KR20160049091A - Adhesive tape for electronic component - Google Patents
Adhesive tape for electronic component Download PDFInfo
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- KR20160049091A KR20160049091A KR1020140144957A KR20140144957A KR20160049091A KR 20160049091 A KR20160049091 A KR 20160049091A KR 1020140144957 A KR1020140144957 A KR 1020140144957A KR 20140144957 A KR20140144957 A KR 20140144957A KR 20160049091 A KR20160049091 A KR 20160049091A
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- pressure
- sensitive adhesive
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- adhesive tape
- parts
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
More particularly, the present invention relates to a pressure-sensitive adhesive tape for electronic parts, and more particularly to a pressure-sensitive adhesive tape for electronic parts, which comprises a heat-resistant substrate layer, a primer coating layer formed by curing a coating solution containing an epoxy silane coupling agent on the heat- , It is possible to prevent the residue of the adhesive in a semiconductor manufacturing process with a plasma process and to improve the leakage and stain of the sealing resin and to provide a pressure sensitive adhesive tape for electronic parts having excellent heat resistance against exposure of the adhesive tape during the manufacturing process of the semiconductor device .
BACKGROUND ART [0002] In recent years, an electronic component manufacturing company manufactures a semiconductor in a quad flat no-lead package (QFN) method without a lead. In the case of QFN, the lead is not extended but is exposed to the bottom of the package in the form of a land around the die, so soldering to the circuit board is possible.
Therefore, the package can be made significantly smaller and thinner than the package having the lead, and the area occupied by the circuit board is reduced by about 40% as compared with the conventional package. The heat generating surface is also different from the conventional method in which the lead frame on which the chip is mounted is stacked by the sealing resin so that the lead frame is on the bottom of the package and the die pad is exposed directly to the outside. Thus, the electrical characteristics are superior to those of the lead-out packages, and the self-inductance is only about half.
However, when the interface between the lead frame and the encapsulating resin coexists with the package bottom, when the general metal molding frame is used, the encapsulating resin easily escapes between the lead frame and the molding frame, . Thus, it is essential to laminate the lead frame by using an adhesive tape, and then to pass through the QFN manufacturing process and the resin encapsulation process to prevent the bleed-out or flash of the encapsulating resin during the resin process. have.
In general, a semiconductor device manufacturing process includes a tape lamination process for adhering an adhesive tape to one side of a lead frame, a die attach process for adhering a semiconductor device to a die pad of a lead frame, A plasma processing process for removing contaminated organic substances on the surface, a wire bonding process for electrically connecting the semiconductor element to the land portion of the lead frame, a die bonding process, and a lead frame having wire bonding, A sealing resin encapsulation process (EMC molding) for encapsulating by use, and a detaping process for detaching the adhesive tape for semiconductor from the encapsulated lead frame.
As described above, in order to comprehensively summarize the required characteristics of the adhesive tape used in the semiconductor device manufacturing process, it is necessary to adhere to the lead frame in accordance with the lamination method of each laminator, and to adhere to the lead frame without forming bubbles after the lamination .
In addition, there should be no physical chemical changes in the tape during the temperature and process times mentioned to ensure good die or wire bondability.
In other words, a part of the pressure-sensitive adhesive layer should escape in the form of outgas and not adsorb on the surface of the semiconductor device element to lower the bonding force of the interface to be bonded.
During the encapsulation resin encapsulation process, the adhesive tape must be kept in close contact with the lead frame so that the encapsulation resin does not penetrate through the interfaces to contaminate the lead frame surface. Of course, it is possible to add a deflash process after the detaching process, but ultimately it is recommended to be efficient and economically free from the additional washing process.
After detaching, there should be no specific reaction between the adhesive and the sealing resin so that the state of the sealing resin surface is realized as intended by the originally designed sealing resin, and the adhesive should not remain on the surface. In addition, the residue of the adhesive should not remain on the surface of the lead frame.
Accordingly, there is a demand for development of a pressure-sensitive adhesive tape suitable for a laminator in which lamination is performed using a hot press in the laminating system while satisfying the required characteristics of the pressure-sensitive adhesive tape for an electronic part as described above. In this case, And the tape must be adhered to the lead frame. In the detaching step, the adhesive residue should not remain on the surface of the sealing resin or the lead frame after the tape is removed.
However, in the conventional pressure-sensitive adhesive tape, the surface of the pressure-sensitive adhesive is damaged due to the plasma in the plasma process, and the residue of the pressure-sensitive adhesive remains on the lead frame in the detaching process.
