KR20170004430A - Microphone package - Google Patents

Microphone package Download PDF

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Publication number
KR20170004430A
KR20170004430A KR1020150094763A KR20150094763A KR20170004430A KR 20170004430 A KR20170004430 A KR 20170004430A KR 1020150094763 A KR1020150094763 A KR 1020150094763A KR 20150094763 A KR20150094763 A KR 20150094763A KR 20170004430 A KR20170004430 A KR 20170004430A
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KR
South Korea
Prior art keywords
base substrate
coupling member
acoustic
transducer
present
Prior art date
Application number
KR1020150094763A
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Korean (ko)
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KR101731043B1 (en
Inventor
김재명
박두영
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(주)파트론
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Priority to KR1020150094763A priority Critical patent/KR101731043B1/en
Publication of KR20170004430A publication Critical patent/KR20170004430A/en
Application granted granted Critical
Publication of KR101731043B1 publication Critical patent/KR101731043B1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A microphone package of the present invention includes a base substrate having acoustic holes formed of a plurality of micro holes, a transducer positioned to cover at least a part of the acoustic holes in the upper surface of the base substrate, A mounting substrate formed on a lower surface of the base substrate, and a mounting substrate coupled to the base substrate by the coupling member and having an inlet hole at a position facing the acoustic hole, the cover including an inner space for accommodating the transducer .

Description

Microphone package {MICROPHONE PACKAGE}

The present invention relates to a microphone package, and more particularly, to a microphone package for converting an acoustic signal into an electrical signal.

Microphone packages are used in various electronic devices such as smart phones, tablet computers, etc. Recently, such electronic devices are becoming smaller and thinner. As a result, various components mounted on the microphone and the like are also becoming smaller.

The microphone package is a structure in which a housing has an internal space and a transducer is accommodated in the internal space for converting an acoustic signal into an electric signal. The acoustic signal is introduced into the space inside the housing through the acoustic hole of the housing. The incoming acoustic signal causes the diaphragm of the transducer to vibrate, and the transducer senses such vibration and generates an electrical signal.

The microphone package can be classified according to the position where the acoustic hole and the transducer are disposed. Specifically, the front type in which the acoustic hole and the transducer are disposed in different directions, the acoustic hole and the transducer are arranged in the same direction, A rear type microphone package is disclosed in Korean Patent No. 10-1320574 (registered on October 15, 2013).

The rear type microphone package is disposed relatively close to the acoustic hole and the transducer, so that the flux, which may occur during the mounting of the foreign body or the microphone package, may penetrate into the acoustic hole and damage the transducer. A microphone package having a structure for solving the problem is required.

A problem to be solved by the present invention is to provide a microphone package that can prevent a transducer from being damaged by foreign matter introduced from the outside.

Another problem to be solved by the present invention is to provide a microphone package capable of improving acoustic characteristics of a microphone with high durability.

Another object to be solved by the present invention is to provide a microphone package of a configuration that can facilitate mounting of a microphone on an electronic device.

According to an aspect of the present invention, there is provided a microphone package including: a base substrate having acoustic holes formed of a plurality of microholes; a transducer positioned to cover at least a part of the acoustic holes on an upper surface of the base substrate; A cover for forming an inner space for accommodating the transducer, a coupling member formed on a bottom surface of the base substrate, and a mounting substrate coupled to the base substrate by the coupling member and having an inlet hole at a position facing the acoustic hole do.

In an embodiment of the present invention, the coupling member may be formed to surround the acoustic hole.

In one embodiment of the present invention, the engaging member may be formed at an edge of the bottom surface of the base substrate.

In an embodiment of the present invention, the engaging member may form a closed curve on a lower surface of the base substrate.

In an embodiment of the present invention, the coupling member may seal between the base substrate and the mounting substrate.

In an embodiment of the present invention, the coupling member may be formed of a solder.

In one embodiment of the present invention, the fine holes may have a diameter of 25 mu m to 100 mu m.

In one embodiment of the present invention, the periphery of the acoustic hole of the base substrate may be formed as a thin portion having a thickness thinner than that of the base substrate.

In one embodiment of the present invention, the boundary portion between the thin portion and the periphery of the thin portion may be formed stepwise.

In one embodiment of the present invention, the stepped portion may be formed on the upper surface of the base substrate.

In one embodiment of the present invention, the stepped portion may be formed on a lower surface of the base substrate.

In one embodiment of the present invention, the peripheral portion of the thin portion is formed to a thickness of 50 to 200 탆, and the thin portion may be formed to a thickness of 40% to 75% of the thickness of the adjacent portion.

