세라믹스, 실리콘, 실리콘 변성 중합체 또는 액정 중합체로 할 수 있다.Moreover, the constituent material of the said board | substrate can be made into polyamide, fiber reinforced plastics, ceramics, silicone, a silicone modified polymer, or a liquid crystal polymer.
본 발명의 광반도체 장치에서는, 프라이머의 접착성이 우수하기 때문에, 이러한 기판이어도 접착성을 손상시키지 않고 사용할 수 있다.In the optical semiconductor device of the present invention, since the adhesion of the primer is excellent, even such a substrate can be used without impairing the adhesion.
또한, 상기 부가 반응 경화형 실리콘 조성물의 경화물이 고무상인 것이 바람직하다.Moreover, it is preferable that the hardened | cured material of the said addition reaction curable silicone composition is rubbery.
이러한 부가 반응 경화형 실리콘 조성물의 경화물이면, 보다 견고한 접착성을 갖고, 기판 상에 형성된 금속 전극, 특히 Ag 전극의 부식을 보다 효과적으로 방지할 수 있다.If it is the hardened | cured material of such an addition reaction hardening type silicone composition, it has more firm adhesiveness and can prevent the corrosion of the metal electrode, especially Ag electrode formed on the board | substrate more effectively.
이상과 같이, 본 발명의 프라이머 조성물이면, 광반도체 소자를 실장한 기판과, 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물과의 접착성을 향상시킴과 함께, 기판 상에 형성된 금속 전극의 부식을 방지하는 것이 가능하고, 또한 프라이머 자신의 내열성·가요성을 향상시키는 프라이머 조성물이 되고, 또한 해당 프라이머 조성물을 사용한 광반도체 장치는 고신뢰성을 갖는 것이 된다.As described above, the primer composition of the present invention improves the adhesion between the substrate on which the optical semiconductor element is mounted and the cured product of the addition reaction curable silicone composition for sealing the optical semiconductor element, and the metal electrode formed on the substrate. It is possible to prevent corrosion of the primer and to improve the heat resistance and flexibility of the primer itself, and the optical semiconductor device using the primer composition has high reliability.
도 1은 본 발명에 관한 광반도체 장치의 일례를 나타내는 LED 램프의 단면도이다.
도 2는 실시예 및 비교예에 있어서의 접착성 시험용 테스트 피스를 설명하는 사시도이다.1 is a cross-sectional view of an LED lamp showing an example of an optical semiconductor device according to the present invention.
It is a perspective view explaining the test piece for adhesive tests in an Example and a comparative example.
상술한 바와 같이, 광반도체 소자를 실장한 기판과, 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물과의 접착성을 향상시킴과 함께, 기판 상에 형성된 금속 전극의 부식을 방지하고, 또한 프라이머 자신의 내열성·가요성을 향상시킬 수 있는 프라이머 조성물의 개발이 요구되고 있었다.As described above, the adhesion between the substrate on which the optical semiconductor element is mounted and the cured product of the addition reaction curable silicone composition for sealing the optical semiconductor element is improved, and the corrosion of the metal electrode formed on the substrate is prevented, Moreover, development of the primer composition which can improve the heat resistance and flexibility of the primer itself was calculated | required.
본 발명자들은, 상기 과제에 대하여 예의 검토를 거듭한 결과, 1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, 1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽을 포함하는 공중합체를 포함한 프라이머 조성물이면, 광반도체 소자를 실장한 기판과, 이 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물을 견고하게 접착시킬 수 있으며, 기판 상에 형성된 금속 전극, 특히 Ag 전극의 부식을 방지하는 것이 가능한 프라이머 조성물이 된다는 것을 알아내어, 본 발명을 완성시켰다.MEANS TO SOLVE THE PROBLEM The present inventors earnestly examined about the said subject, As a result, at least one of the acrylic acid ester and methacrylic acid ester which has one or more SiH groups in one molecule, and the acrylic acid ester and methacrylic acid ester which have one or more alkoxy groups in one molecule If it is a primer composition containing the copolymer containing at least one of these, and the copolymer containing at least one of the acrylic acid ester and methacrylic acid ester which do not have a SiH group and an alkoxy group, The board | substrate which mounted the optical semiconductor element, and the addition which seals this optical semiconductor element The present invention was completed by finding that the cured product of the reaction curable silicone composition can be firmly adhered to a primer composition capable of preventing corrosion of a metal electrode, particularly an Ag electrode, formed on a substrate.
즉, 본 발명은,That is, the present invention,
광반도체 소자를 실장한 기판과, 상기 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물을 접착하는 프라이머 조성물로서,As a primer composition which adhere | attaches the board | substrate which mounted the optical semiconductor element, and the hardened | cured material of the addition reaction curable silicone composition which seals the said optical semiconductor element,
(A) 1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, 1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽을 포함하는 공중합체와,(A) At least one of the acrylic acid ester and methacrylic acid ester which has one or more SiH groups in 1 molecule, and at least one of the acrylic acid ester and methacrylic acid ester which has one or more alkoxy groups in 1 molecule, and does not have a SiH group and an alkoxy group A copolymer comprising at least one of an acrylic acid ester and a methacrylic acid ester,
(B) 용제(B) solvent
를 함유하는 프라이머 조성물이다.It is a primer composition containing.
이하, 본 발명에 대하여 상세하게 설명하지만, 본 발명은 이들로 한정되는 것은 아니다.EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated in detail, this invention is not limited to these.
<프라이머 조성물> <Primer Composition>
본 발명의 프라이머 조성물은, 필수 성분으로서 후술하는 (A) 성분 및 (B) 성분을 함유하는 것이다.The primer composition of this invention contains the (A) component and (B) component mentioned later as an essential component.
이하, 본 발명의 프라이머 조성물의 각 성분에 대하여 설명한다.Hereinafter, each component of the primer composition of this invention is demonstrated.
[(A) 성분][(A) component]
본 발명의 프라이머 조성물에 함유되는 (A) 성분은, 1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, 1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽을 포함하는 공중합체이다.(A) component contained in the primer composition of this invention is an acrylic acid ester and methacrylic acid ester which has at least one of the acrylic acid ester and methacrylic acid ester which has one or more SiH groups in one molecule, and one or more alkoxy groups in one molecule. It is a copolymer containing at least one and at least one of acrylic acid ester and methacrylic acid ester which do not have a SiH group and an alkoxy group.
공중합체인 (A) 성분은, 해당하는 단량체(후술하는 에스테르)를 2,2'-아조비스이소부티로니트릴(AIBN) 등의 라디칼 중합 개시제를 사용하여 중합함으로써 얻을 수 있다.(A) component which is a copolymer can be obtained by superposing | polymerizing the corresponding monomer (ester mentioned later) using radical polymerization initiators, such as 2,2'- azobisisobutyronitrile (AIBN).
