KR20170099636A

KR20170099636A - Device mounting equipment and mounting method

Info

Publication number: KR20170099636A
Application number: KR1020160021984A
Authority: KR
Inventors: 이호재
Original assignee: 스테코 주식회사
Priority date: 2016-02-24
Filing date: 2016-02-24
Publication date: 2017-09-01
Also published as: KR101900263B1

Abstract

The present invention relates to an element mounting apparatus, comprising: a transfer unit for transferring a substrate on which a first mounting area and a second mounting area are formed; a transferring unit disposed on a transfer path of the substrate, A first mounting unit for mounting the device, a coating unit for applying solder to a part of the second mounting area, and a second mounting unit for mounting the second device on the conveying path of the substrate .

Description

[0001] DEVICE MOUNTING EQUIPMENT AND MOUNTING METHOD [0002]

The present invention relates to an element mounting apparatus and a mounting method.

A printed circuit board (PCB) is a printed circuit board pattern formed by printing a conductive material such as copper on an electrically insulating substrate, and is a substrate immediately before mounting electronic components. In other words, in order to densely mount many kinds of electronic components on a flat plate, it is a circuit board in which a mounting position of each component is determined and a circuit line connecting components is printed and fixed on the surface of the flat plate.

Surface mount technology (SMT) is a popular method for mounting conventional parts on circuit line patterns. SMT is a method of attaching surface mounted components (SMC) to electronic circuits that can be mounted directly on the surface of the PCB. These electronic devices are called surface-mount devices (SMD). The SMT equipment mounts the solder on the land of the PCB, mounts the surface mount device on the land printed with the cream type solder, mounts the PCB on which the surface mount device is mounted, and applies the radiant heat to melt the solder, It is equipment to connect PCB land.

A production line for assembling surface mount components on a printed circuit board consists of several types of devices. Specifically, it includes a substrate feeder (Loader) for supplying a printed circuit board to a line, a device for applying a solder on a pattern before mounting the component, and a surface mount component from a surface mount component supply reel (feeder) A reflow oven for melting the solder applied after the surface mount unit mounts all the components on the substrate and connecting the parts to the pattern, A sorter for sorting a printed circuit board on which surface mounting is completed, and an unloader for removing the sorted substrate from the line.

Conventional display driver chip (DDI) makers' DDI chip bonding process is a process of thermo-compression bonding chip to substrate with one bonding head. Conventional SMT process is complex process such as solder print, chip mount and reflow, There is a high cost because of high investment cost.

In addition, the DDI chip bonding process and the SMT process are performed in separate lines, which increases the process time and increases the cost.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the above problems, and it is an object of the present invention to mount all devices attached to a substrate in one line.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

In order to achieve the above object, an element mounting apparatus according to the present invention comprises a transfer unit for transferring a substrate on which a first mounting area and a second mounting area are formed, A first mounting unit for mounting a first element on a part of the first mounting area, a coating unit for applying solder to a part of the second mounting area, and a second element disposed on the conveyance path of the substrate, And a second mounting unit to be mounted.

The coating unit may dispose the solder in a part of the second mounting area in accordance with the number of the plurality of second elements to be soldered.

The second mounting unit may include a vacuum hole for sucking the second element, and a heater for applying heat to the second element to couple with the solder.

The second mounting unit may include a vacuum hole for sucking the second element and a heater which is located above the vacuum hole and transfers heat to the vacuum hole to apply heat to the second element, And the vacuum hole may include a plurality of grooves capable of absorbing a plurality of the second elements, respectively.

The device mounting apparatus according to the present invention may further include a second device alignment substrate spaced apart from the plurality of second devices, and the second device alignment substrate may include a groove or a hole.

The substrate may comprise a film in the form of a re-tulle.

The device mounting apparatus according to the present invention may further include a holder for supporting the film, and a cutting unit disposed on the feeding path of the substrate and cutting the film.

