KR20160049731A - Heatsink fixing device and Heatsink assembly including the same - Google Patents

Heatsink fixing device and Heatsink assembly including the same Download PDF

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Publication number
KR20160049731A
KR20160049731A KR1020140147284A KR20140147284A KR20160049731A KR 20160049731 A KR20160049731 A KR 20160049731A KR 1020140147284 A KR1020140147284 A KR 1020140147284A KR 20140147284 A KR20140147284 A KR 20140147284A KR 20160049731 A KR20160049731 A KR 20160049731A
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KR
South Korea
Prior art keywords
heat sink
support portion
heat
sink support
body portion
Prior art date
Application number
KR1020140147284A
Other languages
Korean (ko)
Inventor
박희준
이계원
오희선
김종윤
최광주
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020140147284A priority Critical patent/KR20160049731A/en
Priority to CN201510166446.6A priority patent/CN106158789A/en
Publication of KR20160049731A publication Critical patent/KR20160049731A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The purpose of the present invention is to provide a heat sink coupling device and a heat sink assembly including the same, wherein an electronic element can be protected even if an external force is applied to a heat sink. The heat sink coupling device according to an embodiment of the present invention comprises: a body part including a division slit at one side; a heat sink supporting part extending outward in the radial direction of the body part from the other side of the body part; a head part extending outward in the radial direction of the heat sink supporting part from the upper side of the heat sink supporting part; and an elastic member arranged at the outer side of the heat sink supporting part.

Description

Heatsink fastening device and heat sink assembly including the same

The present invention relates to a heat sink fastening device and a heat sink assembly including the same.

BACKGROUND ART [0002] In recent years, an integrated circuit package has been used in electronic devices requiring miniaturization and high reliability. The heat generated from the integrated circuit package deteriorates the performance of electronic devices, so heat sinks are combined to dissipate heat.

On the other hand, the heat sink is generally combined with the integrated circuit in contact with the electronic device provided in the integrated circuit package for improving the heat radiation efficiency.

However, when an external force is applied to the heat sink or the electronic device and the heat sink is tilted to one side, there is a problem that the electronic device provided at the bottom of the heat sink or in contact with the heat sink is damaged.

Therefore, there is an urgent need for research to solve this problem.

It is an object of the present invention to provide a heat sink fastening device capable of protecting an electronic device even when an external force is applied to the heat sink, and a heat sink assembly including the heat sink fastening device.

According to an aspect of the present invention, there is provided a heat sink fastening apparatus comprising: a body portion having a split slit on one side; A heat sink support portion extending from the other side of the body portion to a radially outer side of the body portion; A head portion extending from an upper side of the heat sink support portion to a radially outer side of the heat sink support portion; And an elastic member provided on the outer side of the heat sink support portion.

Therefore, even when an external force is applied to the heat sink, the angle at which the heat sink is tilted by the heat sink supporter is minimized, so that breakage of the electronic element provided in the heating element can be prevented.

In addition, in the heat sink fastening apparatus according to an embodiment of the present invention, the heat sink support portion has a rounded shape or an inclined portion that is embedded in the axial direction, thereby reducing the material.

Further, in the heat sink fastening apparatus according to an embodiment of the present invention, the elastic member is provided as a coil spring, and can act as an elastic supporting force.

The heat sink fastening device and the heat sink assembly including the heat sink fastener according to the embodiment of the present invention minimize the angle at which the heat sink is tilted by the heat sink support portion so that even when an external force is applied to the heat sink, Can be prevented.

1 is a perspective view of a heat sink assembly according to an embodiment of the present invention.
2 is a sectional view taken along line A-A 'in Fig.
3 is a perspective view of a heat sink fastening apparatus according to an embodiment of the present invention.
4 is a cross-sectional view taken along the line B-B 'in Fig.
5 is a perspective view of a heat sink fastening apparatus according to another embodiment of the present invention.
6 is a cross-sectional view taken along line C-C 'of FIG.
7 is a perspective view of a heat sink fastening apparatus according to another embodiment of the present invention.
8 is a cross-sectional view taken along the line D-D 'in FIG.
9 is a perspective view of a heat sink fastening apparatus according to another embodiment of the present invention.
10 is a cross-sectional view taken along the line E-E 'in Fig.
11 is a perspective view showing a modified example of the split slit according to the embodiment of the present invention.

Prior to the detailed description of the present invention, the terms or words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings, and the inventor may designate his own invention in the best way It should be construed in accordance with the technical idea of the present invention based on the principle that it can be appropriately defined as a concept of a term to describe it. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention. Therefore, various equivalents It should be understood that water and variations may be present.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that, in the drawings, the same components are denoted by the same reference symbols as possible. Further, the detailed description of known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some of the elements in the accompanying drawings are exaggerated, omitted, or schematically shown, and the size of each element does not entirely reflect the actual size.

