KR20160143176A - Light emitting diode module and light emitting apparatus - Google Patents

Light emitting diode module and light emitting apparatus Download PDF

Info

Publication number
KR20160143176A
KR20160143176A KR1020150079401A KR20150079401A KR20160143176A KR 20160143176 A KR20160143176 A KR 20160143176A KR 1020150079401 A KR1020150079401 A KR 1020150079401A KR 20150079401 A KR20150079401 A KR 20150079401A KR 20160143176 A KR20160143176 A KR 20160143176A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting diode
substrate
diode chips
chips
Prior art date
Application number
KR1020150079401A
Other languages
Korean (ko)
Inventor
정재혜
한상석
이성혁
Original Assignee
서울바이오시스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울바이오시스 주식회사 filed Critical 서울바이오시스 주식회사
Priority to KR1020150079401A priority Critical patent/KR20160143176A/en
Publication of KR20160143176A publication Critical patent/KR20160143176A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting diode module and a light emitting apparatus. The light emitting diode module according to an embodiment of the present invention comprises: a substrate which has a length in one direction; a light emitting diode unit which is installed on the substrate; first and second connectors which are installed on the substrate to supply power supplied from the outside of the light emitting diode unit, wherein the light emitting diode unit includes a plurality of light emitting diode chips are arranged in the length direction of the substrate, and a plurality of second light emitting diode chips which are separated from the first light emitting diode chips at a predetermined distance and are arranged in the length direction of the substrate, wherein a distance (d1) from the end of the substrate to the first light emitting diode chips may be a half (d1=d2x0.5) of a distance (d2) between the first light emitting diode chips and the second light emitting diode chips. According to the present invention, the light emitting diode module in which a plurality of light emitting diode chips are disposed to be separated from each other at a predetermined interval is used, a plurality of light emitting diode modules are connected as necessary, and it is possible to easily operate the light emitting apparatus.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light emitting diode (LED)

The present invention relates to a light emitting diode module and a light emitting device, and more particularly, to a light emitting diode module and a light emitting device having a plurality of light emitting diode chips.

Light emitting diodes are one of the inorganic semiconductor devices that emit light generated by the recombination of electrons and holes. UV light emitting diodes can be used as UV curing, sterilization, white light sources, medical fields and equipment parts. Also, the use range thereof is increasing. In particular, a deep ultraviolet light emitting diode emitting a shorter wavelength than a near ultraviolet light emitting diode emitting light having a peak wavelength in the range of about 340 nm to 420 nm has a strong luminescence intensity against light in the UV-C region. At this time, the deep ultraviolet ray is a light having a peak wavelength in a range of about 340 nm or less, particularly a light having a peak wavelength in a range of about 200 nm to 340 nm.

Such deep ultraviolet light emitting diodes are widely used in ultraviolet curing apparatuses and the like. As described above, it is important that light emitted from the ultraviolet light emitting diode has a higher energy than that of visible light, and that the emitted light emits high energy at a short distance. Accordingly, conventional ultraviolet curing apparatuses use a plurality of ultraviolet light emitting diodes arranged on a substrate.

However, since a plurality of ultraviolet light emitting diodes used in a conventional curing apparatus and the like use a plurality of light emitting diodes on one substrate, if a problem occurs in any of a plurality of light emitting diodes, the entire ultraviolet light emitting diode is difficult to use.

A problem to be solved by the present invention is to provide a light emitting diode module and a light emitting device which can be conveniently replaced when there is a problem in any one of a plurality of light emitting diodes used in a curing apparatus or the like.

A light emitting diode module according to an embodiment of the present invention includes: a substrate having a length in one direction; A light emitting diode unit provided on the substrate; And a plurality of first light emitting diode chips arranged in the longitudinal direction of the substrate, wherein the plurality of first light emitting diode chips are arranged in the longitudinal direction of the substrate, ; And a plurality of second light emitting diode chips spaced apart from the plurality of first light emitting diode chips by a predetermined distance and arranged in the longitudinal direction of the substrate, wherein the plurality of first light emitting diode chips The distance d1 may be half the distance d2 between the plurality of first light emitting diode chips and the plurality of second light emitting diode chips (d1 = d2 0.5).

The plurality of first light emitting diode chips and the plurality of second light emitting diode chips may be mounted on the substrate, and the substrate may include a plurality of first and second light emitting diode chips, And a plurality of conductive patterns to be electrically connected to the second light emitting diode chip may be formed.

