KR20170013542A

KR20170013542A - Electromagnetic Wave Shield for Rapid Transfer FPCB

Info

Publication number: KR20170013542A
Application number: KR1020150106313A
Authority: KR
Inventors: 이정철
Original assignee: 주식회사 코닉에스티
Priority date: 2015-07-28
Filing date: 2015-07-28
Publication date: 2017-02-07

Abstract

A electromagnetic wave shield for a high speed transmission mode comprises: a first insulating layer formed on an FPCB in a sputtering process; an electromagnetic wave shielding layer formed on the first insulating layer in the sputtering process; and a second insulating layer formed on the electromagnetic wave shielding layer in the sputtering process.

Description

[0001] The present invention relates to an FPCB electromagnetic wave shielding film for a high-speed transmission mode (Electromagnetic Wave Shield for Rapid Transfer FPCB)

The present invention relates to an electromagnetic wave shielding film, and more particularly to an electromagnetic wave shielding film of a flexible printed circuit board (FPCB) for a high-speed transmission mode.

In recent years, as mobile devices have become thinner and thinner, circuit boards have become more dense and finer, and as a result, signal interference (EMI) between adjacent circuits is increasing. Therefore, electromagnetic shielding is indispensable in electronic devices.

The electromagnetic wave shielding film is bonded to the surface of the FPCB, and usually comprises a metal shielding film, a metal shielding layer, and an insulating layer covering the metal shielding film.

The metal shielding layer is made by wrapping the FPCB with a conductor having a good electrical conductivity to attenuate electromagnetic waves generated inside or outside. Generally, a metal thin film such as aluminum or silver having excellent conductivity is attached, or a conductive paste in which a conductive powder is dispersed in a binder resin Or a conductive adhesive sheet in which a conductive paste is formed into a sheet is used.

Korean Patent Publication No. 2002-0025182 discloses an adhesive sheet prepared by using a composition for shielding electromagnetic waves in which a thermosetting epoxy resin, a thermosetting urethane resin, a conductive powder and a curing agent are dispersed in a solvent, and uses this as an FPCB electromagnetic shielding film. However, Korean Patent Publication No. 2002-0025182 requires steps such as cutting, contacting, laminating, and removing the adhesive sheet, and it takes a long time to perform these operations, and the working efficiency may be lowered.

In some cases, the electromagnetic shielding layer may be partially opened to expose the underlying FPCB. In this case, it is not easy to open the metal shielding film at a desired position by using an adhesive sheet as disclosed in Korean Patent Publication No. 2001-0025182. In the case of using an adhesive sheet, since a substantial part of the work is performed manually, the quality stability is lowered, and the FPCB shrinks due to the hot press process. Further, when the adhesive sheet is used, defective shielding easily occurs at the stepped portion, and in some cases, the shielding property is not uniform due to the adhesive component.

On the other hand, the electromagnetic wave shielding layer is configured to cover the FPCB as a whole. The electromagnetic wave shielding layer having such a structure does not cause a problem in the low-speed transmission mode. However, in the high-speed transmission mode of 2 to 10 gigabits (GB), for example, the transmission quality may deteriorate due to the electromagnetic shielding film. In particular, in the case of an adhesive sheet, most of the adhesive layer has conductivity, and the adhesive layer itself functions as an electromagnetic wave shielding film, resulting in deterioration of transmission quality deterioration in a high-speed transmission mode.

Disclosure of the Invention The present invention is directed to solving the problem of such an electromagnetic wave shielding layer,

First, the time required for forming the electromagnetic wave shielding film in the FPCB can be shortened,

Secondly, the electromagnetic wave shielding film can be easily formed into a desired shape,

Third, an FPCB electromagnetic shielding film for a high-speed transmission mode which does not deteriorate transmission quality due to an electromagnetic wave shielding film even in a high-speed transmission mode is provided.

In order to achieve the above object, the FPCB electromagnetic shielding film for high-speed transmission mode of the present invention may include a first insulating layer, an electromagnetic wave shielding layer, a second insulating layer, and the like.

The first insulating layer is formed on the FPCB by a sputtering process.

The electromagnetic wave shielding layer is formed on the first insulating layer or on the first insulating layer and the FPCB by a sputtering process.

