KR20160109103A - Apparatus for removing fume - Google Patents

Apparatus for removing fume Download PDF

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Publication number
KR20160109103A
KR20160109103A KR1020150032917A KR20150032917A KR20160109103A KR 20160109103 A KR20160109103 A KR 20160109103A KR 1020150032917 A KR1020150032917 A KR 1020150032917A KR 20150032917 A KR20150032917 A KR 20150032917A KR 20160109103 A KR20160109103 A KR 20160109103A
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KR
South Korea
Prior art keywords
wafer
cassette
panel
accommodating portion
transparent
Prior art date
Application number
KR1020150032917A
Other languages
Korean (ko)
Inventor
우범제
김영철
김상현
한명석
Original Assignee
피코앤테라(주)
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Publication date
Application filed by 피코앤테라(주) filed Critical 피코앤테라(주)
Priority to KR1020150032917A priority Critical patent/KR20160109103A/en
Publication of KR20160109103A publication Critical patent/KR20160109103A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a fume removal apparatus. Especially, the present invention relates to a fume removal apparatus which has a surface for covering a wafer in a cassette to be at least partially transparent or translucent, so as to enable an operator to easily view, thereby smoothly performing a fume removal process.

Description

Apparatus for removing fume

The present invention relates to a fouling removing apparatus, and more particularly to a fouling removing apparatus in which at least a part of a surface surrounding a wafer in a cassette is transparent or translucent.

In general, the semiconductor manufacturing process includes etching, vapor deposition, and etching, and most of the processes are performed while the process gas is filled.

Most of the process gases are vented during the process, but some remain on the wafer surface, affecting wafer damage or polluting the devices used in the process.

In order to solve this problem, Japanese Patent No. 10-1294143 of the present applicant discloses a wafer processing apparatus in which a fume removing function is provided in a cassette of an EFEM itself.

However, in the case of the above-described wafer processing apparatus, there is a disadvantage that the fumes on the entire wafer surface can not be removed uniformly.

Further, there is a problem that it can not be confirmed whether or not the fume removal process is smooth.

Korean Patent Registration No. 1090350 Korean Patent Publication No. 1404621 Korean Patent Registration No. 1294143

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a fume removing apparatus capable of facilitating a fume removing process because an operator can easily see the inside of a cassette.

In order to achieve the above object, a fouling removing apparatus of the present invention includes a cassette on which a wafer is loaded, and at least a part of a surface surrounding the wafer in the cassette is provided in a transparent or translucent manner.

At least a part of the surface of the cassette surrounding the side of the wafer may be transparent or translucent, or at least part of the surface of the cassette that surrounds the top of the wafer may be transparent or translucent.

Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, And an exhaust panel connected to the panel and exhausting the fume, wherein the panel is at least partially transparent or semi-transparent.

Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, An exhaust panel connected to the panel and exhausting the fume, and a cassette top surface disposed on the top of the wafer, wherein at least a part of the top surface of the cassette may be transparent or translucent.

An illuminating device for illuminating the inside of the cassette is provided, and the illuminating device can be installed on the upper surface of the cassette of the cassette or the lower surface of the cassette.

Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, An exhaust panel connected to the panel and exhausting the fume, and an exhaust duct connected to the exhaust panel, wherein the exhaust duct is at least partially transparent or translucent.

The view panel including at least a portion of the view panel that is transparent or semi-transparent so that the cassette can be seen outside the process chamber, the view panel including a side portion of the cassette, Or at least two portions of the rear portion or the upper portion can be viewed at the same time, and the view panel can be formed to be bent.

According to the fume removing apparatus of the present invention as described above, the following effects can be obtained.

At least a part of the surface surrounding the wafer in the cassette is provided transparently or semi-transparently so that the inside of the cassette can be easily seen by the operator, so that the fume removal process can be smooth.

At least a part of the surface of the cassette surrounding the side of the wafer may be transparent or translucent, or at least part of the surface of the cassette that surrounds the top of the wafer may be transparent or translucent.

Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, And an exhaust duct connected to the exhaust panel, wherein the upper surface of the panel, the cassette, or the exhaust duct is at least partially transparent Or semitransparent so that the state of removing fumes or discharging the fumes can be effectively confirmed.