And the first and second connectors may be electrically connected to the first and second connectors, respectively, provided on another substrate disposed adjacent to the substrate.

The plurality of first light emitting diode chips are spaced apart from each other by a predetermined distance, and the distance d3 between the first light emitting diode chips is greater than the distance d3 between the first light emitting diode chip and the second May be equal to the distance d2 of the light emitting diode chips (d3 = d2).

In addition, the substrate may be made of metal or ceramic, and may further include a cover covering the light emitting diode. Here, the cover may be anti-reflection (AR) coating on the surface.

The plurality of first and second light emitting diode chips may emit ultraviolet rays, and the plurality of first and second light emitting diode chips may include light emitting diode chips emitting light of different wavelengths.

The light emitting device according to an embodiment of the present invention includes a first substrate, a plurality of first light emitting diode chips provided on the first substrate, and a first connector for supplying power to the first light emitting diode chip A first light emitting diode module; And a second light emitting diode module including a second substrate, a plurality of second light emitting diode chips provided on the second substrate, and a second connector portion for supplying power to the second light emitting diode chip, The distance between the first and second LED chips may be the same as the distance between the first LED chip and the second LED chip.

In this case, the first light emitting diode module and the second light emitting diode module may be electrically connected in series or in parallel, and the first and second light emitting diode chips may emit ultraviolet rays.

According to the present invention, by using the light emitting diode modules arranged so that a plurality of light emitting diode chips are spaced apart from each other by a predetermined distance, the light emitting diode chips can be equally spaced even if a plurality of light emitting diode modules are connected as needed The irradiation amount of the light emitting diode per unit area can be the same, and the operation of the light emitting device can be made convenient. In particular, even if an error occurs in one light emitting diode module in a light emitting device in which a plurality of light emitting diodes are connected in series or in parallel, only the corresponding light emitting diode module can be used for replacement, thereby effectively managing the light emitting device.

1 is a perspective view illustrating a light emitting diode module according to an embodiment of the present invention.
2 is a plan view showing a light emitting diode module according to an embodiment of the present invention.
3 is a perspective view illustrating a light emitting device according to an embodiment of the present invention.
4 is a graph illustrating a simulation result using a light emitting diode module according to an embodiment of the present invention.
5 is a graph showing simulation results using a light emitting device according to an embodiment of the present invention.

Preferred embodiments of the present invention will be described more specifically with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a light emitting diode module according to an embodiment of the present invention, and FIG. 2 is a plan view illustrating a light emitting diode module according to an embodiment of the present invention.

1 and 2, the light emitting diode module 100 of the present invention includes a substrate 110, a light emitting diode 120, first and second connectors 132 and 134, and a cover 140 .

The substrate 110 may have a plurality of conductive patterns for mounting the light emitting diode 120 and electrically connecting the light emitting diode 120 to the surface of the substrate 110. A plurality of conductive patterns may be electrically connected to the first and second connectors 132 and 134 in a state that the conductive patterns are formed on the substrate 110. [ In addition, the substrate 110 may be a printed circuit board (PCB), and a reflector (not shown) may be formed on the substrate 110. In one embodiment of the present invention, the substrate 110 may be formed in a longitudinal direction in one direction. And the light emitting diode 120 may be disposed at an intermediate portion of the longitudinal direction.

The substrate 110 may include an insulating material, and may include a material having a high thermal conductivity. For example, it may include a high thermal conductive polymer material or a ceramic material, and may include an AlN ceramic. Accordingly, when the light emitting diode module 100 is driven, heat generated from the light emitting diode unit 120 can be effectively radiated to the outside through the substrate 110. Alternatively, the substrate 110 may include a metal such as aluminum (Al) and copper (Cu) as needed. If the substrate 110 includes a metal, an insulating layer may be formed between the plurality of conductive patterns and the substrate 110 so as to be insulated from the plurality of conductive patterns formed on the substrate 110. Accordingly, the heat generated in the light emitting diode unit 120 can be effectively discharged to the outside through the substrate 110.