The second insulating layer may be formed on the electromagnetic wave shielding layer or on the electromagnetic wave shielding layer and the first insulating layer by a sputtering process.

In the FPCB electromagnetic shielding film for a high-speed transmission mode according to the present invention, the FPCB may include a wiring region and a non-wiring region. In this case, the electromagnetic wave shielding layer can be formed thinner or more apart than the non-wiring region in the wiring region of the FPCB. In the wiring region of the FPCB, a plurality of distances of the electromagnetic wave shielding layer may be in the form of strips or islands.

In the FPCB electromagnetic shielding film for high-speed transmission mode according to the present invention, the electromagnetic wave shielding layer can be formed only in the non-wiring region of the FPCB.

In the FPCB electromagnetic shielding film for high-speed transmission mode according to the present invention, the first insulating layer can be formed thicker in the wiring region than in the non-wiring region of FPCB.

In the FPCB electromagnetic shielding film for a high-speed transmission mode according to the present invention, the first insulating layer can be formed thicker as the electromagnetic wave effect of the FPCB wiring is larger.

Another example of the FPCB electromagnetic shielding film for a high-speed transmission mode of the present invention may include an electromagnetic wave shielding layer and an insulating layer.

The electromagnetic wave shielding layer is formed on the FPCB by a sputtering process. The electromagnetic wave shielding layer may be formed thinner or more apart than the non-wiring region in the wiring region of the FPCB.

The insulating layer may be formed on the electromagnetic wave shielding layer or on the electromagnetic wave shielding layer and the FPCB by a sputtering process.

In another example of the FPCB electromagnetic wave shielding film for a high-speed transmission mode according to the present invention, the electromagnetic wave shielding layer may be formed in a plurality of strips in the form of an island in the wiring region of the FPCB.

In another example of the FPCB electromagnetic shielding film for high-speed transmission mode according to the present invention, the electromagnetic wave shielding layer may be formed only in the non-wiring region except the wiring region of the FPCB. In this case, the insulating layer may be formed by a sputtering process on the electromagnetic wave shielding layer and the FPCB.

According to the FPCB electromagnetic wave shielding film for a high-speed transmission mode of the present invention having such a structure, the degradation of transmission quality due to the electromagnetic wave shielding film in the high-speed transmission mode can be minimized.

According to the FPCB electromagnetic shielding film for high-speed transmission mode of the present invention, the time required for forming the electromagnetic wave shielding film on the FPCB can be greatly reduced.

According to the FPCB electromagnetic wave shielding film for high-speed transmission mode of the present invention, it is possible to easily form an electromagnetic wave shielding film having a desired shape, for example, an opening can be accurately formed at a desired position.

Further, the FPCB electromagnetic wave shielding film according to the present invention is shieldable up to a level difference of 150 to 200 mu m, and forms an electromagnetic wave shielding film by a sputtering process, so that the shielding property is stable.

1 shows a first embodiment of an FPCB electromagnetic shielding film according to the present invention.
2 shows a second embodiment of an FPCB electromagnetic shielding film according to the present invention.
3 shows a third embodiment of the FPCB electromagnetic wave shielding film according to the present invention.
4 shows a fourth embodiment of an FPCB electromagnetic wave shielding film according to the present invention.
5 shows a fifth embodiment of an FPCB electromagnetic wave shielding film according to the present invention.
6 shows a sixth embodiment of the FPCB electromagnetic wave shielding film according to the present invention.
7 shows a seventh embodiment of an FPCB electromagnetic wave shielding film according to the present invention.
8 shows an FPCB electromagnetic shielding film according to an eighth embodiment of the present invention.
Fig. 9 shows a ninth embodiment of the FPCB electromagnetic wave shielding film according to the present invention.
10 shows a tenth embodiment of an FPCB electromagnetic wave shielding film according to the present invention.
11 illustrates a method of forming an FPCB electromagnetic shielding film according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 shows a first embodiment of an FPCB electromagnetic shielding film according to the present invention.

The electromagnetic wave shielding film is formed on the FPCB 100 and includes a first insulating layer 200, an electromagnetic wave shielding layer 300, and a second insulating layer 400 as shown in FIG. .

As shown in Fig. 1, the FPCB 100 can include a wiring 110 for transmitting a signal and an insulating cover 120 for internally protecting the wiring 110. As shown in Fig. For convenience of explanation, in the present invention, the wiring region A is connected to the central portion of the insulating cover 120 through which the wiring 110 passes in the FPCB 100, and the non-wiring region (B) And is defined as an outer side portion of the cover 120.

The first insulating layer 200 is formed on the FPCB 100. The first insulating layer 200 is formed by a sputtering process. The first insulating layer 200 may be made of Teflon, silicone rubber, nylon thermistor, insulating PVC, capton, or the like.

It is preferable that the first insulating layer 200 is formed thicker as the influence of the electromagnetic wave by the wiring 110 of the FPCB 100 is greater.

The electromagnetic wave shielding layer 300 is formed entirely on the first insulating layer 200. The electromagnetic wave shielding layer 300 is formed by a sputtering process. The electromagnetic wave shielding layer 300 may be made of aluminum, copper, silver, nickel or the like, or a mixture of some of them may be used. Also, the electromagnetic wave shielding layer 300 may be formed by stacking a plurality of metal layers in order, for example, nickel, silver, and nickel. In this case, the lower nickel layer may be 100 to 300 angstroms, the silver layer may be 500 to 1000 angstroms, and the upper nickel layer may be 100 to 300 angstroms. The electromagnetic wave shielding layer 300 is electrically connected to a case, for example, and is grounded.

The second insulating layer 400 is formed on the electromagnetic wave shielding layer 300. The second insulating layer 400 is formed by a sputtering process. The second insulating layer 400 may be made of the same insulating material as the first insulating layer 200 or other insulating material.

In the electromagnetic wave shielding film of the first embodiment having such a configuration, since the FPCB wiring 110 located at the lower portion and the electromagnetic wave shielding layer 300 located at the upper portion are further separated by the first insulating layer 200, the electromagnetic wave shielding layer 300 ) On the wiring 110 can be reduced. As the first insulating layer 200 is thickened in the allowable range, the influence can be further reduced.

The first insulating layer 200 may be formed thicker in the wiring region A than the non-wiring region B of the FPCB 100 in the first embodiment.

2 shows a second embodiment of an FPCB electromagnetic shielding film according to the present invention.

2, the electromagnetic wave shielding film of the second embodiment includes a first insulating layer 200, an electromagnetic wave shielding layer 300, and a second insulating layer 400. Unlike the first embodiment, The electromagnetic wave shielding layer 300 can be formed only in the non-wiring region B of the FPCB 100. [

Thus, when the electromagnetic wave shielding layer 300 is formed only in the non-wiring region B of the FPCB 100, the influence of the electromagnetic wave shielding layer 300 on the wiring 110 can be further reduced.

The rest of the configuration is the same as that of the first embodiment, and therefore, the description of the remaining configuration is replaced with the description of the first embodiment.

3 shows a third embodiment of the FPCB electromagnetic wave shielding film according to the present invention.

3, the electromagnetic wave shielding film of the third embodiment includes a first insulating layer 200, an electromagnetic wave shielding layer 300, and a second insulating layer 400. Unlike the first embodiment, The electromagnetic wave shielding layer 300 can be formed not only in the non-wiring area B of the FPCB 100 but also in the area of the wiring area A where the wiring 110 does not pass.

4 shows a fourth embodiment of an FPCB electromagnetic wave shielding film according to the present invention.

As shown in Fig. 4, the electromagnetic wave shielding film of the fourth embodiment includes a first insulating layer 200, an electromagnetic wave shielding layer 300, and a second insulating layer 400.

The fourth embodiment differs from the first embodiment in that the electromagnetic wave shielding layer 300 is formed entirely on the FPCB 100 and the electromagnetic wave shielding layer 300 of the wiring region A is formed in a form . The spacing of the electromagnetic wave shielding layer 300 may be formed in the form of a plurality of strips spaced in the width direction or the longitudinal direction, or a plurality of islands spaced in all directions. Here, the plurality of strips and islands are not completely separated, but at least one side may be connected to each other to maintain electrical connection.