이러한 (A) 성분을 함유하는 프라이머 조성물은, 광반도체 소자를 실장하는 기판 및 전극에 대하여 충분한 접착성을 부여함과 함께, 상기 기판 상에 가요성이 있는 막을 형성하고, 금속 전극(특히 Ag 전극)의 경시적인 부식을 억제하는 것이 된다.The primer composition containing the component (A) provides sufficient adhesion to the substrate and the electrode on which the optical semiconductor element is mounted, and forms a flexible film on the substrate, thereby providing a metal electrode (especially an Ag electrode). It is to suppress corrosion over time.
(A) 성분의 배합량은, 후술하는 (B) 성분에 대하여 용해되는 양이면 특별히 한정되지 않지만, 조성물 전체((A), (B) 성분 등의 합계)의 30질량% 이하인 것이 바람직하고, 보다 바람직하게는 0.01 내지 20질량%이고, 더욱 바람직하게는 0.1 내지 10질량%이다. 함유량이 30질량% 이하이면, 얻어지는 막의 표면의 요철의 발생을 방지할 수 있으며, 프라이머로서의 충분한 성능을 얻을 수 있다.Although the compounding quantity of (A) component will not be specifically limited if it is a quantity melt | dissolved with respect to (B) component mentioned later, It is preferable that it is 30 mass% or less of the whole composition (total of (A), (B) component, etc.), and more Preferably it is 0.01-20 mass%, More preferably, it is 0.1-10 mass%. When content is 30 mass% or less, generation | occurrence | production of the unevenness | corrugation of the surface of the film | membrane obtained can be prevented, and sufficient performance as a primer can be obtained.
1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르Acrylic esters and methacrylic esters having at least one SiH group in one molecule
1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르로서는, 하기 식 (1)로 표시되는 구조를 포함하는 화합물을 들 수 있다.As acrylic acid ester and methacrylic acid ester which have one or more SiH groups in 1 molecule, the compound containing the structure represented by following formula (1) is mentioned.
(식 중, R은 수소 원자 또는 메틸기, R1은 1가의 유기기, R2는 2가의 유기기를 나타낸다. n은 0, 1 또는 2이다.)(Wherein R is a hydrogen atom or a methyl group, R 1 represents a monovalent organic group, and R 2 represents a divalent organic group. N is 0, 1 or 2).
또한, 디오르가노폴리실록산 중에 하기 식 (2) 또는 하기 식 (3)으로 표시되는 구조를 갖는 화합물도 예시할 수 있다.Moreover, the compound which has a structure represented by following formula (2) or following formula (3) in diorganopolysiloxane can also be illustrated.
(식 중, R, R1, R2는 상기와 마찬가지의 의미를 나타낸다. l은 0 또는 양의 정수, m은 양의 정수이다. 괄호가 붙은 각 실록산 단위의 배열순은 일정하지 않다.)(Wherein R, R 1 and R 2 have the same meaning as above. L is 0 or a positive integer and m is a positive integer. The order of the units of each siloxane in parentheses is not constant.)
(식 중, R, R1, R2는 상기와 마찬가지의 의미를 나타낸다. o, p는 양의 정수이다. 괄호가 붙은 각 실록산 단위의 배열순은 일정하지 않다.)(Wherein R, R 1 and R 2 have the same meaning as described above. O and p are positive integers. The order of the units of siloxane units with parentheses is not constant.)
여기서, R1로 표시되는 1가의 유기기로서는, 탄소수 1 내지 10, 특히 탄소수 1 내지 3의 비치환 또는 치환 1가 탄화수소기가 바람직하다. 1가 탄화수소기로서는, 메틸기, 에틸기, 프로필기, 이소프로필기, 부틸기, 이소부틸기, tert-부틸기, 펜틸기, 네오펜틸기, 헥실기, 옥틸기 등의 알킬기, 시클로헥실기 등의 시클로알킬기, 비닐기, 알릴기, 프로페닐기 등의 알케닐기, 페닐기, 톨릴기, 크실릴기, 나프틸기 등의 아릴기, 벤질기, 페닐에틸기, 페닐프로필기 등의 아르알킬기 등이나, 이들 기의 수소 원자의 일부 또는 전부가 불소, 브롬, 염소 등의 할로겐 원자, 시아노기 등으로 치환된 것, 예를 들어 클로로메틸기, 클로로프로필기, 브로모에틸기, 트리플루오로프로필기, 시아노에틸기 등을 들 수 있다. R1로서는, 메틸기, 에틸기, 페닐기가 바람직하고, 메틸기가 특히 바람직하다.Here, as a monovalent organic group represented by R <1> , a C1-C10, especially C1-C3 unsubstituted or substituted monovalent hydrocarbon group is preferable. Examples of the monovalent hydrocarbon group include an alkyl group such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group and octyl group and cyclohexyl group Alkenyl groups such as cycloalkyl groups, vinyl groups, allyl groups, propenyl groups, aryl groups such as phenyl groups, tolyl groups, xylyl groups, naphthyl groups, aralkyl groups such as benzyl groups, phenylethyl groups, and phenylpropyl groups; A part or all of the hydrogen atoms of which are substituted with halogen atoms such as fluorine, bromine, chlorine, cyano group, etc., for example, chloromethyl group, chloropropyl group, bromoethyl group, trifluoropropyl group, cyanoethyl group, etc. Can be mentioned. As R <1> , a methyl group, an ethyl group, and a phenyl group are preferable, and a methyl group is especially preferable.
R2로 표시되는 2가의 유기기로서는, 탄소수 1 내지 10, 특히 탄소수 1 내지 3의 비치환 또는 치환 2가 탄화수소기가 바람직하다. 2가 탄화수소기로서는, 메틸렌기, 에틸렌기, n-프로필렌기, n-부틸렌기, n-펜틸렌기, n-헥실렌기, 시클로헥실렌기, n-옥틸렌기 등의 알킬렌기, 페닐렌기, 나프틸렌기 등의 아릴렌기를 들 수 있다. R2로서는, 에틸렌기, n-프로필렌기가 바람직하고, n-프로필렌기가 특히 바람직하다.As a divalent organic group represented by R <2> , a C1-C10, especially a C1-C3 unsubstituted or substituted bivalent hydrocarbon group is preferable. Examples of the divalent hydrocarbon group include alkylene groups such as methylene group, ethylene group, n-propylene group, n-butylene group, n-pentylene group, n-hexylene group, cyclohexylene group and n-octylene group, phenylene group, Arylene groups, such as a naphthylene group, are mentioned. As R <2> , an ethylene group and n-propylene group are preferable and n-propylene group is especially preferable.