The light emitting diode unit 120 includes a plurality of light emitting diode chips 120a and a plurality of light emitting diode chips 120a may be regularly arranged on the substrate 110 as shown in FIGS. have. At this time, the light emitting diode unit 120 may be disposed at a stop of the substrate 110 in one direction. In an embodiment of the present invention, the light emitting diode 120 may include a plurality of light emitting diode chips 120a and may be regularly arranged on the substrate 110. The first column 122, the second column 124, And the third row (126). The light emitting diode chips 120a arranged in the first to third columns 122, 124 and 126 may have the same number of the LED chips 120a in the columns 122, 124 and 126, Each of the eight LED chips 120a may be arranged. The light emitting diode chips 120a disposed in the respective rows 122, 124, and 126 may be spaced apart by the same distance d3.

The distance d2 between the first row 122 and the second row 124 and the distance between the second row 124 and the third row 126 may be the same, The spaced distance d2 between the first row 122 and the second row 124 and the spaced distance d3 between the adjacent LED chips 120a of the first row 122 may be the same (d2 = d3). The distance d1 from the edge of the substrate 110 to the light emitting diode chip 120a in the first column 122 is greater than the distance d2 between the first column 122 and the second column 124, Lt; / RTI >

As described above, the plurality of light emitting diode chips 120a may be mounted on the substrate 110 in a state where they are arranged along a predetermined rule. Of course, in one embodiment of the present invention, the LEDs 120 may be arranged in a state where the first to third columns 122, 124 and 126 are provided, but the number may vary as needed. The light emitting diode chips 120a included in the first column 122 and the second column 124 may be arranged in parallel to each other as shown in FIGS. 1 and 2. However, .

In an embodiment of the present invention, the LED chip 120a may be mounted on a substrate 110 by a chip on board (COB) method, The heat can be directly emitted through the substrate 110, the heat radiation effect can be enhanced, and the height of the light emitting diode module 100 can be reduced to enable downsizing.

In an embodiment of the present invention, the LED chip 120a may be an ultraviolet LED chip 120a for emitting ultraviolet rays, and may include a light emitting diode 120a capable of emitting light having a peak wavelength in a range of about 200 nm to 420 nm, Chip 120a may be used.

The first connector 132 and the second connector are installed on the substrate 110 to supply an externally supplied power source to the light emitting diode unit 120. The first connector 132 and the second connector 134 may be respectively provided on both sides of the LED unit 120 with respect to the LED unit 120 and may be electrically connected to a plurality of conductive patterns formed on the substrate 110. Accordingly, a power source applied through the first and second connectors 132 and 134 can be supplied to the light emitting diode unit 120 through a plurality of conductive patterns.

The first and second connectors 132 and 134 may be electrically connected to the outside by wire bonding or may be electrically connected in various ways.

The cover 140 is provided to cover the light emitting diode unit 120 and is manufactured using a material through which the light emitted from the light emitting diode unit 120 can be transmitted. In one embodiment of the present invention, the cover 140 may be formed of glass, resin, or the like. And the cover 140 may be coated with an anti-reflection (AR) coating on its surface. The cover 140 is formed to cover the light emitting diode unit 120, thereby protecting the light emitting diode unit 120 from an external impact or the like. Further, the substrate 110 may be provided with a pressure sensitive adhesive sheet so that the cover 140 can be detachably attached thereto.

The substrate 110 may have a plurality of holes 112 and 114 formed therein. The plurality of holes may be formed in a circular or hemispherical shape for mounting the light emitting diode module in a separate structure. An electrode pattern (not shown) is formed on the substrate 110 around the holes 112 and 114 so that the connectors 132 and 134 are not formed through coupling means (e.g., screws) made of a conductive material So that power can be supplied to the light emitting diode unit 120.

3 is a perspective view illustrating a light emitting device according to an embodiment of the present invention.

Referring to FIG. 3, the light emitting device includes a first light emitting diode module 100, a second light emitting diode module 200, and a cover 140.

The first and second light emitting diode modules 100 and 200 may be disposed adjacent to each other, and the third and fourth light emitting diode modules may be adjacent to each other.

The first and second light emitting diode modules 100 and 200 have the same structure as the light emitting diode module 100 described with reference to FIGS. 1 and 2. FIG. The second light emitting diode module 200 is disposed in close contact with the first light emitting diode module 100. The light emitting diode chip 120a of the first light emitting diode module 100 and the light emitting diode chip 120a of the second light emitting diode module 200 may be spaced apart from each other at a uniform interval.

