KR20170078440A - Conductive coating materials for access floor system and coating method thereof - Google Patents
Conductive coating materials for access floor system and coating method thereof Download PDFInfo
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- KR20170078440A KR20170078440A KR1020150188960A KR20150188960A KR20170078440A KR 20170078440 A KR20170078440 A KR 20170078440A KR 1020150188960 A KR1020150188960 A KR 1020150188960A KR 20150188960 A KR20150188960 A KR 20150188960A KR 20170078440 A KR20170078440 A KR 20170078440A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/005—Dendritic macromolecules
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- C09D7/1216—
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Floor Finish (AREA)
Abstract
A conductive coating agent and a coating method of a dual floor floor system panel are disclosed. The conductive coating agent is composed of 40 to 80 wt% of the binder, 3 to 30 wt% of the conductive material, 5 to 60 wt% of the filler, 50 wt% or less of the solvent, 10 wt% or less of the additive and 10 wt% or less of the colorant, The flooring system panel is replaced with a conductive tile to form a coating layer on the panel. Thus, a conductive panel can be manufactured by a simplified process compared to the conventional method, a wide range of electric resistance can be realized, and a coating film So as to produce a high quality double floor system panel.
Description
The present invention relates to a conductive coating agent and coating method of a dual floor system panel that replaces a conductive tile adhered to the surface of a panel in a raised floor system with a conductive coating.
Components such as IC circuits used in the semiconductor and electronics industries are mass-produced in clean rooms that consist of a raised floor system, but they are vulnerable to the effects of static electricity, which can lead to destruction and performance degradation when exposed to static electricity. To solve this problem, a clean floor double floor system uses a PVC conductive tile on top of an aluminum panel with excellent EDS.
When PVC conductive tiles are adhered to an aluminum panel, manufacturing costs are increased due to an increase in processes related to adhesion of PVC conductive tiles to aluminum panels, lowering of workability due to curing time, and adhesion of conductive adhesive. PVC conductive tiles produced by mixing filler into PVC resin have problems such as generation of dust and lowering of chargeability due to carbon loss due to weak abrasion resistance. In addition, there are problems of improving the conductivity of PVC conductive tiles and limitation of implementation of surface resistance.
In addition, conductive coatings for electronic materials have been commercialized for various purposes, but they are expensive and have excellent conductivity in thin films. However, since they have poor conductivity and film properties in thick films (over 100 탆), they are inferior in application to dual- There is a problem that it can not be implemented.
It is an object of the present invention to provide a conductive coating agent capable of manufacturing a panel in place of a conductive tile adhered to an aluminum panel in a dual floor system .
It is another object of the present invention to effectively coat conductive coatings in place of conventional conductive tiles adhered to panels in a raised floor system.
It is a further object of the present invention to replace conductive tiles adhered to panels of a raised floor system with conductive coatings to produce conductive panels in a simplified process compared to the prior art.
It is still another object of the present invention to provide a panel of a dual floor floor system with improved physical properties such as abrasion resistance and chemical resistance.
It is a further object of the present invention to provide a variety of electrical resistances by adjusting the type and content of conductive material through a conductive coating agent coated on a panel of a raised floor system.
It is a further object of the present invention to provide a cushioning feel by coating a panel of a raised floor system with a conductive coating.
It is another object of the present invention to provide a coating film capable of setting a coating thickness of a conductive coating agent coated on a panel and capable of various colors and designs.
According to the present invention, the above-mentioned objects can be achieved by a composition according to the present invention which comprises 40 to 80% by weight of a binder, 3 to 30% by weight of a conductive material, 5 to 60% by weight of a filler, 50% ≪ / RTI > is achieved by a conductive coating agent on a raised floorboard system panel.
According to an embodiment of the present invention, the binder may be a mixture of one or more kinds selected from urethane, epoxy, polyester, unsaturated polyester, acryl, urethane, urea, melamine, ≪ / RTI >
According to an embodiment of the present invention, the conductive material is selected from graphite, graphene, carbon black, nickel, copper, aluminum, boron, carbon nanotubes, tin, gold, silver, zinc, ITO, ATO, conductive titanium oxide One or a mixture of two or more.
Further, according to the embodiment of the present invention, the conductive material is impregnated with the powder particles in the binder.
According to the embodiment of the present invention, the filler is selected from a mixture of one or more selected from calcium carbonate, barium sulfate, talc, silica, fumed silica, kaolin, bentonite, glass bubbles and titanium oxide.
Further, according to the embodiment of the present invention, the additive is selected from one or a mixture of two or more selected from a dispersing agent, a defoaming agent, a defoaming agent, a leveling agent, an adhesion promoter, a curing accelerator and a viscosity controlling agent.