1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르는, 1종 단독 또는 2종 이상을 병용해도 된다.Acrylic acid ester and methacrylic acid ester which has one or more SiH groups in 1 molecule may use together single 1 type or 2 types or more.
1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르Acrylic esters and methacrylic acid esters having at least one alkoxy group in one molecule
1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르로서는, 하기 식 (4)로 표시되는 구조를 포함하는 화합물을 들 수 있다.As acrylic acid ester and methacrylic acid ester which have one or more alkoxy groups in 1 molecule, the compound containing the structure represented by following formula (4) is mentioned.
(식 중, R, R1, R2는 상기와 마찬가지의 의미를 나타낸다. R3은 탄소수 1 내지 4의 1가의 탄화수소기를 나타낸다. q는 0, 1 또는 2이다.)(In formula, R, R <1> , R <2> shows the same meaning as the above. R <3> represents a C1-C4 monovalent hydrocarbon group. Q is 0, 1 or 2.)
또한, 디오르가노폴리실록산 중에 하기 식 (5) 또는 하기 식 (6)으로 표시되는 구조를 갖는 화합물도 예시할 수 있다.Moreover, the compound which has a structure represented by following formula (5) or following formula (6) in diorganopolysiloxane can also be illustrated.
(식 중, R, R1, R2, R3은 상기와 마찬가지의 의미를 나타낸다. r은 0 또는 양의 정수, s는 양의 정수이다. 괄호가 붙은 각 실록산 단위의 배열순은 일정하지 않다.)(Wherein R, R 1 , R 2 , and R 3 represent the same meaning as described above. R is 0 or a positive integer and s is a positive integer. The order of the units of siloxane in parentheses is not constant.) .)
(식 중, R, R1, R2, R3은 상기와 마찬가지의 의미를 나타낸다. t, u는 양의 정수이다. 괄호가 붙은 각 실록산 단위의 배열순은 일정하지 않다.)(Wherein, R, R 1 , R 2 , and R 3 represent the same meanings as above. T and u are positive integers. The order of the units of each siloxane unit in parentheses is not constant.)
여기서, R1, R2로 표시되는 유기기로서는 상기와 마찬가지의 것을 들 수 있다. R3으로 표시되는 탄소수 1 내지 4의 1가의 탄화수소기로서는, 메틸기, 에틸기, 프로필기, 이소프로필기, 부틸기, 이소부틸기, tert-부틸기 등을 들 수 있으며, 메틸기 또는 에틸기가 바람직하다.Here, the thing similar to the above is mentioned as an organic group represented by R <1> , R <2> . As a C1-C4 monovalent hydrocarbon group represented by R <3> , a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert- butyl group, etc. are mentioned, A methyl group or an ethyl group is preferable. .
1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르는, 1종 단독 또는 2종 이상을 병용해도 된다.Acrylic acid ester and methacrylic acid ester which has one or more alkoxy groups in 1 molecule may use together 1 type individually or 2 types or more.
SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르 및 메타크릴산에스테르Acrylic esters and methacrylic esters having no SiH and alkoxy groups
SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르로서는, 예를 들어 아크릴산메틸, 아크릴산에틸, 아크릴산-n-부틸, 아크릴산이소부틸, 아크릴산이소펜틸, 아크릴산-n-헥실, 아크릴산이소옥틸, 아크릴산-2-에틸헥실, 아크릴산-n-옥틸, 아크릴산이소노닐, 아크릴산-n-데실, 아크릴산이소데실 등을 들 수 있다.As acrylic acid ester which does not have a SiH group and an alkoxy group, for example, methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, isopentyl acrylate, n-hexyl acrylate, isooctyl acrylate and 2-ethylhexyl acrylate , Acrylic acid n-octyl, isononyl acrylate, acrylic acid n-decyl, isodecyl acrylate and the like.
SiH기 및 알콕시기를 갖지 않는 메타크릴산에스테르로서는, 예를 들어 메타크릴산메틸, 메타크릴산에틸, 메타크릴산-n-부틸, 메타크릴산이소부틸, 메타크릴산이소펜틸, 메타크릴산-n-헥실, 메타크릴산이소옥틸, 메타크릴산-2-에틸헥실, 메타크릴산-n-옥틸, 메타크릴산이소노닐, 메타크릴산-n-데실, 메타크릴산이소데실 등을 들 수 있다.As methacrylic acid ester which does not have a SiH group and an alkoxy group, for example, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, isopentyl methacrylate, and methacrylic acid- n-hexyl, isooctyl methacrylate, 2-ethylhexyl methacrylate, methacrylic acid-n-octyl, isononyl methacrylate, methacrylic acid-n-decyl, isodecyl methacrylate, etc. are mentioned. have.
상기 예시 중에서도 알킬기의 탄소 원자수가 1 내지 12, 특히 알킬기의 탄소 원자수가 1 내지 4인 아크릴산알킬에스테르, 메타크릴산알킬에스테르가 바람직하고, 1종 단독 또는 2종 이상을 병용해도 된다.Among the above examples, acrylic acid alkyl esters and methacrylic acid alkyl esters having 1 to 12 carbon atoms, particularly 1 to 4 carbon atoms in the alkyl group, are preferable, and one type alone or two or more types may be used in combination.
[(B) 성분][(B) component]
용제인 (B) 성분으로서는, 본 발명의 프라이머 조성물을 구성하는 상기 (A) 성분 및 후술하는 임의 성분을 용해하는 것이면 특별히 한정되는 것은 아니며, 공지된 유기 용제를 사용할 수 있다.As (B) component which is a solvent, if it melt | dissolves the said (A) component and the optional component mentioned later which comprise the primer composition of this invention, it will not specifically limit, A well-known organic solvent can be used.
용제로서는, 예를 들어 크실렌, 톨루엔, 벤젠 등의 방향족 탄화수소계 용제, 헵탄, 헥산 등의 지방족 탄화수소계 용제, 트리클로로에틸렌, 퍼클로로에틸렌, 염화메틸렌 등의 할로겐화 탄화수소계 용제, 아세트산에틸, 1-프로필렌글리콜메틸에테르아세테이트 등의 에스테르계 용제, 메틸이소부틸케톤, 메틸에틸케톤 등의 케톤계 용제, 에탄올, 이소프로판올, 부탄올 등의 알코올계 용제, 리그로인, 시클로헥사논, 디에틸에테르, 고무 휘발류, 실리콘계 용제 등을 들 수 있다. 이 중에서도 아세트산에틸, 1-프로필렌글리콜메틸에테르아세테이트, 헥산, 아세톤이 적합하게 사용된다.Examples of the solvent include aromatic hydrocarbon solvents such as xylene, toluene and benzene, aliphatic hydrocarbon solvents such as heptane and hexane, halogenated hydrocarbon solvents such as trichloroethylene, perchloroethylene and methylene chloride, ethyl acetate and 1-. Ester solvents such as propylene glycol methyl ether acetate, ketone solvents such as methyl isobutyl ketone and methyl ethyl ketone, alcohol solvents such as ethanol, isopropanol and butanol, ligroin, cyclohexanone, diethyl ether, rubber volatiles, silicone A solvent etc. are mentioned. Among these, ethyl acetate, 1-propylene glycol methyl ether acetate, hexane, and acetone are used suitably.