And an illuminating device for illuminating the inside of the cassette. The illuminating device is provided on the upper surface of the cassette of the cassette or the lower surface of the cassette so that the inside of the cassette can be seen more easily and precisely.

The view panel including at least a portion of the view panel that is transparent or semi-transparent so that the cassette can be seen outside the process chamber, the view panel including a side portion of the cassette, Or at least two portions of the rear or upper portion are simultaneously visible, and the view panel is formed to be bent so that the operator can confirm the fume removal and the discharge state of the fume at a glance.

1 is a perspective view of a cassette of a foul removing device according to a preferred embodiment of the present invention.
2 is a rear perspective view of the cassette of Fig.
Fig. 3 is a rear view of a fumigation device according to a preferred embodiment of the present invention. Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

For reference, the same components as those of the conventional art will be described with reference to the above-described prior art, and a detailed description thereof will be omitted.

As shown in Figs. 1 to 3, the fouling removing apparatus of this embodiment includes a cassette 500 on which wafers w are loaded.

1, the cassette 500 includes a first wafer supporting portion 510 for supporting a wafer w in front, a second wafer supporting portion 530 for supporting the wafer w in the rear side, A panel 550 for connecting the first wafer support unit 510 and the second wafer support unit 530 to each other and an exhaust panel 570 connected to the panel 550 and having an exhaust port for exhausting the fumes, A lower cassette surface 540 disposed at the lower portion of the wafer w and an exhaust duct 580 connected to the exhaust panel 570. The cassette upper surface 520,

As described above, the cassette 500 surrounds the front and rear sides and the upper and lower sides of the wafer w, so that the fume removal can be more effective.

The first wafer support 510 is disposed to be spaced on both sides of the front side of the cassette 500.

The second wafer support portions 530 are disposed on both sides of the rear side of the cassette 500, respectively.

A plurality of support members 290 for supporting the wafers w are formed on the first and second wafer supports 510 and 530.

A support member 290 formed on the first wafer support 510 is installed on the horizontally disposed metal piece. The metal piece is supplied with a purge gas from a purge gas supply unit, which will be described below, and an injection port for injecting the purge gas is formed.

A support member 290 formed on the second wafer support 530 is mounted on a vertically disposed rod member.

The rod member is formed into a rod shape having a generally hexagonal cross-section, and a seating groove on which members adjacent to both outer sides are seated is formed. This has the advantage that the circular wafer w can be stably supported and the apparatus becomes compact, and the apparatus can be easily assembled.

At least a part of the surface of the cassette 500 surrounding the wafer w is provided transparently or semi-transparently.

At least a part of the side surface of the wafer w or the surface surrounding the upper side of the wafer w in the cassette 500 is provided transparently or semi-transparently.

More specifically, as shown in FIG. 2, the panel 550 is made of a transparent material such as acryl, and the user can visually recognize that the fume remaining on the wafer w mounted in the cassette 500 is removed can do.

2, the panel 550 is formed in a plate shape, and a first bent portion 551 is formed at the rear, and a second bent portion 552 is formed at the rear of the first bent portion 551. Further, Is formed.

The panel 550 is disposed on both sides of the cassette 500 and the interval between the panels 550 on both sides becomes narrower toward the rear due to the first bent portion 551. [

The front end of the panel 550 is engaged with the engaging groove formed in the plurality of metal pieces constituting the first wafer supporting portion 510 and the second bent portion 552 is engaged with the second wafer supporting portion 530, 1 wafer supporting portion 510 and the second wafer supporting portion 530 so as to prevent the purge gas and the fume gas in the cassette 500 from being discharged to the outside.

The cassette top surface 520 is disposed above the first and second wafer supports 510 and 530 and the panel 550 and the exhaust panel 570.

An upper heater (not shown) is installed on the upper surface 520 of the cassette.

The upper heater is formed in a donut shape and has a thin plate shape with a hole formed at the central portion thereof.

A portion of the cassette upper surface 520 corresponding to the hole of the upper heater is formed of a transparent material 521 so that the inside of the cassette 500 can be seen from above.

The cassette lower surface 540 is disposed under the first and second wafer supports 510 and 530 and the panel 550 and the exhaust panel 570.

