KR20190017527A - Polyimide precursor composition and method for producing polyimide film using the same - Google Patents
Polyimide precursor composition and method for producing polyimide film using the same Download PDFInfo
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Abstract
Description
본 발명은 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름 제조 방법에 관한 것으로서, 더욱 상세하게는, 플렉서블 기판의 제조에 사용될 수 있는 폴리이미드 전구체 조성물, 이를 이용한 폴리이미드 필름 제조방법 및 폴리이미드 필름을 포함하는 디스플레이 소자에 관한 것이다.The present invention relates to a polyimide precursor composition and a method for producing a polyimide film using the polyimide precursor composition. More particularly, the present invention relates to a polyimide precursor composition that can be used for the production of a flexible substrate, To a display element comprising a film.
최근 대면적 구현이 용이하고 박형 및 경량화가 가능한 평판 디스플레이(Flat Panel Display; FPD)에 대한 수요가 증가하고 있다. 이러한 평판 디스플레이에는 액정 표시 장치(Liquid Crystal Display; LCD), 플라즈마 디스플레이 패널(Plasma Display Panel; PDP), 유기 발광 표시 장치(Organic Light Emitting Display; OLED) 등이 있다. 그러나 기존의 평판 디스플레이는 유리 기판을 사용하기 때문에 유연성이 없으므로 응용과 용도에 한계가 있다. 이에 따라, 유연성이 없는 유리 기판 대신에 플라스틱, 호일 등과 같이 유연성 있는 재료의 기판을 사용하여 구부러질 수 있게 제조된 플렉서블 표시 장치(Flexible Display Device)가 차세대 표시 장치로 활발히 개발되고 있다. Recently, there is an increasing demand for a flat panel display (FPD) that can be easily realized in a large area and can be made thin and light. Such a flat panel display includes a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED). However, since conventional flat panel displays use a glass substrate, they are not flexible and thus have limited applications and applications. Accordingly, a flexible display device, which is manufactured so as to be bent by using a substrate of a flexible material such as plastic, foil or the like instead of a glass substrate having no flexibility, has been actively developed as a next generation display device.
플렉서블 표시 장치는 일반적으로 고온의 TFT(Thin Film Transistor) 공정 으로 제조된다. 장치 내에 포함되는 반도체층, 절연막 및 배리어층의 종류에 따라 공정온도가 달라질 수 있지만, 통상 TFT 공정 시 300 내지 500℃ 정도의 온도가 필요하다. 그러나 이러한 공정온도를 견딜 수 있는 폴리머 재료는 극히 제한적이며, 내열성이 우수한 것으로 알려진 폴리이미드가 주로 사용되고 있다. 폴리이미드 소재는 열적 특성이 우수할 뿐만 아니라 유연하고 가벼우므로 폴리이미드 기판이 기존의 유리기판을 대체할 수 있는 플라스틱 기판으로 가장 주목받고 있다. The flexible display device is generally manufactured by a high-temperature TFT (Thin Film Transistor) process. The process temperature may vary depending on the type of the semiconductor layer, the insulating film, and the barrier layer included in the device, but a temperature of about 300 to 500 ° C is generally required in the TFT process. However, polymer materials that can withstand such process temperatures are extremely limited, and polyimides known to have excellent heat resistance are mainly used. Since polyimide materials have excellent thermal properties and are flexible and lightweight, polyimide substrates are attracting the most attention as plastic substrates that can replace conventional glass substrates.
폴리이미드 기판을 제작하는 공정에는 여러 가지가 있는데, 그 중 가장 많이 사용하는 방법은 캐리어 글라스(Carrier Glass)에 폴리아믹산(Polyamic acid) 고분자 용액을 스핀(spin) 또는 슬릿 코터(slit coater)를 이용하여 일정한 두께로 코팅한 후에 Convection Oven 또는 IR Oven 을 통해 열적 이미드화 반응 및 용매 제거 공정을 거쳐 폴리이미드 기판을 제조하는 것이다. 플렉서블 디스플레이 생산 공정은 폴리이미드 기판 위에 TFT Backplane, 유기 발광층 등을 형성시켜 제품을 만든 후, 광 절연막 제거(Laser Lift Off) 방법으로 캐리어 글라스로부터 분리시킨다. 폴리이미드 소재는 휘어지기 쉽기 때문에 기판을 캐리어 글라스에 고정된 상태에서 후속 공정이 진행된다. TFT 또는 증착 공정에서는 비교적 고온에서 진행되기 때문에 폴리이미드 소재와 캐리어 글라스와 열팽창계수 차이가 크면 캐리어 글라스가 휘어질 우려가 있기 때문에 비슷한 열팽창계수를 갖는 것이 중요하다.There are various processes for manufacturing a polyimide substrate. Among them, the most commonly used method is a method in which a polyamic acid polymer solution is applied to a carrier glass using a spin or a slit coater And then the film is coated to a predetermined thickness and then subjected to a thermal imidization reaction and a solvent removal process through Convection Oven or IR Oven to produce a polyimide substrate. In the flexible display production process, a TFT backplane, an organic light emitting layer, and the like are formed on a polyimide substrate, and the product is separated from a carrier glass by a laser lift off method. Since the polyimide material is liable to warp, the subsequent process proceeds with the substrate fixed to the carrier glass. In a TFT or a deposition process, since the process proceeds at a relatively high temperature, when the difference in thermal expansion coefficient between the polyimide material and the carrier glass is large, it is important that the carrier glass has a similar thermal expansion coefficient.
폴리아믹산 고분자 용액은 극성용매 중에서 디아민(Diamine)과 이무수물(Dianhydride)을 중합하여 제조하며, 상기 극성용매로는 디메틸아세트아미드(Dimethylacetamide: DMAC, , 끓는점: 165.1 ℃), 디메틸포름아미드(Dimethylformamide: DMF, , 끓는점: 153 ℃), N-메틸피롤리돈(N- Methylpyrrolidone: NMP, , 끓는점: 202, ℃) 등이 일반적으로 사용되고 있으나, 이들은 환경 규제 대상으로 사용이 제한되어 다른 용매로의 대체가 필요하다.The polyamic acid polymer solution is prepared by polymerizing a diamine and a dianhydride in a polar solvent, and the polar solvent includes dimethylacetamide (DMAC, , Boiling point: 165.1 占 폚), dimethylformamide (DMF, , Boiling point: 153 占 폚), N-methylpyrrolidone (NMP, , Boiling point: 202, ℃) are generally used, but they are restricted to be used for environmental regulation and need to be replaced with other solvents.