(B) 성분은, 프라이머 조성물 도포 작업시의 증발 속도에 따라, 1종을 단독으로 사용해도 2종 이상을 조합하여 혼합 용제로서 사용해도 된다.(B) A component may be used individually by 1 type or in combination of 2 or more types as a mixed solvent according to the evaporation rate at the time of primer composition application | coating operation.
(B) 성분의 배합량은 특별히 한정되지 않지만, 프라이머 조성물 전체((A), (B) 성분 등의 합계)의 70질량% 이상인 것이 바람직하고, 보다 바람직하게는 80 내지 99.99질량%, 더욱 바람직하게는 90 내지 99.9질량%이다. (B) 성분의 배합량이 70질량% 이상이면, 도포시 및 건조시의 작업성이 보다 양호한 프라이머 조성물이 되고, 예를 들어 후술하는 기판 상에 프라이머막을 형성할 때에 균일하게 할 수 있고, 표면에 요철이 생김에 따른 막의 깨짐이 없고, 프라이머로서의 충분한 성능을 부여하는 것이 된다.Although the compounding quantity of (B) component is not specifically limited, It is preferable that it is 70 mass% or more of the whole primer composition (total of (A), (B) component, etc.), More preferably, it is 80-99.99 mass%, More preferably, Is 90 to 99.9 mass%. When the compounding quantity of (B) component is 70 mass% or more, it becomes a primer composition with more favorable workability at the time of application | coating and drying, for example, can be made uniform when forming a primer film on the board | substrate mentioned later, There is no cracking of the film due to unevenness, and it gives sufficient performance as a primer.
[(C) 성분][(C) component]
본 발명의 프라이머 조성물에는, (C) 성분으로서 실란 커플링제를 더 배합할 수 있다.A silane coupling agent can further be mix | blended with the primer composition of this invention as (C) component.
실란 커플링제로서는, 일반적인 실란 커플링제여도 되고, 예를 들어 비닐트리메톡시실란, 비닐트리에톡시실란 등의 비닐기 함유 실란 커플링제, 글리시독시프로필트리메톡시실란 등의 에폭시기 함유 실란 커플링제, 메타크릴로일옥시프로필트리메톡시실란, 아크릴로일옥시프로필트리메톡시실란 등의 (메트)아크릴옥시기 함유 실란 커플링제, 머캅토프로필트리메톡시실란 등의 머캅토기 함유 실란 커플링제 등을 들 수 있다. 이 중에서도 비닐트리메톡시실란, 메타크릴로일옥시프로필트리메톡시실란이 바람직하다.As a silane coupling agent, a general silane coupling agent may be sufficient, and epoxy group containing silane coupling agents, such as vinyl group containing silane coupling agents, such as vinyl trimethoxysilane and vinyl triethoxysilane, and glycidoxy propyl trimethoxysilane, for example. Mercapto group-containing silane coupling agents such as (meth) acryloxy group-containing silane coupling agents such as methacryloyloxypropyltrimethoxysilane and acryloyloxypropyltrimethoxysilane, and mercaptopropyltrimethoxysilane Can be mentioned. Among these, vinyl trimethoxysilane and methacryloyloxypropyl trimethoxysilane are preferable.
(C) 성분을 사용하는 경우의 배합량으로서는, 프라이머 조성물 전체((A) 내지 (C) 성분 등의 합계)의 0.05 내지 10질량%인 것이 바람직하고, 보다 바람직하게는 0.1 내지 3질량%이다. (C) 성분의 배합량이 0.05질량% 이상이면, 접착성 향상 효과가 충분해지고, 10질량%를 초과한 값을 배합해도 가일층의 접착성 향상 효과가 얻어지지 않기 때문에, 10질량% 이하인 것이 바람직하다.As a compounding quantity at the time of using (C) component, it is preferable that it is 0.05-10 mass% of the whole primer composition (total of (A)-(C) component etc.), More preferably, it is 0.1-3 mass%. When the compounding quantity of (C) component is 0.05 mass% or more, an adhesive improvement effect will become enough, and even if it mix | blends the value exceeding 10 mass%, since the further adhesive improvement effect is not obtained, it is preferable that it is 10 mass% or less. .
[기타 성분] [Other Ingredients]
본 발명의 프라이머 조성물에는, 상기 성분 이외에, 필요에 따라 기타 임의 성분을 배합할 수 있다. 예를 들어, 금속 부식 억제제로서, 벤조트리아졸, 부틸히드록시톨루엔, 하이드로퀴논 또는 그의 유도체를 배합할 수 있다.In addition to the said component, other arbitrary components can be mix | blended with the primer composition of this invention as needed. For example, as the metal corrosion inhibitor, benzotriazole, butylhydroxytoluene, hydroquinone or derivatives thereof can be blended.
벤조트리아졸, 디부틸히드록시톨루엔, 하이드로퀴논 또는 그의 유도체는, LED 램프가 가혹한 외부 환경에 노출되어, 예를 들어 대기 중의 황 화합물이 광반도체 장치의 밀봉재(부가 반응 경화형 실리콘 조성물의 경화물)를 투과한 경우에, 이 밀봉재로 밀봉된 기판 상의 금속 전극, 특히 Ag 전극의 부식을 보다 효과적으로 억제하는 성분이다.As for benzotriazole, dibutylhydroxytoluene, hydroquinone or derivatives thereof, an LED lamp is exposed to a harsh external environment, for example, the sulfur compound in air | atmosphere is a sealing material (hardened | cured material of an addition reaction hardening type silicone composition) of an optical semiconductor device. In the case of passing through, it is a component that more effectively suppresses corrosion of metal electrodes, particularly Ag electrodes, on the substrate sealed with the sealing material.