A lower heater (not shown) is also provided on the lower surface 540 of the cassette.

The lower heater may be formed in a thin plate shape.

Further, as shown in FIG. 1, an illuminating device 501 for illuminating the inside of the cassette 500 is provided, so that the inside of the cassette 500 can be seen more easily and precisely.

The lighting apparatus 501 is provided with an LED or the like and is installed on the cassette upper surface 520 and / or the cassette lower surface 520.

The lighting apparatus 501 is installed in the cassette upper surface 520 and / or the hole formed in the cassette lower surface 520, and is covered by the illumination cover 502.

The illumination device 501 is disposed in front of the cassette 500 or close to the first wafer support 510 and the panel 550.

An exhaust duct 580 for discharging the fume is installed in the rear of the cassette 500.

Specifically, the exhaust duct 580 is installed at the rear of the exhaust panel 570.

Therefore, an exhaust panel 570 is disposed between the wafer W and the exhaust duct 580.

The exhaust duct 580 includes a duct body including a duct top surface, a duct side wall, and a duct bottom surface 584 disposed horizontally.

The exhaust duct 580 is formed integrally with the upper surface of the duct, the duct side wall, and the duct bottom surface 584.

At least a part of the exhaust duct 580 is provided in a transparent or translucent manner, so that it is possible to effectively confirm the state of removing the fume or discharging the fume.

In the present embodiment, the exhaust duct 580 is formed entirely transparent or translucent.

The exhaust duct 580 is opened frontward to form a fume inlet, a hole is formed in the duct bottom surface 584 as a lower part, and a circular pipe is connected to form a discharge port 581.

3, the fume removing apparatus includes a purge gas supply unit (not shown) for supplying gas into the cassette 500, a purge gas discharge unit (not shown) for discharging the discharged purge gas and fumes, A control unit (not shown) for controlling the supply and discharge of the purge gas, and a connection unit 410 connected to the process chamber of the wafer w. The connection unit 410 is installed in the process chamber and seals the process chamber by separating the inside and the outside of the process chamber.

The connection part 410 includes a frame part 411 installed in the process chamber, a view panel 412 installed on the frame part 411 and surrounded by a frame part 411, a frame part 411, And a mechanical chamber 413 disposed at a lower portion of the support plate and provided with the purge gas supply portion, the purge gas discharge portion, the control portion, and the like.

The view panel 412 is at least partially transparent or translucent so that the cassette 500 can be seen outside the process chamber.

The view panel 412 is disposed on the left side (side) and rear side of the cassette 500.

In addition, the view panel 412 is formed so that at least two portions of the cassette 500 on the left, rear, or top of the cassette 500 can be seen at the same time. That is, the view panel 412 is formed so that at least two portions of the panel 550 or the exhaust duct 580 or the cassette upper surface 520, which are transparent or semi-transparent portions in the cassette 500, can be viewed at the same time.

In this embodiment, the view panel 412 is formed to be bent so that all three portions can be seen, so that the operator can easily confirm the fume removal and the fume discharge state at a glance.

The view panel 412 is formed so as to bend so as to protrude laterally.

The view panel 412 is formed such that its top surface is inclined so that its sectional area decreases toward the bottom.

The machine room 413 is formed to be accessible from the outside of the process chamber, thereby facilitating maintenance of the apparatus.

Further, a wheel is provided under the machine room 413 to facilitate the movement of the apparatus.

Hereinafter, the process of spraying the purge gas with the above-described configuration to remove the fumes of the wafer w will be described.

A robot arm (not shown) inserts the wafer w into the cassette 500 of the apparatus for removing the fumes of the wafer w.

The wafers w transferred by the robot arm are supported by the supporting members 290 of the metal pieces 200 of the first wafer supporting part 510 on the left and right front sides of the cassette 500 and the supporting members 290 on the rear left and right sides of the cassette 500 Is supported by the support members 290 of the second wafer support 530,

Therefore, since the wafer W is supported by the four support members, the contact area thereof is minimized, and damage to the wafer W can be prevented.

When the wafer W is supported on the first wafer support portion 510 and the second wafer support portion 530 by setting the distance between the left and right first wafer support portions 510 to be slightly longer than the diameter of the wafer w, So that they can be spaced apart and supported.