In addition, according to the embodiment of the present invention, the colorant may include a white pigment having high hiding power as an inorganic pigment, but not limited thereto, all pigments can be used.
Further, according to an embodiment of the present invention, the coating composition further comprises a solvent. The solvent may be a mixture of one or more kinds selected from the group consisting of hydrocarbon series, halogenated hydrocarbon series, alcohols, aldehydes, ethers, esters, ketones and glycol ethers, or a mixture of two or more selected from disulfide hydrocarbons and cresols .
The above objects are achieved according to the invention by a process for the production of a composition comprising 40 to 80% by weight of a binder, 3 to 30% by weight of a conductive material, 5 to 60% by weight of a filler, up to 50% by weight of a solvent, Conductive coating agents; Adjusting the viscosity of the conductive coating agent according to the thickness of the coating film to form the coating layer; And from the above step, a conductive coating agent having a controlled viscosity is applied to the surface of a dual floor floor system panel using a coating method such as roll coating, slot die coating, gravure coating, silk screen coating or spray coating, And forming a coating layer having a thickness of 100 to 3000 mu m.
In addition, according to the embodiment of the present invention, in the step of forming the coating layer, the color and the pattern of the panel can be formed into a multi-coating layer.
According to an embodiment of the present invention, in the step of forming a coating layer, a primer coating is formed on the top of the panel; Forming a second coating layer by coating a conductive coating agent after forming the first coating layer; And forming a third coating layer for imparting hue and functionality after forming the first and second coating layers.
A multi-layer coating layer may also be formed. The coating layer may consist of a 1.2..5.n coating layer, preferably a maximum of the fifth coating layer. However, the coating layer is not limited thereto.
Further, according to an embodiment of the present invention, the method further comprises forming the conductive coating agent into a one-component or two-component conductive coating agent using a binder before forming the coating layer.
Further, according to an embodiment of the present invention, the conductive coating agent further includes a dispersion step using a method selected from 3-roll mill, ball mill, basket mill, and Dyno mill for dispersing the colorant and the conductive material before forming the coating layer do.
In addition, according to the embodiment of the present invention, the viscosity of the conductive coating agent is adjusted to be in the range of 1000 to 10,000 cps, depending on the film thickness to form the coating layer.
The present invention can produce a panel in which a conductive coating agent is directly applied by replacing a conductive tile adhered to an aluminum panel in a dual floor system, thereby providing a conductive panel with a simplified process compared to the conventional method.
In addition, the present invention can form a coating film by freely adjusting the binder of the conductive coating agent, thereby effectively manufacturing a panel for use in a high-quality double-layer flooring system having excellent wear resistance and chemical resistance and having a cushion feeling.
In addition, the present invention has an effect that a variety of electrical resistances can be freely implemented by adjusting the type and content of the conductive material through the conductive coating agent coated on the panel of the raised floor system.
In addition, the present invention has an effect that a coating thickness of a conductive coating agent coated on a panel can be arbitrarily set, and a coating film capable of various colors and designs can be freely formed.
The present invention also solves the environmental problem since conductive PVC tiles adhering to panels of a raised floor system can be replaced by conductive coatings. PVC recovery and incineration, and the use of plasticizers.
In addition, the present invention replaces the PVC conductive tile bonding process with a coating process of a conductive coating in a dual floor system, reducing lead time, reducing costs, and reducing costs associated with tile inventory management.
In addition, the present invention can freely impart a functional group by a conductive coating agent when a conductive coating agent is coated on a panel of a dual floor system, so that it can be applied to various fields such as antimicrobial resistance, abrasion resistance, fluorescence, high heat resistance, The range (10 3 to 10 12 Ω) can be freely implemented, and heat radiation and electromagnetic wave shielding effect can be expected.
Hereinafter, embodiments of the present invention will be described in detail.
The present invention replaces the existing PVC conductive adhesive that adheres to the panel surface of a raised floor system with a new coating of conductive coating to produce a panel of raised floor system.
The conductive coating agent of the present invention can solve problems such as electrical resistance, heat resistance and chemical resistance which can not be expected in conventional conductive acrylic adhesives such as acrylic, epoxy and rubber, conductive polyurethane and epoxy adhesive, The process is easy and simple to implement.
The conductive coating agent according to the present invention is coated with a simple coating process on the panel surface of a dual floor system to replace the existing PVC conductive tile with a coating layer.
