KR20170104704A - System for attaching stiffner to printed circuit board - Google Patents

System for attaching stiffner to printed circuit board Download PDF

Info

Publication number
KR20170104704A
KR20170104704A KR1020160027127A KR20160027127A KR20170104704A KR 20170104704 A KR20170104704 A KR 20170104704A KR 1020160027127 A KR1020160027127 A KR 1020160027127A KR 20160027127 A KR20160027127 A KR 20160027127A KR 20170104704 A KR20170104704 A KR 20170104704A
Authority
KR
South Korea
Prior art keywords
piece
circuit board
printed circuit
jig
punching
Prior art date
Application number
KR1020160027127A
Other languages
Korean (ko)
Other versions
KR101788446B1 (en
Inventor
김정우
윤정호
Original Assignee
한양대학교 에리카산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한양대학교 에리카산학협력단 filed Critical 한양대학교 에리카산학협력단
Priority to KR1020160027127A priority Critical patent/KR101788446B1/en
Publication of KR20170104704A publication Critical patent/KR20170104704A/en
Application granted granted Critical
Publication of KR101788446B1 publication Critical patent/KR101788446B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • H05K1/0281Reinforcement details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention relates to a system for attaching a stiffener to a printed circuit board so as to reinforce each piece substrate of the printed circuit board having a plurality of piece substrates. The system comprises: a punching device for punching a material to manufacture a plurality of piece stiffeners and holding the piece stiffeners on one surface thereof; a jig device having a plurality of intaglio accommodating parts and accommodating the piece stiffener in the intaglio accommodating part; and an attaching device for touching the jig device and the printed circuit board to attach the piece stiffener to the piece substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a system for attaching a printed circuit board stiffener,

The present invention relates to a printed circuit board stiffener attachment system.

A printed circuit board, that is, a printed circuit board (PCB) is a circuit board pattern formed of a conductive material such as copper on an electrically insulating substrate, and is mounted on an electronic component.

PCBs are divided into rigid PCBs made of phenol and epoxy and flexible PCBs (FPCB) made of easily bendable materials such as polyimide, depending on the kind of substrate material. There is also a rigid-flexible PCB that includes both a rigid region and a flexible region.

Flexible PCBs or Rigid-Flexible PCBs Flexible reinforcement materials that reinforce hardness and flatness or absorb electromagnetic waves can be used in the flexible area.

The printed circuit board can be expanded or contracted according to the temperature in the material characteristic. Particularly, in the process of manufacturing a printed circuit board, it is necessary to pass through a forming (thermocompression) process for adhesion of different materials (interlaminar bond), and then it can be stretched. Then, it may be shrunk in the subsequent heating or thermo-compression process (baking, dry / wet drying, welding, forming of subsidiary materials, etc.).

In attaching the reinforcing member to such a printed circuit board, there has been a problem that accuracy of attaching the reinforcing member to the printed circuit board is reduced due to elongation and contraction of the printed circuit board.

The inventor of the present invention has studied for a long time to solve such a problem, has developed through trial and error, and finally completed the present invention.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a system for attaching a stiffener to a printed circuit board stiffener efficiently in response to elongation and contraction of a printed circuit board.

On the other hand, other unspecified purposes of the present invention will be further considered within the scope of the following detailed description and easily deduced from the effects thereof.

According to an aspect of the present invention, there is provided a printed circuit board stitcher attaching system for attaching a stiffener for reinforcing each piece substrate of a printed circuit board having a plurality of piece substrates, A punching device which is made of a plurality of piece stiffeners and on which the piecestiffeners are held; A jig device having a plurality of intaglio accommodating portions and accommodating the piece fastener in the intaglio receiving portion; And an attaching device for bringing the jig device into contact with the printed circuit board and attaching the piece fastener to the piece substrate.

The jig device may include a plurality of jigs having the engraved accommodation portion.