또한 폴리이미드 기판을 제작하는 열적 이미드화 공정은 오븐에서의 고온 경화(curing) 과정에 의해 공정 시간(lead time)이 정해지는데 이를 줄이기 위해 승온 시간을 단축시키고, 각 온도 단계에서의 유지시간을 단축하는 등 다양한 시도가 이루어지고 있다. 또한 고온 공정(120℃ 공정 시작 및 450℃ 경화(cure) 공정) 및 고속 건조 진행 시 급속한 용매 휘발로 인해 코팅면에 결함이 발생하는데 이를 개선하기 위하여 다양한 방법이 시도되고 있다. In addition, in the thermal imidation process for fabricating the polyimide substrate, the lead time is determined by a high temperature curing process in the oven. In order to reduce the lead time, the temperature rise time is shortened and the holding time at each temperature step is shortened And various attempts have been made. In addition, defects are generated on the coated surface due to rapid solvent evaporation during the high-temperature process (120 ° C process start and 450 ° cure process) and high-speed drying process.
본 발명의 목적은, 환경규제 대상 용매를 대체하는 새로운 혼합용매를 이용하여 친환경적인 폴리이미드 전구체 조성물을 제공하는 것이다.An object of the present invention is to provide an environmentally friendly polyimide precursor composition using a new mixed solvent replacing a solvent to be environmentally controlled.
본 발명의 다른 목적은, 상기 폴리이미드 전구체 조성물을 이용하여 우수한 특성을 갖는 폴리이미드 필름을 제조하는 방법을 제공하는 것이다.Another object of the present invention is to provide a method for producing a polyimide film having excellent properties by using the polyimide precursor composition.
상기 목적을 달성하기 위하여, 본 발명은, 3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드(DMPA)를 포함하는 혼합 용매; 및 폴리아믹산 또는 폴리이미드;를 포함하는 조성물을 제공한다. Disclosure of the Invention In order to achieve the above object, the present invention provides a mixed solvent comprising 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA); And a polyamic acid or polyimide.
본 발명에 따른 조성물은 환경규제 대상 용매를 대체하는 새로운 혼합용매를 사용한다. 새로운 혼합용매의 사용으로부터, 고온 경화(curing) 및 속건 공정으로 폴리이미드 필름제조 공정 시간(lead time)을 단축할 수 있다. 또한, 휘발도가 다른 두 용매를 포함한 혼합용매의 사용으로부터 투과율과 표면 특성이 양호한 폴리이미드 필름을 얻을 수 있다. The composition according to the present invention uses a new mixed solvent that replaces the environmentally regulated solvent. From the use of new mixed solvents, high temperature curing and quick drying processes can shorten the polyimide film manufacturing process lead time. Further, from the use of a mixed solvent containing two solvents having different volatilities, a polyimide film having excellent transmittance and surface characteristics can be obtained.
이하, 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.
본 발명의 조성물은 3-메톡시-N,N-디메틸프로피온 아미드(M3DMPA)와 N,N-디메틸프로피온아미드(DMPA)를 포함하는 혼합 용매; 및 폴리아믹산 또는 폴리이미드;를 포함한다.The composition of the present invention comprises a mixed solvent comprising 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA); And polyamic acid or polyimide.
본 발명에 사용되는 혼합 용매는 휘발도가 다른 두 물질로서, 3-메톡시-N,N-디메틸프로피온아미드(3-Methoxy-N,N-dimethylpropionamide; M3DMPA, , 끓는점: 188.7℃) 및 N,N-디메틸프로피온아미드(N,N-Dimethylpropionamide; DMPA, , 끓는점: 174-176℃)를 혼합한 것으로서, 고온 공정 시 용매의 급격한 휘발로 인한 표면 결함을 방지하고, 폴리이미드 필름의 투과율과 표면 특성을 개선한다.The mixed solvent used in the present invention is a mixture of 2-methoxy-N, N-dimethylpropionamide (M3DMPA, , Boiling point: 188.7 占 폚) and N, N-Dimethylpropionamide (DMPA, , Boiling point: 174-176 DEG C), which prevents surface defects due to rapid volatilization of the solvent during the high temperature process and improves the transmittance and surface characteristics of the polyimide film.
상기 3-메톡시-N,N-디메틸프로피온아미드(M3DMPA) : N,N-디메틸프로피온 아미드 (DMPA)의 혼합 비율(중량비)은 1 : 99 내지 99 : 1, 바람직하게는 3 : 7 내지 7 : 3일 수 있으며, 예를 들어 5:5의 중량비일 수 있다. 여기서, 상기 3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)의 사용량이 너무 적으면, 속건 공정에서 필름 표면이 불량한 문제가 있고, 상기 사용량이 너무 많으면,필름 코팅면에는 유리하나 투과도가 낮아지는 문제가 있다. The mixing ratio (weight ratio) of the 3-methoxy-N, N-dimethylpropionamide (M3DMPA): N, N-dimethylpropionamide (DMPA) is 1: 99 to 99: 1, preferably 3: : 3, and can be, for example, a weight ratio of 5: 5. If the amount of the 3-methoxy-N, N-dimethylpropionamide (M3DMPA) is too small, there is a problem that the film surface is poor in the fast drying process. If the amount is too large, There is a problem of lowering.
본 발명의 조성물에 사용되는 폴리아믹산은 분자 내에 아민기와 카르복실기를 가지는 화합물로서, 가열에 의해 아민기와 카르복실기가 반응하여 이민기를 형성하는 고분자로서, 상기 혼합 용매 중에서, 디아민 단량체와 이무수물 단량체를 반응시켜 제조할 수 있다. The polyamic acid used in the composition of the present invention is a compound having an amine group and a carboxyl group in a molecule and reacts with an amine group and a carboxyl group by heating to form an imine group. In the mixed solvent, a diamine monomer and a dianhydride monomer are reacted Can be manufactured.