The influence of the electromagnetic wave shielding layer 300 on the wiring 110 can be reduced by lowering the density of the electromagnetic wave shielding layer 300 in the wiring region A of the FPCB 100 as in the fourth embodiment.

5 shows a fifth embodiment of an FPCB electromagnetic wave shielding film according to the present invention.

As shown in FIG. 5, the electromagnetic wave shielding film of the fifth embodiment may include a first insulating layer 200, an electromagnetic wave shielding layer 300, and a second insulating layer 400.

The first insulating layer 200 can be formed only in the wiring region A of the FPCB 100. The first insulating layer 200 is formed by a sputtering process.

The electromagnetic wave shielding layer 300 may be formed on the FPCB 100 of the non-wiring region B and on the first insulating layer 200. [ The electromagnetic wave shielding layer 300 may be formed thick in the non-wiring region B of the FPCB 100 and thinly formed on the first insulating layer 200 covering the wiring region A. [ The electromagnetic wave shielding layer 300 is formed by a sputtering process.

The second insulating layer 400 is stacked on the electromagnetic wave shielding layer 300. The second insulating layer 400 is formed by a sputtering process.

When the electromagnetic wave shielding layer 300 is formed thinly in the wiring region A of the FPCB 100 and the first insulating layer 200 is formed below the electromagnetic wave shielding layer 300, Can be reduced.

6 shows a sixth embodiment of the FPCB electromagnetic wave shielding film according to the present invention.

6, the electromagnetic wave shielding film of the sixth embodiment includes a first insulating layer 200, an electromagnetic wave shielding layer 300, and a second insulating layer 400. Unlike the fifth embodiment, The electromagnetic wave shielding layer 300 may not be formed in the wiring region A of the FPCB 100. [

If the electromagnetic wave shielding layer 300 is not formed in the wiring region A of the FPCB 100 as described above, the influence of the electromagnetic wave shielding layer 300 on the wiring 110 can be further reduced.

7 shows a seventh embodiment of an FPCB electromagnetic wave shielding film according to the present invention.

7, the electromagnetic wave shielding film of the seventh embodiment may include the electromagnetic wave shielding layer 300 and the second insulating layer 400. [

The electromagnetic wave shielding layer 300 is formed on the FPCB 100 and is not formed in the wiring region A but can be formed only in the non-wiring region B. The electromagnetic wave shielding layer 300 is formed by a sputtering process.

The second insulating layer 400 may be formed on the FPCB 100 and the electromagnetic wave shielding layer 300. The second insulating layer 400 is formed by a sputtering process.

8 shows an FPCB electromagnetic shielding film according to an eighth embodiment of the present invention.

8, the electromagnetic wave shielding film of the eighth embodiment includes an electromagnetic wave shielding layer 300 and a second insulating layer 400. In contrast to the seventh embodiment, the electromagnetic wave shielding layer 300 is formed of FPCB Can be formed only in the non-wiring region (B) of the wiring substrate (100) and only in the wiring region (A) where the wiring (110) does not pass.

Fig. 9 shows a ninth embodiment of the FPCB electromagnetic wave shielding film according to the present invention.

As shown in Fig. 9, the electromagnetic wave shielding film of the ninth embodiment includes the electromagnetic wave shielding layer 300 and the second insulating layer 400.

The electromagnetic wave shielding layer 300 may be entirely formed on the FPCB 100 and the electromagnetic wave shielding layer 300 of the wiring region A may be formed in a plurality of spaces. The spacing of the electromagnetic wave shielding layer 300 may be configured as a plurality of strips spaced in the width direction or the length direction, and a plurality of islands spaced in four directions.

10 shows a 10th embodiment of the FPCB electromagnetic wave shielding film according to the present invention.

10, the electromagnetic wave shielding layer 300 is entirely formed on the non-wiring region B of the FPCB 100 and the second insulating layer 400, and the non-wiring region B of the FPCB 100 ), And it can be formed thin in the wiring region (A) of the FPCB (100).

The second insulating layer 400 may be formed on the electromagnetic wave shielding layer 300.

11 illustrates a method of forming an FPCB electromagnetic shielding film according to the present invention.