The plurality of piece substrates may be divided into a plurality of groups, and the plurality of jigs may respectively correspond to the plurality of groups.

The jig device may further include a plate coupled with the plurality of jigs.

Wherein the plate and the jig are coupled by a coupling member, the jig and the coupling member are fixedly coupled, and the plate is provided with a hole for receiving the coupling member, the diameter of the hole is larger than the diameter of the coupling member, The engaging member may be movable left and right in the hole.

The plate side end of the engaging member may be provided with a releasing preventing portion for preventing the engaging member from separating from the hole.

Wherein the first guide hole is formed in the printed circuit board, the jig includes a guide pin, the guide pin is inserted into the first guide hole when the printed circuit board and the jig device are in contact with each other, The eccentricity of the guide pin with respect to the one guide hole can be corrected by the lateral movement of the engaging member.

Wherein the punching device includes an upper body and a lower body, the upper body is vertically movable with respect to the lower body, the lower body is formed with a plurality of punching projections that are vertically movable, May be disposed on the upper surface of the lower body.

The upper body may have a suction unit, and the suction unit may suction the piece stiffener so that the punched piece piece is held on the lower surface of the upper body.

The upper body is provided with a second guide hole, and the jig is provided with a guide pin. When the piece stiffener is received in the intaglio receiving portion, the guide pin can be inserted into the second guide hole.

A first inspection device for inspecting whether or not the piece of stencil is accommodated in the intaglio receiving portion; And a second inspection device for inspecting whether or not the piece stiffener is attached to the piece substrate.

The present invention also provides a jig device for attaching a stiffener to a piece substrate of a printed circuit board having a plurality of piece substrates to reinforce each piece substrate of the piece substrate, And a piece stiffener is accommodated in each of the intaglio receiving portions, and the piece stiffener can be attached to the piece substrate by making contact with the printed circuit board.

The plurality of piece substrates may be divided into a plurality of groups, and the plurality of jigs may respectively correspond to the plurality of groups.

The jig device may further include a plate coupled with the plurality of jigs.

Wherein the plate and the jig are coupled by a coupling member, the jig and the coupling member are fixedly coupled, and the plate is provided with a hole for receiving the coupling member, the diameter of the hole is larger than the diameter of the coupling member, The engaging member may be movable left and right in the hole.

The plate side end of the engaging member may be provided with a releasing preventing portion for preventing the engaging member from separating from the hole.

Wherein the guide pins are formed in the printed circuit board, the jigs are provided with guide pins, the guide pins are inserted into the first guide holes upon contact with the printed circuit board, The eccentricity of the guide pin can be corrected by the lateral movement of the engaging member.

According to the present invention as described above, the stiffener can be accurately attached to the printed circuit board.

On the other hand, even if the effects are not explicitly mentioned here, the effect described in the following specification, which is expected by the technical features of the present invention, and its potential effects are treated as described in the specification of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a diagram of a printed circuit board stiffener attachment system in accordance with an embodiment of the present invention.
2 shows a punching device of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention.
3 is a diagram showing a state in which a punching device of a system for attaching a printed circuit board stiffener is punched according to an embodiment of the present invention.
4 is a view showing a state in which a punching device of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention is punched and re-punched.
5 and 6 are views showing a state in which a jig device of a system for attaching a printed circuit board stiffener accommodates a piece stiffener according to an embodiment of the present invention.
7 shows a first inspection apparatus of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention.
8 shows an apparatus for attaching a printed circuit board stiffener attachment system according to an embodiment of the present invention.
9 is a view showing a state where a jig device and a printed circuit board are attached in an attachment device of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention.
10 shows a second inspection apparatus of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention.
It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, an embodiment of a system for attaching a printed circuit board stiffener according to the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals designate like or corresponding components, A duplicate description will be omitted.

1 is a diagram illustrating a printed circuit board stiffener attachment system in accordance with an embodiment of the present invention.

