KR20170053345A - 3d laser beam irradiating apparatus and 3d laser beam irradiating method - Google Patents

3d laser beam irradiating apparatus and 3d laser beam irradiating method Download PDF

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KR20170053345A
KR20170053345A KR1020150155727A KR20150155727A KR20170053345A KR 20170053345 A KR20170053345 A KR 20170053345A KR 1020150155727 A KR1020150155727 A KR 1020150155727A KR 20150155727 A KR20150155727 A KR 20150155727A KR 20170053345 A KR20170053345 A KR 20170053345A
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South Korea
Prior art keywords
stage
laser beam
scanner
axis
error
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KR1020150155727A
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Korean (ko)
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KR101769550B1 (en
Inventor
김경한
이제훈
손현기
노지환
최지연
김정오
이승우
안상훈
조성학
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한국기계연구원
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides a three-dimensional laser irradiation apparatus capable of improving the processing speed and reducing errors.
A three-dimensional laser irradiation apparatus according to one aspect of the present invention includes a stage whose movement is controlled by a first command period, a scanner which is controlled by a second command period shorter than the first command period to move the laser beam, A second control section for controlling the scanner in the second instruction period; and a second control section for controlling the laser irradiation of the scanner to compensate for the movement error of the stage, And a compensation control section for correcting the path.

Description

TECHNICAL FIELD [0001] The present invention relates to a three-dimensional laser irradiating apparatus and a three-dimensional laser irradiating method,

The present invention relates to a three-dimensional laser irradiation apparatus and a three-dimensional laser irradiation method.

A laser processing apparatus or a laser scanner is a method of processing a desired shape by driving only an XY-axis stage in a state in which a laser is scanned at a predetermined point and condensed by a focusing lens in accordance with the constitution method and purpose of use, Or a three-axis galvanometer with a mirror attached to it, a technique of welding with a laser scanner while moving a multi-joint robot, a technique of analyzing and processing data of a low-speed XY-axis stage controller and a high- And a method of separately producing and processing a positioning system.

Although the method of machining a desired shape by driving only the XY-axis stage is capable of large-area processing, the processing speed is slower than that of the scanner, and the method of processing a shape by a scanner is high- A method of controlling the scanner while simultaneously moving the stage is useful. The conventional method of controlling the scanner while moving the stage is to adjust the moving data of the conveyor belt moving only in one direction to the moving speed of the product, It is mainly used for marking the serial number of the products flowing on the moving conveyor belt.

In recent years, laser scanners have been widely applied to ultra-precise and high-speed processing fields, but their application fields are limited due to limited range of scanners. However, since semiconductor components are becoming larger in size, it is necessary to simultaneously operate a scanner and a stage, and a device capable of simultaneously driving a scanner and a stage in order to improve processing performance and speed is needed.

The present invention provides a three-dimensional laser irradiation apparatus and a three-dimensional laser irradiation method capable of improving a processing speed and reducing an error.

According to an aspect of the present invention, there is provided a three-dimensional laser irradiating apparatus comprising a laser oscillator for outputting a laser beam, a stage for controlling movement of the laser beam in a first command period, A first controller connected to the stage and controlling the movement of the stage in the first command period, a second controller coupled to the stage, for moving the stage, A second control unit connected to the scanner and controlling the scanner in the second instruction period, and a second control unit connected to the error measuring unit and the second control unit to compensate the movement error of the stage And a compensation control unit for correcting the laser irradiation path of the scanner.

The apparatus may further include a variable focus unit disposed on a path of the laser beam to control a focal length of the laser beam, wherein the second controller and the compensation controller are connected to the variable focus unit to control the variable focus unit have.

In addition, the stage may include rotation units provided to be rotatable about at least one of the transfer units movable along the coordinate axes of the three-dimensional rectangular coordinate system and the coordinate axes of the three-dimensional rectangular coordinate system.

The three-dimensional orthogonal coordinate system includes x-axis, y-axis, and z-axis orthogonal to each other. The stage includes a first transfer unit movably installed in the x-axis direction, a second transfer unit installed movably in the y- A third transfer unit provided movably in the z-axis direction, a first rotation unit rotatably provided about the x-axis, and a second rotation unit rotatable about the y-axis.

Also, the scanner can move the laser beam in the x-axis direction and the y-axis direction, and the variable focus portion can move the laser beam in the z-axis direction.

The control unit may further include a control point setting unit for generating a plurality of control points on a surface of the workpiece, wherein the second control unit controls the laser beam to move the first control point To the second control point, but to move to different paths.

The three-dimensional laser irradiating device forms a virtual reference plane contacting with the control point, forms a virtual rectangular parallelepiped by setting the focus adjustable distance of the variable focus from the reference plane to a height, And a scanning volume setting unit that sets the scanning volume as a scanning volume.

The error measuring unit may include a plurality of position encoders for measuring the position of the stage and a plurality of angular encoders for measuring the rotation of the stage. The first command period may be 10 to 1000 times the second command period.

According to another aspect of the present invention, there is provided a three-dimensional laser irradiation method comprising: controlling a scanner in a second command period shorter than the first command period to move a laser beam while controlling movement of a stage in a first command period; An error measuring step of measuring a position error of the stage while the stage is moving, and a controller controlling the scanner to compensate for a position error of the stage while the scanner moves and irradiates the laser beam And a path correcting step of correcting a path through which the laser beam travels.

Here, the path correcting step may control the variable focus unit that controls the focal length of the laser beam in the second command period together with the scanner.

Further, the three-dimensional laser irradiation method may further include a control point generating step of generating a plurality of control points on the surface of the workpiece, wherein the laser beam irradiation step is a step of irradiating the processing center of the stage with the laser beam Moving the laser beam from the first control point to the second control point and moving the laser beam from the first control point to the second control point in a different path within the same time as the machining center of the stage.

Further, the three-dimensional laser irradiation method may further include a synchronization step of determining whether or not the machining center of the stage and the laser beam are located on the same control point.

The laser beam irradiation step may include setting a position of the stage on a path connecting between the control points to set an end vector and setting a scanning length for each axis of the three dimensional rectangular coordinate system in the end vector direction, Setting a scanning volume of the shape, and irradiating the laser beam with the surface of the work piece belonging to the scanning volume confined to the effective machining portion.

The step of irradiating the laser beam may include transferring the stage to a three-dimensional shortest distance between the control points. The three-dimensional orthogonal coordinate system may include an x-axis, a y-axis, and a z-axis orthogonal to each other, and the axial scanning length may correspond to a scanning length in the x- and y-axis directions corresponding to the scanning area of the scanner, And a scanning length in the z-axis direction corresponding to a negative focus adjustable distance.

The laser beam irradiation step may include moving the stage along at least one coordinate axis of a three-dimensional orthogonal coordinate system including x-axis, y-axis, and z-axis orthogonal to each other, or at least one of coordinate axes of the three- Wherein the path correcting step includes calculating a position error of the stage according to the following condition to correct the path to the scanner or the variable focus point.

Figure pat00001

here

Figure pat00002
Where P stxi is the x direction error of the stage, P styi is the y direction error of the stage, P stzi is the z direction error of the stage, dx i , dy i , dz i are position errors, and θ i , i is an angle error,
Figure pat00003
to be.

The present invention can improve not only the process speed but also the error by transferring the stage and the scanner in cooperation with each other.

1 is a configuration diagram showing a three-dimensional laser irradiation apparatus according to an embodiment of the present invention.
2 is a perspective view illustrating a stage according to an embodiment of the present invention.
3 is a block diagram showing a part of a three-dimensional laser irradiation apparatus according to an embodiment of the present invention.
4 is a flowchart for explaining a 3D laser irradiation method according to an embodiment of the present invention.
5 is a view showing the position error and the angular error of the stage.
6 is a view showing the movement path of the stage and the laser irradiation path of the scanner.
7 is a view showing the scanning volume formed on the surface of the workpiece.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

1 is a configuration diagram showing a three-dimensional laser irradiation apparatus according to an embodiment of the present invention.

1, a three-dimensional laser irradiating apparatus 100 according to the present embodiment includes a stage 10 on which a workpiece is mounted, a laser oscillator 21 for outputting a laser beam, A first control unit 30 for controlling the movement of the stage 10 at a first command period, an error measuring unit 40 for measuring a position error of the stage 10, A second control section 60 for controlling the movement of the scanner 23 in a shorter second command period and a compensation control section 50 for correcting the movement of the scanner 23 to compensate for the position error of the stage.

The three-dimensional laser irradiating apparatus 100 according to the present embodiment can be used as a laser scanning apparatus for moving and irradiating a laser beam along a predetermined path. The laser beam irradiating apparatus 100 can be used as a laser processing apparatus or a curing apparatus .