The microphone package according to the embodiment of the present invention can prevent the transducer from being damaged by foreign matter introduced from the outside.

In addition, the microphone package according to an embodiment of the present invention can improve the acoustic characteristics of the microphone with high durability

In addition, the microphone package according to an embodiment of the present invention is a structure that facilitates mounting a microphone on an electronic device.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.
2 is a bottom view of a bottom surface of a base substrate in a state where a coupling member of a microphone package according to an embodiment of the present invention is coupled.
3 is a cross-sectional view of a microphone package according to another embodiment of the present invention.
4 is a bottom view illustrating a bottom surface of a base substrate in a state where a coupling member of a microphone package according to an embodiment of the present invention is coupled.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that adding a detailed description of a technique or a configuration already known in the field can make the gist of the present invention unclear, some of it will be omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express the embodiments of the present invention, which may vary depending on the person or custom in the relevant field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, a microphone package according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 attached hereto.

1 is a cross-sectional view of a microphone package according to an embodiment of the present invention.

Referring to FIG. 1, a microphone package of the present invention includes a base substrate 100, a transducer 200, a cover 300, and a mounting substrate 400.

The base substrate 100 is formed in a flat plate shape. The base substrate 100 may have a rectangular shape in top and bottom. Terminals 101 and 102 may be formed on the upper surface and the lower surface of the base substrate 100, respectively. The terminal 101 on the upper surface of the base substrate 100 is connected to the transducer 200 and / or the ASIC 250 mounted on the upper surface of the base substrate 100 to transmit electric signals or supply power. The terminal 102 on the lower surface of the base substrate 100 may be an input / output terminal connected to the mounting substrate 400 to transmit an electric signal or supply power. The terminals 101 on the upper surface of the base substrate 100 and the terminals 102 on the lower surface may be electrically connected to each other by via holes (not shown) passing through the base substrate 100. In the base substrate 100, the base substrate 100 may be formed of a printed circuit board (PCB).

An acoustic hole 110 is formed in the base substrate 100. The acoustic holes 110 are formed to penetrate the upper surface and the lower surface of the base substrate 100. An external acoustic signal can be introduced into the interior of the microphone package through the acoustic hole 110.

Here, the acoustic hole 110 is formed of a plurality of fine holes 111. It is preferable that the fine holes 111 are densely formed in one portion of the base substrate 100. The fine holes 111 may have a diameter of 25 mu m to 100 mu m.

The portion of the base substrate 100 in which the fine holes 111 are densely formed may be formed as a thin portion 120 having a thickness thinner than other portions of the peripheral portion.

The base substrate 100 in the vicinity of the thin portion 120 may be formed of a substrate having a thickness of 50 mu m to 200 mu m. The thin portion 120 may be formed to a thickness of 40% to 75% of the thickness of the adjacent base substrate 100. Specifically, the thin portion 120 may be formed to a thickness of 20 占 퐉 to 150 占 퐉.

A step may be formed at a boundary portion between the thin portion 120 and other peripheral portions. Although it is shown in FIG. 1 that the step is formed on the lower surface of the base substrate 100, the step may be formed on both the upper surface, the lower surface, and the upper surface of the base substrate 100.

The fine holes 111 may be formed by laser drilling or punching. If the fine holes 111 are formed in the thin portion 120, it may be relatively easy to form the fine holes 111.

The frequency characteristic of the acoustic signal passing through the acoustic hole 110 by the fine holes 111 can be changed. Specifically, the frequency characteristics of the acoustic signal can be changed by the diameter, shape or number of the fine holes 111 and the like. Therefore, the designer can adjust the characteristics of the fine holes 111 to tune the acoustic characteristics of the microphone.

In addition, the inside of the microphone can be protected by the fine holes 111. In particular, the acoustic holes 110 in which the plurality of microholes 111 are formed may be less likely to infiltrate foreign matter, dust, moisture, etc. from the outside than a structure in which one relatively large opening is formed. Accordingly, the inner space of the microphone package can be protected.

A transducer (200) is an element that receives an acoustic signal and converts it into an electrical signal. The transducer 200 may be, but is not limited to, an electret transducer, a MEMS transducer, or a piezoelectric transducer. The transducer 200 is mounted on the terminal 101 on the upper surface of the base substrate 100 and is electrically connected.

A transducer (200) is formed around the acoustic hole (110) of the base substrate (100). Specifically, the transducer 200 is positioned above the acoustic hole 110 of the base substrate 100 and is positioned to cover at least a part of the acoustic hole 110. The upper surface terminal 101 of the base substrate 100 connected to the lower terminal of the transducer 200 may be formed around the acoustic hole 110. [

The transducer 200 may cover the acoustic hole 110 completely. The inner space S surrounded by the base substrate 100 and the cover 300 may be formed as a space separated from the outside of the acoustic hole 110 as the transducer 200 completely covers the acoustic hole 110 have. The divided space S is divided by the external space and the transducer 200. The separated space S may be referred to as a back chamber.