Referring to FIG. 1, a printed circuit board stitcher attaching system according to an embodiment of the present invention may include a punching apparatus 100, a jig apparatus 200, and an attaching apparatus 400. The printed circuit board stapler attachment system according to the embodiment of the present invention may further include a first inspection apparatus 300 and a second inspection apparatus 500.

FIG. 2 shows a punching apparatus 100 of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention, and FIG. 3 shows a punching apparatus 100 of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention Fig.

Referring to FIGS. 2 and 3, the punching apparatus 100 is a device for manufacturing a plurality of piece stiffeners 21 by punching a stiffener material 20.

Here, the stiffener material 20 may be a metal material for reinforcing the printed circuit board 10 in order to reduce warpage of the printed circuit board 10. For example, the stiffener material 20 may be stainless steel (SUS) material. The thickness of the material 20 may be about 0.1 mm. However, the material and thickness of the stiffener material 20 are not limited to those described above.

The fact that the material 20 is made of the piece stiffener 21 means that the material 20 is punched and divided into pieces smaller than the material 20.

On the other hand, the material 20 is placed on one side of the punching device 100 in the form of a roll, and the flat material 20 is placed on the punching device 100 while the roll is unwound.

As shown in FIG. 2, the punching apparatus 100 may include an upper body 110 and a lower body 120.

The upper body 110 is installed to move up and down with respect to the lower body 120. That is, when punching the material 20, the upper body 110 moves downward toward the lower body 120 to restrain the material 20, and when the punching is completed, the upper body 110 moves upward to release the material 20 .

The material 20 may be disposed on the upper surface of the lower body 120. The lower body 120 may have a plurality of punching protrusions 121 that are vertically movable. That is, the punching protrusion 121 may move upward to protrude from the upper surface of the lower body 120 when punching the material 20, and downwardly to not protrude from the upper surface of the lower body 120 at the end of punching .

Meanwhile, the punching apparatus 100 may serve to hold the punched stapler 21 on one side of the punching apparatus 100.

The upper body 110 of the punching apparatus 100 may be provided with a suction unit 111-2. The suction unit 111-2 may be installed inside the upper body 110. Even if the upper body 110 moves upward from the lower body 120 to unfasten the material 20 by suctioning the piece fastener 21 by operating the suction unit 111-2 at the time of punching, Can be held on the lower surface of the upper body 110.

The punching process will be described with reference to FIG. Although only two of the plurality of punching protrusions 121 are shown in Fig. 3, the number of the plurality of punching protrusions 121 may be three or more.

First, as shown in Fig. 3 (a), the material 20 is disposed between the upper body 110 and the lower punching.

The upper body 110 moves downward toward the lower body 120 to restrict the material 20 and the punching protrusion 121 moves upward so that the material 20 ).

The upper body 110 is provided with a holding part 111-1 for receiving and holding the piece stiffener 21 by being pushed up to the inside of the upper body 110 as the punching protrusion 121 is moved upward.

That is, when the lower body 120 is provided with a plurality of punching protrusions 121, the upper body 110 may have a holding part 111-1 corresponding to each of the punching protrusions 121.

In addition, a suction unit 111-2 may be installed inside the holding unit 111-1. 3 (b), the suction device 111-2 operates, and the suction force of the suction device 111-2 causes a force to be applied to the piece-like stiffener 21 from below to the upper side, and the piece- And can be held in the portion 111-1.

3 (c), when the upper body 110 moves upwards to release the material 20 from the restrained state, the material 20 can be moved in a specific direction as required, and the piece- And can be held in the holding part 111-1 of the upper body 110. [

3 (b), the holding portion 111-1 pushed up by the upward movement of the punching protrusion 121 can be maintained in a raised state also in FIG. 3 (c).

Alternatively, unlike the case shown in Fig. 3 (c), the holding part 111-1 may be returned to the state of Fig. 3 (a). In this case, however, the suction device 111-2 continues to operate, so that the piecestiffler 21 can be held.