Parquet flooring systems and panels
The flooring system is a floor of a clean room or the like, and the panel is a part constituting a roof of a double floor. The panel may be an aluminum alloy doped with an appropriate amount of silicon, magnesium, nickel, copper, manganese, iron or the like as an additive to the main aluminum and may be an Al-Si alloy or Al-Mg alloy of 12 types of ALDC . It may be an aluminum alloy corresponding to the aluminum-silicon-magnesium-alloy series (Mg-Al-Si alloy) of 6000 series on the classification table defined by Aluminum Association (AA) In the present invention, a panel of a dual floor floor system can be produced in a relatively simple process without effectively coating a conductive coating agent on the surface of the panel and adhering a separate PVC conductive tile.
Conductive coating agent
The conductive coating agent may be composed of 40 to 80 wt% of a binder, 3 to 30 wt% of a conductive material, 5 to 60 wt% of a filler, 50 wt% or less of a solvent, 10 wt% or less of an additive, and 10 wt% or less of a colorant.
The binder may be selected from one or more materials selected from urethane, epoxy, polyester, unsaturated polyester, acrylic, urethane, urea, melamine, water dispersible urethane and acrylic emulsion polymer.
The conductive material may be selected from among a mixture of one or more selected from graphite, graphene, carbon black, nickel, copper, aluminum, boron, carbon nanotubes, tin, gold, silver, zinc, ITO, ATO and conductive titanium oxide And preferably the conductive material is impregnated with the powder particles in the binder. Conductive materials impregnated into the binder with the powder particles increase the dispersibility and form a coating layer having a uniform electrical resistance distribution.
The filler as the filler is selected from one or more selected from among calcium carbonate, barium sulfate, talc, silica, fumed silica, kaolin, bentonite, glass bubbles and titanium oxide.
The additive is selected from one or a mixture of two or more selected from a dispersing agent, a defoaming agent, a defoaming agent, a leveling agent, an adhesion promoter, a hardening accelerator, and a viscosity controlling agent. The colorant includes a white pigment having high hiding power as an inorganic pigment.
The coating composition may further comprise a solvent. The solvent may be a mixture of one or more kinds selected from the group consisting of hydrocarbon series, halogenated hydrocarbon series, alcohols, aldehydes, ethers, esters, ketones and glycol ethers, or a mixture of two or more selected from disulfide hydrocarbons and cresols .
Panel Coating in a Dual Flooring System Using Conductive Coatings
A conductive coating agent is prepared which is composed of 40 to 80 wt% of a binder, 3 to 30 wt% of a conductive material, 5 to 60 wt% of a filler, 50 wt% or less of a solvent, 10 wt% or less of an additive and 10 wt% or less of a colorant.
The viscosity of the conductive coating agent is adjusted according to the thickness of the coating film to be formed.
A coating layer having a thickness of 100 to 3000 탆 is formed on the surface of the panel by using roll coating, slot die coating, gravure coating, silk screen coating, spray coating or the like on the surface of the dual floor floor system panel do.
If the thickness of the coating is less than 100 탆, the cushioning and durability may be affected. If the thickness is more than 3000 탆, it is difficult to form the coating layer and it is difficult to realize the surface resistance. Therefore, the coating layer having a film thickness of 100 to 3000 mu m is a preferable coating film thickness range of the conductive coating layer.
The coating layer can form a single coating layer that exhibits the surface color and pattern of the panel depending on the choice of colorant while maintaining conductivity. In addition, the coating layer may be formed by first primer coating the upper surface of the panel to form a first coating layer, then coating a conductive coating agent to form a second coating layer, and forming a first coating layer and a third coating layer May be formed.
This allows a single coating layer to be achieved while maintaining the conductivity of the panel surface in a variety of colors and patterns. The multilayer coating layer can also show various colors and patterns. When the conductive coating agent is coated on the upper part of the panel first and then the secondary coating and the multilayer coating are performed using a white color having a high hiding power, various colors and patterns can be realized. In this case, by using the thickness of the coating layer and the selective use of the conductive material, Or may supplement or supplement it. In some cases, a single coating may provide conductivity and color patterns.
Also, the conductive coating agent may be prepared as a one-pack type or two-pack type conductive coating agent by using a binder before forming the coating layer. However, since the two-pack type requires a quantitative mixing process, it is preferable to use a one- .
In addition, the conductive coating agent can be used to evenly adjust the component distribution of the conductive coating agent in a uniform distribution using a method selected from a three-roll mill, a ball mill, a basket mill, and a dyno mill for dispersing the colorant and the conductive material before forming the coating layer. have.
If dispersion is not carried out, there will be a large difference in distribution of electrical resistance and poor coloring. The dispersion method using a three-roll mill, a ball mill, a basket mill, and a dynomil may be selected by a method suitable for dispersion of a conductive coating agent.