The first connector 132 and the second connector 134 of the first light emitting diode module 100 are electrically connected to the first connector 232 and the second connector 234 of the second light emitting diode module 200, Can be connected. The first connector 132 of the first light emitting diode module 100 and the first connector 232 of the second light emitting diode are electrically connected to each other so that the first connector 132 of the first light emitting diode module 100, The first light emitting diode module 100 and the second light emitting diode module 200 may be connected in parallel when the second connector 134 and the second connector 234 of the second light emitting diode module 200 are electrically connected . Or the first connector 132 of the first light emitting diode module 100 and the second connector 234 of the second light emitting diode module 200 are electrically connected to each other so that the first light emitting diode module 100 and the second light emitting diode The modules 200 may be connected in series with each other.

The first and second connectors 132 and 132 may be connected in series or in parallel according to the arrangement of the first light emitting diode module 100 and the second light emitting diode module 200. However, , 134) may be connected in series or in parallel by wire bonding.

The cover 140 may be formed to cover the LED 120 of one LED module 100 as shown in FIG. 1, but as shown in FIG. 3, a plurality of LED modules In the connected state, one cover 140 may be formed to cover the entire LED module. At this time, the cover 140 may be formed to cover only the light emitting diode part 120 of all the light emitting diode modules. And an AR coating may be formed on the cover 140 as needed.

FIG. 4 is a graph illustrating a simulation result using a light emitting diode module according to an embodiment of the present invention, and FIG. 5 is a graph illustrating simulation results using a light emitting device according to an embodiment of the present invention.

Referring to FIG. 4, the light emitting diode module 100 according to an exemplary embodiment of the present invention has an amount of light of 3.6 W / cm 2 at a position separated by about 10 mm from the light emitting diode module 100. Referring to FIG. 5, in the light emitting device according to an embodiment of the present invention, it is confirmed that the amount of light at a position separated by about 10 mm from the light emitting device is about 8.0 W / cm 2.

The above results can be confirmed with reference to Table 1.

division Light-emitting diode module One 4 Peak Wavelengths (nm) 385 385 Evaluation Area Size (mm) 200 ㅧ 200 200 ㅧ 200 Optical Pwer (W) 24 96 distance (mm)
&
Irradiance (W / cm2) D = 1 9.0 12.0 D = 5 6.2 10.5 D = 10 3.6 8.0 D = 20 1.5 4.4 D = 30 0.7 2.5 D = 40 0.4 1.6 D = 50 0.3 1.1

In addition, the simulated light emitting diode module 100 is a result of simulating the mounting of 24 light emitting diode chips 120a in one light emitting diode module 100. FIG.

In contrast to the light emitting diode module 100 according to one embodiment of the present invention, the conventional light emitting diode module shows the simulation results as shown in Table 2.

A B C D E Optical Area 50 ㅧ 25mm 75 ㅧ 25mm 150 ㅧ 25mm 225 ㅧ 25mm 300 ㅧ 25mm Chip quantity 100 150 300 450 600 Typical Peak Irradiance (W / ㎠) 365 nm 395 nm 365 nm 395 nm 365 nm 395 nm 365 nm 395 nm 365 nm 395 nm Street 1 mm 4.0 8.0 4.0 8.0 4.0 8.5 4.0 8.5 4.0 8.5 10mm 2.8 5.7 2.8 5.7 3.0 6.2 3.0 6.2 3.0 6.2 Optical power 45W 90W 68W 135W 133W 273 W 200W 410W 267W 547W

As described above, compared to the conventional light emitting diode module, the light amount at the position where the light emitting diode module 100 and the light emitting device according to the embodiment of the present invention are spaced apart by about 10 mm is higher than the conventional one, .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It should be understood that the scope of the present invention is to be understood as the scope of the following claims and their equivalents.

100: Light emitting diode module
110: substrate 112, 114: hole
120: light emitting diode part 122: first column
124: second column 126: third column
120a: light emitting diode chip 132: first connector
134: second connector 140: cover

Claims (12)

A substrate having a length in one direction;
A light emitting diode unit provided on the substrate; And
And first and second connectors provided on the substrate and supplying power supplied from the outside to the light emitting diode unit,
The light-
A plurality of first light emitting diode chips arranged in the longitudinal direction of the substrate; And
And a plurality of second light emitting diode chips spaced apart from the first light emitting diode chips by a predetermined distance and arranged in the longitudinal direction of the substrate,
The distance d1 from the end of the substrate to the plurality of first light emitting diode chips is half of the distance d2 between the plurality of first light emitting diode chips and the plurality of second light emitting diode chips, 0.5). The method according to claim 1,
The plurality of first light emitting diode chips and the plurality of second light emitting diode chips are mounted on the substrate,
Wherein the substrate is provided with a plurality of conductive patterns for electrically connecting the plurality of first and second light emitting diode chips to the plurality of first and second light emitting diode chips. The method according to claim 1,
Wherein the first and second connectors are respectively electrically connected to first and second connectors provided on another substrate disposed adjacent to the substrate. The method according to claim 1,
Wherein the plurality of first light emitting diode chips are spaced apart from each other by a predetermined distance,
Wherein a distance d3 between the plurality of first light emitting diode chips is equal to a distance d2 between the plurality of first light emitting diode chips and the plurality of second light emitting diode chips. The method according to claim 1,
Wherein the substrate is made of metal or ceramic. The method according to claim 1,
And a cover for covering the light emitting diode part. The method of claim 6,
Wherein the cover is an AR (anti reflection) coating on the surface. The method according to claim 1,
Wherein the first and second light emitting diode chips emit ultraviolet rays. The method according to claim 1,
Wherein the plurality of first and second light emitting diode chips each include a light emitting diode chip emitting light of different wavelengths. A first light emitting diode module including a first substrate, a plurality of first light emitting diode chips provided on the first substrate, and a first connector portion for supplying power to the first light emitting diode chip; And
And a second light emitting diode module including a second substrate, a plurality of second light emitting diode chips provided on the second substrate, and a second connector portion for supplying power to the second light emitting diode chip,
Wherein a distance between the first light emitting diode chips is equal to a distance between the first light emitting diode chip and the second light emitting diode chip. The method of claim 10,
Wherein the first light emitting diode module and the second light emitting diode module are electrically connected in series or in parallel. The method of claim 10,
Wherein the plurality of first and second light emitting diode chips emit ultraviolet rays.
KR1020150079401A 2015-06-04 2015-06-04 Light emitting diode module and light emitting apparatus KR20160143176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150079401A KR20160143176A (en) 2015-06-04 2015-06-04 Light emitting diode module and light emitting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150079401A KR20160143176A (en) 2015-06-04 2015-06-04 Light emitting diode module and light emitting apparatus

Publications (1)

Publication Number Publication Date
KR20160143176A true KR20160143176A (en) 2016-12-14

Family

ID=57575368

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150079401A KR20160143176A (en) 2015-06-04 2015-06-04 Light emitting diode module and light emitting apparatus

Country Status (1)

Country Link
KR (1) KR20160143176A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220147352A (en) 2021-04-27 2022-11-03 주식회사 진우씨스템 Medical LED Light Source System

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220147352A (en) 2021-04-27 2022-11-03 주식회사 진우씨스템 Medical LED Light Source System

Similar Documents

Publication Publication Date Title
US20110089806A1 (en) Light-emitting element lamp and lighting equipment
JP6206795B2 (en) Light emitting module and lighting device
WO2006049086A1 (en) Light emitting module, lighting device, and display device
JP2006245032A5 (en)
JP2009016095A (en) Illuminating device and substrate
US9335010B2 (en) Edge weighted spacing of LEDs for improved uniformity range
WO2014118835A1 (en) Ultraviolet light emitting device
JP2016207839A (en) Light radiation device
US10935192B2 (en) Tube-shaped LED lighting device
US9625119B2 (en) Non-uniform lens array for illumination profile modification
KR20160143176A (en) Light emitting diode module and light emitting apparatus
KR20180110614A (en) Light emitting device and light illuminating apparatus comprising the light emitting device
US20180266651A1 (en) Led plane light source lamp
US10754232B2 (en) Optical projector module
EP2226842A1 (en) Thermal conduction structure for heat generating components
KR101522606B1 (en) Reflection and radiant heat panel for led module
KR101260180B1 (en) LED Package and manufacturing method thereof
EP2848102A1 (en) Mounting support for solid-state light radiation sources and light source therefor
JP2014203729A (en) Line light source device and irradiation apparatus
KR20160117260A (en) Light Irradiation Module
KR101249763B1 (en) LED Display Apparatus
KR20120033812A (en) Led illumination equipment
KR20070113173A (en) Apparatus for emitting 3-dimensional light in multi-side
KR102499233B1 (en) Light reflecting element that can be mounted on circuit board
EP2788971A1 (en) Led luminaire