KR20180092464A - Paper printed circuit board - Google Patents

Paper printed circuit board Download PDF

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Publication number
KR20180092464A
KR20180092464A KR1020170018162A KR20170018162A KR20180092464A KR 20180092464 A KR20180092464 A KR 20180092464A KR 1020170018162 A KR1020170018162 A KR 1020170018162A KR 20170018162 A KR20170018162 A KR 20170018162A KR 20180092464 A KR20180092464 A KR 20180092464A
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South Korea
Prior art keywords
circuit board
printed circuit
paper
present
paper printed
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KR1020170018162A
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Korean (ko)
Inventor
장경식
남충현
이하늘
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한국기술교육대학교 산학협력단
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Priority to KR1020170018162A priority Critical patent/KR20180092464A/en
Publication of KR20180092464A publication Critical patent/KR20180092464A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention relates to a paper printed circuit board which has characteristics in that a circuit wiring is formed on a paper with a conductive ink. According to the present invention, the paper printed circuit board can be tested by quickly forming a simple circuit on a paper at low cost.

Description

종이 인쇄회로기판{PAPER PRINTED CIRCUIT BOARD}[0001] PAPER PRINTED CIRCUIT BOARD [0002]

본 발명은 인쇄회로기판에 관한 것으로, 더욱 상세하게는 종이에 회로배선을인쇄한 종이 인쇄회로기판에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly to a paper printed circuit board on which circuit wiring is printed on paper.

일반적으로 사용되는 인쇄회로기판은 페놀이나 에폭시 등의 절연 판에 구리 등 도체 형상을 형성하여 전자 부품 및 반도체를 전기적으로 연결시켜주고 지지하는 회로 연결용 부품으로써, 집적 회로를 기판 일정 부분의 위 또는 홀에 납땜을 함으로써 사용을 할 수 있도록 한다.A commonly used printed circuit board is a circuit connection part that electrically connects and supports electronic components and semiconductors by forming a conductor shape such as copper on an insulating plate such as phenol or epoxy. Use it by soldering in the hole.

인쇄회로기판을 이용한 기술로는 반도체 등의 전자 부품의 기능이 필요한 가전기기, 컴퓨터, 자동차 등 모든 전자 및 정보통신 기기에 기본적으로 장착되는 필수 부품이다.The technology using a printed circuit board is an essential component that is basically attached to all electronic and information communication devices such as home appliances, computers, and automobiles that require the functions of electronic components such as semiconductors.

이렇듯 인쇄회로기판을 이용하면 초소형 집적 회로들을 핸드폰이나 가전기기 등 전자기기에 장착함으로써, 제품 자체의 부피를 최소화 할 수 있다.By using the printed circuit board, it is possible to minimize the volume of the product itself by attaching the micro-sized integrated circuits to electronic devices such as cellular phones and home appliances.

그러나 종래의 인쇄회로기판은 값 비싼 공정 기계를 구매해야 하며, 원료의 표면을 드릴로 깎아내는 과정을 거침으로 시간적인 소모가 상당하다. 이 뿐만 아니라 공정 기계를 사용하기 위해 일반 사용자가 기업에 의뢰하여 인쇄회로기판을 제작하는 데 소모되는 금액적인 부분이 크며, 정확하게 회로가 구성이 되어 있지 않을 시에 추가 금액이 발생한다.However, conventional printed circuit boards require expensive processing machines to be purchased, and the surface of the raw materials is shaved by drilling, which is time consuming. In addition, there is a large amount of money that is consumed by a general user to manufacture a printed circuit board to use a process machine, and an additional amount is generated when the circuit is not configured correctly.

대한민국 공개특허공보 제10-2012-0035998호(공개일: 2012.04.17)Korean Patent Publication No. 10-2012-0035998 (published on Apr. 17, 2012)

따라서 본 발명이 이루고자 하는 기술적 과제는 전도성 잉크로 전자 회로배선을 종이에 인쇄한 종이 인쇄회로기판을 제공하는 데 있다. SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a printed circuit board on which electronic circuit wiring is printed on paper with conductive ink.