1 is a perspective view of a heat sink assembly 500 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A 'of FIG.

Referring to FIGS. 1 and 2, a heat sink assembly 500 according to an embodiment of the present invention includes a heating body 100, a heat sink 200, and a heat sink fastening device 300.

The heating element 100 may be various kinds of electronic devices or electronic parts that emit heat to the outside during driving. For example, the heating element 100 may be a substrate 110 on which at least one electronic element 120 is mounted.

At least one electronic device 120 may be mounted on the substrate 110. For this purpose, a wiring pattern and a ground electrode for electrically connecting mounting electrodes (not shown) and mounting electrodes are formed.

The substrate 110 may be a PCB (Printed Circuit Board) or an FPCB (Flexible Printed Circuit Board) substrate made of polyethylene terephthalate (PET), glass, polycarbonate (PC) Or may be formed in a film form.

However, it is to be understood that the type of the substrate 110 is not limited to the proposed embodiment, and various types of members to which the electronic device 120 can be coupled can be used.

The substrate 110 may include mounting electrodes formed on the upper surface thereof, circuit patterns formed in the substrate 110, and conductive vias (not shown) electrically connecting the electrodes. In addition, A cavity that can be mounted may be formed.

Herein, the substrate 110 may be coupled to the heat sink 200 by a heat sink fastening device 300 to be described later. To this end, the substrate 110 is provided with an insertion hole 111 for the heat sink fastening device 300 do.

A plurality of heat sink fastening devices 300 to be described later may be inserted into the insertion holes 111, and a plurality of heat sink fastening devices 300 may be provided.

At least one electronic device 120 may be mounted on the substrate 110. For example, the substrate 110 may be an integrated circuit (IC) chip or a multi-layer ceramic capacitor (MLCC).

Such electronic devices 120 generate a lot of heat when driving an electronic product, and the heat generated by the electronic device 120 lowers the performance of other electronic components in the vicinity or reduces the performance of the electronic device.

The heat sink 200 may be provided on the upper side of the substrate 110. The heat sink 200 may be mounted on the upper surface of the substrate 110. In this case, .

In addition, when a plurality of electronic devices 120 are provided, at least one of the plurality of electronic devices 120 may be provided to be in contact with the heat sink 200.

The heat sink 200 is a passive heat dissipating means for dissipating the heat generated from the electronic devices 120 to the outside and may include a heat dissipating plate 210 and a heat dissipating fin 220.

Here, the heat dissipating plate 210 may be provided in a flat plate shape as an example. However, the present invention is not limited to this, and may be provided in various shapes according to the structure of the electronic product and the necessity.

Meanwhile, the heat dissipation plate 210 may be provided on the upper part of the electronic device 120, and one side thereof may be provided in contact with the electronic device 120.

Thus, the heat dissipation plate 210 may receive heat from at least one electronic device 120 in a conduction, radiation, and convection manner to cool the electronic devices 120.

Meanwhile, a plurality of heat dissipation fins 220 may be provided on a surface of the heat dissipation plate 210 which is not opposed to the electronic device 120.

The heat dissipation fins 220 may protrude outward from one side of the heat dissipation plate 210, and a plurality of heat dissipation fins 220 may be formed corresponding to the size of the heat dissipation plate 210.

The heat dissipation fins 220 are provided to increase the contact area with the outside air to improve the cooling efficiency of the heat sink 200. A plurality of heat dissipation fins 220 are formed on one surface of the heat dissipation plate 210 It is preferable that it is protruded.

In addition, although only a configuration in which the radiating fin 220 having a rectangular shape is provided in the heat dissipating plate 210 is shown in the drawing, it is not necessarily limited to this, but it is possible to deform into various shapes such as a curved wave shape.

The heat sink 200 may be coupled to the heating element 100 by a heat sink fastening device 300 to be described later. To this end, the heat sink 200 is provided with at least one heat sink fastening device 300 through holes 211 may be provided.

FIG. 3 is a perspective view of a heat sink fastening apparatus 300 according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line B-B 'of FIG.

3 and 4, the heat sink fastening apparatus 300 includes a body portion 310, a heat sink support portion 320, a head portion 330, and an elastic member 340.

The body portion 310 is inserted into the heat generating body 100 and the heat sink 200. That is, the body 310 may be inserted into and inserted through the insertion hole 111 of the heat generating element 100 and the through hole 211 of the heat sink 200, and the partitioning slit 310a .

