KR20180084297A - Thermally Conductive Sheet - Google Patents
Thermally Conductive Sheet Download PDFInfo
- Publication number
- KR20180084297A KR20180084297A KR1020170007202A KR20170007202A KR20180084297A KR 20180084297 A KR20180084297 A KR 20180084297A KR 1020170007202 A KR1020170007202 A KR 1020170007202A KR 20170007202 A KR20170007202 A KR 20170007202A KR 20180084297 A KR20180084297 A KR 20180084297A
- Authority
- KR
- South Korea
- Prior art keywords
- thermal conductive
- conductive sheet
- polymer resin
- thickness direction
- thermally conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Disclosed is a thermal conductive sheet with flexibility and excellent thickness-direction thermal conductivity. The thermal conductive sheet comprises a polymer foam having an open cell structure in which a plurality of pores are connected in the thickness direction; a polymer resin filled in the pores and cured; thermal conductive powder dispersed in the polymer resin; and a thermal conductive fiber arranged so that the longitudinal direction corresponds to the thickness direction and dispersed in the polymer resin. A heat transfer path is formed in the thickness direction by the thermal conductive powder and the thermal conductive fiber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170007202A KR101991950B1 (en) | 2017-01-16 | 2017-01-16 | Thermally Conductive Sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170007202A KR101991950B1 (en) | 2017-01-16 | 2017-01-16 | Thermally Conductive Sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180084297A true KR20180084297A (en) | 2018-07-25 |
KR101991950B1 KR101991950B1 (en) | 2019-06-24 |
Family
ID=63058622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170007202A KR101991950B1 (en) | 2017-01-16 | 2017-01-16 | Thermally Conductive Sheet |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101991950B1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3305720B2 (en) * | 1993-07-06 | 2002-07-24 | 株式会社東芝 | Heat dissipation sheet |
JP2007128986A (en) * | 2005-11-01 | 2007-05-24 | Polymatech Co Ltd | Thermally conductive member and method of manufacturing same |
JP2014027144A (en) * | 2012-07-27 | 2014-02-06 | Polymatech Co Ltd | Thermally conductive compact and manufacturing method thereof |
KR101507573B1 (en) * | 2014-01-24 | 2015-04-07 | 조인셋 주식회사 | Method for making conductive elastic member |
-
2017
- 2017-01-16 KR KR1020170007202A patent/KR101991950B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3305720B2 (en) * | 1993-07-06 | 2002-07-24 | 株式会社東芝 | Heat dissipation sheet |
JP2007128986A (en) * | 2005-11-01 | 2007-05-24 | Polymatech Co Ltd | Thermally conductive member and method of manufacturing same |
JP2014027144A (en) * | 2012-07-27 | 2014-02-06 | Polymatech Co Ltd | Thermally conductive compact and manufacturing method thereof |
KR101507573B1 (en) * | 2014-01-24 | 2015-04-07 | 조인셋 주식회사 | Method for making conductive elastic member |
Also Published As
Publication number | Publication date |
---|---|
KR101991950B1 (en) | 2019-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |