KR20160070370A - Substrate polishing apparatus and method, substrate of the same - Google Patents

Substrate polishing apparatus and method, substrate of the same Download PDF

Info

Publication number
KR20160070370A
KR20160070370A KR1020140177212A KR20140177212A KR20160070370A KR 20160070370 A KR20160070370 A KR 20160070370A KR 1020140177212 A KR1020140177212 A KR 1020140177212A KR 20140177212 A KR20140177212 A KR 20140177212A KR 20160070370 A KR20160070370 A KR 20160070370A
Authority
KR
South Korea
Prior art keywords
substrate
polishing
edge
polishing wheel
oblique direction
Prior art date
Application number
KR1020140177212A
Other languages
Korean (ko)
Inventor
배기환
Original Assignee
주식회사 케이엔제이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엔제이 filed Critical 주식회사 케이엔제이
Priority to KR1020140177212A priority Critical patent/KR20160070370A/en
Publication of KR20160070370A publication Critical patent/KR20160070370A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention relates to a substrate polishing apparatus and method, and more particularly to a substrate polishing apparatus and method capable of increasing the bending strength of a substrate by forming abrasive grains formed by polishing the substrate in an oblique direction , And a substrate therefrom.
A substrate polishing apparatus according to the present invention comprises: a table on which a substrate is placed; A polishing wheel for polishing an edge or a side surface of the substrate; A spindle for driving the polishing wheel; And pressure adjusting means for adjusting the polishing pressure by moving the polishing wheel in the horizontal direction.

Description

[0001] SUBSTRATE POLISHING APPARATUS AND METHOD, SUBSTRATE OF THE SAME [0002]

The present invention relates to a substrate polishing apparatus and method, and more particularly to a substrate polishing apparatus and method capable of increasing the bending strength of a substrate by forming abrasive grains formed by polishing the substrate in an oblique direction , And a substrate therefrom.

In general, a flat panel display panel, a TFT substrate, and a color filter substrate (hereinafter, referred to as a "substrate") such as a cover glass or panel of a smart phone, an LCD or an OLED are cut to a required size on the original plate.

Cutting in this manner produces sharp edges e1, e2 on the cut surface. The sharp edges e1 and e2 are polished in order to remove the sharp edges e1 and e2 because they may be broken during transportation, transportation or processing (see Fig. 1 (c)).

In addition, when the substrate S is cut, defects such as chipping (refer to 'D' in FIG. 1) may occur after cutting. In order to remove the chipping D thus generated and to prevent cracks, e2. When the edge is polished in this way, a polishing surface M is produced as shown in Fig. 1 (c).

The conventional polishing apparatus 100 will be described with reference to FIG.

As shown in the figure, the polishing apparatus 100 includes a table 110 on which a substrate S is placed, a rotating means 111 for rotating the table 110, and a polishing means 111 for polishing the edge of the substrate S seated on the table 110 A polishing wheel 120, and a spindle 121 for driving the polishing wheel 120.

Further, the position adjusting means 150 is provided to adjust the polishing position.

The spindle 121 and the polishing wheel 120 are driven in a fixed state and the table 110 polishes the edge (straight line) of the substrate S while moving in the horizontal direction. As described above, the edge of the straight line section is machined, the upper surface edge is polished at four places while the substrate is rotated, and the substrate is polished again at the four edge edges.

In particular, the mounting plate 141 to which the polishing wheel 120 and the spindle 121 are coupled is moved up and down by an air cylinder 130 as a pressure adjusting means. More specifically, the mounting plate 141 is vertically connected to the base 140 fixed to the position adjusting means 150. When the air cylinder 130 is driven to extend the cylinder rod 131 So that the polishing wheel 120 can be lifted up together with the mounting plate 141.

FIG. 3 illustrates a process of polishing a side surface of a substrate using a conventional polishing apparatus. More specifically, the polishing wheel 120 rotates about the spindle shaft 121a, and the side surface F of the substrate S is polished by the circumferential surface of the polishing wheel 20. [ After polishing, the abrasive grain P1 is formed on the side surface of the substrate. The abrasive grain P1 at this time is naturally formed vertically. That is, the vertical abrasive discs P1 are formed on the four side surfaces along the rim of the substrate S.

4, the edge e1 of the substrate is polished. In this case as well, since the polishing wheel 20 is rotated around the spindle shaft 21a while being in contact with the edge e1, The abrasive grain P2 perpendicular to the edge e1 is formed.

However, there is a problem that the substrate S on which the abrasive grains P2 are formed in the vertical direction is vulnerable to the bending (bending) force.

An object of the present invention is to provide a substrate polishing apparatus and method capable of increasing a bending strength of a substrate by forming abrasive grains formed by polishing a substrate in an oblique direction, And the like.

According to an aspect of the present invention, there is provided a substrate polishing apparatus comprising: a table on which a substrate is placed; A polishing wheel for polishing an edge or a side surface of the substrate; And a spindle for driving the polishing wheel, wherein the polishing wheel polishes an edge or a side of the substrate in an oblique direction.

It is also preferable that the rotation axis of the polishing wheel is not parallel to the edge or the side surface of the substrate.

The contact surface between the polishing wheel and the substrate is preferably formed obliquely with respect to an edge or a side surface of the substrate.

Further, the polishing wheel is formed in a cylindrical shape, and it is preferable to polish the edge or the side surface of the substrate with a circumferential surface.

A substrate polishing method according to the present invention comprises the steps of: 1) seating a substrate on a table; 2) moving the polishing wheel up and down to adjust the polishing position; And 3) polishing the substrate by rotating the polishing wheel in an oblique direction.

It is also preferable that the polishing step be disposed in such a manner that the abrasive grain is formed in an oblique direction on an edge or a side surface of the substrate.

In the substrate according to the present invention, abrasive grains are formed in oblique directions.

It is also preferable that the abrasive grains are formed to be inclined to a range of 30 to 60 degrees from a vertical line.

Further, the abrasive grain is preferably formed on the edge or side surface of the substrate.

According to the present invention, there is an effect that the bending strength of the substrate can be increased by forming the abrasive grain formed by the polishing of the substrate in an oblique direction.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a substrate generally cut from a disk and a substrate polished with sharp edges.
2 shows a conventional polishing apparatus.
FIGS. 3 and 4 show the state of use of the conventional polishing apparatus.
5 shows a polishing apparatus according to the present invention.
Figures 6 and 7 show a substrate polished by the polishing apparatus of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

5, a substrate polishing apparatus 1 according to the present invention includes a table 10, a polishing wheel 20, and a spindle 21. As shown in Fig.

The table 10 is a means for seating the substrate S and includes a rotating means 11 for rotating the table 10 and a Y direction moving means (not shown) for moving the table 10 in the Y direction. . Therefore, the table 10 is provided so as to be movable in the Y direction.

The polishing wheel 20 is also formed in a cylindrical shape and is mounted on the spindle 21 to polish the edge of the substrate S to the circumferential surface.

Particularly, in this embodiment, it can be seen that one side (l2) of the substrate (S) and the rotation axis (21a) of the polishing wheel are not parallel but form an acute angle (A). Thus, the polishing wheel 20 can polish the edge or side of the substrate S in an oblique direction because one side l2 of the substrate and the rotation axis 21a of the polishing wheel are not parallel. In other words, the extension line l1 passing through the contact surface between the polishing wheel 20 and the substrate S is formed in an oblique direction with respect to the edge or the side surface of the substrate.

A polishing method according to the present invention will be described with reference to FIG.

First, after the substrate S is placed on the table 10, the polishing wheel 20 is moved up and down to adjust the polishing position, and then the polishing wheel 20 is rotated in an oblique direction to polish the substrate.

Fig. 6 shows a substrate S polished by the polishing apparatus 1 according to the present invention. As shown in the figure, an edge e1 of the substrate S is provided with a polishing surface, which is formed with oblique polishing pores P3.

Fig. 7 also shows a substrate S whose side is polished by the polishing apparatus according to the present invention. Likewise, the side surface F of the substrate S is provided with the abrasive grain P4 in the oblique direction. Specifically, in this embodiment, the abrasive grains P4 and L4 are polished so as to have an angle? 3 and an angle B of about 45 degrees. Thus, the abrasive grain P4 is formed in an oblique direction, and the bending strength is improved.

1: Polishing device
10: Table
11: Rotation means
20: Polishing wheel
21: Spindle

Claims (9)

A table on which a substrate is placed;
A polishing wheel for polishing an edge or a side surface of the substrate; And
And a spindle for driving the polishing wheel,
Wherein the polishing wheel polishes an edge or a side of the substrate in an oblique direction.
The method according to claim 1,
Wherein the rotation axis of the polishing wheel with respect to the edge or the side surface of the substrate is arranged so as not to be parallel.
The method according to claim 1,
Wherein a contact surface between the polishing wheel and the substrate is formed in an oblique direction with respect to an edge or a side surface of the substrate.
The method according to claim 1,
Wherein the polishing wheel is formed in a cylindrical shape and polishes an edge or a side surface of the substrate with a circumferential surface.
1) placing a substrate on a table;
2) moving the polishing wheel up and down to adjust the polishing position;
And 3) polishing the substrate by rotating the polishing wheel in an oblique direction.
6. The method of claim 5,
Wherein the step (3) includes disposing the polishing wheel such that abrasive grains are formed in an oblique direction on an edge or a side surface of the substrate.
Wherein the abrasive grains are formed in an oblique direction.
8. The method of claim 7,
Wherein the abrasive grains are formed to be inclined in a range of 30 to 60 degrees from a vertical line.
8. The method of claim 7,
Wherein the abrasive grain is formed at an edge or a side of the substrate.
KR1020140177212A 2014-12-10 2014-12-10 Substrate polishing apparatus and method, substrate of the same KR20160070370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140177212A KR20160070370A (en) 2014-12-10 2014-12-10 Substrate polishing apparatus and method, substrate of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140177212A KR20160070370A (en) 2014-12-10 2014-12-10 Substrate polishing apparatus and method, substrate of the same

Publications (1)

Publication Number Publication Date
KR20160070370A true KR20160070370A (en) 2016-06-20

Family

ID=56354224

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140177212A KR20160070370A (en) 2014-12-10 2014-12-10 Substrate polishing apparatus and method, substrate of the same

Country Status (1)

Country Link
KR (1) KR20160070370A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210037339A (en) 2019-09-27 2021-04-06 주식회사 케이엔제이 Substrate grinding apparatus and method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210037339A (en) 2019-09-27 2021-04-06 주식회사 케이엔제이 Substrate grinding apparatus and method of the same

Similar Documents

Publication Publication Date Title
KR102192452B1 (en) Method for manufacturing groove for grinding of resin-bond grindstone, resin-bond grindstone, and apparatus and method for processing plate-like body
JP5363190B2 (en) End face processing method of plate glass
TWI676604B (en) Method of scribing thick plate glass, and scribing wheel for scribing thick plate glass
WO2007070353A3 (en) Methods and apparatus for processing a substrate
JP5174118B2 (en) Scribing wheel and manufacturing method thereof
KR20150145503A (en) Substrate polishing apparatus and method of the same
KR101362242B1 (en) Work edge grinding apparatus and method using the same
KR20160070370A (en) Substrate polishing apparatus and method, substrate of the same
KR102125392B1 (en) Lens-centering method for spherical center-type processing machine, lens-processing method, and spherical center-type processing machine
JP6803169B2 (en) Grinding method
TWI804670B (en) Method and apparatus for manufacturing semiconductor device
JP6263036B2 (en) Edge grinding wheel and chamfering device
KR101830617B1 (en) Substrate polishing apparatus and method of using the same
JP2014217935A (en) Dressing tool
CN103182681A (en) Rectifying device for millstone of double-sided grinder, and rectifying method thereof
KR101871853B1 (en) Panel machining apparatus for flat type display
JP2014159049A (en) Sapphire wafer grinding method
WO2014002447A1 (en) Substrate-edge grinding method, and substrate-edge grinding device
JP2012019126A (en) Wafer processing method
KR101399496B1 (en) The edge of the plate processing apparatus and method of the same
KR101807653B1 (en) Substrate champering apparatus
CN108436733B (en) Polishing device
JP5499150B2 (en) Scribing wheel and manufacturing method thereof
JP2008238278A (en) Chamfering device, chamfering method, and sintered magnet
KR101390934B1 (en) Method for chamfering edge of glass in display

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
J301 Trial decision

Free format text: TRIAL NUMBER: 2017101004271; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20170905

Effective date: 20190208