상기 디아민 단량체로는 p-페닐렌디아민(p-Phenylenediamine:PPDA), 4,4'-옥시디아닐린(4,4'-Oxydianiline: ODA), 4,4'-메틸렌디아닐린(4,4'-Methylenedianiline: MDA), m-톨리딘(m-Tolidin; 2,2'-Dimethyl-4,4'-Diaminobiphenyl), 1,3-비스(4'-아미노페녹시)벤젠(1,3-BIS(4'-Aminophenoxy)benzene: TPE-R) 그리고, 불소기가 함유된 2,2'-비스(트리플루오로플루오로메틸)벤지딘(2,2'-Bis(trifluoromethyl)benzidine: TFMB) , 2,2'-비스[4-(4-아미노페녹시)페닐]헥사플루오로플루오로프로판(2,2-BIS[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane: HFBAPP), 2,2-비스(3-아미노-4-히드록시페닐)헥사플루오로프로판(2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane: BIS-AP-AF), 1,3-디아미노-2,4,5,6-테트라플루오로벤젠(1,3-Diamino-2,4,5,6-Tetrafluorobenzene: DRFB) , 유황기가 포함된 3,3'-디아미노디페닐술폰(3,3'-Diaminodiphenyl Sulfone: DDS), 4,4'-디아미노디페닐설파이드(4,4'-Diaminodiphenyl Sulfide: ASD), 비스[4-(4-아미노페녹시)페닐]술폰(Bis[4-(4-aminophenoxy)phenyl]sulfone: BAPS), 2,2-비스[4-(3-아미노페녹시)벤젠]술폰(2,2-Bis [4-(3-Aminophenoxy) Benzene] Sulfone: m-BAPS) 등을 사용할 있다. 이 중 단일 또는 이종 이상의 단량체를 혼합하여 사용할 수 있으며, 높은 내열 특성을 확보하기 위해 Aromatic 구조의 단량체인 p-페닐렌디아민(p-Phenylenediamine: PPDA)이 적절하다. Examples of the diamine monomer include p-phenylenediamine (PPDA), 4,4'-oxydianiline (ODA), 4,4'-methylenedianiline (4,4 ' -Methylenedianiline (MDA), m-Tolidin (2,2'-Dimethyl-4,4'-Diaminobiphenyl), 1,3-bis (4'-aminophenoxy) benzene (2,2'-bis (trifluoromethyl) benzidine: TFMB) containing a fluorine group, 2, 2'-bis (trifluoromethyl) benzene: Bis (4-aminophenoxy) phenyl] hexafluoropropane (HFBAPP), 2,2-bis (3 Amino-4-hydroxyphenyl) hexafluoropropane (BIS-AP-AF), 1,3-diamino-2,4,5- 3,3'-Diaminodiphenyl Sulfone (DDS) containing 3-diamino-2,4,5,6-tetrafluorobenzene (DRFB) ), 4,4'-diaminodiphenyl sulfide (4,4'-Diaminodiphenyl Sulf (ASD), bis [4- (4-aminophenoxy) phenyl] sulfone: BAPS), 2,2-bis [4- Benzene] sulfone (m-BAPS) can be used. One or more monomers may be used in combination. In order to ensure high heat resistance, p-phenylenediamine (PPDA), which is an aromatic monomer, is suitable.
상기 이무수물(Dianhdride) 단량체로는 방향족 이무수물(Dianhydride) 화합물이 적절하며, 3,3',4,4'-벤조페논테트라카복실산이무수물(3,3',4,4'-Benzophenonetetracarboxylic dianhydride: BTDA), 피로멜리트산 이무수물(Pyromellitic dianhydride: PMDA), 3,3',4,4'-비페닐테트라카복실산 이무수물 (3,3'4,4'-Biphenyl tetracarboxylicacid dianhydride: BPDA), 2,2-비스(3,4-안하이드로디카복시페닐)-헥사플루오로프로판 이무수물(2,2-Bis(3,4-anhydrodicarboxyphenyl)-hexafluoropropane dianhydride: 6FDA), 2,3,3',4-비페닐테트라카복실산 이무수물 (2,3,3',4-biphenyl tetracarboxylicacid dianhydride: a-BPDA), 4,4'-옥시디프탈산 무수물 (4,4'-oxydiphthalic Anhydride: ODPA), 3,3',4,4'- -디페닐술폰테트라카복실산 이무수물(3,3',4,4'-Diphenylsulfone-tetracarboxylic Dianhydride: DSDA), 2,2-비스[4-(3,4-디카르복시페녹시)페닐]프로판 이무수물(2,2-bis [4-(3,4-dicarboxyphenoxy) phenyl] propane dianhydride: BPADA), 하이드로퀴논디프탈산 무수물(Hydroquinone diphthalic anhydride: HQDA) 등을 사용할 수 있다. 이 중 단일 또는 이종 이상의 단량체를 혼합하여 사용할 수 있으며,높은 내열 특성을 확보하기 위하여 3,3',4,4'-비페닐테트라카복실산 이무수물 (3,3'4,4'-Biphenyl tetracarboxylicacid dianhydride: BPDA)이 적절하다.As the dianhydride monomer, an aromatic dianhydride compound is suitable, and 3,3 ', 4,4'-benzophenone tetracarboxylic acid is an anhydride (3,3', 4,4'-benzophenonetetracarboxylic dianhydride: 2, 3,3 ', 4,4'-biphenyl tetracarboxylic acid dianhydride (BPDA), 2, 3', 4,4'-biphenyltetracarboxylic dianhydride (BTDA), pyromellitic dianhydride 2-bis (3,4-anhydrodicarboxyphenyl) -hexafluoropropane dianhydride (6FDA), 2,3,3 ', 4- Biphenyl tetracarboxylicacid dianhydride (a-BPDA), 4,4'-oxydiphthalic anhydride (ODPA), 3,3 ', 4,4'-biphenyl tetracarboxylic acid dianhydride , 4,4'-diphenylsulfone-tetracarboxylic dianhydride (DSDA), 2,2-bis [4- (3,4-dicarboxyphenoxy ) Phenyl] propane dianhydride (2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride (BPADA), hydroquinone diphthalic anhydride (HQDA), and the like. Among them, monomers or monomers of more than two kinds can be used in combination. In order to ensure high heat resistance, 3,3 ', 4,4'-biphenyl tetracarboxylic acid dianhydride (3,3'4,4'-Biphenyl tetracarboxylic acid dianhydride : BPDA) is appropriate.