4 is a view showing a state in which the punching apparatus 100 of the system for attaching the printed circuit board stapler according to the embodiment of the present invention is punched and re-punched.

The punching device can repeatedly perform punching. Here, 'repeatedly progressed' means that punching is performed again after the piecestiffener 21 produced through punching is transferred from the holding state to the jig 200.

In describing the first occurring punching and the second occurring punching, we will call the second punching 're-punching' to distinguish it from the first occurring punching.

Figure 4 (a) shows the punching process of the material 20. Here, the number of the punching protrusions 121 is sixteen, and sixteen punching holes 22 are formed in the material 20 in accordance with the punching of the punching protrusions 121. In addition, the 16 piece stiffeners 21 will be held in the punching device 100. The held piece fastener 21 can then be released from the holding state to be transferred to the jig device 200, which will be described later.

After the piece stiffener 21 is out of the holding state, the re-punching shown in Fig. 4 (b) can proceed. Here, the punching position and the re-punching position may not overlap. That is, the first punching hole 22 made at the time of punching and the second punching hole 22 'made at the time of re-punching do not overlap each other, and the interval between the first punching hole 22 and the second punching hole 22' May be greater than or equal to zero. In particular, the distance between the first punching hole 22 and the second punching hole 22 'may be equal to or greater than the thickness of the material 20. For example, when the thickness of the material 20 is 0.1 mm, The interval between the first punching hole 22 and the second punching hole 22 'may be 0.1 mm.

On the other hand, before the re-punching proceeds, the horizontal movement of the material 20 can proceed. That is, the process of moving the material 20 so that the first punching hole 22 and the second punching hole 22 'are not overlapped can be preceded.

For example, re-punching can proceed after the material 20 moves in the direction of the arrow in Fig. 4 (b).

The degree of horizontal movement (X-axis and / or Y-axis movement) of the material 20 can be controlled by the size of the piecestifler 21, the interval between the punching holes 22, and the like. Further, the X axis and the Y axis can be separately controlled, and the material 20 can move only in the X axis, move only in the Y axis, or move in the X axis and the Y axis.

On the other hand, if the punching space is judged to be insufficient in the predetermined area of the material 20 after the re-punching is completed, the material 20 can be cut (indicated by a dotted line). A cutting device for cutting the material 20 may be provided in the punching device 100.

The cut material 20 becomes a scrap 23 and can be stacked on the side of the punching device 100. [

However, if it is determined that the punching space still remains within the predetermined area of the material 20 after the re-punching is completed, the horizontal movement and re-punching of the material 20 can be resumed.

 Using this re-punching process, the loss of material 20 can be minimized.

5 and 6 are views showing a state in which the jig device 200 of the system for attaching the printed circuit board stiffener according to the embodiment of the present invention receives the piece stiffener 21. Fig.

5 and 6, the jig device 200 includes the engraved receiving portion 221, and the piece stiffener 21 held by the punching device 100 is positioned in the engraved receiving portion 221 Device.

The jig apparatus 200 moves under the piece fastener 21 held on one surface of the punching apparatus 100 and the punching apparatus 100 stops holding the piece fastener 21, And can be accommodated in the intaglio receiving portion 221 of the apparatus 200.

The jig device 200 may include a plate 210, a plurality of jigs 220, a guide pin 222, and a coupling member 223.

The plate 210 is coupled to the plurality of jigs 220, and each of the jigs 220 may have a plurality of intaglio receiving portions 221 formed therein.

The intaglio receiving part 221 means a concave shaped groove formed in the jig 220, and may be formed in plural. The size of the intaglio receiving portion 221 may be equal to or larger than the size of the piece stiffener 21.

The plurality of jigs 220 may be spaced apart from each other on one plate 210. In FIG. 5, four jigs 220 are shown, and four jigs 220 are coupled to one plate 210.

The size of the plate 210 may be the same as the size of the printed circuit board 10, but the size of each jig 220 is smaller than that of the printed circuit board 10.