In addition to the transducer 200, another element such as the ASIC 250 may be mounted on the inner space S.

The cover 300 is coupled with the base substrate 100 to form an inner space S. The cover 300 may include a top surface portion and a side surface portion. The upper surface portion is disposed so as to face the upper surface of the base substrate 100 in a spaced apart relationship, and the side surface portion extends downward from the outer surface of the upper surface portion to connect the upper surface portion to the base substrate 100. A flange portion that abuts and engages with the base substrate 100 may be formed at the lower end of the side portion. The upper surface portion and the side surface portion may be integrally formed, or may be separately formed and then joined.

The cover 300 may be formed of a metal material. The cover 300 may be formed of, for example, one or a combination of two or more materials selected from brass, bronze or phosphor bronze.

The microphone package including the base substrate 100, the transducer 200, and the cover 300 is mounted on the mounting substrate 400. The mounting substrate 400 is coupled to the base substrate 100 and the lower surface. The mounting substrate 400 may be a substrate of an electronic device on which the microphone package is mounted. The mounting substrate 400 may be formed to have a size larger than that of the base substrate 100. The mounting substrate 400 is formed in a flat plate shape like the base substrate 100.

The mounting substrate 400 has an inlet hole 410 formed therein. The inlet hole 410 is formed at a position opposite to the acoustic hole 110 when the microphone package is mounted on the mounting substrate 400. The inlet hole 410 is preferably formed to be the same or similar in shape and size to the acoustic hole 110. When the acoustic holes 110 and the inlet holes 410 are opposed to each other, an acoustic signal passes through the inlet hole 410 and the acoustic hole 110 and flows into the internal space below the mounting substrate 400.

The base substrate 100 and the mounting substrate 400 are coupled by the coupling member 500. The joining member 500 is positioned between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 to couple the two.

Referring to FIG. 2, the coupling member 500 is coupled to the lower surface of the base substrate 100. 2 is a bottom view of a bottom surface of a base substrate in a state where a coupling member of a microphone package according to an embodiment of the present invention is coupled.

Referring to FIG. 2, the coupling member 500 may be formed to surround the acoustic hole 110 on the lower surface of the base substrate 100. The coupling member 500 may be formed as a closed curve surrounding the acoustic hole 110 while maintaining a predetermined gap with the acoustic hole 110. Accordingly, A closed region can be formed on the lower surface of the substrate 100. The input and output terminals 102 of the lower surface of the base substrate 100 are connected to the outside of the closed region as the coupling member 500 is formed around the acoustic hole 110. [ .

1, a gap G corresponding to the thickness of the coupling member 500 is formed as the coupling member 500 is positioned between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 And the gap G in the vicinity of the acoustic hole 110 and the inlet hole 410 is sealed by the coupling member 500. [ The space between the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400 near the acoustic hole 110 and the inlet hole 410 is opened only to the acoustic hole 110 and the inlet hole 410, The acoustic signal flowing into the inlet hole 410 from the outside does not flow out to the other place but proceeds only to the acoustic hole 110. In addition, The acoustic signal does not flow into the acoustic hole 110. This can help improve the acoustic characteristics of the microphone.

The joining member 500 may be formed of a solder. The coupling member 500 may be formed as a microphone package is mounted on the mounting substrate 400 by Surface Mount Technology (SMT). The coupling member 500 may be melted in the process of being formed, Flux can occur. The flux can bounce in a random direction, some of which can bounce in the direction of the acoustic hole 110. If the flux enters the acoustic hole 110 and contacts the transducer 200, the transducer 200 may be damaged. However, in the present invention, since the acoustic hole 110 is composed of the plurality of fine holes 111, the probability that the flux passes through the acoustic hole 110 and contacts the transducer 200 is relatively low. It is possible to suppress damage to the battery 200.

The joining member 500 may be formed of a metal such as tin, copper, or aluminum as well as lead. In some cases, the coupling member 500 may be formed of a curable resin material.

The coupling member 500 may electrically connect the lower surface of the base substrate 100 and the upper surface of the mounting substrate 400, as the case may be. More specifically, electrodes may be formed on the lower surface of the base substrate 100 to which the coupling member 500 is coupled and the upper surface of the mounting substrate 400, respectively. The coupling member 500 may be formed of a conductive material and may be coupled to the electrodes to electrically connect the electrodes. In some cases, the coupling member 500 can transfer electrical signals or electric power between the base substrate 100 and the mounting substrate 400. The coupling member 500 may be electrically connected to the ground terminal formed on the mounting substrate 400 and connected to the base substrate 100.