금속 부식 억제제를 첨가하는 경우의 배합량은, (A), (B) 성분의 합계 100질량부에 대하여 0.005 내지 1질량부인 것이 바람직하고, 특히 0.01 내지 0.5질량부인 것이 바람직하다.It is preferable that it is 0.005-1 mass part with respect to a total of 100 mass parts of (A) and (B) component, and, as for the compounding quantity at the time of adding a metal corrosion inhibitor, it is especially preferable that it is 0.01-0.5 mass part.
또한, 기타 임의 성분으로서, 형광체, 보강성 충전제, 염료, 안료, 내열성 향상제, 산화 방지제, 접착 촉진제 등을 첨가해도 된다.Moreover, you may add fluorescent substance, a reinforcing filler, dye, a pigment, a heat resistance improver, antioxidant, an adhesion promoter, etc. as other arbitrary components.
[프라이머 조성물의 제조 방법] [Method for Producing Primer Composition]
본 발명의 프라이머 조성물의 제조 방법으로서는, 상기 (A), (B) 성분 및 필요에 따라 상기 임의 성분을 상온하나 가열하에서 혼합 교반기에 의해 균일하게 혼합하는 방법 등을 들 수 있다.As a manufacturing method of the primer composition of this invention, the method of mixing uniformly the said (A), (B) component and the said arbitrary component as needed with a mixing stirrer under normal temperature or heating as needed.
<광반도체 장치> <Optical semiconductor device>
또한, 본 발명은, 광반도체 소자를 실장한 기판과, 상기 광반도체 소자를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물이, 상기 프라이머 조성물에 의해 접착된 것인 광반도체 장치를 제공한다.Moreover, this invention provides the optical semiconductor device by which the board | substrate which mounted the optical semiconductor element and the hardened | cured material of the addition reaction hardening type silicone composition which seals the said optical semiconductor element are adhere | attached with the said primer composition.
이하, 본 발명의 광반도체 장치의 일 형태에 대하여 도면을 참조하여 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, one form of the optical semiconductor device of this invention is demonstrated with reference to drawings.
도 1은, 본 발명에 관한 광반도체 장치의 일례를 나타내는 광반도체 장치(LED 램프)의 단면도이다. 광반도체 장치(LED 램프)(1)는, 광반도체 소자로서 LED(3)를 실장한 기판(4)과, LED(3)를 밀봉하는 부가 반응 경화형 실리콘 조성물의 경화물(5)을, 상술한 프라이머 조성물(2)에 의해 접착한 것이다. 이 중, 기판(4)에는, Ag 전극 등의 금속 전극(6)이 형성되어 있으며, 본딩 와이어(7)로 LED(3)의 전극 단자(도시하지 않음)와 금속 전극(6)이 전기적으로 접속되어 있다.1 is a cross-sectional view of an optical semiconductor device (LED lamp) showing an example of the optical semiconductor device according to the present invention. The optical semiconductor device (LED lamp) 1 describes the
기판(4)을 구성하는 재료로서는, 폴리아미드, 각종 섬유 강화 플라스틱, 세라믹스, 실리콘, 실리콘 변성 중합체, 액정 중합체 등을 들 수 있다.As a material which comprises the board |
부가 반응 경화형 실리콘 조성물의 경화물(5)은, 부가 반응 경화형 실리콘 조성물을 경화시킴으로써 얻어지는 것이며, 투명한 경화물인 것이 바람직하고, 또한 고무상인 것이 바람직하다. 상기 부가 반응 경화형 실리콘 조성물로서는, 종래 공지된 비닐기 함유 오르가노폴리실록산, 가교제인 오르가노하이드로겐폴리실록산 및 부가 반응 촉매인 백금계 촉매를 적어도 함유하는 것을 사용할 수 있으며, 또한 상기 부가 반응 경화형 실리콘 조성물에는, 기타 임의 성분으로서 반응 억제제, 착색제, 난연성 부여제, 내열성 향상제, 가소제, 보강성 실리카, 접착성 부여제 등을 첨가해도 된다.The hardened | cured
도 1에 도시하는 광반도체 장치(LED 램프)(1)의 제조 방법으로서는, 이하의 방법을 예시할 수 있다.The following method can be illustrated as a manufacturing method of the optical semiconductor device (LED lamp) 1 shown in FIG.
미리, Ag 도금으로 Ag 전극 등의 금속 전극(6)이 형성된 기판(4)에 LED(3) 등의 광반도체 소자를 접착제로 접합하여, 본딩 와이어(7)에 의해 LED(3)의 전극 단자(도시하지 않음)와 금속 전극(6)을 전기적으로 접속해 두고, 이 후, LED(3)가 실장된 기판(4)을 필요에 따라 청소한 후, 스피너 등의 도포 장치나 분무기 등으로 프라이머 조성물(2)을 기판(4)에 도포한 후, 가열, 풍건 등에 의해 프라이머 조성물(2) 중의 용제를 휘발시키고, 바람직하게는 10㎛ 이하, 보다 바람직하게는 0.1 내지 5㎛의 두께의 피막을 형성한다. 프라이머의 피막을 형성한 후, 부가 반응 경화형 실리콘 조성물을 디스펜서 등으로 도포하고, 실온에서 방치 또는 가열 경화시켜 고무상의 경화물(5)로 LED(3)를 밀봉한다.An optical semiconductor element such as the
이와 같이, 상술한 (A), (B) 성분을 함유하는 본 발명의 프라이머 조성물을 사용함으로써, LED 등의 광반도체 소자를 실장한 기판과 부가 반응 경화형 실리콘 조성물의 경화물이 견고하게 접착하여, 높은 신뢰성의 광반도체 장치, 특히 LED 램프를 제공할 수 있다.Thus, by using the primer composition of this invention containing the above-mentioned (A) and (B) component, the board | substrate which mounted optical semiconductor elements, such as LED, and the hardened | cured material of an addition reaction curable silicone composition adhere firmly, It is possible to provide a high reliability optical semiconductor device, in particular an LED lamp.
또한, LED 램프가 가혹한 외부 환경에 노출되어, 대기 중의 황 화합물 등이 상기 실리콘 조성물의 경화물 내에 투과되는 경우에도, 본 발명의 프라이머 조성물을 사용함으로써 기판 상의 금속 전극, 특히 Ag 전극의 부식을 억제할 수 있다.In addition, even when an LED lamp is exposed to a harsh external environment and sulfur compounds in the atmosphere are permeated into the cured product of the silicone composition, the use of the primer composition of the present invention suppresses corrosion of metal electrodes, particularly Ag electrodes, on a substrate. can do.