Each of the plurality of jigs 220 corresponds to a group of the piece substrates 11. Hereinafter, the 'piece substrate 11' and the 'group' will be described.

The printed circuit board 10 includes a plurality of piece substrates 11 (unit substrates). In the latter half of the manufacturing process of the printed circuit board 10, there may be a cutting process of the printed circuit board 10, and the printed circuit board 10 may be separated into the plurality of piece substrates 11 through the cutting process.

In the present invention, the stiffener is attached to the printed circuit board 10 in units of the printed circuit board 10 on which the piece substrates 11 are all attached.

However, in the present invention, the plurality of piece substrates 11 can be divided into a plurality of groups, wherein the 'groups' are bundled into two or more piece substrates 11.

For example, if a piece of printed circuit board 10 includes a sixteen piece substrate 11 (see FIG. 10), then the sixteen piece substrate 11 is formed by four piece substrates 11 forming a group And can be divided into four groups in total.

In the case where one piece stiffener 21 is attached to one piece substrate 11, four jigs 220 corresponding to the four groups may be provided in the jig device 200, Four piece stiffeners 21 can be accommodated for each jig 220.

The four piece stiffeners 21 accommodated in the respective jigs 220 can be attached to the piece substrate 11 belonging to one group.

A guide pin 222 may be formed on the jig 220. The guide pin 222 corresponds to the first guide hole 12 of the printed circuit board 10 to be described later and guides alignment when the jig device 200 and the printed circuit board 10 are in contact with each other.

Also, the guide pin 222 may correspond to the second guide hole 112 formed in the punching apparatus 100.

Referring to FIG. 6, a process of accommodating the piece-type stiffener 21 will be described. 6, only a part of the jig 220 of the jig 200 is shown. However, as described above, the plurality of jig 220 of the jig 200 is formed.

6 (a), the piece stiffener 21 is held on the lower surface of the punching apparatus 100, particularly the upper body 110.

6 (b), the jig device 200 is disposed between the upper body 110 and the lower body 120 of the punching apparatus 100, and the upper body 110 moves downward, (200).

Here, the guide pin 222 may be inserted into the second guide hole 112.

When the holding part 111-1 comes down and the suction device 111-2 stops the suction operation after the jig device 200 is restrained, the piece stiffener 21 is seated in the intaglio receiving part 221 .

6 (c), when the piece of fastener 21 is seated in the recessed receiving portion 221, the upper body 110 is moved upward to release the jig device 200 from the confining state, 200 may exit the punching device 100.

Although not shown in the drawing, another suction may be performed inside the jig 200 according to the needs of those skilled in the art, thereby preventing the piecestifler 21 from being detached from the intaglio receiving portion 221.

Meanwhile, the plurality of jigs 220 and the plate 210 can be coupled by the engagement member 223. The engaging member 223 may be provided for each of the plurality of jigs 220.

The jig 220 and the engaging member 223 are fixedly coupled so that the engaging member 223 can not move from the jig 220.

On the other hand, although the plate 210 and the engaging member 223 are engaged, the engaging member 223 may be movable from the plate 210.

That is, the plate 210 is provided with a hole for receiving the coupling member 223, and the diameter of the hole is formed to be larger than the diameter of the coupling member 223, so that the coupling member 223 can move left and right in the hole . In other words, a space is created between the hole and the engaging member 223, and the size of the spacing space may be 0.1 to 0.5 mm, but is not limited thereto.

On the other hand, the separation preventing portion 224 may be formed on the plate 210 side end of the coupling member 223. The release preventing portion 224 serves as a stopper in the upward movement of the engaging member 223. That is, even if the separation preventing portion 224 is formed, the lateral movement of the coupling member 223 in the hole of the plate 210 may not be restricted.

The coupling member 223 and the separation preventing portion 224 may have a T shape as a whole. That is, in the 'T' character, the longitudinal direction serves as the engagement member 223, and the lateral direction can be the departure prevention portion 224.