A device mounting method according to the present invention includes the steps of transferring a substrate on which a first mounting region and a second mounting region are formed, a first mounting unit disposed on a transfer path of the substrate, Applying a solder to a portion of the second mounting region, and mounting a second element to the solder with a second mounting unit disposed on a transfer path of the substrate .

The soldering step may include disposing the solder in a part of the second mounting area in accordance with the number of the second elements to be soldered.

Wherein the second mounting unit includes a vacuum hole for sucking the second element and a heater which is located on the upper side of the vacuum hole and which applies heat to the second element to couple with the solder, , Simultaneously adsorbing a plurality of the second elements on the second element alignment substrate spaced apart from the second element through a plurality of the vacuum holes, and transferring the adsorbed second element to the second mounting region And lowering the solder to an upper portion of the solder; and simultaneously heating the plurality of second elements through the heater to solder the solder to the solder.

A plurality of chips such as a resistor and a capacitor are simultaneously attracted to a substrate on which an active element such as a display driving chip (DDI) is mounted through a plurality of vacuum holes processed on the surface of a second mounting unit, By soldering, active and passive devices can be mounted in an in-line process to shorten the entire process and increase the productivity of the SMT process for passive devices.

In the case of a package process in which active elements other than DDI are combined with a passive element, in the case of a roll-type film process, the thermocompression bonding process and the SMT process can be configured as an inline device.

1 is a schematic flow chart showing an element mounting apparatus and an in-line mounting method according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a second mounting unit of the element mounting apparatus according to the embodiment of the present invention.
3 is a schematic plan view of a second device alignment substrate of an element mounting apparatus according to an embodiment of the present invention.
FIGS. 4 and 5 are schematic cross-sectional views showing an element mounting method according to an embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference symbols as possible even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the difference that the embodiments of the present invention are not conclusive.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

Hereinafter, the configuration of the element mounting apparatus according to the embodiment of the present invention will be described in detail.

FIG. 1 is a schematic flow chart showing an element mounting apparatus and an in-line mounting method according to an embodiment of the present invention. FIG. 2 is a schematic view of a second mounting unit 400 of the element mounting apparatus according to the embodiment of the present invention. 3 is a schematic plan view of the second device alignment substrate 800 of the device mounting apparatus according to the embodiment of the present invention.

An element mounting apparatus according to an example of the present invention includes a substrate 100, a transfer unit 10, a first mounting unit 200, a coating unit 300, a second mounting unit 400, a second device alignment substrate 800 ).

The element mounting apparatus includes a transfer unit 10 for transferring a substrate 100 having a first mounting region 110 and a second mounting region 120 formed thereon, A first mounting unit 200 for mounting the first element 500 on a part of the first mounting region 110 on the first mounting region 110, a coating unit 200 for applying solder 700 to a part of the second mounting region 120, And a second mounting unit 400 disposed on the transfer path of the substrate 100 and mounting the second device 600 on the solder 700. [

The substrate 100 may include a film 20 in the form of a re-tulle. The device mounting apparatus may further include a holder (not shown) for supporting the film 20 and a cutting unit (not shown) disposed on the feeding path of the substrate 100 and cutting the film 20 have.

The substrate 100 may include a first mounting region 110 and a second mounting region 120 on which the elements 500 and 600 are mounted. For example, as can be seen in the example of FIG. 1, the substrate 100 may be a reel-toothed reel-toothed film 20. The holder (not shown) may serve to hold the reel tape-like film 20 in a fixed position so as to be rotatable.

The first mounting region 110 of the substrate 100 is a region in which the first elements 500 to be mounted by the first mounting unit 200 described later are mounted and the second mounting region 120 of the substrate 100, Is an area in which the second elements 600 to be mounted by the second mounting unit 400 to be described later are mounted. 1 and 3, the first mounting region 110 may be a center portion of the substrate 100, and the second mounting region 120 may be a peripheral portion of the substrate 100. In this case, have.