When the wafers w are all fed into the cassette 500, the purge gas control unit supplies the purge gas through the purge gas supply unit.

The supplied purge gas is injected into the cassette 500 through the injection port of the metal piece.

The thus injected purge gas flows along the rear surface of the cassette 500 to the exhaust panel 570 along with the fumes remaining on the surface of the wafer w.

That is, the purge gases discharged from the front of the cassette 500 flow backward by the rear exhaust panel 570, thereby cleaning the wafer w from the front to the rear.

The fumes are introduced into the fume inlet of the exhaust duct 580 through the outlet 571 of the exhaust panel 570 and are discharged to the fume outlet 581.

The fume that has exited through the discharge port 581 is discharged to the purge gas discharge port.

This flow of the purge gas is performed for each layer of each wafer w.

The fume removal and fume discharge conditions may also be displayed on the view panel 412 and the cassette 500 through the panel 550 or the exhaust duct 580 or the cassette top surface 520 which is a transparent or translucent part, The operator can easily confirm it at once.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims .

DESCRIPTION OF REFERENCE NUMERALS
410: connection 412: view panel
500: cassette 520: cassette upper surface
530: first wafer supporting part 540:
550: Panel 570: Exhaust panel
580: exhaust duct 501: lighting device

Claims (11)

A cassette on which a wafer is loaded,
Wherein at least a part of the surface of the cassette that surrounds the wafer is provided in a transparent or translucent manner. The method according to claim 1,
Wherein at least a part of the surface of the cassette that surrounds the side of the wafer is provided in a transparent or translucent manner. 3. The method according to claim 1 or 2,
Wherein at least a part of the surface of the cassette which surrounds the upper portion of the wafer is provided in a transparent or translucent manner. 3. The method according to claim 1 or 2,
Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, And an exhaust panel connected to the panel and exhausting the fume,
Wherein the panel is at least partially transparent or translucent. 3. The method according to claim 1 or 2,
Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, An exhaust panel connected to the panel and exhausting the fume, and a cassette top surface disposed on the top of the wafer,
Wherein the upper surface of the cassette is at least partially transparent or translucent. 3. The method according to claim 1 or 2,
And a lighting device for illuminating the inside of the cassette. The method according to claim 6,
Wherein the illumination device is installed on an upper surface of the cassette of the cassette or a lower surface of the cassette. 3. The method according to claim 1 or 2,
Wherein the cassette includes a first wafer accommodating portion for supporting the wafer at a front side thereof, a second wafer accommodating portion for supporting the wafer at a rear side thereof, a panel for connecting the first wafer accommodating portion and the second wafer accommodating portion, An exhaust panel connected to the panel and exhausting the fume, and an exhaust duct connected to the exhaust panel,
Wherein the exhaust duct is provided at least partially in a transparent or translucent manner. 3. The method according to claim 1 or 2,
And a connection portion connected to the process chamber of the wafer,
Wherein the connection portion includes a view panel having at least a part transparent or translucent so that the cassette can be seen from outside the process chamber. 10. The method of claim 9,
Wherein the view panel is formed so that at least two portions of the side, rear, or top of the cassette can be seen at the same time. 11. The method of claim 10,
Wherein the view panel is formed to be bent.
KR1020150032917A 2015-03-10 2015-03-10 Apparatus for removing fume KR20160109103A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3287693A1 (en) 2016-08-26 2018-02-28 LG Electronics, Inc. Back light unit and display device including the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101294143B1 (en) 2011-12-28 2013-08-08 우범제 Apparatus for handling wafer and method for handling wafer using the same
KR101404621B1 (en) 2012-11-05 2014-06-09 우범제 A side storage have a enclosed type door equipment and a fume remove equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101294143B1 (en) 2011-12-28 2013-08-08 우범제 Apparatus for handling wafer and method for handling wafer using the same
KR101404621B1 (en) 2012-11-05 2014-06-09 우범제 A side storage have a enclosed type door equipment and a fume remove equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3287693A1 (en) 2016-08-26 2018-02-28 LG Electronics, Inc. Back light unit and display device including the same

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