As shown in FIG. 2, the stage 10 is composed of a stage movable in five axes. The stage 10 includes a plurality of conveying portions that can move along a coordinate axis of a three-dimensional rectangular coordinate system, And rotating parts provided to be rotatable about at least any one of them. The three-dimensional Cartesian coordinate system includes x-axis, y-axis and z-axis orthogonal to each other.

More specifically, the stage 10 includes a first transfer part 110 provided movably in the x-axis direction with respect to the support member 120 and the support member 120, a first transfer part 110 which is movable in the z-axis direction with respect to the first transfer part 110, And a third conveying unit 150 installed to be movable in the y-axis direction with respect to the second conveying unit 130. As shown in FIG. The stage 10 is rotatable about the y-axis with respect to the first rotating portion 160 and the first rotating portion 160 arranged to be rotatable in the A direction about the x-axis with respect to the third transferring portion 150, And a second rotation part 170 installed as far as possible. Accordingly, the stage 10 is formed to move in five axes, and the workpiece 180 can be installed in the second rotation unit 170. [

The present invention is not limited to this example. The stage 10 may be connected to the scanner 23 to move the scanner 23, . That is, in this embodiment, the stage 10 can be defined as a device that moves the scanner 23 or the workpiece 180 and has a longer command period than the scanner 23. The stage 10 and the scanner 23 can combine the driving mechanisms to maintain the processing speed of the laser beam on the workpiece 180 constant.

3, the three-dimensional laser irradiation apparatus 100 includes a laser oscillator 21 and a variable focal point unit 25 for adjusting a focal distance of the laser beam 29 emitted from the laser oscillator 21, A scanner 23 for adjusting the position of the laser beam 29, and a condenser lens 26.

The scanner 23 is disposed on the path of the laser beam 29 to move the laser beam 29 and irradiate the workpiece 180. The scanner 23 includes two reflectors 23a and 23b for reflecting the incident laser beam 29. The reflectors 23a and 23b may be provided with actuators for controlling the movement of the reflectors. The scanner 23 controls the movement of the laser beam 29 in the x-axis direction and the y-axis direction using the reflecting mirrors 23a and 23b.

The variable focus portion 25 is a device for adjusting the focus of the laser beam 29 and controls the z-axis movement of the laser beam 29. The condenser lens 26 irradiates the workpiece 180 with the laser beam 29 concentrated. The second control unit 60 and the compensation control unit 50 are connected to the variable focus unit 25 to control the variable focus unit 25.

Referring to FIG. 1, the first control unit 30 is connected to the stage 10 to control the movement of the stage 10, and controls the movement of the stage 10 at a first command period. For example, the first command period may be 1 ms.

6, the control point setting unit 70 includes a control point setting unit 70 and a control point setting unit 70. The control point setting unit 70 includes a control point setting unit 70, (Shown in FIG. 7). The control points CP1, CP2, CP3,. The control point setting unit 70 generates a plurality of control points CP1, CP2, CP3, ... on the machining path in consideration of the movable distance of the stage 10 based on the input drawing.

The first control unit 30 controls the movement path of the stage 10 so that the machining center of the stage 10 moves from one control point CP1 to another control point CP1, CP2, CP3, S1 to the control points CP1, CP2, CP3 ... from one control point CP1 to another control point CP1, CP2, CP3, City) along the shortest distance. In the present description, the machining center means a reference position where machining or measurement is performed, and the movement of the stage 10 means that the machining center of the stage 10 moves.

1 and 5, the error measuring unit 40 is connected to the stage 10 to measure a movement error of the stage 10, and measures a moving path of the predetermined stage 10 and a real- And the movement error of the stage 10 is measured in real time. The error measuring unit 40 can measure the movement error of the stage 10 at the first command period. The error measuring unit 40 includes a plurality of encoders. The error measuring unit 40 includes three position encoders and two angular encoders. The position encoders measure the x-axis, y-axis, and z-axis displacements of the stage 10, and the angular encoders measure the angle of rotation in the A and B directions.

The error measuring unit 40 measures an error by comparing the surface of the stage 180 with the surface of the stage 180 that is in contact with the surface (PL, shown in Fig. 7) of the workpiece 180 at the point of the input path. As shown in FIG. 5, the position error measured by the encoder can be expressed as dx i , dy i , dz i , and the angular error can be expressed as θ i , φ i .

The error of the actual stage 10 considering the angular error can be expressed by the following equation (1).

[Equation 1]

Figure pat00004

here

Figure pat00005
P stxi is the x direction error of the stage, P styi is the y direction error of the stage, P stzi is the z direction error of the stage,
Figure pat00006
to be.