본 발명의 조성물은 필요에 따라 첨가제를 더욱 포함할 수 있다. 상기 첨가제는 에폭시 다관능기를 포함하는 물질일 수 있으며, 혼합용매와 함께 코팅면의 결함을 개선하는 역할을 할 수 있다. 상기 첨가제는 예를 들면, 하기 화학식으로 표시되는 [화학식1-1] Ethylene glycol diglycidyl ether, [화학식1-2] N,N-Diglycidyl -4-Glycidyloxyaniline, , [화학식1-3] 1,4-Bis((2,3-epoxypropoxy)methyl) cyclohexane, [화학식1-4] 2,2'-[1,3-Phenylenebis (oxymethylene)] dioxirane, [화학식1-5] 4,4'-methylene bis N,N-diglicidyl aniline 등을 사용할 수 있으나 이에 제한되는 것은 아니며, 에폭시 다관능기를 포함하는 수지를 첨가제로써 사용할 수 있다. The composition of the present invention may further contain additives as required. The additive may be a material containing an epoxy polyfunctional group and may serve to improve defects on the coated surface together with the mixed solvent. The additive may be, for example, an ethylene glycol diglycidyl ether represented by the following formula: [Formula 1-2] N, N-Diglycidyl-4-Glycidyloxyaniline, Bis ((2,3-epoxypropoxy) methyl) cyclohexane, 2,2 '- [1,3-Phenylenebis (oxymethylene)] dioxirane, , N-diglycidyl aniline, and the like, but the present invention is not limited thereto. A resin containing an epoxy polyfunctional group can be used as an additive.
상기 첨가제는 폴리아믹산 또는 폴리이미드 100 중량부에 대하여, 0.02 내지 1.2 중량부 첨가될 수 있다. 여기서, 상기 첨가제의 첨가량이 너무 적으면 필름 표면이 들뜨는 문제가 있을 수 있고, 너무 많으면 필름의 투과율이 저하(50% 미만)되는 문제가 있다.The additive may be added in an amount of 0.02 to 1.2 parts by weight based on 100 parts by weight of polyamic acid or polyimide. If the added amount of the additive is too small, there is a problem that the surface of the film is floated, and when it is too much, the transmittance of the film is lowered (less than 50%).
상기 첨가제는 용매에 용해시킨 후 본 발명의 조성물에 첨가될 수 있으며, 첨가제가 용해되는 용매는 3-메톡시-N,N-디메틸프로피온 아미드(M3DMPA)와 N,N-디메틸프로피온아미드(DMPA)를 포함하는 혼합 용매일 수 있으나, 이에 제한되는 것은 아니며 물성 개선을 위해 다른 종류의 용매가 사용될 수도 있다.The additive may be added to the composition of the present invention after dissolving in a solvent. The solvent in which the additive is dissolved is 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N- dimethylpropionamide (DMPA) But the present invention is not limited thereto, and other kinds of solvents may be used for improving the physical properties.
[화학식 1-1] [Formula 1-1]
[화학식 1-2][Formula 1-2]
[화학식 1-3][Formula 1-3]
[화학시 1-4][Chemistry 1-4]
[화학식 1-5][Formula 1-5]
본 발명의 조성물에 있어서, 상기 폴리아믹산 또는 폴리이미드는 상기 혼합 용매 100 중량부에 대하여, 5 내지 30 중량부, 바람직하게는 8 내지 20 중량부, 더욱 바람직하게는 10 내지 15 중량부일 수 있다. 여기서, 상기 폴리아믹산 또는 폴리이미드의 함량이 너무 적으면 점도가 낮아 균일한 두께의 폴리이미드 필름을 얻기 어렵고 고온 bake에 투입 시 급속한 용매 휘발로 인한 표면이 불량할 가능성이 높고, 너무 많으면 점도가 높아 슬릿 코팅 시 필름 두께 조절이 어려워 상대적으로 두꺼운 필름이 형성될 가능성이 높다.In the composition of the present invention, the polyamic acid or polyimide may be used in an amount of 5 to 30 parts by weight, preferably 8 to 20 parts by weight, more preferably 10 to 15 parts by weight, based on 100 parts by weight of the mixed solvent. If the content of the polyamic acid or polyimide is too low, it is difficult to obtain a polyimide film having a uniform thickness because of low viscosity. When the polyamic acid or polyimide is added to a high-temperature bake, the surface is likely to be poor due to rapid solvent volatilization. The slit coating is difficult to control the thickness of the film, so that a relatively thick film is likely to be formed.
본 발명의 조성물에 있어서, 조성물의 점도는 1000 내지 20000 cps일 수 있다. 점도가 1000 cps 미만일 경우에는 저분자가 상대적으로 많이 존재하고, 코팅시 흐름성이 높아 두께가 얇은 폴리이미드 박막이 형성될 수 있고, 점도가 20000 cps를 초과할 경우에는 고분자가 많이 존재하며 흐름성이 떨어져 상당히 두꺼운 후막이 형성되어 적정 폴리이미드 필름 두께를 얻는데 어려움이 있을 수 있다.In the composition of the present invention, the viscosity of the composition may be 1000 to 20000 cps. When the viscosity is less than 1000 cps, a polyimide thin film having a small thickness can be formed due to a relatively large amount of low molecular weight, high flowability during coating, and when the viscosity exceeds 20000 cps, It may be difficult to obtain an adequate polyimide film thickness because a thick thick film is formed apart.
다음으로 본 발명에 따른 폴리이미드 필름의 제조방법을 설명한다. Next, a method for producing the polyimide film according to the present invention will be described.