The engaging member 223 may be located at the center of the jig 220 but the position is not limited and the number of the engaging members 223 is not limited, Lt; / RTI >

7 is a view showing a first inspection apparatus 300 of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention.

The first inspection apparatus 300 inspects whether the piece-like stiffener 21 is properly accommodated in the intaglio receiving portion 221.

If the colors of the jig 220 and the piece stiffener 21 are different, the acceptance can be checked through color, and the acceptability can be checked by measuring the distance from the first inspection apparatus 300 to the jig 220 . However, the present invention is not limited thereto.

FIG. 8 is a view showing an attachment device 400 of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention, and FIG. 9 is a schematic diagram showing an apparatus 400 for attaching a printed circuit board stiffener attachment system according to an embodiment of the present invention The jig device 200 and the printed circuit board 10 are attached to each other.

8, after the printed circuit board 10 is placed on the jig device 200, the printed circuit board 10 is brought into contact with each other in the attaching device 400, and the printed circuit board 10 is separated from the jig device 200 . Here, as the printed circuit board 10 is brought into contact with the jig device 200, the piece stiffener 21 can be attached to the printed circuit board 10.

The attachment device 400 may include an upper die 410 and a lower die 420. The printed circuit board 10 and the jig device 200 are seated on the lower die 420 and the upper die 410 is moved toward the lower die 420 to pressurize the printed circuit board 10 and the jig device 200 ) Can be brought into complete contact.

The attachment device 400 may include a heat generator to apply heat when the jig device 200 contacts the printed circuit board 10. That is, the piece stiffener 21 may be heat bonded to the printed circuit board 10.

The suction operated by the jig device 200 is stopped so that the piece stiffener 21 can be attached to the printed circuit board 10 when attached to the printed circuit board 10 of the piece stiffener 21. [ can do.

9, when the jig 200 is brought into contact with the printed circuit board 10, the guide pins 222 of the jig 220 are inserted into the first guide holes 12 of the printed circuit board 10 .

Here, although the first guide hole 12 and the guide pin 222 are designed to correspond to each other, eccentricity of the guide pin 222 with respect to the first guide hole 12 may occur for various reasons.

For example, when the printed circuit board 10 receives heat in the process of manufacturing the printed circuit board 10, it may be increased by a predetermined ratio due to the material characteristics of the printed circuit board 10.

As described above, the eccentricity of the guide pin 222 with respect to the first guide hole 12 can be auto-centered or auto-aligned by the engaging member 223 described above.

More specifically, for example, when the printed circuit board 10 is extended by 0.4 mm, in the two adjacent jigs 220, the guide pins 222 of the jig 220 are connected to the first guide holes 12 Eccentricity can not be avoided.

Since the jig 220 can move with respect to the plate 210 while the guide pin 222 enters the first guide hole 12, the two jigs 220 are moved leftward by 0.2 mm and rightward by 0.2 mm, , The eccentricity can be corrected.

10 is a view showing a second inspection apparatus 500 of a system for attaching a printed circuit board stiffener according to an embodiment of the present invention.

The second inspection apparatus 500 can check whether or not the piece stiffener 21 is attached to each piece substrate 11. [

For example, each piece substrate 11 may include a rigid portion R and a flex portion F, and the piece stiffener 21 may be attached to the rigid portion R. [

The second inspection apparatus 500 can check whether or not it is attached using the color, material, thickness, and the like of the piecestifler 21.

Although not shown in the figure, the jig device 200 in which the piecestifper 21 is detached can be inspected separately for the presence of the remaining piecestiffener 21.

The scope of protection of the present invention is not limited to the description and the expression of the embodiments explicitly described in the foregoing. It is again to be understood that the scope of protection of the present invention can not be limited by obvious alterations or permutations of the present invention.

