KR20180084297A - Thermally Conductive Sheet - Google Patents

Thermally Conductive Sheet Download PDF

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Publication number
KR20180084297A
KR20180084297A KR1020170007202A KR20170007202A KR20180084297A KR 20180084297 A KR20180084297 A KR 20180084297A KR 1020170007202 A KR1020170007202 A KR 1020170007202A KR 20170007202 A KR20170007202 A KR 20170007202A KR 20180084297 A KR20180084297 A KR 20180084297A
Authority
KR
South Korea
Prior art keywords
thermal conductive
conductive sheet
polymer resin
thickness direction
thermally conductive
Prior art date
Application number
KR1020170007202A
Other languages
Korean (ko)
Other versions
KR101991950B1 (en
Inventor
김선기
Original Assignee
조인셋 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조인셋 주식회사 filed Critical 조인셋 주식회사
Priority to KR1020170007202A priority Critical patent/KR101991950B1/en
Publication of KR20180084297A publication Critical patent/KR20180084297A/en
Application granted granted Critical
Publication of KR101991950B1 publication Critical patent/KR101991950B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738—Semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed is a thermal conductive sheet with flexibility and excellent thickness-direction thermal conductivity. The thermal conductive sheet comprises a polymer foam having an open cell structure in which a plurality of pores are connected in the thickness direction; a polymer resin filled in the pores and cured; thermal conductive powder dispersed in the polymer resin; and a thermal conductive fiber arranged so that the longitudinal direction corresponds to the thickness direction and dispersed in the polymer resin. A heat transfer path is formed in the thickness direction by the thermal conductive powder and the thermal conductive fiber.
KR1020170007202A 2017-01-16 2017-01-16 Thermally Conductive Sheet KR101991950B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170007202A KR101991950B1 (en) 2017-01-16 2017-01-16 Thermally Conductive Sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170007202A KR101991950B1 (en) 2017-01-16 2017-01-16 Thermally Conductive Sheet

Publications (2)

Publication Number Publication Date
KR20180084297A true KR20180084297A (en) 2018-07-25
KR101991950B1 KR101991950B1 (en) 2019-06-24

Family

ID=63058622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170007202A KR101991950B1 (en) 2017-01-16 2017-01-16 Thermally Conductive Sheet

Country Status (1)

Country Link
KR (1) KR101991950B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3305720B2 (en) * 1993-07-06 2002-07-24 株式会社東芝 Heat dissipation sheet
JP2007128986A (en) * 2005-11-01 2007-05-24 Polymatech Co Ltd Thermally conductive member and method of manufacturing same
JP2014027144A (en) * 2012-07-27 2014-02-06 Polymatech Co Ltd Thermally conductive compact and manufacturing method thereof
KR101507573B1 (en) * 2014-01-24 2015-04-07 조인셋 주식회사 Method for making conductive elastic member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3305720B2 (en) * 1993-07-06 2002-07-24 株式会社東芝 Heat dissipation sheet
JP2007128986A (en) * 2005-11-01 2007-05-24 Polymatech Co Ltd Thermally conductive member and method of manufacturing same
JP2014027144A (en) * 2012-07-27 2014-02-06 Polymatech Co Ltd Thermally conductive compact and manufacturing method thereof
KR101507573B1 (en) * 2014-01-24 2015-04-07 조인셋 주식회사 Method for making conductive elastic member

Also Published As

Publication number Publication date
KR101991950B1 (en) 2019-06-24

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant