KR20170023578A - Method and Apparatus for Manufacturing Multi Array Panel - Google Patents
Method and Apparatus for Manufacturing Multi Array Panel Download PDFInfo
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- KR20170023578A KR20170023578A KR1020150118905A KR20150118905A KR20170023578A KR 20170023578 A KR20170023578 A KR 20170023578A KR 1020150118905 A KR1020150118905 A KR 1020150118905A KR 20150118905 A KR20150118905 A KR 20150118905A KR 20170023578 A KR20170023578 A KR 20170023578A
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- cell
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
A manufacturing method of a multi-array substrate and an apparatus for manufacturing the multi-array substrate are disclosed. The multi-array substrate manufacturing apparatus of the present invention can manufacture a multi-array substrate in which a plurality of individually reinforced cell substrates are adhered to one carrier substrate. When a multi-array substrate is used, reinforcement processing can be individually performed for each cell substrate, and a touch panel manufacturing process can be simultaneously performed on a plurality of cell substrates on a multi-array substrate in a touch panel manufacturing process, Therefore, not only the completeness of the reinforcing treatment of the individual cell substrate can be enhanced, but also the productivity is high and the manufacturing cost can be reduced.
Description
In order to enable the reinforcement process individually for each of the cell substrates and to simultaneously perform the touch panel fabrication process for a plurality of cell substrates in the touch panel manufacturing process, To a single carrier substrate, and a multi-array substrate manufacturing apparatus.
Among the touch panels, capacitive touch panels are widely applied to portable electronic devices such as mobile phones because they have excellent durability and multi-touch functions. In recent years, there is an increasing demand for a thin and durable touch panel for a touch panel .
The capacitance type touch panel is a method of coating a transparent electrode layer (ITO) on one side of a transparent film or glass to allow a certain amount of current to flow, and sensing a change in fine capacitance caused by touching to recognize the touch position. (OGS: One Glass Solution), which forms an ITO pattern on a cover glass instead of using an inner glass or a film formed with an ITO pattern, has been actively developed.
There are various ways to divide, but the integrated touch panel is largely classified into hybrid cover glass integral type (G1F) and cover glass integral type (G2) type. The GIF-type touch panel generates a transparent electrode pattern for Tx in a cover glass, creates a transparent electrode pattern for Rx on a separate PET (polyethylene terephthalate) film, and then bonds the glass and the film with an adhesive (OCA). On the other hand, the G2 type touch panel generates a pattern of one of Tx or Rx transparent electrodes in a cover glass, creates an insulator layer on the pattern, and then generates the remaining transparent electrode patterns.
However, if the cover glass is damaged by the G2 or G1F type touch panel, the transparent electrode formed on the cover glass is damaged and the touch operation becomes impossible. Therefore, a separate tempered glass is applied on the cover glass to protect the electrode layer A glass-glass (GG) method has been proposed.
A manufacturing method of a cover glass integrated touch panel is divided into a sheet process and a cell process.
In the sheet system, (1) a reinforcing process is performed on a large-area circular substrate (usually glass), (2) a plurality of cell regions which are actually used as a touch panel on the circular substrate are divided The touch panel manufacturing process is performed later. (3) When a plurality of cells are formed on an original substrate, the cell substrate is finally cut into cell-unit substrates (hereinafter referred to as "cell substrates").
Such a sheet method is advantageous in that productivity is high and manufacturing cost is low by performing a substrate processing process such as printing or a thin film process on a large disk basis, but it is difficult to cut a surface-enhanced disk into a cell substrate, There is a problem in that the strength of the substrate at the edge is lowered due to heat generated and the durability is weakened. There is also a problem that after the substrate processing step, the high temperature chemical strengthening treatment on the side of the cell substrate is substantially impossible.
Due to the problems of the sheet type, most cover glass integrated type touch panels are manufactured in accordance with the cell type.
The cell method is as follows: (1) First, a large-sized original plate is cut into a plurality of cell substrates, (2) a touch panel is manufactured such as placing a transparent electrode after performing chemical strengthening treatment on each cut cell substrate And the process is performed. Since the cell method performs the cutting process prior to the surface strengthening treatment, the cutting process is easy, and since the surface strengthening treatment process is performed before the substrate treatment process after the cutting, effective strengthening treatment is also performed on the side surface including the cell substrate So that the durability of the product can be improved.
However, the cell type has a disadvantage in that the manufacturing process is long, the productivity is low, and the manufacturing cost is high, compared with the sheet type, because the touch panel manufacturing process is performed on a cell substrate basis.