It is preferable that the viscosity of the conductive coating agent is adjusted to be in the range of 1000 to 10,000 cps according to the thickness of the coating layer to be formed. The viscosity of the conductive coating agent directly affects the curing time, the work flow, and the quality control. If it is 1000 cps or less, the dispersibility is good, but the flow on the surface of the panel is fast, which hinders the easy formation of the film thickness. If it exceeds 10,000 cps, the handling property is good, but the dispersibility is poor, and the difference in coloring and electrical resistance distribution can be excessively large. Thus, when forming the coating layer on the panel, the viscosity of the conductive coating agent in the range of 1000 to 10,000 cps can be selected as the viscosity of the desired conductive coating agent.
Panel coating thickness of dual floor system
The coating thickness of the coating layer formed on the surface of the panel may be uniform or non-uniform. The coating thickness of the uniform coating layer is advantageous from the viewpoint of maintaining a constant electric resistance and coloring property of the color, but the conductive coating layer has the largest thickness of the coating layer at the center portion with respect to the panel surface of the dual floor flooring system, The thickness of the coating film gradually becomes thinner, and the coating thickness of the coating layer at the center and the periphery can be adjusted to be differentially adjusted.
Increasing the film thickness proportionally increases the distribution probability of the impregnation amount of the conductive material, so that the differential film thickness reduces the uniform distribution of the electrical resistance, but it may also increase or decrease the film thickness by grasping areas and areas where static electricity is concentrated.
The coating layer formed on the panel surface with a film thickness is cured by a method such as thermal curing or UV curing.
The present invention can produce a panel in which a conductive coating agent is directly applied instead of a conductive tile adhered to an aluminum panel in a dual floor system, so that a conductive panel applied to a dual floor system can be manufactured by a simplified process have.
The present invention can provide a coating film having a cushion feeling because it can control the physical properties of the binder of the conductive coating agent to form a coating film, and thus the coating film thickness can be adjusted to 100 to 3000 탆 while being excellent in abrasion resistance and chemical resistance. . The coating thickness of the coating layer can be selectively adjusted as needed, so that it is possible to produce an effective surface resistance.
The present invention can produce a conductive panel that freely implements a wide range of electrical resistance by adjusting the type and content of the conductive material through the conductive coating agent coated on the panel of the raised floor system.
The present invention relates to a method of manufacturing a conductive panel having various patterned surfaces and a coloring of a dual floor floor system panel by freely forming a coating film capable of setting a coating thickness of a conductive coating agent coated on the panel and capable of various colors and designs .
The present invention can replace the conductive PVC tiles adhering to the panels of the raised floor system with conductive coatings, thus limiting the use of PVC recovery and incineration and plasticizers, thereby enabling eco-friendly construction and management of the raised floor system.
The present invention replaces the PVC conductive tile bonding process with a coating process of a conductive coating in a dual floor system, reducing lead time, reducing costs, and reducing costs associated with tile inventory management.
The present invention can freely impart a functional group to a conductive coating agent when a conductive coating agent is coated on a panel of a dual floor system, so that it has an electric resistance range of from 10 3 to 10 12 to antimicrobial resistance, stain resistance, fluorescence, Ω) can be freely implemented, and heat radiation and an electromagnetic wave shielding effect can be expected.
In addition, as an application of the present invention, it is possible not only to form a coating layer by applying a conductive coating agent to an aluminum panel of a dual floor floor system, but also to coat various materials such as steel, plastic, wood, and inorganic panels to impart conductivity.
Although the present invention has been described with reference to the exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. .
Claims (11)
Wherein the binder is selected from the group consisting of urethane, epoxy, polyester, unsaturated polyester, acryl, urethane, urea, melamine, water dispersible urethane and acrylic emulsion polymer compound Conductive coatings.
Wherein the conductive material is selected from a mixture of one or more selected from graphite, graphene, carbon black, nickel, copper, aluminum, boron, carbon nanotubes, tin, gold, silver, zinc, ITO, ATO and conductive titanium oxide Conductive coatings on a dual floor system panel.
Wherein the filler is at least one selected from the group consisting of calcium carbonate, barium sulfate, talc, silica, fumed silica, kaolin, bentonite, glass bubbles and titanium oxide.
Wherein the additive is selected from the group consisting of a dispersant, a defoaming agent, a defoaming agent, a leveling agent, an adhesion promoter, a curing accelerator, and a viscosity control agent.