Referring to FIGS. 1 and 6, the second controller 60 forms a laser irradiation path S2 of the scanner 23 in accordance with the drawing connected to the scanner 23, and uses the scanner 23 And moves the laser beam along the laser irradiation path S2. The second control unit 60 generates an instruction in a second instruction period to control the scanner 23, wherein the first instruction period may be 10 to 1000 times the second instruction period. For example, the second command period may be 10 μs.

The compensation control unit 50 is connected to the error measuring unit 40 and the second control unit 60 and corrects the laser irradiation path S2 of the scanner 23 so as to compensate the position error of the stage 10. [ Here, the laser irradiation path S2 of the scanner 23 refers to the path through which the laser beam 29 is moved by the scanner 23, not the path through which the scanner 23 moves, The movement path is relatively determined by the movement of the stage 10 as a path through which the laser beam moves with respect to the surface of the workpiece.

The compensation control unit 50 corrects the laser irradiation path S2 of the scanner 23 so that the laser beam can be moved to the correct position by compensating the error of the stage 10 derived according to Equation 1 above . The compensation control unit 50 can receive the position error of the stage 10 in real time while the stage 10 moves and can modify the laser irradiation path S2 of the scanner 23 in real time.

The second control unit 60 controls the laser beam 29 to move between the control points CP1, CP2, CP3,. The second control unit 60 controls the scanner 23 to move the laser beam from the first control point CP1 to the second control point CP2 within the same time as the stage 10 by moving the laser beam to a different path .

The time t sc at which the laser beam travels between the control points CP1, CP2, CP3 ... by the scanner 23 and the machining center of the stage 10 move between the control points CP1, CP2, CP3 ... (T st ) can be expressed by the following equation (2).

&Quot; (2) "

Figure pat00007
,

Figure pat00008
,

Figure pat00009
,

Figure pat00010
.

Where t st, n is the time the stage moves between the nth control point, t sc, n is the time the scanner moves between the nth control point, V fa is the machining speed,

Figure pat00011
P sc, i is the laser irradiation path of the scanner,
Figure pat00012
Axis path of the stage,
Figure pat00013
Axis path of the stage,
Figure pat00014
Is the z-axis path of the stage,
Figure pat00015
Axis laser irradiation path of the scanner,
Figure pat00016
Axis laser irradiation path of the scanner,
Figure pat00017
Means the z-axis laser irradiation path of the scanner. In addition, the delay of the scanner may include a marking delay, a jump delay, and a polygon delay.

The processing speed V fa is always controlled to be constant by the second control unit 60 and the z-axis laser irradiation path of the scanner 23 is controlled by the variable focal point unit 25.

The scanner 23 and the stage 10 can be synchronized at the respective control points CP1, CP2, CP3,... If the movement times of the control points CP1, CP2, CP3, The second control unit 60 determines whether the stage 10 and the scanner 23 are located at the same control point CP1, CP2, CP3 ... and the stage 10 and the scanner 23 are located at the same control point The stage 10 and the scanner 23 are transferred to the next control points CP1, CP2, CP3,.

Referring to FIGS. 6 and 7, the 3D laser irradiation apparatus 100 may further include a scanning volume setting unit 80. The scanning volume setting unit 80 forms an imaginary reference plane MS having a rectangular shape having a width x i and a length y i in contact with the control points CP1, CP2, CP3, and (MS) set to the height (z i) the focus adjustable distance from the laser, to form a rectangular parallelepiped of the virtual, and specify it as the scanning volume (MH).

The scanning volume MH is formed in the reference plane MS as a front end face contacting with the surface PL of the workpiece 180 and the surface of the workpiece 180 belonging to the scanning volume MH is formed in the effective machining portion MT ). The second controller 60 adjusts the moving speed of the scanner 23 and the laser irradiation path so that the effective machining portion MT is overlapped.

Hereinafter, a three-dimensional laser irradiation method according to the present embodiment will be described. 4 is a flowchart for explaining a 3D laser irradiation method according to an embodiment of the present invention.

1 and 4, the laser irradiation method according to the present embodiment includes a control point generation step S101, a laser beam irradiation step S102, an error measurement step S103, a path correction step S104, Step S105.

The control point generation step S101 is performed before the laser beam irradiation step S102 and generates a plurality of control points CP1, CP2, CP3, ... on the surface of the workpiece 180 as shown in FIG. 6 . The control points CP1, CP2, CP3, ... are formed on the entire machining path and are generated in consideration of the movable distance of the stage 10 based on the input drawing.