Specifically, the split slit 310a reduces the diameter of the body portion 310 when the body portion 310 is fastened to the heat generating body 100 and the heat sink 200, so that the split slit 310a can be easily fastened.

That is, the split slit 310a can provide a space in which the diameter of the body portion 310 can be reduced.

At this time, at least one or more split slits 310a may be provided on one side of the body portion 310. [

That is, the split slit 310a may be provided as one slit in the axial direction at one side of the body 310, or may be provided with a plurality of slits (see FIG. 11).

It should be noted that the shape of the split slit 310a can be variously modified as long as the body 310 can reduce the diameter of the body 310 when the body 310 is fastened to the heat generating body 100 and the heat sink 200 Leave.

3, the axially lower side or upper side refers to the direction from the body 310 to the head part 330, or vice versa, referring to FIG. 3, and the radially outer side or the inner side, Refers to a direction from the center of the head part 330 toward the outer peripheral surface of the head part 330 or vice versa.

On the other hand, a locking protrusion 311 protruding outward in the radial direction and provided in a hook shape may be provided on the outer circumferential surface of one side of the body portion 310 provided with the divided slit 310.

The locking protrusion 311 is protruded from the outer circumferential surface of the body portion 310 and is provided so as to be reduced in diameter toward the lower side in the axial direction and the heat sink fastening device 300 is separated from the heat generating body 100 and the heat sink 200 .

The heat sink supporter 320 is provided to minimize the inclination angle of the heat sink 200 when an external force is applied to the heat sink assembly 500. The heat sink supporter 320 is disposed radially outward from the other side of the body 310, Can be extended.

That is, the heat sink support 320 is formed to extend radially outward from the other side of the body 310 so as to support one side of the heat sink 200 to prevent the heat sink 200 from tilting, The bottom surface of the extended heat sink support 320 supports the heat sink 200 when the heat sink 200 is inclined.

For this purpose, the heat sink supporter 320 may be provided to be in contact with one surface of the heat sink 200.

The detailed process for preventing the heat sink 200 from tilting to the heat sink support 320 will be described later.

The heat sink support 320 may have various shapes. Various modifications of the heat sink support 320 will be described in detail below.

1st Variation example

5 and 6, the heat sink support 320 includes a flange portion 321 extending radially outwardly from the other side of the body portion 310, and a flange portion 321 extending from the center of the flange portion 321, 330, respectively.

That is, the outer surface of the heat sink supporter 320 except for the flange portion 321 is drawn inward in the radial direction, and the diameter of the connection portion 322 may be smaller than the diameter of the flange portion 321.

Here, the flange portion 321 supports the heat sink 200 to prevent the electronic device 120 provided at the lower portion from being damaged by tilting the heat sink.

That is, the overall size of the heat sink support portion 320 excluding the flange portion 321 is minimized, thereby reducing manufacturing costs.

Second Variation example

Referring to FIGS. 7 and 8, the outer surface of the heat sink support 320 may be inserted into the heat sink support 320 to be rounded.

That is, the curvature R may be formed on the outer surface of the heat sink supporter 320, and specifically, the diameter may be decreased as the distance to the central portion of the heat sink supporter 320 is reduced.

Accordingly, when the heat sink fastening device 300 is fastened, the stress acting on the heat sink support portion 320 is prevented from acting as one side, and is distributed throughout the heat sink support portion 320, have.

Third Variation example

9 and 10, the heat sink support 320 may be provided with a recessed portion 323 embedded along the outer circumferential surface of the body portion 310 to the upper side in the axial direction of the heat sink support portion 320.

That is, the recessed portion 323 may be formed to be embedded in the upper side in the axial direction from the bottom surface of the heat sink support portion 320.

Accordingly, the heat sink support 320 may be formed in a tubular shape extending from the head portion 330. [

The shape of the heat sink supporter 320 is not limited to the proposed modifications but may be modified so that the shape of the heat sink supporter 320 is not limited to that of the heat sink supporter 320. [ It can be variously modified as long as it protrudes from the outside.

The head portion 330 may extend from the upper side of the heat sink support portion 320 to the outside of the heat sink support portion 320 in the radial direction.

At this time, one end of the elastic member 340 may be held in contact with the bottom surface of the head part 320.

Meanwhile, an elastic member 340 may be provided on the outer side of the heat sink supporter 320, and the elastic member 240 may be a coil spring, for example.

In addition, the heat sink supporter 320 may be inserted into the elastic member 240 to be inserted therein.

The elastic member 340 is provided to improve the contact force between the heat sink 200 and the heat emitting body 100 and has one end contacting the bottom surface of the head portion 330 to apply an elastic force to the heat sink 200 and the heat emitting body 100. [ Lt; / RTI >

Hereinafter, with reference to FIG. 2, the principle of preventing the breakage of the electronic device 120 even when an external force is applied to one side of the heat sink 200 according to the embodiment of the present invention, Will be described.

When the external force F1 is applied to one side of the heat sink 200, since the heat sink 200 is in contact with the electronic element 120 provided at the bottom, the heat sink 200, A force F2 that rises in the opposite direction of the external force F1 acts on the other side.

In this case, if the movement of the heat sink 200 is not restricted, the heat sink 200 is inclined to break the electronic device 120 provided under the heat sink.

In the heat sink fastening apparatus 300 according to the embodiment of the present invention, the force F3 for lowering the heat sink 200 by the reaction of the upward force F2 is applied to the heat sink support portion 320 by the heat sink 200, so that the heat sink 200 is not tilted.

Therefore, when an external force is applied to the heat sink 200, it is possible to prevent the heat sink 200 from tilting in one direction, thereby preventing damage to the electronic device 120 provided under the heat sink 200.

At this time, the heat sink supporter 320 is provided in the heat sink fastening device 300 and does not occupy a space in the substrate 110, so that the substrate area on which the electronic device 120 is mounted can be maintained.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be apparent to those of ordinary skill in the art that such changes or modifications are within the scope of the appended claims.

100: heating element 110: substrate
120: electronic device 200: heat sink
210: heat dissipating plate 220: heat dissipating fin
300: Heat sink fastening device 310: Body part
320: Heatsink support part 330: Head part
340: elastic member 500: heat sink assembly

Claims (11)

A body portion having a split slit at one side thereof;
A heat sink support portion extending from the other side of the body portion to a radially outer side of the body portion;
A head portion extending from an upper side of the heat sink support portion to a radially outer side of the heat sink support portion; And
An elastic member provided outside the heat sink support; And the heat sink fixing device.
The method according to claim 1,
Wherein the heat sink support portion includes a flange portion extending radially outward from the other side of the body portion and a connection portion extending from the center of the flange portion and connected to the head portion,
And the diameter of the connecting portion is smaller than the diameter of the flange portion.
The method according to claim 1,
And the outer surface of the heat sink support portion is drawn inwardly of the heat sink support portion to be rounded.
The method according to claim 1,
Wherein the heat sink support portion includes a recessed portion which is recessed upwardly in the axial direction of the heat sink support portion along an outer circumferential surface of the body portion.
The method according to claim 1,
And the heat sink support portion is inserted into and engaged with the elastic member.
The method according to claim 1,
Wherein the elastic member is a coil spring.
The method according to claim 1,
And a locking protrusion formed on an outer circumferential surface of one side of the body portion provided with the split slit, the protrusion protruding radially outwardly and provided in a hook shape.
The method according to claim 1,
Wherein the plurality of split slits are provided on one side of the body portion.
The heat sink fastening device according to any one of claims 1 to 8, And
A heat sink having the heat sink fastening device inserted therein and having a plurality of heat dissipating fins; And
And a heat sink having the heat sink on the upper side.
10. The method of claim 9,
And the heat sink support portion is configured to be in contact with one surface of the heat sink.
10. The method of claim 9,
Wherein the heating element is provided as a substrate on which at least one electronic element is mounted.


KR1020140147284A 2014-10-28 2014-10-28 Heatsink fixing device and Heatsink assembly including the same KR20160049731A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020140147284A KR20160049731A (en) 2014-10-28 2014-10-28 Heatsink fixing device and Heatsink assembly including the same
CN201510166446.6A CN106158789A (en) 2014-10-28 2015-04-09 Fixer for heat radiator and the heat sink assembly including this fixer for heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140147284A KR20160049731A (en) 2014-10-28 2014-10-28 Heatsink fixing device and Heatsink assembly including the same

Publications (1)

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KR20160049731A true KR20160049731A (en) 2016-05-10

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CN (1) CN106158789A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230108754A (en) * 2022-01-10 2023-07-19 (주)리치텍코리아 Spring pin assembly for fixing heat sink

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
CN101132682A (en) * 2006-08-25 2008-02-27 富准精密工业(深圳)有限公司 Fixed part and its manufacturing method, combination of radiating devices using the fixed part
CN202084528U (en) * 2011-04-15 2011-12-21 鸿富锦精密工业（深圳）有限公司 Radiating apparatus with radiating fins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230108754A (en) * 2022-01-10 2023-07-19 (주)리치텍코리아 Spring pin assembly for fixing heat sink

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Publication number Publication date
CN106158789A (en) 2016-11-23

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