It is an object of the present invention to provide a method of manufacturing a multi-array substrate in which a plurality of individually reinforced cell substrates are bonded to a single carrier substrate and a multi-array substrate manufacturing apparatus thereof, So that the touch panel manufacturing process can be simultaneously performed on the plurality of cell substrates in the touch panel manufacturing process.
According to another aspect of the present invention, there is provided a method of manufacturing a multi-array substrate, the method comprising: forming a plurality of cell substrates on a single carrier substrate so as to simultaneously form layers for a touch panel on a plurality of cell substrates; Preparing a plurality of cell substrates reinforced with a plurality of cell substrates; A carrier substrate preparation step of partitioning a cell position for the plurality of cell substrates on a carrier substrate and printing a process pattern for each of the plurality of cell positions; Arranging the plurality of cell substrates at the plurality of cell locations so that the center of the cell substrate is aligned with the center of the process pattern; And bonding and bonding the plurality of cell substrates to the carrier substrate, thereby producing a multi-array substrate.
Here, it is preferable that the process pattern uses the pattern of the layer to be generated simultaneously on the plurality of cell substrates. For example, in the preparing of the carrier substrate, The process pattern can be printed at one time.
According to another embodiment, the cell substrate disposing step may include: a resin disposing step of applying a bonding resin to each of the cell substrates; Aligning the center of the cell substrate coated with the bonding resin so as to coincide with the center of the process pattern, and arranging the cell substrate at the cell position; And a cell substrate adhering step of adhering the cell substrate to the carrier substrate by curing the resin by irradiating ultraviolet rays or applying heat to the carrier substrate on which the cell substrate is disposed.
Wherein the cell substrate transfer step comprises: measuring a first distance between a first edge of the cell substrate and an edge of the process pattern opposite the first edge; Measuring a second distance between a second edge located diagonally to the first edge and an edge of the process pattern opposite the second edge; And adjusting the posture of the cell substrate such that the first distance and the second distance are equal.
The cell substrate transferring step may include a step of transferring the first and second faces forming the first corner of the cell substrate with reference to the first corner and the second corner facing each other in the diagonal direction of the cell substrate, (A1, b1) between two surfaces of the process pattern opposite to the first and second surfaces with a first camera; Measuring a distance (a2, b2) between the third and fourth faces forming the second edge and the two faces of the process pattern facing the third and fourth faces simultaneously with a second camera; And adjusting the posture of the cell substrate such that a1 = a2 and b1 = b2.
A multi-array substrate manufacturing apparatus according to another embodiment of the present invention includes a substrate stage, a resin application module, a cell placement module, and a bonding module. The substrate stage supports a carrier substrate on which a process pattern is formed for each cell position at which the plurality of cell substrates are to be arranged. The resin application module applies a bonding resin to one side of the plurality of chemically reinforced cell substrates. The cell placement module places the plurality of cell substrates coated on one side of the bonding resin with the resin application module on the carrier substrate loaded on the substrate stage. The bonding module cures the bonding resin by irradiating heat or ultraviolet rays to the carrier substrate on which the plurality of cell substrates are disposed, thereby bonding the plurality of cell substrates to the carrier substrate to complete the multi-array substrate.
In the case of using the multi-array substrate of the present invention, since the touch panel manufacturing process can be simultaneously performed on a plurality of cell substrates, each of the cell substrates is strengthened individually, Lt; / RTI >
A multi-array substrate manufacturing apparatus of the present invention generates a process pattern on a carrier substrate using a mask to be used in a touch panel manufacturing process and aligns the position of the cell substrate using the process pattern generated on the carrier substrate , The error with respect to the position of the cell substrate is remarkably reduced, thereby making it possible to manufacture the sheet type by the multi-array substrate.
Further, in the multi-array substrate manufacturing apparatus of the present invention, since the bonding resin for bonding the individual cell substrate to the carrier substrate is applied to the cell substrate using the resin transfer roller, the application process is very easily performed, It is possible to prevent the resin from being applied to other regions of the carrier substrate.
In addition, in the multi-array substrate manufacturing apparatus of the present invention, all four cell substrates can be arranged at the same time in the step of arranging the cell substrates on the carrier substrate. In this arrangement process, It is possible to simplify the structure of the conveying means by using the conveying means integrated with the conveying means.
Further, in the multi-array substrate manufacturing apparatus of the present invention, the process pattern printed on the carrier substrate may be disposed at the center of the cell substrate using only two cameras in the process of positioning the cell substrate on the carrier substrate.
1 is a perspective view of a multi-array substrate manufacturing apparatus according to an embodiment of the present invention,
FIG. 2 is a perspective view of an example of the cell placement module of FIG. 1;
Figure 3 is a top view of the cell placement module of Figure 2,
4 is a view showing a pickup unit of the cell placement module of FIG. 2,
5 is a view showing an example of a carrier substrate in which process patterns are shown,
6 is a view provided to explain a process of correcting the posture of the cell substrate on the carrier substrate, and
7 is a cross-sectional view of a resin application module according to an embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail with reference to the drawings.
The present invention utilizes the advantages of a cell type by using (1) a cell substrate that is individually chemically reinforced (i.e., tempered glass), (2) a plurality of cell substrates, A bonded multi-array substrate is manufactured, and a touch panel manufacturing process is performed on a multi-array substrate unit at a time, so that a touch panel manufacturing process is simultaneously applied to a plurality of cell substrates.
1, the
The
The
Here, the
On the
A plurality of
The reference mark 10-b is a reference coordinate of the process pattern 10-a displayed on the
In the present invention, the four
7, each of the
The
2 to 4, the
It is preferable that the first to fourth pick-up
The transfer unit is provided with a first transfer unit 131-1 for transferring the first pick-up
When the transfer of the
4, the first pick-up
Hereinafter, the operation of the
≪ Pretreatment step: Preparing the carrier substrate and the cell substrate >
A
<Resin application process>
After the
<Cell substrate transfer step>
Coordinates of cell positions on which the
Therefore, the transfer unit transfers the first pick-up
After the transfer of the
The first
On the other hand, the transfer of the
≪ Repeat of cell substrate transfer step >
The
≪ Cell glass bonding step &
When all of the
Through the above method, the
<Posture Correction of Cell Substrate>
After the
At this time, the posture correction of the cell substrate is performed in such a manner that the process pattern 10-a is positioned at the center of the
The method illustrated by way of example in FIG. 6 (a) is the first distance between the first edge 30-a and the edge of the process pattern 10-a opposite the first edge 30-a (b) between the edges of the process pattern 10-a opposed to the second edge 30-b and the second edge 30-b are coincident with each other. To this end, the first camera of the
The first distance a and the second distance b coincide with each other because the respective pick-up
In the method of FIG. 6B, the first camera of the
A process pattern 10-a is formed at the center of the
Thus, when the process pattern 10-a is aligned at the center of each
Accordingly, the method of using the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention.
Claims (14)
Preparing a plurality of chemically reinforced cell substrates;
A carrier substrate preparation step of partitioning a cell position for the plurality of cell substrates on a carrier substrate and printing a process pattern for each of the plurality of cell positions;
Arranging the plurality of cell substrates at the plurality of cell locations so that the center of the cell substrate is aligned with the center of the process pattern; And
And bonding and bonding the plurality of cell substrates to the carrier substrate to thereby produce a multi-array substrate.
Wherein the process pattern uses the pattern of the layer to be simultaneously generated on the plurality of cell substrates.
Wherein the carrier substrate preparation step prints the process pattern of the plurality of cell positions at once using a mask to be used for forming the layer.
The cell substrate disposing step may include:
A resin applying step of applying a bonding resin to each of the cell substrates;
A cell substrate transfer step of aligning the center of the cell substrate coated with the bonding resin so as to coincide with the center of the process pattern, and arranging the cell substrate at the cell position; And
And a cell substrate adhering step of adhering the cell substrate to the carrier substrate by curing the resin by irradiating ultraviolet rays or applying heat to the carrier substrate on which the cell substrate is disposed.
In the cell substrate transfer step,
Measuring a first distance between a first edge of the cell substrate and an edge of the process pattern opposite the first edge;
Measuring a second distance between a second edge located diagonally to the first edge and an edge of the process pattern opposite the second edge; And
And adjusting a posture of the cell substrate so that the first distance and the second distance are equal to each other.
In the cell substrate transfer step,
The first and second surfaces forming a first corner of the cell substrate and the first and second surfaces opposing the first and second surfaces with respect to a first corner and a second corner facing each other in the diagonal direction of the cell substrate, Measuring a distance (a1, b1) between two faces of the pattern to the first camera at the same time;
Simultaneously measuring a distance (a2, b2) between the third and fourth faces forming the second edge and the two faces of the process pattern opposite to the third and fourth faces with a second camera; And
And adjusting the posture of the cell substrate so that a1 = a2 and b1 = b2.
A substrate stage for supporting a carrier substrate on which a process pattern is formed for each cell position at which the plurality of cell substrates are to be arranged;
A resin application module for applying a bonding resin to one surface of the plurality of chemically reinforced cell substrates;
A cell placement module for placing the plurality of cell substrates coated on one side of the bonding resin with the resin application module on a carrier substrate loaded on the substrate stage; And
And a bonding module for bonding the plurality of cell substrates to the carrier substrate by curing the bonding resin by irradiating heat or ultraviolet rays to the carrier substrate on which the plurality of cell substrates are disposed.
Wherein the process pattern uses the pattern of the layer to be simultaneously generated on the plurality of cell substrates.
Wherein the carrier substrate is formed by printing a process pattern of the plurality of cell positions at one time using a mask to be used for forming the layer.
The cell placement module includes:
First to fourth pick-up units for vacuum holding and holding the cell substrates, respectively;
And a transfer unit for linearly moving the first to fourth pickup units in the x, y, and z axes or rotating the first to fourth pickup units at a desired angle (?), Respectively, Substrate manufacturing apparatus.
The transfer unit
A first transfer unit 131-1 for transferring the first pick-up unit on the x-axis, a first transfer unit 131-2 for transferring the second pick-up unit on the x-axis, A first to third transfer unit 131-3 for transferring the third pick-up unit on the x-axis, a first to fourth transfer unit 131-4 for transferring the fourth pick-up unit on the x-axis, A second transferring unit 133-1 for transferring the first transferring unit 131-1 and the first transferring unit 131-2 on the y axis, A second-2 transferring unit 133-3 for transferring the first to fourth transferring units 131-4 to 131-3 on the y-axis, a second-1 transferring unit 133-3 for transferring the second- A fourth transfer unit 135 for transferring the first to fourth pick-up units on the x-axis, and fourth to fourth transfer units 137-1, 137-2, 137- 5-1 to 5-4 transfer units 139-1, 139-2, 139-3, and 139-4 for rotating the first to fourth pickup units about the z-axis, respectively, ) Wherein the substrate is a substrate.
Wherein the cell array module is arranged at the cell position by aligning the center of the cell substrate coated with the bonding resin so as to coincide with the center of the process pattern.
And first to fourth camera units to be transported together with the first to fourth pick-up units by the transport unit,
Wherein each of the first to fourth camera units comprises:
A first camera used to measure a first distance between a first edge of the cell substrate and an edge of the process pattern opposite the first edge; And
A second camera used to measure a second distance between a second corner located diagonally to the first corner and an edge of the process pattern opposite the second corner,
Wherein the transfer unit adjusts the posture of the cell substrate so that the first distance and the second distance are the same.
And first to fourth camera units to be transported together with the first to fourth pick-up units by the transport unit,
Wherein each of the first to fourth camera units comprises:
The first and second surfaces forming a first corner of the cell substrate and the first and second surfaces opposing the first and second surfaces with respect to a first corner and a second corner facing each other in the diagonal direction of the cell substrate, A first camera used to simultaneously measure distances (a1, b1) between two faces of the pattern; And
(A2, b2) between two faces of the process pattern facing the third and fourth faces forming the second edge and the third and fourth faces, and,
Wherein the transfer unit adjusts the posture of the cell substrate so that a1 = a2 and b1 = b2.
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KR1020150118905A KR101748828B1 (en) | 2015-08-24 | 2015-08-24 | Method and Apparatus for Manufacturing Multi Array Panel |
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KR20200045776A (en) * | 2018-10-23 | 2020-05-06 | 일진디스플레이(주) | Method for Manufacturing Touch Panel |
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JP2004010911A (en) | 2002-06-03 | 2004-01-15 | Konica Minolta Holdings Inc | Method for forming transparent conductive film, and article having transparent conductive film |
JP5486969B2 (en) | 2010-03-17 | 2014-05-07 | 株式会社ジャパンディスプレイ | Manufacturing method of touch panel |
KR101213199B1 (en) * | 2012-04-24 | 2012-12-18 | 주식회사 아이.엠.텍 | Touch pannel vacuum attachment system substrate |
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KR20200045776A (en) * | 2018-10-23 | 2020-05-06 | 일진디스플레이(주) | Method for Manufacturing Touch Panel |
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