The laser beam irradiation step S102 is a step of controlling the stage 10 and the scanner 23 so as to irradiate the laser beam while moving the processing center of the stage 10 and moving the stage 10 in a first command period, Controls the scanner (23) in a second command period shorter than the first command period to move the laser beam to irradiate the workpiece. Here, the first command period may be 10 to 1000 times the second command period, the first command period may be 1 ms, and the second command period may be 10 μs.

The laser beam irradiation step (S102) moves the machining center of the stage and the laser beam from one control point (CP1, CP2, CP3 ...) to another control point (CP1, CP2, CP3 ...). The laser beam irradiation step (S102) moves the laser beam from the first control point CP1 to the second control point CP2 in a different path within the same time as the machining center of the stage 10. The laser beam irradiation step S102 transfers the stage 10 in the three-dimensional shortest distance between the control points CP1, CP2, CP3,.

5 and 6, the laser beam irradiation step S102 sets the position of the stage 10 on the path between the control points CP1, CP2, CP3, , Sets the scanning lengths of the axes of the three-dimensional orthogonal coordinate system in the end vector direction to set the imaginary rectangular parallelepiped scanning volume MH and sets the surface of the workpiece belonging to the scanning volume MH as the effective machining portion MT The laser beam is irradiated.

Here, the three-dimensional orthogonal coordinate system includes x-axis, y-axis, and z-axis orthogonal to each other, and the scanning length of each axis includes a scanning length in the x-axis and y-axis directions corresponding to the scanning area of the scanner 23, And a scanning length in the z-axis direction corresponding to the focus adjustable distance of the lens.

The error measuring step S103 measures the position error of the stage 10 during the transfer of the stage 10. [ The error measuring step S103 compares the moving path of the stage 10 set using the plurality of encoders with the real-time position of the actual stage 10 to measure the moving error of the stage 10 in real time.

The path correction step S104 modifies the laser irradiation path of the scanner 23 so as to compensate the position error of the stage 10 while the stage 10 is moving. The path correction step (S104) controls the variable focal point unit 25, which controls the focal length of the laser beam in the second command period together with the scanner 23. The path correction step S104 calculates the position error of the stage 10 according to the following equation (1) and corrects the path to the scanner 23 or the variable focal point part 25.

[Equation 1]

Figure pat00018

here

Figure pat00019
Where P stxi is the x direction error of the stage, P styi is the y direction error of the stage, P stzi is the z direction error of the stage, dx i , dy i , dz i are position errors, and θ i , i is an angle error,
Figure pat00020
to be.

The synchronization step S105 determines whether the machining center of the stage 10 and the laser beam are located at the same control points CP1, CP2, CP3,.

The synchronization step S105 is performed when the stage 10 and the scanner 23 are positioned at the same control points CP1, CP2, CP3 ..., and the stage 10 and the scanner 23 are moved to the next control point CP1, CP2, ). If any one of the scanner 23 or the stage 10 has not yet reached the same control point CP1, CP2, CP3 ..., it is necessary to move simultaneously on the same control point CP1, CP2, CP3 ... .

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

100: laser irradiation apparatus 10: stage
21: laser oscillator 23: scanner
23a, 23b: reflector 25: variable focus portion
26: condenser lens 29: laser beam
30: first control unit 40: error measuring unit
50: compensation control unit 60: second control unit
70: Control point setting unit 80: Scanning volume setting unit
110: first transfer part 120: support member
130: second transfer part 150: third transfer part
160: first rotating part 170: second rotating part
180: Workpiece

Claims (17)