R: Rigid part
F: Flex part
10: printed circuit board
11: piece substrate
12: first guide hole
20: Material
21: Peace Stiffener
22, 22 ': Punching hole
23: scrap
100: Punching device
110: upper body
111-1: holding part
111-2: Suction machine
112: second guide hole
120: Lower body
121: punching projection
200: jig device
210: Plate
220: Jig
221: engraved portion
222: guide pin
223:
224:
300: First inspection apparatus
400: Attachment device
410: upper die
420: Lower die
500: second inspection apparatus

Claims (17)

A system for attaching a stiffener to a piece of printed circuit board having a plurality of piece substrates to reinforce each piece substrate,
A punching device for punching a material into a plurality of piece stiffeners and holding the piece stiffeners on one surface thereof;
A jig device having a plurality of intaglio accommodating portions and accommodating the piece fastener in the intaglio receiving portion; And
And an attaching device for bringing the jig device into contact with the printed circuit board and attaching the piece fastener to the piece substrate.
The method according to claim 1,
Wherein the jig device includes a plurality of jigs having the intaglio receiving portion.
3. The method of claim 2,
Wherein the plurality of piece substrates are divided into a plurality of groups,
And the plurality of jigs correspond to the plurality of groups, respectively.
3. The method of claim 2,
Wherein the jig device further comprises a plate coupled with the plurality of jigs.
5. The method of claim 4,
Wherein the plate and the jig are coupled by a coupling member,
The jig and the engaging member are fixedly engaged,
Wherein the plate is provided with a hole for receiving the coupling member,
Wherein the diameter of the hole is larger than the diameter of the engaging member,
Wherein the engagement member is movable in the hole in the left and right direction.
6. The method of claim 5,
Wherein the plate side end of the engaging member is formed with an escape preventing portion for preventing the engaging member from separating from the hole.
6. The method of claim 5,
A first guide hole is formed in the printed circuit board,
The jig is provided with a guide pin,
Wherein the guide pin is inserted into the first guide hole when the jig device is in contact with the printed circuit board,
Wherein the eccentricity of the guide pin with respect to the first guide hole is corrected by the lateral movement of the engaging member.
3. The method of claim 2,
The punching device includes an upper body and a lower body,
Wherein the upper body is vertically movable with respect to the lower body,
Wherein the lower body includes a plurality of punching projections that are vertically movable,
And wherein the material is disposed on an upper surface of the lower body.
9. The method of claim 8,
The upper body is provided with a suction unit,
Characterized in that the suction unit sucks the piece fastener so that the punched piece fastener is held on the lower surface of the upper body.
9. The method of claim 8,
The upper body is provided with a second guide hole,
The jig is provided with a guide pin,
Wherein the guide pin is inserted into the second guide hole when the piece fastener is received in the intaglio receiving portion.
The method according to claim 1,
A first inspection device for inspecting whether or not the piece of stencil is accommodated in the intaglio receiving portion; And
Further comprising a second inspection device for inspecting whether or not the piece stiffener is attached to the piece substrate.
1. A jig device for attaching a stiffener to a piece substrate for reinforcing each piece substrate of a printed circuit board having a plurality of piece substrates,
A plurality of pieces of jig having a concave receptacle portion, a piece stiffener is accommodated in each of the intaglio accommodating portions,
And the piece stiffener is attached to the piece substrate by being in contact with the printed circuit board.
13. The method of claim 12,
Wherein the plurality of piece substrates are divided into a plurality of groups,
And the plurality of jigs correspond to the plurality of groups, respectively.
13. The method of claim 12,
Wherein the jig device further comprises a plate coupled with the plurality of jigs,
15. The method of claim 14,
Wherein the plate and the jig are coupled by a coupling member,
The jig and the engaging member are fixedly engaged,
Wherein the plate is provided with a hole for receiving the coupling member,
Wherein the diameter of the hole is larger than the diameter of the engaging member,
Wherein the engaging member is movable in the hole in the left-right direction.
16. The method of claim 15,
Wherein the plate side end of the engaging member is formed with an escape preventing portion for preventing the engaging member from separating from the hole.
16. The method of claim 15,
A guide hole is formed in the printed circuit board,
The jig is provided with a guide pin,
Wherein the guide pin is inserted into the first guide hole upon contact with the printed circuit board,
And the eccentricity of the guide pin with respect to the first guide hole is corrected by the lateral movement of the engaging member.
KR1020160027127A 2016-03-07 2016-03-07 System for attaching stiffner to printed circuit board KR101788446B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020160027127A KR101788446B1 (en) 2016-03-07 2016-03-07 System for attaching stiffner to printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160027127A KR101788446B1 (en) 2016-03-07 2016-03-07 System for attaching stiffner to printed circuit board