In step S11, a first insulating layer 200 is first formed on the FPCB 100 by a sputtering process. A first insulator, which is a layered material of the first insulating layer 200, is mounted with a target. After the FPCB 100 is mounted on the carrier, it is inserted into the process chamber. An inert gas such as argon or xenon is injected into the process chamber while maintaining the inside of the process chamber at a process pressure.

With the carrier grounded, a cathode high voltage is applied to the cathode. At this time, the cathode high voltage may be a DC voltage or a pulse voltage. When a high voltage is applied between the cathode part and the carrier, argon or xenon gas is ionized to become a plasma state. Ionized argon ions (Ar ⁺ ) are accelerated by high voltage and impinge on the target. At this time, the insulator ions protrude from the target and move in the carrier direction, and the first insulator is laminated on the FPCB 100 to form the first insulator layer 200.

In step S13, the electromagnetic wave shielding layer 300 is formed on the first insulating layer 200. [ The electromagnetic wave shielding layer 300 may be formed in the same manner as the formation of the first insulating layer 200. The formation of the electromagnetic wave shielding layer 300 can usually be performed in a process chamber different from the process chamber of the first insulating layer 200.

In the case of forming strips, islands, etc. in the formation of the electromagnetic wave shielding layer 300, a mask having a pattern of strips or islands can be used.

The second insulating layer 400 is formed on the electromagnetic wave shielding layer 300 or on the electromagnetic wave shielding layer 300 and the first insulating layer 200 in step S15. The formation of the second insulating layer 400 may be performed in the same manner as the formation of the first insulating layer 200. The second insulating layer 400 may be formed in a process chamber different from the process chamber of the first insulating layer 200 or the electromagnetic wave shielding film 300.

Although the present invention has been described based on various embodiments, it is intended to exemplify the present invention. Those skilled in the art will appreciate that the above embodiments may be modified or modified in other forms based on the above embodiment. However, such variations and modifications may be construed to be included in the following claims.

100: FPCB 110: Wiring
120: Insulation cover A: wiring area
B: non-wiring region 200: first insulating layer
300: electromagnetic wave shielding layer 400: second insulating layer

Claims

In the FPCB electromagnetic shielding film for the high-speed transmission mode,
A first insulating layer formed on the FPCB by a sputtering process;
An electromagnetic wave shielding layer formed on the first insulating layer by a sputtering process;
And a second insulating layer formed on the electromagnetic wave shielding layer by a sputtering process.

The method according to claim 1,
Wherein the FPCB includes a wiring region and a non-wiring region,
Wherein the electromagnetic wave shielding layer has a wiring region of the FPCB thinner or more spaced than the non-wiring region.

3. The method of claim 2,
Wherein the electromagnetic wave shielding layer formed in a plurality of spaces in the FPCB wiring region has a strip or an island shape.

The method according to claim 1,
Wherein the FPCB includes a wiring region and a non-wiring region,
Wherein the electromagnetic wave shielding layer is formed only in the non-wiring region of the FPCB.

The method according to claim 1,
Wherein the FPCB includes a wiring region and a non-wiring region,
Wherein the first insulating layer forms a wiring region thicker than a non-wiring region of the FPCB.

The method according to claim 1,
Wherein the FPCB includes a wiring region and a non-wiring region,
Wherein the first insulating layer is thicker as the influence of electromagnetic waves in the wiring region of the FPCB is greater.

In the FPCB electromagnetic shielding film for the high-speed transmission mode,
An electromagnetic wave shielding layer formed on the FPCB by a sputtering process, the electromagnetic wave shielding layer being thinner or more spaced from the non-wiring region in the wiring region of the FPCB;
And an insulating layer formed on the electromagnetic wave shielding layer or on the electromagnetic wave shielding layer and the FPCB by a sputtering process.

8. The method of claim 7,
Wherein the electromagnetic wave shielding layer formed in a plurality of spaces in the FPCB wiring region has a strip or an island shape.

In the FPCB electromagnetic shielding film for the high-speed transmission mode,
An electromagnetic wave shielding layer formed on the FPCB by a sputtering process and formed only in a non-wiring region of the FPCB;
And an insulating layer formed on the FPCB and the electromagnetic wave shielding layer by a sputtering process.