The transfer unit 10 may serve to transfer the substrate 100 so that the elements 500 and 600 mounted on the substrate 100 are all mounted on one line.

The cutting unit (not shown) cuts the substrate 100 by a predetermined unit after the mounting of the elements 500 and 600 on the substrate 100 is completed. The cutting unit can be disposed on the conveyance path of the substrate 100 conveyed by the conveying unit 10 so that the process from the mounting of the elements 500 and 600 to the substrate 100 to the cutting can be performed in one line have.

The first mounting unit 200 may be disposed on a transfer path of the substrate 100 and may serve to mount the first device 500 in the first mounting region 110. As can be seen from the example of FIG. 1 (a), for example, the first mounting unit 200 can mount the display driving chip DDI on the central portion of the substrate 100 by thermocompression bonding.

The solder 700 may be disposed on a part of the second mounting region 120 according to the number of the plurality of the second devices 600 to be soldered.

The second mounting unit 400 includes a vacuum hole 410 for sucking the second device 600 and a heater 430 for applying heat to the second device 600 to be coupled to the solder 700, . &Lt; / RTI > The second mounting unit 400 includes a vacuum hole 410 for sucking the second element 600 and a second hole 440 for receiving heat from the vacuum hole 410 And a heater 430 coupled to the solder 700 by applying heat to the second element 600. The vacuum hole 410 may be formed to be capable of adsorbing a plurality of the second elements 600, And may include a plurality of grooves 420.

The device mounting apparatus may further include a second device alignment substrate 800 for spacing a plurality of the second devices 600 and the second device alignment substrate 800 may include a groove or a hole 810 have.

The application unit 300 applies a solder 700 to a part of the second mounting region 120 of the substrate 100 in order to mount the second elements 600 to be mounted by the second mounting unit 400 Lt; / RTI > The solder 700 may serve to attach the second element 600 to the substrate 100.

The application unit 300 may serve to dispose the solder 700 apart from the number of the plurality of second elements 600 to be soldered and the position where the second element 600 is mounted on the substrate 100 . As shown in FIG. 1B and FIG. 4, the coating unit 300 can disperse the solder 700 in the second mounting region 120. For example, the position of the substrate 100 on which the application unit 300 disposes the solder 700 may be a groove or a hole 810 on the second device alignment substrate 800, which will be described later, As shown in FIG.

The second mounting unit 400 is disposed on the transfer path of the substrate 100 and mounts the second device 600 on the solder 700 of the second mounting region 120. The second device 600 includes a vacuum hole 410, (Not shown).

The vacuum hole 410 of the second mounting unit 400 serves to attract the second element 600. The second element 600 is attracted by the second element alignment substrate 800 to be described later, And to move the solder paste on the solder 700 located in the mounting region 120. 2, for example, the vacuum hole 410 may be located under the second mounting unit 400, and may include a plurality of grooves (not shown) for sucking the plurality of second elements 600 at the same time 420). As can be seen in the example of FIG. 4, one groove 420 of the vacuum hole 410, for example, can adsorb one second element 600.

The heater 430 of the second mounting unit 400 melts the solder 700 which is in contact with the second element 600 by applying heat to the second element 600 to form the second element 600 on the solder 700, As shown in FIG. The heater 430 can heat the vacuum hole 410 to transfer heat to the second element 600 to which the vacuum hole 410 is adsorbed so that the second element 600 can be coupled to the solder 700 have. 2, the heater 430 may be positioned above the vacuum hole 410 of the second mounting unit 400. As shown in FIG.

The second device alignment substrate 800 serves to define a spacing position of the second device 600 spaced apart from the second mounting region 120 and may include a groove or a hole 810. The second mounting unit 400 is simultaneously mounted on the second element alignment substrate 800 through the groove 420 of the vacuum hole 410 arranged corresponding to the position of the second element 600 spaced apart from the second element alignment substrate 800 600 can be adsorbed. As can be seen in the example of FIG. 3, the grooves or holes 810 of the second device alignment substrate 800 may serve to position the second device 600 to be spaced apart. In one example, the grooves 420 of the second device alignment substrate 800 may be intaglio processed.