Publications (2)

Publication Number Publication Date
KR20170104704A true KR20170104704A (en) 2017-09-18
KR101788446B1 KR101788446B1 (en) 2017-10-20

Family

ID=60034331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160027127A KR101788446B1 (en) 2016-03-07 2016-03-07 System for attaching stiffner to printed circuit board

Country Status (1)

Country Link
KR (1) KR101788446B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109737868A (en) * 2018-12-21 2019-05-10 华为技术有限公司 Flight time mould group and electronic equipment
KR102104859B1 (en) * 2019-05-14 2020-04-27 (주)와이에스티 Mike hole laser manufacturing method of ductility circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135519A (en) * 2008-12-03 2010-06-17 Nippon Mektron Ltd Reinforcing plate mounting method in printed circuit board
KR101151827B1 (en) * 2011-10-31 2012-06-01 최은주 Apparatus for attaching reinforcement to fpcb

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109737868A (en) * 2018-12-21 2019-05-10 华为技术有限公司 Flight time mould group and electronic equipment
KR102104859B1 (en) * 2019-05-14 2020-04-27 (주)와이에스티 Mike hole laser manufacturing method of ductility circuit board

Also Published As

Publication number Publication date
KR101788446B1 (en) 2017-10-20

Similar Documents

Publication Publication Date Title
EP2296038B1 (en) Mask defect testing apparatus
US20150136837A1 (en) Electronic component mounting system and electronic component mounting method
KR101788446B1 (en) System for attaching stiffner to printed circuit board
EP3622304B1 (en) Method for producing a multi-layer of a probe card for a testing apparatus of electronic devices
CN100579354C (en) Positioning method and device for flexble printed circuit wiring plate relative cramping means
KR101602318B1 (en) Method for manufacturing the Embedded FPCB
JP5588851B2 (en) Electrical connection device and manufacturing method thereof
KR101788445B1 (en) Method for attaching stiffner to printed circuit board
US6202918B1 (en) Method and apparatus for placing conductive preforms
KR101351355B1 (en) Automatic cutting die for attaching coverlay film
JPH08148767A (en) Flexible printed circuit board
KR101774917B1 (en) Press device for FPCB having transfer unit
KR101791117B1 (en) Jig for inosculating two sheets
JP2018202691A (en) Screen printing system and screen printing method
KR100847016B1 (en) Apparatus for spreading the cream solder on PCB and spreading process using thereof
JP6078910B2 (en) Printed wiring board manufacturing method, board combination, and printed wiring board
JP5200575B2 (en) Circuit board, circuit board inspection method, and circuit board manufacturing method
KR101953221B1 (en) Automatic film peeling device for flexible printed circuit board process
CN113630954A (en) Circuit board
JPH045951B2 (en)
KR100583977B1 (en) Printed circuit board making method
KR20160141914A (en) Device for laminating dry-flim and method thereof, device for manufacturing PCB using the same and method thereof
KR101365769B1 (en) Manufacturing method of probecard
JP2001177294A (en) Apparatus and method for loading chip component
JP2010237061A (en) Substrate-holding implement, electronic component inspection apparatus and electronic component inspection method

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right