A laser oscillator outputting a laser beam;
A stage in which movement is controlled in a first command period;
A scanner disposed on a path of the laser beam and controlled by a second command period shorter than the first command period to move the laser beam and irradiate the workpiece;
A first controller coupled to the stage and controlling movement of the stage in the first command period;
An error measuring unit connected to the stage and measuring a movement error of the stage;
A second controller connected to the scanner and controlling the scanner in the second instruction period; And
A compensation control unit connected to the error measuring unit and the second controller to correct a laser irradiation path of the scanner to compensate for a movement error of the stage;
Dimensional laser irradiation device. The method according to claim 1,
The laser beam Further comprising a variable focus portion disposed on a path for controlling a focal length of the laser beam,
Wherein the second control unit and the compensation control unit are connected to the variable focus unit to control the variable focus unit. 3. The method of claim 2,
Wherein the stage includes rotation parts provided so as to be rotatable about at least any one of transfer parts movable along a coordinate axis of a three-dimensional rectangular coordinate system and coordinate axes of the three-dimensional rectangular coordinate system. The method of claim 3,
Wherein the three-dimensional Cartesian coordinate system includes x-axis, y-axis and z-axis orthogonal to each other,
The stage includes a first conveying section provided movably in the x-axis direction, a second conveying section provided movably in the y-axis direction, a third conveying section provided movably in the z-axis direction, And a second rotating part rotatably provided around the y-axis. The method of claim 3,
Wherein the scanner is capable of moving the laser beam in the x-axis direction and the y-
Wherein the variable focus portion is capable of moving the laser beam in the z-axis direction. The method according to claim 1,
Further comprising a control point setting unit for generating a plurality of control points on the surface of the workpiece,
And the second controller controls the scanner to move the laser beam from the first control point to the second control point within a time period equal to the machining center of the stage, and to move the laser beam to a different path. The method of claim 3,
A virtual reference plane in contact with the control point is formed, a virtual rectangular parallelepiped is formed by setting the focus adjustable distance of the variable focus from the reference plane to a height, and a scanning volume setting for designating the virtual rectangular parallelepiped as a scanning volume The apparatus of claim 1, The method according to claim 1,
Wherein the error measuring unit includes a plurality of position encoders for measuring the position of the stage and a plurality of angular encoders for measuring the rotation of the stage. The method according to claim 1,
Wherein the first command period is 10 to 1000 times the second command period. A laser beam irradiation step of controlling the scanner in a second command period shorter than the first command period to move the laser beam and irradiate the workpiece while controlling the movement of the stage in the first command period;
An error measuring step of measuring a position error of the stage while the stage is moving; And
A path correction step of controlling the scanner so as to compensate for a position error of the stage while the scanner moves and irradiates the laser beam, thereby modifying a path along which the laser beam travels;
Dimensional laser irradiation method. 11. The method of claim 10,
Wherein the path correcting step controls a variable focal length of the laser beam with the scanner in the second command period. 12. The method of claim 11,
Further comprising a control point generating step of generating a plurality of control points on the surface of the workpiece,
Wherein the step of irradiating the laser beam includes moving the machining center of the stage and the laser beam from the first control point to the second control point, and moving the laser beam in the same direction as the machining center of the stage, Point to the second control point. 13. The method of claim 12,
Further comprising a synchronization step of determining whether the machining center of the stage and the laser beam are located on the same control point. 13. The method of claim 12,
The laser beam irradiation step may include:
Setting a position of the stage on a path between the control points to set a front end vector,
Setting a scanning length for each axis of the three-dimensional rectangular coordinate system in the end vector direction to set a scanning volume of a virtual rectangular parallelepiped shape,
And irradiating the laser beam with the surface of the work piece belonging to the scanning volume confined to the effective machining portion. 15. The method of claim 14,
The laser beam irradiation step may include:
And transferring the stage to a three-dimensional shortest distance between the control points. 15. The method of claim 14,
Wherein the three-dimensional Cartesian coordinate system includes x-axis, y-axis and z-axis orthogonal to each other,
Wherein the axial scanning length includes a scanning length in the x-axis and y-axis directions corresponding to the scanning area of the scanner and a scanning length in the z-axis direction corresponding to a focus adjustable distance in the variable focal point. Way. 17. The method of claim 16,
The laser beam irradiation step may include:
Moving the stage along at least one coordinate axis of a three-dimensional orthogonal coordinate system including x-axis, y-axis and z-axis orthogonal to each other or rotating the stage about at least one of the coordinate axes of the three- ≪ / RTI >
The path correcting step includes:
And calculating a position error of the stage according to the following condition to correct the path to the scanner or the variable focus portion.
Figure pat00021

here
Figure pat00022
Where P stxi is the x direction error of the stage, P styi is the y direction error of the stage, P stzi is the z direction error of the stage, dx i , dy i , dz i are position errors, and θ i , i is an angle error,
Figure pat00023
to be.
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KR20180137071A (en) * 2017-06-15 2018-12-27 (주)하드램 Apparatus for 3D laser patterning
KR20210000371A (en) * 2019-06-25 2021-01-05 이노6 주식회사 Linear conveyor system control unit

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JP2004216401A (en) * 2003-01-10 2004-08-05 Sharp Corp Laser beam machining device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180137071A (en) * 2017-06-15 2018-12-27 (주)하드램 Apparatus for 3D laser patterning
KR20210000371A (en) * 2019-06-25 2021-01-05 이노6 주식회사 Linear conveyor system control unit

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