본 발명에 따라 폴리이미드 필름을 제조하기 위해서는, 먼저, 상기 조성물을 어플리케이터(applicator)를 이용하여 캐리어 기판(carrier glass 등)에 예를 들면, 400㎛ 두께(wet 두께)로 코팅한다. 이때 상기 캐리어 기판으로는 유리, 금속기판 또는 플라스틱 기판 등이 특별한 제한 없이 사용될 수 있으며, 이중에서도 폴리이미드 전구체에 대한 경화 공정 중 열 및 화학적 안정성이 우수하고, 별도의 이형제 처리 없이도, 경화 후 형성된 폴리이미드계 필름에 대해 손상 없이 용이하게 분리될 수 있는 유리 기판이 바람직하다. 상기 코팅(도포) 공정은 통상의 도포 방법에 따라 실시될 수 있으며, 구체적으로는 스핀 코팅법, 바코팅법, 롤코팅법, 에어-나이프법, 그라비아법, 리버스 롤법, 키스 롤법, 닥터 블레이드법, 스프레이법, 침지법 또는 솔질(brushing)법 등이 이용될 수 있다In order to produce the polyimide film according to the present invention, first, the composition is coated on a carrier substrate (carrier glass or the like) with a thickness of 400 μm (wet thickness) using an applicator. As the carrier substrate, a glass substrate, a metal substrate, a plastic substrate, or the like can be used without any particular limitation. Among these, the carrier substrate is excellent in heat and chemical stability during the curing process for the polyimide precursor, A glass substrate that can be easily separated without damaging the mid-based film is preferred. The coating (coating) process may be carried out according to a conventional coating method. Specifically, the coating (coating) process may be performed by a spin coating method, a bar coating method, a roll coating method, an air-knife method, a gravure method, a reverse roll method, a kiss roll method, , A spray method, a dipping method, or a brushing method may be used
상기 조성물은 최종 제조되는 폴리이미드 필름이 디스플레이 기판으로 적합한 두께를 갖도록 하는 두께 범위로 기판 위에 도포될 수 있다. 구체적으로는 용매 증발 및 경화 후, 최종 두께가 1 내지 30㎛가 되도록 하는 양으로 도포될 수 있다. 상기 코팅(도포) 과정 후, 경화 공정에 앞서 조성물 내에 존재하는 용매를 제거하기 위한 건조공정이 선택적으로 더 실시될 수 있다. 상기 건조공정은 통상의 방법에 따라 실시될 수 있으며, 구체적으로 140℃ 이하, 혹은 80 내지 140℃의 온도에서 실시될 수 있다. 건조 공정의 실시 온도가 80℃ 미만이면 건조 공정이 길어지고, 140℃를 초과할 경우 이미드화가 급격히 진행되어 균일한 두께의 폴리이미드 필름 형성이 어렵다.The composition can be applied over the substrate in a thickness range such that the polyimide film to be finally produced has a suitable thickness as the display substrate. Specifically, after the solvent evaporation and curing, it may be applied in an amount such that the final thickness is 1 to 30 占 퐉. After the coating (coating) process, a drying process for removing the solvent present in the composition prior to the curing process may be further optionally performed. The drying process may be carried out according to a conventional method. Specifically, the drying process may be performed at a temperature of 140 ° C or lower, or 80-140 ° C. If the drying temperature is lower than 80 캜, the drying process becomes longer. If the drying temperature is higher than 140 캜, the imidization rapidly proceeds to make it difficult to form a polyimide film having a uniform thickness.
한편, 열적 이미드화 공정을 통한 경화(Cure) 공정은 상당히 오랜 시간이 걸리기 때문에 경화 공정 시간을 줄여야만 생산량을 늘릴 수 있다. 이에 오븐이 완전히 냉각 되지 않은 상태에서 다음 코팅 기판을 투입하여 공정 시간을 단축시키려는 시도가 진행 중이다. 본 발명에서는, 경화(curing) 공정시 냉각이 완료되지 않은 오븐, 예를 들어 100℃의 온도인 컨벡션 오븐(convection oven)에서, 450℃까지 분당 5 내지 10℃의 승온 속도로 가열하여 폴리이미드 필름을 제조할 수 있다. 상기 경화 공정은 경우에 따라 300 내지 450℃ 온도까지 가열하여 진행될 수 있다. 또한, 상기 경화 공정은 상기한 온도범위 내에서 단계별 열처리를 통한 다단계 공정으로 진행될 수도 있으며, 예를 들어 200℃의 온도에서 1차열처리하고, 300℃의 온도에서 2차 열처리하고, 350℃의 온도에서 3차 열처리하여 수행될 수도 있으나, 이에 제한되는 것은 아니다. 또한, 상기 경화 공정시 경화 시간은 특별히 한정되지 않으며, 일 예로서 3 내지 60분 동안 실시될 수 있다. On the other hand, since the curing process through the thermal imidization process takes a long time, it is necessary to reduce the curing process time to increase the production amount. Attempts have been made to reduce the processing time by charging the next coated substrate without the oven being completely cooled. In the present invention, in a convection oven in which the cooling is not completed in a curing process, for example, at a temperature of 100 ° C, heating is carried out at a heating rate of 5 to 10 ° C per minute up to 450 ° C to produce a polyimide film Can be prepared. The curing process may optionally be carried out by heating to a temperature of 300 to 450 ° C. The curing process may be a multi-step process through a stepwise heat treatment within the temperature range described above. For example, the curing process may be first heat treatment at a temperature of 200 캜, second heat treatment at a temperature of 300 캜, But the present invention is not limited thereto. In addition, the curing time in the curing step is not particularly limited and can be, for example, 3 to 60 minutes.
또, 상기 경화 공정 후에 폴리이미드 필름 내 폴리이미드계 수지의 이미드화율을 높여 우수한 물성적 특징을 갖는 폴리이미드계 필름을 형성하기 위해 후속의 열처리 공정이 선택적으로 더 실시될 수 있다. 상기 후속 열처리 공정은 200℃ 이상, 혹은 200 내지 450℃에서 1분 내지 30분 동안 실시될 수 있다. 또 상기 후속의 열처리 공정은 1회 실시될 수도 있고 또는 2회 이상 다단계로 실시될 수도 있다. 구체적으로는 200 내지 220℃에서의 제1열처리, 300 내지 350℃에서의 제2열처리 및 400 내지 450℃에서의 제3열처리를 포함하는 3단계로 실시될 수 있다. 이어서, 냉각 후 기판 위에 형성된 폴리이미드 필름을 통상의 방법에 따라 캐리어 기판으로부터 박리함으로써 완성될 수 있다.After the curing step, a subsequent heat treatment step may be selectively performed to increase the imidization ratio of the polyimide resin in the polyimide film to form a polyimide film having excellent physical properties. The subsequent heat treatment may be performed at 200 ° C or higher, or 200 ° C to 450 ° C for 1 minute to 30 minutes. The subsequent heat treatment process may be performed once or may be performed in two or more stages. Specifically, it may be carried out in three stages including a first heat treatment at 200 to 220 占 폚, a second heat treatment at 300 to 350 占 폚, and a third heat treatment at 400 to 450 占 폚. Then, the polyimide film formed on the substrate after cooling can be completed by peeling off the carrier substrate from the substrate by a conventional method.