또한, 본 발명의 광반도체 장치는 LED용으로서 적합하게 사용할 수 있으며, 상기한 일 형태에서는, 광반도체 소자의 일례로서 LED를 사용하여 설명했지만, 이외에, 예를 들어 포토 트랜지스터, 포토다이오드, CCD, 태양 전지 모듈, EPROM, 포토커플러 등에 적용할 수도 있다.In addition, the optical semiconductor device of this invention can be used suitably for LED, The above-mentioned aspect demonstrated using LED as an example of an optical semiconductor element, In addition, For example, a photo transistor, a photodiode, a CCD, It can also be applied to solar cell modules, EPROMs, photocouplers and the like.
[실시예]EXAMPLE
이하, 합성예, 실시예 및 비교예를 나타내어, 본 발명을 구체적으로 설명하지만, 본 발명은 하기의 실시예로 제한되는 것은 아니다.Hereinafter, although a synthesis example, an Example, and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to a following example.
[합성예 1] Synthesis Example 1
메타크릴산메틸 40질량부, 하기 식 (7)로 표시되는 SiH 함유 메타크릴산에스테르 10질량부, 하기 식 (8)로 표시되는 메톡시기 함유 메타크릴산에스테르 6질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 10 parts by mass of SiH-containing methacrylic acid ester represented by the following formula (7), 6 parts by mass of methoxy group-containing methacrylic acid ester represented by the following formula (8), 1-propylene glycol methyl 230 mass parts of ether acetate and 0.25 mass parts of AIBN were heated and stirred at 90 degreeC for 6 hours, and the solution containing a copolymer was produced.
[합성예 2] Synthesis Example 2
메타크릴산메틸 40질량부, 상기 식 (7)로 표시되는 SiH 함유 메타크릴산에스테르 14질량부, 상기 식 (8)로 표시되는 메톡시기 함유 메타크릴산에스테르 4질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 14 parts by mass of SiH-containing methacrylic acid ester represented by formula (7), 4 parts by mass of methoxy group-containing methacrylic acid ester represented by formula (8), 1-propylene glycol methyl 230 mass parts of ether acetate and 0.25 mass parts of AIBN were heated and stirred at 90 degreeC for 6 hours, and the solution containing a copolymer was produced.
[합성예 3] Synthesis Example 3
메타크릴산메틸 40질량부, 상기 식 (7)로 표시되는 SiH 함유 메타크릴산에스테르 19질량부, 상기 식 (8)로 표시되는 메톡시기 함유 메타크릴산에스테르 1질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 19 parts by mass of SiH-containing methacrylic acid ester represented by formula (7), 1 part by mass of methoxy group-containing methacrylic acid ester represented by formula (8), 1-propylene glycol methyl 230 mass parts of ether acetate and 0.25 mass parts of AIBN were heated and stirred at 90 degreeC for 6 hours, and the solution containing a copolymer was produced.
[합성예 4] Synthesis Example 4
메타크릴산메틸 40질량부, 상기 식 (7)로 표시되는 SiH 함유 메타크릴산에스테르 14질량부, 하기 식 (9)로 표시되는 메톡시기 함유 메타크릴산에스테르 5질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 14 parts by mass of SiH-containing methacrylic acid ester represented by the formula (7), 5 parts by mass of methoxy group-containing methacrylic acid ester represented by the following formula (9), 1-propylene glycol methyl 230 mass parts of ether acetate and 0.25 mass parts of AIBN were heated and stirred at 90 degreeC for 6 hours, and the solution containing a copolymer was produced.
[합성예 5] Synthesis Example 5
메타크릴산메틸 40질량부, 하기 식 (10)으로 표시되는 SiH 함유 아크릴산에스테르 14질량부, 상기 식 (8)로 표시되는 메톡시기 함유 메타크릴산에스테르 4질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 14 parts by mass of SiH-containing acrylate ester represented by the following formula (10), 4 parts by mass of methoxy group-containing methacrylate ester represented by the formula (8), 1-propylene glycol methyl ether acetate 230 mass parts and 0.25 mass parts of AIBN were heat-stirred at 90 degreeC for 6 hours, and the solution containing a copolymer was produced.
[합성예 6] Synthesis Example 6
메타크릴산메틸 40질량부, 상기 식 (7)로 표시되는 SiH 함유 메타크릴산에스테르 14질량부, 하기 식 (11)로 표시되는 메톡시기 함유 아크릴산에스테르 4질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 14 parts by mass of SiH-containing methacrylic acid ester represented by the formula (7), 4 parts by mass of methoxy group-containing acrylate ester represented by the following formula (11), 1-propylene glycol methyl ether acetate 230 mass parts and 0.25 mass parts of AIBN were heat-stirred at 90 degreeC for 6 hours, and the solution containing a copolymer was produced.
[비교 합성예 1] Comparative Synthesis Example 1
메타크릴산메틸 40질량부, 상기 식 (7)로 표시되는 SiH 함유 메타크릴산에스테르 14질량부, 1-프로필렌글리콜메틸에테르아세테이트 230질량부, AIBN 0.25질량부를 90℃에서 6시간 가열 교반하여, 공중합체를 함유하는 용액을 제조하였다.40 parts by mass of methyl methacrylate, 14 parts by mass of SiH-containing methacrylic acid ester represented by the formula (7), 230 parts by mass of 1-propylene glycol methyl ether acetate, and 0.25 parts by mass of AIBN were heated and stirred at 90 ° C. for 6 hours, A solution containing a copolymer was prepared.
[실시예 1 내지 6, 비교예 1] [Examples 1 to 6 and Comparative Example 1]
상기 합성예 1 내지 6, 비교 합성예 1에서 합성한 공중합체를 불휘발분이 8%가 되도록 1-프로필렌글리콜메틸에테르아세테이트로 희석하여, 프라이머 조성물을 얻었다(실시예 1 내지 6, 비교예 1).The copolymers synthesized in Synthesis Examples 1 to 6 and Comparative Synthesis Example 1 were diluted with 1-propylene glycol methyl ether acetate so as to have a nonvolatile content of 8% to obtain a primer composition (Examples 1 to 6 and Comparative Example 1). .
얻어진 프라이머 조성물을 사용하여, 각종 물성(외관, 투과율, 접착성(접착 강도) 및 부식성)을 하기에 나타내는 평가 방법에 의해 측정하고, 결과를 표 1, 2에 나타내었다. 또한, 표 1, 2에 나타낸 물성은, 23℃에서 측정한 값이다.Using the obtained primer composition, various physical properties (appearance, transmittance, adhesiveness (adhesive strength), and corrosiveness) were measured by the evaluation method shown below, and the results are shown in Tables 1 and 2. In addition, the physical property shown in Table 1, 2 is the value measured at 23 degreeC.