Hereinafter, a device mounting method according to an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic flow chart showing an element mounting apparatus and an in-line mounting method according to an embodiment of the present invention, and FIGS. 4 and 5 are schematic cross-sectional views showing an element mounting method according to an embodiment of the present invention.

An element mounting apparatus according to an example of the present invention includes a substrate 100, a transfer unit 10, a first mounting unit 200, a coating unit 300, a second mounting unit 400, a second device alignment substrate 800 ). The substrate 100, the transfer unit 10, the first mounting unit 200, the application unit 300, the second mounting unit 400, the second device alignment substrate 800, The description of the element mounting apparatus according to the present invention can be applied analogously.

The element mounting method includes a step S1 of transferring a substrate 100 on which a first mounting area 110 and a second mounting area 120 are formed, a first mounting unit (not shown) disposed on a transfer path of the substrate 100 (S2) mounting a first element (500) on a part of the first mounting area (110) on the substrate (100) with a solder paste (S4) of mounting a second device (600) on the solder (700) with a second mounting unit (400) disposed on a transfer path of the substrate (100) .

The solder 700 may be disposed on a part of the second mounting region 120 according to the number of the plurality of the second elements 600 to be soldered.

The second mounting unit 400 includes a vacuum hole 410 for sucking the second device 600 and a second hole 600 located above the vacuum hole 410 to apply heat to the second device 600 And a heater 430 to be coupled to the solder 700. The mounting step S4 of the second device 600 includes a step of mounting the second device 600 on the second device alignment substrate 800 spaced apart from the second device 600 (S5) of simultaneously attracting a plurality of the second elements (600) in the second mounting region (120) through the plurality of vacuum holes (410) The solder 700 is heated by the heater 430 to heat the plurality of the second elements 600 at the same time to move the solder 700 upward And a step S7 of soldering.

A method of mounting the elements 500 and 600 using the element mounting apparatus described above is a step of transferring the substrate 100 through the transfer unit 10 in step S1. For example, the transfer unit 10 can be made to roll all the elements 500 and 600 in one in-line by loosening and in-line the film 20 in the form of a roll tape over the cradle.

Next, the step (S2) is a step of mounting the first element 500 in the first mounting region 110 in the first mounting unit 200. As can be seen from the example of FIG. 1 (a), in this step, for example, an active element such as a display driving chip (DDI) can be mounted on the central portion of the substrate 100 by thermocompression bonding using thermocompression bonding .

Next, referring to FIG. 1 (b), the solder 700 is applied to a part of the second mounting region 120 by the coating unit 300. Referring to FIG. The solder 700 may be dispersed in the second mounting region 120 so as to coincide with the spacing arrangement of the plurality of second elements 600 of the second element alignment substrate 800 described above, can do.

Next, the step (S4) includes mounting the second element 600 on the substrate 100 by the second mounting unit 400, which will be described later (S5) to (S7).

(S5) is a step of simultaneously attracting a plurality of second devices 600 on the second device alignment substrate 800 through a plurality of vacuum holes 410 of the second mounting unit 400. [ As can be seen in the example of FIG. 4, the vacuum hole 410 includes a plurality of grooves 420, for example, so that each of the grooves 420 can absorb one second element 600. As an example, the second element 600 may be a passive element such as resistance, capacity, and the like.

In step S6, the adsorbed second element 600 is moved to the upper side of the solder 700 located in the second mounting region 120 and lowered to the upper side of the solder 700. The second mounting unit 400 may mount the second element 600 on the solder 700 spaced apart from the second mounting region 120 after the second element 600 is picked up from the second element alignment substrate 800. [ . For example, the second device alignment substrate 800 may be positioned near the transfer unit 10 and the second mounting unit 400 may move the second device 600 over the solder 700 in a rotational motion.