Hereinafter, a microphone package according to another embodiment of the present invention will be described with reference to FIGS. 3 and 4. FIG.

In describing the present embodiment, description will be made mainly on the points different from the above-described embodiment with reference to Figs. 1 and 2. Fig.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a microphone package, and more particularly, to a microphone package according to another embodiment of the present invention.

3 and 4, the joining member 500 is coupled to the rim portion of the lower surface of the base substrate 100. [ The coupling member 500 and the acoustic hole 110 may be spaced apart by a predetermined distance as the coupling member 500 is coupled to the bottom of the bottom surface of the base substrate 100.

Therefore, as the coupling member 500 is maximally spaced from the acoustic hole 110, the flux that may be generated when the coupling member 500 is melted can be suppressed as much as possible from flowing into the acoustic hole 110. As a result, damage to the transducer 200 due to the flux can be minimized.

When the engaging member 500 is formed as a rim portion of the lower surface of the base substrate 100, a closed region formed by the closed curve of the engaging member 500 is formed larger than that shown in Fig. Output terminals 102 of the base substrate 100 are located in the closed region as well as the acoustic holes 110. The microphone package is mounted on the mounting substrate 400 after the input and output terminals 102 Can be minimized from being damaged due to penetration of foreign matter or the like.

1, when the edge portion of the lower surface of the base substrate 100 is formed, the sealing gap G, which is communicated with the acoustic hole 110 and the inlet hole 410, . Therefore, the frequency characteristics of the acoustic signal can be changed by changing the shape and volume of the sealed gap (G) space. Thus, the characteristic of the acoustic signal received by the transducer 200 can be changed. By controlling such changes, the reception sensitivity and acoustic characteristics of the microphone can be adjusted.

The embodiments of the microphone package of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: base substrate 110: acoustic hole
111: fine hole 120: thin portion
200: Transducer 250: ASIC
300: cover 400: mounted substrate
500: coupling member

Claims (12)

A base substrate having acoustic holes formed of a plurality of micro holes;
A transducer positioned to cover at least a portion of the acoustic hole in an upper surface of the base substrate;
A cover coupled to the base substrate to define an inner space for receiving the transducer;
A coupling member formed on a bottom surface of the base substrate; And
And a mounting substrate coupled to the base substrate by the coupling member and having an inlet hole at a position facing the acoustic hole. The method according to claim 1,
And the coupling member is formed so as to surround the periphery of the acoustic hole. The method according to claim 1,
Wherein the coupling member is formed at an edge portion of the bottom surface of the base substrate. The method according to claim 1,
Wherein the coupling member forms a closed curve on a lower surface of the base substrate. The method according to claim 1,
Wherein the coupling member seals between the base substrate and the mounting substrate. The method according to claim 1,
Wherein the coupling member is formed of a solder. The method according to claim 1,
Wherein the microhole has a diameter of 25 mu m to 100 mu m. The method according to claim 1,
Wherein a periphery of the acoustic hole of the base substrate is formed as a thin portion having a thickness thinner than that of the base substrate. 9. The method of claim 8,
And a boundary portion between the thin portion and the periphery of the thin portion is stepped. 10. The method of claim 9,
Wherein the stepped portion is formed on an upper surface of the base substrate. 10. The method of claim 9,
Wherein the stepped portion is formed on a bottom surface of the base substrate. 9. The method of claim 8,
The peripheral portion of the thin portion is formed to a thickness of 50 to 200 탆,
Wherein the thin portion is formed to a thickness of 40% to 75% of the thickness of the adjacent portion.
KR1020150094763A 2015-07-02 2015-07-02 Microphone package KR101731043B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150094763A KR101731043B1 (en) 2015-07-02 2015-07-02 Microphone package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150094763A KR101731043B1 (en) 2015-07-02 2015-07-02 Microphone package

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KR20170004430A true KR20170004430A (en) 2017-01-11
KR101731043B1 KR101731043B1 (en) 2017-04-27

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101938584B1 (en) * 2017-10-20 2019-01-15 소스트 주식회사 Mems microphone
KR102350882B1 (en) * 2020-10-29 2022-01-13 (주)다빛센스 Microphone device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
JP2007060285A (en) * 2005-08-24 2007-03-08 Matsushita Electric Works Ltd Silicon microphone package
WO2012088688A1 (en) * 2010-12-30 2012-07-05 Goertek Inc. A mems microphone and method for packaging the same

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