[외관] [Exterior]
얻어진 프라이머 조성물을 슬라이드 글래스 상에 두께 2㎛가 되도록 브러시 도포하고, 60℃에서 30분 방치하여 건조시키고, 또한 180℃에서 30분 건조 처리를 행하였다. 이 프라이머 조성물 상에 부가 반응 경화형 실리콘 고무 조성물(신에쯔 가가꾸 고교 가부시키가이샤제, KER-2600)을 2mm 두께로 도포하여 150℃에서 1시간 경화시켜, 그의 외관을 관찰하였다.The obtained primer composition was brush-coated so that it might become thickness of 2 micrometers on slide glass, it was left to stand at 60 degreeC for 30 minutes, and it dried at 180 degreeC for 30 minutes. On this primer composition, an addition reaction curable silicone rubber composition (manufactured by Shin-Etsu Chemical Co., Ltd., KER-2600) was applied to a thickness of 2 mm, cured at 150 ° C for 1 hour, and the appearance thereof was observed.
[투과율 시험] [Transmittance test]
얻어진 프라이머 조성물을 슬라이드 글래스 상에 두께 2㎛가 되도록 브러시 도포하고, 60℃에서 30분 방치하여 건조시켜, 프라이머 조성물 피막을 형성하였다.이 프라이머 조성물 피막이 형성된 슬라이드 글래스의 파장 400nm에 있어서의 투과율(초기 투과율)을, 슬라이드 글래스를 블랭크로 하여 측정하고, 이것을 100%로 하였다. 이어서, 상기 프라이머 조성물 피막이 형성된 슬라이드 글래스를 180℃×500시간의 열 처리를 하고, 열 처리 후의 투과율을 상기와 마찬가지로 측정하여, 초기 투과율에 대한 변화를 구하였다.The obtained primer composition was brush-coated so that it might become 2 micrometers in thickness on slide glass, it was left to stand at 60 degreeC for 30 minutes, and it dried, and the primer composition film was formed. Transmittance) was measured with a slide glass as a blank, and this was made into 100%. Subsequently, the slide glass in which the said primer composition film was formed was heat-processed 180 degreeCx500 hours, the transmittance | permeability after heat processing was measured similarly to the above, and the change with respect to initial stage transmittance | permeability was calculated | required.
[접착성(접착 강도) 시험] [Adhesion (Adhesion Strength) Test]
도 2에 도시한 바와 같은 접착 시험용의 테스트 피스(11)를 제작하였다. 즉, 2매의 Al 기판(12, 13)(케이디에스사제, 폭 25mm)의 각각의 편면에, 얻어진 프라이머 조성물을 두께 0.01mm로 도포하고, 60℃에서 30분 방치하고, 또한 180℃에서 건조시켜, 프라이머 조성물 피막(14, 15)을 형성하였다. 이들 Al 기판을 프라이머 조성물 피막(14, 15)이 형성된 면을 대향시켜, 이들의 단부가 10mm 겹치도록 하고, 그 사이에 부가 반응 경화형 실리콘 고무 조성물(신에쯔 가가꾸 고교 가부시키가이샤제, KER-2600)을 2mm 두께로 끼워 넣도록 하여, 150℃에서 30분간 가열함으로써 해당 부가 반응 경화형 실리콘 고무 조성물을 경화시키고, 실리콘 고무 조성물의 경화물(16)에 의해 접착(접착 면적 25mm×10mm=250mm2)된 2매의 Al 기판을 포함하는 테스트 피스를 제작하였다.The
이 테스트 피스의 Al 기판(12, 13)의 각각의 단부를 반대 방향(도 2의 화살표 방향)으로, 인장 시험기(시마즈 세이사쿠쇼제, 오토그래프)를 사용하여 인장 속도 50mm/분으로 인장하고, 단위 면적당의 접착 강도(MPa)를 구하였다.Each end of each of the Al substrates 12 and 13 of this test piece was pulled at a tensile speed of 50 mm / min using a tensile tester (manufactured by Shimadzu Seisakusho, Autograph) in the opposite direction (arrow direction in Fig. 2), The adhesive strength (MPa) per unit area was calculated | required.
[내부식성 시험] [Corrosion Resistance Test]
얻어진 프라이머 조성물을 은 전극을 저부에 갖는 LED 패키지에 충전하고, 60℃에서 30분 방치하고 180℃에서 건조시킨 후, 이 위에 부가 반응 경화형 실리콘 고무 조성물(신에쯔 가가꾸 고교 가부시키가이샤제, KER-2600)을 1mm 두께로 도포하고, 150℃에서 2시간 경화시켜 실리콘 고무층을 갖는 테스트 피스를 제작하였다. 이 테스트 피스를 황 결정 0.1g과 함께 100cc 유리병에 넣고, 밀폐하여 70℃에서 방치하고, 1일 후 및 7일 후의 은 도금의 부식의 정도를 눈으로 보아 관찰하여, 하기 기준으로 평가하였다.After filling the obtained primer composition into the LED package which has a silver electrode in the bottom part, it was left to stand at 60 degreeC for 30 minutes, and it dried at 180 degreeC, and the addition reaction hardening type silicone rubber composition (made by Shin-Etsu Chemical Co., Ltd. on this), KER-2600) was applied to a thickness of 1 mm, and cured at 150 ° C. for 2 hours to prepare a test piece having a silicone rubber layer. The test piece was placed in a 100 cc glass bottle with 0.1 g of sulfur crystals, sealed, and left to stand at 70 ° C. The degree of corrosion of silver plating after 1 day and 7 days was visually observed and evaluated according to the following criteria.
○: 부식(변색) 없음○: no corrosion (discoloration)
△: 다소의 부식(변색)△: slight corrosion (discoloration)
×: 흑변×: black side
[비교예 2] Comparative Example 2
프라이머 조성물을 사용하지 않은 것 이외는, 실시예 1 내지 6 및 비교예 1과 마찬가지로 상기 접착성(접착 강도) 시험 및 내부식성 시험을 행하였다.The adhesiveness (adhesive strength) test and the corrosion resistance test were done similarly to Examples 1-6 and Comparative Example 1 except not using a primer composition.
표 1에 나타낸 결과로부터 명백해진 바와 같이, 본 발명의 프라이머 조성물을 사용한 실시예 1 내지 6에서는, Al과 부가 반응 경화형 실리콘 고무 조성물의 경화물이 견고하게 접착되어 있다. 또한, 슬라이드 글래스에 도포한 프라이머 조성물 피막의 내열성 시험에서는, 변색이 없고, 피막 자체의 변화도 없고, 내열성도 우수하였다. 또한, 은 전극을 탑재한 LED 패키지를 사용한 내부식성 시험에서는, 실시예 1 내지 6 모두 7일 경과 후에도 변색이 없고, 높은 부식 억제 효과가 보였다.As apparent from the results shown in Table 1, in Examples 1 to 6 using the primer composition of the present invention, Al and the cured product of the addition reaction curable silicone rubber composition are firmly adhered. Moreover, in the heat resistance test of the primer composition film apply | coated to the slide glass, there was no discoloration, there was no change of the film itself, and it was excellent also in heat resistance. In the corrosion resistance test using the LED package equipped with the silver electrode, all of Examples 1 to 6 had no discoloration even after 7 days had elapsed, and a high corrosion inhibitory effect was observed.
한편, 본 발명의 프라이머 조성물과는 상이한 프라이머 조성물을 사용한 비교예 1은, 실시예 1 내지 6에 비해 접착성 및 내부식성이 떨어졌다. 또한, 프라이머 조성물 자체를 사용하지 않은 비교예 2에서는, 실시예 1 내지 6에 비해 접착성 및 내부식성이 대폭으로 떨어졌다.On the other hand, the comparative example 1 using the primer composition different from the primer composition of this invention was inferior to adhesiveness and corrosion resistance compared with Examples 1-6. In Comparative Example 2, in which the primer composition itself was not used, the adhesion and the corrosion resistance were significantly inferior to those of Examples 1 to 6.
또한, 본 발명은, 상기 실시 형태로 한정되는 것은 아니다. 상기 실시 형태는 예시이며, 본 발명의 특허 청구 범위에 기재된 기술적 사상과 실질적으로 동일한 구성을 갖고, 마찬가지의 작용 효과를 발휘하는 것은, 어떠한 것이어도 본 발명의 기술적 범위에 포함된다.In addition, this invention is not limited to the said embodiment. The said embodiment is an illustration, It has the structure substantially the same as the technical idea described in the claim of this invention, and what exhibits the same effect is contained in the technical scope of this invention.
1…광반도체 장치(LED 램프)
2…프라이머 조성물
3…LED
4…기판
5…부가 반응 경화형 실리콘 조성물의 경화물
6…금속 전극
7…본딩 와이어
11…테스트 피스
12, 13…Al 기판
14, 15…프라이머 조성물 피막
16…부가 반응 경화형 실리콘 고무 조성물의 경화물One… Optical semiconductor device (LED lamp)
2… Primer composition
3... LED
4… Board
5... Cured product of the addition reaction curable silicone composition
6... Metal electrode
7... Bonding wire
11... Test piece
12, 13... Al substrate
14, 15... Primer composition film
16... Cured product of an addition reaction curable silicone rubber composition
Claims (7)
(A) 1분자 중에 하나 이상의 SiH기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, 1분자 중에 하나 이상의 알콕시기를 갖는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽과, SiH기 및 알콕시기를 갖지 않는 아크릴산에스테르 및 메타크릴산에스테르 중 적어도 한쪽을 포함하는 공중합체와,
(B) 용제
를 함유하는 것을 특징으로 하는 프라이머 조성물.As a primer composition which adhere | attaches the board | substrate which mounted the optical semiconductor element, and the hardened | cured material of the addition reaction curable silicone composition which seals the said optical semiconductor element,
(A) At least one of the acrylic acid ester and methacrylic acid ester which has one or more SiH groups in 1 molecule, and at least one of the acrylic acid ester and methacrylic acid ester which has one or more alkoxy groups in 1 molecule, and does not have a SiH group and an alkoxy group A copolymer comprising at least one of an acrylic acid ester and a methacrylic acid ester,
(B) solvent
A primer composition comprising a.
(C) 실란 커플링제
를 더 함유하는 것을 특징으로 하는 프라이머 조성물.The method according to claim 1 or 2, wherein the primer composition,
(C) silane coupling agent
A primer composition further comprising.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000198930A (en) | 1998-12-28 | 2000-07-18 | Shin Etsu Chem Co Ltd | Addition curable silicone composition |
JP2004292714A (en) | 2003-03-28 | 2004-10-21 | Kanegafuchi Chem Ind Co Ltd | Curable composition, cured product, its manufacturing method and light emitting diode encapsulated by cured product |
JP2010168496A (en) | 2009-01-23 | 2010-08-05 | Shin-Etsu Chemical Co Ltd | Primer composition and photosemiconductor device using the same |
JP2012144652A (en) | 2011-01-13 | 2012-08-02 | Shin-Etsu Chemical Co Ltd | Primer composition and photosemiconductor device using the same |
KR20140093632A (en) * | 2013-01-18 | 2014-07-28 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Primer composition and photosemiconductor device using the same |
KR20170016433A (en) * | 2014-06-06 | 2017-02-13 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Primer composition |
Family Cites Families (5)
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JP2006063092A (en) * | 2004-07-29 | 2006-03-09 | Dow Corning Toray Co Ltd | Curable organopolysiloxane composition, its curing method, optical semiconductor device and adhesion promoter |
CN101121771A (en) * | 2006-08-11 | 2008-02-13 | 汉高股份两合公司 | Acryloxyalkoxysilicane modified acrylic acid ester polymerization emulsion and its preparation method and application |
JP5148088B2 (en) * | 2006-08-25 | 2013-02-20 | 東レ・ダウコーニング株式会社 | Curable organopolysiloxane composition and semiconductor device |
JP2009206124A (en) * | 2008-02-26 | 2009-09-10 | Shin Etsu Chem Co Ltd | Sealing method of led device, and led device |
JP5869501B2 (en) * | 2013-01-25 | 2016-02-24 | 信越化学工業株式会社 | Primer composition and optical semiconductor device using the same |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000198930A (en) | 1998-12-28 | 2000-07-18 | Shin Etsu Chem Co Ltd | Addition curable silicone composition |
JP2004292714A (en) | 2003-03-28 | 2004-10-21 | Kanegafuchi Chem Ind Co Ltd | Curable composition, cured product, its manufacturing method and light emitting diode encapsulated by cured product |
JP2010168496A (en) | 2009-01-23 | 2010-08-05 | Shin-Etsu Chemical Co Ltd | Primer composition and photosemiconductor device using the same |
KR101717782B1 (en) * | 2009-01-23 | 2017-03-17 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Primer composition and optical semiconductor device using the same |
JP2012144652A (en) | 2011-01-13 | 2012-08-02 | Shin-Etsu Chemical Co Ltd | Primer composition and photosemiconductor device using the same |
KR20140093632A (en) * | 2013-01-18 | 2014-07-28 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Primer composition and photosemiconductor device using the same |
JP2014157849A (en) | 2013-01-18 | 2014-08-28 | Shin Etsu Chem Co Ltd | Primer composition and optical semiconductor device using the same |
KR20170016433A (en) * | 2014-06-06 | 2017-02-13 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Primer composition |
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