The second element 600 moved above the solder 700 can come into contact with the upper portion of the solder 700 by the descent of the second mounting unit 400. [

In step S7, the plurality of second elements 600 are simultaneously heated through the heater 430 to solder the solder 700. [ For example, when the second element 600 and the solder 700 are in contact with each other, the heater 430 of the second mounting unit 400 generates heat to heat the vacuum hole 410, So that the solder 700 in contact with the second element 600 can be melted and the second element 600 can be coupled to the solder 700. The heater 430 simultaneously generates heat to couple the plurality of second elements 600 to the solder 700 at the same time, thereby increasing the process speed.

According to the element mounting apparatus and the element mounting method according to the present invention, both the active element and the passive element are mounted in a single line, which increases the process speed and reduces the cost, thereby shortening the development period and reducing the process inventory.

Although the exemplary embodiments of the present invention have been described for the sake of convenience, the exemplary embodiments of the present invention may be embodied together, and some of the exemplary embodiments may be combined.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

10: transfer unit 20: reel turret film
100: substrate 110: first mounting area
120: second mounting area 200: first mounting unit
300: dispensing unit 400: second mounting unit
410: vacuum hole 420: groove
430: heater 500: first element
600: second element 700: solder
800: second element alignment substrate
810: groove or hole of the second element alignment substrate

Claims

A transfer unit for transferring the substrate on which the first mounting area and the second mounting area are formed;
A first mounting unit disposed on a transfer path of the substrate and mounting a first element on a part of the first mounting area on the substrate;
A coating unit for applying solder to a part of the second mounting area; And
And a second mounting unit disposed on a transfer path of the substrate and mounting the second element on the solder.

The method according to claim 1,
Wherein the coating unit disposes the solder in a part of the second mounting area in accordance with a number of the plurality of second elements to be soldered.

The apparatus according to claim 1, wherein the second mounting unit comprises:
A vacuum hole for adsorbing the second element; And
And a heater for applying heat to the second element to bond the solder to the second element.

The apparatus according to claim 1, wherein the second mounting unit comprises:
A vacuum hole for adsorbing the second element; And
And a heater positioned above the vacuum hole and coupled to the solder by transferring heat to the vacuum hole to apply heat to the second element,
Wherein the vacuum hole includes a plurality of grooves capable of adsorbing a plurality of the second elements, respectively.

The method according to claim 1,
And a second element alignment substrate spaced apart from the plurality of second elements,
Wherein the second element alignment substrate includes a groove or a hole.

The method according to claim 1,
Wherein the substrate is a film in the form of a re-tulle.

The method according to claim 6,
A holder for supporting the film; And
And a cutting unit disposed on a transport path of the substrate and cutting the film.

Transferring a substrate on which the first mounting area and the second mounting area are formed;
Mounting a first element on a part of the first mounting area on the substrate with a first mounting unit disposed on a transfer path of the substrate;
Applying solder to a portion of the second mounting area; And
And mounting a second element on the solder with a second mounting unit disposed on a transfer path of the substrate.

9. The method of claim 8,
Wherein the applying step disposes the solder in a part of the second mounting area in accordance with a number of the plurality of second elements to be soldered.

9. The method of claim 8,
Wherein the second mounting unit comprises:
A vacuum hole for adsorbing the second element; And
And a heater positioned above the vacuum hole and coupled to the solder by applying heat to the second element,
Wherein the second element mounting step includes:
Simultaneously adsorbing a plurality of the second elements on the second element alignment substrate spaced apart from the second element through the plurality of vacuum holes;
Moving the sucked second element to an upper side of the solder located in the second mounting region and lowering the solder to an upper portion of the solder;
And simultaneously heating the plurality of second elements through the heater to solder the solder to the solder.