본 발명의 조성물이 혼합용매와 함께 폴리이미드를 포함할 경우에는, 이미 이미드화가 수행된 상태이기 때문에, 조성물을 코팅한 후 용매를 증발시킴으로써 폴리이미드 필름을 제조할 수 있다. 용매의 증발은 예를 들어 200℃ 이상의 온도로 가열하여 수행될 수 있으나, 이에 제한되는 것은 아니다.When the composition of the present invention contains a polyimide together with a mixed solvent, the polyimide film can be produced by coating the composition and then evaporating the solvent since the imidization is carried out. The evaporation of the solvent can be carried out, for example, by heating to a temperature of 200 DEG C or higher, but is not limited thereto.
상기 폴리이미드 필름을 포함하는 디스플레이 기판 및 소자가 제공될 수 있다. 구체적으로는 상기 소자는 가요성 기판을 갖는 임의의 태양전지(예를 들어, 플렉서블 태양전지), 유기발광다이오드(OLED) 조명(예를 들어, 플렉서블 OLED 조명), 가요성 기판을 갖는 임의의 반도체 소자, 또는 가요성 기판을 갖는 유기전계발광소자, 전기 영동 소자 또는 LCD 소자 등의 플렉서블 디스플레이 소자일 수 있다. A display substrate and an element including the polyimide film may be provided. Specifically, the device can be any solar cell having a flexible substrate (e.g., a flexible solar cell), organic light emitting diode (OLED) lighting (e.g., flexible OLED lighting) Device, or an organic electroluminescent device having a flexible substrate, an electrophoretic device, or an LCD device.
이하, 구체적인 실시예를 통하여 본 발명을 더욱 상세히 설명한다. 하기 실시예는 본 발명을 예시하기 위한 것으로서, 본 발명이 하기 실시예에 의해 한정되는 것은 아니다. Hereinafter, the present invention will be described in more detail with reference to specific examples. The following examples illustrate the present invention and are not intended to limit the scope of the present invention.
[실시예 1] 폴리이미드 전구체 조성물의 제조:[Example 1] Preparation of polyimide precursor composition :
3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드 (DMPA)가 1:9 (중량비)로 혼합된 혼합 용매 529.2g에 p-페닐렌디아민(PPDA) 21.62g (0.2 mol)를 상온에서 완전히 용해시킨 다음, 3,3'4,4'-비페닐테트라 카복실산 이무수물(BPDA) 58.84g (0.2 mol)을 투입하여 반응시키고 18시간 동안 교반 후 종료함으로써, 혼합용매 100 중량부 대비 15 중량부의 폴리아믹산 (폴리이미드 전구체)을 포함하는 조성물을 얻었다. 고분자화가 잘 진행되어 필름화가 가능한지를 확인하게 위해 조성물의 점도를 BrookField 점도계를 사용하여 측정하였으며, 얻어진 폴리아믹산 조성물의 점도는 13500cps였다. Phenylenediamine (PPDA) 21.62 was added to 529.2 g of a mixed solvent in which 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA) g (0.2 mol) was completely dissolved at room temperature, and then 58.84 g (0.2 mol) of 3,3'4,4'-biphenyltetracarboxylic dianhydride (BPDA) was added thereto and reacted. After stirring for 18 hours, A composition containing 15 parts by weight of polyamic acid (polyimide precursor) relative to 100 parts by weight of the mixed solvent was obtained. The viscosity of the composition was measured using a Brookfield viscometer to confirm whether the polymerization proceeded to make it possible to form a film, and the viscosity of the obtained polyamic acid composition was 13500 cps.
[실시예 2] 폴리이미드 전구체 조성물의 제조:[Example 2] Production of polyimide precursor composition :
3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드 (DMPA)의 혼합 비율을 3:7로 한 것을 제외하고는, 실시예 1과 동일한 방법으로 폴리아믹산(폴리이미드 전구체) 조성물을 얻었다. 얻어진 폴리아믹산 조성물의 점도는 13000cps였다.Except that the mixing ratio of 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA) was 3: 7, Polyimide precursor) composition. The viscosity of the obtained polyamic acid composition was 13000 cps.
[실시예 3] 폴리이미드 전구체 조성물의 제조:[Example 3] Preparation of polyimide precursor composition :
3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드 (DMPA)의 혼합 비율을 5:5로 한 것을 제외하고는, 실시예 1과 동일한 방법으로 폴리아믹산(폴리이미드 전구체) 조성물을 얻었다. 얻어진 폴리아믹산 조성물의 점도는 12500cps였다.The procedure of Example 1 was repeated except that the mixing ratio of 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA) was changed to 5: Polyimide precursor) composition. The viscosity of the obtained polyamic acid composition was 12500 cps.
[실시예 4] 폴리이미드 전구체 조성물의 제조:[Example 4] Production of polyimide precursor composition :
3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드 (DMPA)의 혼합 비율을 7:3으로 한 것을 제외하고는, 실시예 1과 동일한 방법으로 폴리아믹산(폴리이미드 전구체) 조성물을 얻었다. 얻어진 폴리아믹산 조성물의 점도는 13400cps였다.Except that the mixing ratio of 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA) was changed to 7: 3, Polyimide precursor) composition. The viscosity of the obtained polyamic acid composition was 13,400 cps.
[실시예 5] 폴리이미드 전구체 조성물의 제조:[Example 5] Preparation of polyimide precursor composition :
3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)와 N,N-디메틸프로피온아미드 (DMPA)의 혼합 비율을 9:1로 한 것을 제외하고는, 실시예 1과 동일한 방법으로 폴리아믹산(폴리이미드 전구체) 조성물을 얻었다. 얻어진 폴리아믹산 조성물의 점도는 13400cps였다. Except that the mixing ratio of 3-methoxy-N, N-dimethylpropionamide (M3DMPA) and N, N-dimethylpropionamide (DMPA) was changed to 9: 1. Polyimide precursor) composition. The viscosity of the obtained polyamic acid composition was 13,400 cps.