From the above step, a conductive coating agent having a controlled viscosity is applied to the surface of the dual floor floor system panel using a coating method such as roll coating, slot die coating, gravure coating, silk screen coating or spray coating to obtain a coating film thickness of 100 ≪ / RTI > to about 3000 < RTI ID = 0.0 > pm. ≪ / RTI >
Wherein the forming of the coating layer comprises forming a multi-layer coating layer from a single layer coating on the color and pattern of the panel.
In the step of forming the coating layer, a primer coating agent is coated on the upper part of the panel to improve the adhesion, thereby forming a first coating layer. Forming a second coating layer by coating a conductive coating agent after forming the first coating layer; Forming a third coating layer capable of imparting hue and functionality after forming the first and second coating layers; And forming a multi-layer coating layer consisting of 4.5 ... n-th coats after forming said third gouging layer. ≪ Desc / Clms Page number 24 >
Wherein the conductive coating agent comprises a dispersing step using a method selected from the three-roll mill, ball mill, basket mill, and dyno mill for dispersing the colorant and the conductive material prior to forming the coating layer. .
Wherein the thickness of the coating formed on the surface of the panel in the coating layer forming step is uniform or non-uniform.
In the step of forming the second coating layer, in the dual floor floor system forming the coating layer using the conductive coating agent of any one of claims 1 to 5, which imparts antibacterial, abrasion resistance, fluorescence, high heat resistance, ≪ / RTI >
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020150188960A KR20170078440A (en) | 2015-12-29 | 2015-12-29 | Conductive coating materials for access floor system and coating method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020150188960A KR20170078440A (en) | 2015-12-29 | 2015-12-29 | Conductive coating materials for access floor system and coating method thereof |
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| KR20170078440A true KR20170078440A (en) | 2017-07-07 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108610950A (en) * | 2017-01-13 | 2018-10-02 | 苏州碳丰石墨烯科技有限公司 | A kind of high temperature exothermic coating and preparation method thereof |
| CN109928645A (en) * | 2019-04-17 | 2019-06-25 | 东方美涂(哈尔滨)科技有限公司 | A kind of high temperature resistant heating glass dalle and preparation method thereof |
| CN110591483A (en) * | 2019-09-25 | 2019-12-20 | 复旦大学 | High-conductivity water-based automobile bumper primer and preparation method thereof |
| CN110776805A (en) * | 2019-10-14 | 2020-02-11 | 广州盛门新材料科技有限公司 | Water-based fluorinated graphene coating and preparation method and application thereof |
| CN111205713A (en) * | 2020-02-22 | 2020-05-29 | 东莞市鹏威能源科技有限公司 | Graphene shielding film slurry and preparation method and application thereof |
| DE102018009794A1 (en) * | 2018-12-17 | 2020-06-18 | Sto Se & Co. Kgaa | Coating composition for floor coverings |
| CN112194954A (en) * | 2019-07-08 | 2021-01-08 | 常州市大使涂料有限公司 | Graphene epoxy zinc-rich coating |
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2015
- 2015-12-29 KR KR1020150188960A patent/KR20170078440A/en not_active Application Discontinuation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108610950A (en) * | 2017-01-13 | 2018-10-02 | 苏州碳丰石墨烯科技有限公司 | A kind of high temperature exothermic coating and preparation method thereof |
| CN108610950B (en) * | 2017-01-13 | 2020-05-26 | 苏州碳丰石墨烯科技有限公司 | High-temperature heating coating and preparation method thereof |
| DE102018009794A1 (en) * | 2018-12-17 | 2020-06-18 | Sto Se & Co. Kgaa | Coating composition for floor coverings |
| CN109928645A (en) * | 2019-04-17 | 2019-06-25 | 东方美涂(哈尔滨)科技有限公司 | A kind of high temperature resistant heating glass dalle and preparation method thereof |
| CN112194954A (en) * | 2019-07-08 | 2021-01-08 | 常州市大使涂料有限公司 | Graphene epoxy zinc-rich coating |
| CN110591483A (en) * | 2019-09-25 | 2019-12-20 | 复旦大学 | High-conductivity water-based automobile bumper primer and preparation method thereof |
| CN110776805A (en) * | 2019-10-14 | 2020-02-11 | 广州盛门新材料科技有限公司 | Water-based fluorinated graphene coating and preparation method and application thereof |
| CN111205713A (en) * | 2020-02-22 | 2020-05-29 | 东莞市鹏威能源科技有限公司 | Graphene shielding film slurry and preparation method and application thereof |
| CN111205713B (en) * | 2020-02-22 | 2021-08-31 | 东莞市鹏威能源科技有限公司 | Graphene shielding film slurry and preparation method and application thereof |
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