본 발명의 한 특징에 따른 종이 인쇄회로기판은 종이에 도전성 잉크로 회로배선을 형성하는 것을 특징으로 한다.A paper printed circuit board according to one aspect of the present invention is characterized by forming a circuit wiring with conductive ink on paper.

상기 도정성 잉크는 잉크 카트리지에 탄소 나노 분말이 혼합될 수 있다.The amorphous ink may be mixed with the carbon nano powder in the ink cartridge.

이러한 특징에 따르면, 본 발명은 종이를 사용하여 인쇄회로기판의 원료비용을 절감하고, 공정 기계의 구매를 하지 않고, 일반 프린터를 사용함으로써 시간적, 금전적인 비용을 줄이는 효과가 있다. According to this aspect, the present invention has the effect of reducing the cost of raw materials of the printed circuit board by using paper, and reducing the time and monetary cost by using a general printer without purchasing a process machine.

또한, 본 발명은 프린터 속도가 빠르기 때문에 학생이나 일반 사용자들도 간단한 회로를 구성하여 테스트 할 수 있고, 홀이 일정 간격 뚫려 있는 동판을 사용하기 때문에 2층 내지 다층 회로를 제작 할 수 있는 효과가 있다.In addition, since the printer speed is high, the present invention can be applied to a simple circuit configuration for a student or a general user, and a two-layer or multi-layer circuit can be manufactured because a copper plate having holes is formed at regular intervals is used .

도 1은 본 발명의 일 실시예에 따른 종이 인쇄회로기판의 평면도이다.
도 2는 본 발명의 일 실시예에 따른 종이 인쇄회로기판을 다층 회로기판에 적용한 예를 도시한 도면이다.1 is a plan view of a paper printed circuit board according to an embodiment of the present invention.
2 is a view showing an example of applying a paper printed circuit board according to an embodiment of the present invention to a multilayer circuit board.

아래에서는 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

그러면 본 발명의 일 실시예에 따른 종이 인쇄회로기판에 대하여 상세히 설명한다.A paper printed circuit board according to an embodiment of the present invention will now be described in detail.

도 1은 본 발명의 일 실시예에 따른 종이 인쇄회로기판의 평면도이다.1 is a plan view of a paper printed circuit board according to an embodiment of the present invention.

도 1을 참조하면, 본 발명의 종이 인쇄회로기판은 종이(100)에 전도성 잉크로 회로배선(200)을 형성한다. 이때, 전도성 잉크는 일반 프린트에서 사용하는 잉크 카트리지에 탄소 나노 분말이 혼합된 것이다.Referring to FIG. 1, a paper printed circuit board of the present invention forms a circuit wiring 200 with conductive ink on a paper 100. At this time, the conductive ink is a mixture of the carbon nano powder in the ink cartridge used in the general printing.

도 2는 본 발명의 일 실시예에 따른 종이 인쇄회로기판을 다층 회로기판에 적용한 예를 도시한 도면이다. 2 is a view showing an example of applying a paper printed circuit board according to an embodiment of the present invention to a multilayer circuit board.

도 2를 참조하면, 종이를 이용하여 다층의 회로기판이 인쇄될 경우 종이(100)는 전기적으로 연결이 되지 않을 수 있다. 이때 2개의 종이 인쇄회로기판(1000) 사이에 동판(300) 사용하여 전기적으로 연결할 수 있다.Referring to FIG. 2, when a multilayer circuit board is printed using paper, the paper 100 may not be electrically connected. At this time, the two paper printed circuit boards 1000 can be electrically connected to each other by using the copper plate 300.

상기 종이 인쇄회로기판(1000)은 구겨지거나 비틀어질 가능성도 있기 때문에 동판(300)이 종이 인쇄회로기판(1000)을 잡아 주는 역할을 할 수 있으며, 프린터로 종이(100)을 인쇄할 때에는 양면 인쇄를 기본 설정 값으로 하고, 홀이 뚫리는 부분의 뒷부분은 동판(300)의 홀 보다 1mm 내지 2mm 정도 크게 잉크를 바른다.Since the paper printed circuit board 1000 may be wrinkled or twisted, the copper board 300 may play a role of holding the paper printed circuit board 1000. When the paper 100 is printed by the printer, And the rear portion of the portion where the hole is to be opened is applied with ink 1 mm to 2 mm larger than the hole of the copper plate 300.

이때, 상기 홀(310) 주위에 전기가 통하는 전도체가 표면에 구성이 되어 있다. 이러한 특징을 이용하여, 상기 홀(310)이 뚫리는 부분의 뒷 부분에 도전성을 가지는 잉크를 바름으로써 종이(100)의 위 표면과 아래 표면 그리고 동판(300) 간의 전기적인 연결이 가능하다.At this time, the surface of the conductor around the hole 310 is electrically conductive. With this feature, electrical connection is possible between the upper surface and the lower surface of the paper 100 and the copper plate 300 by applying ink having conductivity to the rear portion of the hole where the hole 310 is opened.

여기서, 동판(300)의 크기는 가로 길이 10cm 세로 길이 10cm 내외의 규격에 맞춰 제작하는 것이 바람직하고, 홀(310)은 집적 회로의 핀 다리에 맞는 규격으로 일정하게 형성한다.Here, the size of the copper plate 300 is preferably adjusted to a dimension of about 10 cm in length and 10 cm in length and the hole 310 is formed to have a constant size conforming to the pin leg of the integrated circuit.

사용의 예를 들면, 사용자가 회로 설계 프로그램으로 인쇄할 인쇄회로기판을 제작한다면, 프로그램 내부 배경을 동판(300)의 규격에 맞게 이미지를 설정함으로써 동판에 맞게 부품을 배치할 수 있다.For example, when a user manufactures a printed circuit board to be printed with a circuit design program, the user can arrange the parts in accordance with the copper plate by setting an image in accordance with the specification of the copper plate 300 in the background of the program.

여기서, 상기 홀(310) 내부는 전기가 통하는 도전체가 내부로 구성되어 있으며, 쓰루홀(THROUGH HOLE) 패키지의 집적 회로를 동판(300)에 꼽았을 때, 종이 인쇄회로기판(1000)와 동판(300)이 전기적으로 연결될 수 있다.When the integrated circuit of the THROUGH HOLE package is plugged into the copper plate 300, the paper printed circuit board 1000 and the copper plate (not shown) 300 may be electrically connected.

또한 쓰루홀(THROUGH HOLE) 패키지 집적 회로의 핀 규격과 간격을 맞춰 제작 하여 집적 회로가 흔들리거나 연결되지 않은 것을 방지한다.In addition, the THROUGH HOLE package is manufactured in accordance with the pin size and spacing of the integrated circuit, thereby preventing the integrated circuit from being shaken or disconnected.

이상에서 본 발명의 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: 종이 200: 회로배선
300: 동판 310: 홀100: paper 200: circuit wiring
300: copper plate 310: hole

Claims (2)

종이에 도전성 잉크로 회로배선을 형성하는 것을 특징으로 하는 종이 인쇄회로기판.Wherein the circuit wiring is formed of conductive ink on paper. 제1항에 있어서,
상기 도정성 잉크는 잉크 카트리지에 탄소 나노 분말이 혼합된 것을 특징으로 하는 종이 인쇄회로기판.
The method according to claim 1,
Wherein the artificial ink is a mixture of carbon nano powder in an ink cartridge.
KR1020170018162A 2017-02-09 2017-02-09 Paper printed circuit board KR20180092464A (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120035998A (en) 2010-10-07 2012-04-17 서울시립대학교 산학협력단 Oled with a paper substrate and mathod of manufacturing the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120035998A (en) 2010-10-07 2012-04-17 서울시립대학교 산학협력단 Oled with a paper substrate and mathod of manufacturing the same

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