[실시예 1-1 내지 1-5] 폴리이미드 필름의 제조:[Examples 1-1 to 1-5] Preparation of polyimide film :
실시예 1에서 얻어진 폴리아믹산 조성물에, 상기 폴리아믹산 단량체 고형분의 양 대비 표 1의 첨가량에 따라 N,N-Diglycidyl-4-Glycidyloxyaniline 을 혼합하고 교반하여 코팅액 조성물을 제조하였다. 제조된 코팅액 조성물을 어플리케이터(applicator)를 이용하여 캐리어 글라스(carrier glass)에 350㎛의 두께(wet 두께)로 코팅하고, 컨벡션 오븐(convection oven)에서 450℃ 까지 분당 8℃의 승온 속도로 가열하여 열적 이미드 반응을 진행하였다. 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 1에 나타내었다. N, N-Diglycidyl-4-Glycidyloxyaniline was added to the polyamic acid composition obtained in Example 1 in accordance with the amount of the polyamic acid monomer solid added to the amount of the polyamic acid monomer in Table 1, and the mixture was stirred to prepare a coating liquid composition. The prepared coating liquid composition was coated on a carrier glass to a thickness of 350 mu m (wet thickness) using an applicator and heated in a convection oven at 450 DEG C at a rate of 8 DEG C per minute Thermal imide reaction proceeded. The external shape and optical characteristics of the obtained polyimide film were analyzed and shown in Table 1.
[실시예 2-1 내지 2-5] 폴리이미드 필름의 제조:[Examples 2-1 to 2-5] Preparation of polyimide film :
실시예 2에서 얻어진 폴리아믹산 조성물에, 상기 폴리아믹산 단량체 고형분의 양 대비 표 2의 첨가량에 따라 N,N-Diglycidyl-4-Glycidyloxyaniline 을 혼합한 것을 제외하고는 실시예 1-1과 동일한 방법으로 열적 이미드 반응을 진행하고, 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 2에 나타내었다. Except that N, N-Diglycidyl-4-Glycidyloxyaniline was mixed with the polyamic acid composition obtained in Example 2 in accordance with the amount of the polyamic acid monomer solid content added in Table 2 relative to the amount of the polyamic acid monomer solid content. The imide reaction proceeded, and the external shape and optical characteristics of the obtained polyimide film were analyzed and shown in Table 2.
[실시예 3-1 내지 3-5] 폴리이미드 필름의 제조:[Examples 3-1 to 3-5] Preparation of polyimide film :
실시예 3에서 얻어진 폴리아믹산 조성물에, 상기 폴리아믹산 단량체 고형분의 양 대비 표 3의 첨가량에 따라 N,N-Diglycidyl-4-Glycidyloxyaniline 을 혼합한 것을 제외하고는 실시예 1-1과 동일한 방법으로 열적 이미드 반응을 진행하고, 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 3에 나타내었다. Except that N, N-Diglycidyl-4-Glycidyloxyaniline was mixed with the polyamic acid composition obtained in Example 3 in accordance with the amount of the polyamic acid monomer solid content added in Table 3 in relation to the amount of the polyamic acid monomer solid content. The imide reaction proceeded, and the external shape and optical characteristics of the polyimide film thus obtained were analyzed and shown in Table 3.
[실시예 4-1 내지 4-5] 폴리이미드 필름의 제조:[Examples 4-1 to 4-5] Preparation of polyimide film :
실시예 4에서 얻어진 폴리아믹산 조성물에, 상기 폴리아믹산 단량체 고형분의 양 대비 표 4의 첨가량에 따라 N,N-Diglycidyl-4-Glycidyloxyaniline 을 혼합한 것을 제외하고는 실시예 1-1과 동일한 방법으로 열적 이미드 반응을 진행하고, 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 4에 나타내었다. Except that N, N-Diglycidyl-4-Glycidyloxyaniline was mixed with the polyamic acid composition obtained in Example 4 in accordance with the amount of the polyamic acid monomer solid content added in Table 4 with respect to the amount of the polyamic acid monomer solid content. Imide reaction proceeded, and the external shape and optical characteristics of the obtained polyimide film were analyzed and shown in Table 4. [
[실시예 5-1 내지 5-5] 폴리이미드 필름의 제조:[Examples 5-1 to 5-5] Preparation of polyimide film :
실시예 5에서 얻어진 폴리아믹산 조성물에, 상기 폴리아믹산 단량체 고형분의 양 대비 표 5의 첨가량에 따라 N,N-Diglycidyl-4-Glycidyloxyaniline 을 혼합한 것을 제외하고는 실시예 1-1과 동일한 방법으로 열적 이미드 반응을 진행하고, 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 5에 나타내었다. Except that N, N-Diglycidyl-4-Glycidyloxyaniline was mixed with the polyamic acid composition obtained in Example 5 in accordance with the addition amount of the polyamic acid monomer in the amount shown in Table 5 with respect to the amount of the solid content of the polyamic acid monomer. Imide reaction proceeded, and the external shape and optical characteristics of the obtained polyimide film were analyzed and shown in Table 5.
[비교예 1-1 내지 1-5] 폴리이미드 필름의 제조:[Comparative Examples 1-1 to 1-5] Preparation of polyimide film :
용매로 3-메톡시-N,N-디메틸프로피온아미드(M3DMPA)만을 사용하여 폴리아믹산 조성물을 제조한 것을 제외하고는, 실시예 1-1 내지 1-5와 동일한 방법으로 열적 이미드 반응을 진행하고, 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 6에 나타내었다. Except that polyamic acid composition was prepared using only 3-methoxy-N, N-dimethylpropionamide (M3DMPA) as a solvent, thermal imidization reaction was carried out in the same manner as in Examples 1-1 to 1-5 And the external shape and optical characteristics of the obtained polyimide film were analyzed and shown in Table 6.
[비교예 2-1 내지 2-5] 폴리이미드 필름의 제조:[Comparative Examples 2-1 to 2-5] Preparation of polyimide film :
용매로 N,N-디메틸프로피온아미드 (DMPA)만을 사용하여 폴리아믹산 조성물을 제조한 것을 제외하고는, 실시예 1-1 내지 1-5와 동일한 방법으로 열적 이미드 반응을 진행하고, 얻어진 폴리이미드 필름의 외부 형태와 광학적 특성 등을 분석하여 표 7에 나타내었다. The thermal imide reaction was carried out in the same manner as in Examples 1-1 to 1-5 except that the polyamic acid composition was prepared using only N, N-dimethylpropionamide (DMPA) as a solvent, and the obtained polyimide The external shape and optical properties of the film were analyzed and shown in Table 7.
<폴리이미드 물성 분석>≪ Analysis of polyimide physical properties &
[점도 측정][Measurement of viscosity]
회전형 고점도용 점도계(BrookField社 Corn-Plate 방식)를 사용하여 25℃에서 3회 측정 후 평균값을 측정하였다.The average value was measured after three measurements at 25 ° C using a rotating high viscosity viscometer (BrookField corn-plate method).
[필름두께][Film thickness]
필름의 두께는 초음파 두께 측정 장비 (Qnix4500)를 사용하여 10회 측정 후 평균값과 표준편차를 확인하였다. The thickness of the film was measured 10 times using ultrasonic thickness measuring equipment (Qnix4500) and the mean value and standard deviation were confirmed.
[투과도 측정] [Measurement of transmittance]
광학 측정 장비 (Nippon Denshoku社, COH-400)을 이용하여 가시광선 영역에서의 평균 투과도를 5회 측정 후 평균값을 측정하였다.The average transmittance in the visible light region was measured five times using an optical measuring instrument (Nippon Denshoku Co., COH-400), and the average value was measured.
[기계적 물성- Stress, Strain][Mechanical Properties - Stress, Strain]
폴리이미드 필름의 기계적 물성을 측정하기 위하여 Ametek LLOYD Instrument社 의 UTM(Universal Test Machine)을 이용하였다. 필름 시편을 폭 5mm, 길이 70mm 이상으로 준비한 후 Grip To Grip size는 30mm로 설정하고, Tension Rate는 10mm/min 속도로 10회 측정 후 평균값 및 표준편차를 확인하였다.The UTM (Universal Test Machine) of Ametek LLOYD Instrument was used to measure the mechanical properties of the polyimide film. The film specimen was prepared with a width of 5 mm and a length of 70 mm or more. The grip to grip size was set to 30 mm. The tensile rate was measured 10 times at a rate of 10 mm / min.
(ppm)Additive input
(ppm)
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(MPa)
(%)Strain
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(MPa)
(%)Strain
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(ppm)Additive input
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상기 표 1 내지 7로부터 알 수 있는 바와 같이, 혼합용매를 사용함에 따라 폴리이미드 필름의 표면 상태가 양호하면서 50% 이상의 투과율을 나타낼 수 있음을 알 수 있다. 다만, 첨가제의 투입량이 적을 경우 투과도는 우수한 반면 표면의 상태가 불량해질 수 있고, 과량의 첨가제가 투입될 경우 투과율이 50% 미만으로 현저히 저하되는 것을 알 수 있다.As can be seen from Tables 1 to 7, it can be seen that the surface state of the polyimide film is good and a transmittance of 50% or more can be obtained by using a mixed solvent. However, it can be seen that when the amount of the additive is small, the transmittance is excellent, but the surface condition can be poor, and when an excessive amount of additive is added, the transmittance is remarkably decreased to less than 50%.
또한, 본 발명의 혼합용매가 아닌 M3DMPA 또는 DMPA가 단독으로 사용된 경우에는 필름 표면 상태가 모두 불량한 것으로 확인되었는바, 이로부터 본 발명의 조성물이 혼합용매를 포함함에 따라 폴리이미드 필름의 표면상태를 개선할 수 있는 효과가 있음을 알 수 있으며, In addition, when M3DMPA or DMPA, which is not a mixed solvent of the present invention, was used alone, it was confirmed that the surface state of the film was poor. From the results, it was found that the surface state of the polyimide film It can be seen that there is an effect that can be improved,
특히 빠른 승온속도, 예를 들어 실시예에서와 같이 8℃의 승온속도로 속건처리될 경우에도, 본 발명에서의 혼합용매가 사용된 조성물은 제조된 필름 표면 상태가 양호한 효과가 있는 반면, DMPA와 같은 1종의 용매가 사용된 경우 필름의 표면상태가 좋지 않은 점을 확인할 수 있다.In particular, when the composition is rapidly dried at a rapid heating rate, for example, at a heating rate of 8 ° C as in the examples, the composition using the mixed solvent of the present invention has a good effect on the surface condition of the film, while DMPA When the same kind of solvent is used, it can be confirmed that the surface condition of the film is poor.
나아가, 필름 두께의 표준편차 면에서, 본 발명의 혼합용매를 사용함에 따라 두께의 표준편차가 1 이하, 즉 두께의 차이가 크지 않아 필름 형성시 두께의 신뢰성이 우수한 효과가 있음을 알 수 있으며,Further, from the viewpoint of the standard deviation of the film thickness, it can be seen that the standard deviation of the thickness is not more than 1, that is, the difference in thickness is not so large when the mixed solvent of the present invention is used,
응력(Stress) 및 변형률(Strain)에 있어서도, 본 발명의 혼합용매를 사용할 경우, 편차가 각각 10 이하, 1 이하로 나타났으며, 이로부터 혼합용매를 사용하여 제조된 폴리이미드 필름의 기계적 특성에 큰 변동이 발생하지 않아, 폴리이미드 필름의 신뢰성이 우수한 것을 알 수 있다.In the case of using the mixed solvent of the present invention, the deviations were respectively less than 10 and not more than 1 in the stress and the strain, and the mechanical properties of the polyimide film produced from the mixed solvent It can be seen that the polyimide film is excellent in reliability because no large fluctuation occurs.
Claims (6)
폴리아믹산 또는 폴리이미드;를 포함하는 것인 조성물.A mixed solvent comprising 3-methoxy-N, N-dimethylpropionamide and N, N-dimethylpropionamide; And
Polyamic acid or polyimide.
[3] The method according to claim 1, wherein the ethylene glycol diglycidyl ether, N, N-diglycidyl-4-glycidyloxyaniline, 1,4-bis ((2,3- One or two selected from the group consisting of 2,2 '- [1,3-phenylenebis (oxymethylene)] dioxirane and 4,4'-methylenebis N, N-diglycidylaniline. ≪ / RTI > more than one kind of additive.
The composition of claim 1, wherein the composition has a viscosity of from 1,000 to 20,000 cps.
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