Accordingly, the present inventors have made efforts to solve the problems of conventional adhesive tapes for electronic parts. As a result, in order to meet the required characteristics of a semiconductor manufacturing process with a plasma process, a primer coating is performed to obtain a cohesive force between the heat- It is possible to prevent the residue of the pressure-sensitive adhesive on the pressure-sensitive adhesive tape and to improve the sealing resin leakage and the stain, thereby completing the present invention.
An object of the present invention is to provide a pressure-sensitive adhesive tape for electronic parts, which satisfies all the characteristics required in a lamination process and is useful for a pressure-sensitive adhesive tape for electronic parts having a plasma process during a manufacturing process.
Another object of the present invention is to provide an adhesive tape for electronic parts capable of preventing the leakage of the adhesive residue and the sealing resin in a detaching step after plasma processing.
In order to attain the above object, the present invention provides a pressure-sensitive adhesive tape for electronic parts, comprising a heat-resistant substrate layer, a primer coating layer formed by curing a coating solution containing an epoxy silane coupling agent on the heat-resistant substrate layer and a pressure-
The adhesive tape of the present invention is characterized in that a primer coating layer is additionally formed between the heat-resistant substrate layer and the pressure-sensitive adhesive layer to provide a cohesive force between the heat-resistant substrate layer and the pressure-sensitive adhesive layer so as to satisfy the required characteristics in a semiconductor manufacturing process with a plasma process It is possible to prevent the residue of the adhesive and to improve the sealing resin leakage and stain.
Therefore, in the case of the conventional adhesive tape, the surface of the adhesive is damaged due to the plasma in the plasma process, thereby eliminating the problem that the adhesive remains on the lead frame in the detaching process.
Thus, in the adhesive tape of the present invention, the primer coating layer is formed to a thickness of 0.5 to 5 占 퐉, and more specifically, the primer coating layer is composed of a composition comprising 0.1 to 10 parts by weight of an epoxy silane coupling agent per 100 parts by weight of the phenoxy resin, And is formed by curing.
Further, in the pressure-sensitive adhesive tape of the present invention, the pressure-sensitive adhesive layer is designed to be cured by thermal curing and energy ray casting so that adhesive strength is exhibited during a heating process, not at room temperature.
At this time, the pressure-sensitive adhesive layer may contain, per 100 parts by weight of the phenoxy resin, 0.1 to 10 parts by weight of an acrylic resin, one of melamine, urea-formaldehyde, an isocyanate functional prepolymer, 5 to 20 parts by weight of a thermosetting agent, 5 to 30 parts by weight of an energy ray-curable acrylic compound having at least one carbon-carbon double bond structure in a molecule and a pressure-sensitive adhesive composition containing a photoinitiator in an organic solvent are cured by thermal curing and energy ray- It is designed to exhibit an adhesive force during a heating process, not a bonding process. In this case, the photoinitiator is contained in an amount of 0.5 to 10 parts by weight based on 100 parts by weight of the energy ray-curable acrylic resin.
The glass transition temperature of the pressure-sensitive adhesive composition is preferably 80 to 150 DEG C, the adhesive force at room temperature to stainless steel is 0 to 1 gf / 50 mm, and the thickness of the pressure-sensitive adhesive layer is 2 to 10 mu m.
According to the present invention, the adhesive tape further comprising the primer coating layer between the heat-resistant substrate layer and the pressure-sensitive adhesive layer provides a good cohesive force between the heat-resistant substrate layer and the pressure-sensitive adhesive layer, and after detaching due to the plasma process during the production of electronic parts, The phenomenon occurring can be improved.
Further, the pressure-sensitive adhesive tape of the present invention is constituted by a specific pressure-sensitive adhesive layer. It does not have an adhesive force at room temperature but exhibits an adhesive force only during the heating lamination process and can laminate the lead frame and has excellent heat resistance against the thermal history in which the adhesive tape is exposed during the manufacturing process of the semiconductor device, It is effective to improve the reliability during manufacturing of the apparatus, to prevent the leakage of the sealing material, and to prevent the defective appearance when the tape is removed after the completion of the process.
Hereinafter, the present invention will be described in detail.
The present invention relates to a heat-
A primer coating layer formed by curing a coating liquid containing an epoxy silane coupling agent on the heat-resistant substrate layer and
A pressure-sensitive adhesive tape for electronic parts, wherein the pressure-sensitive adhesive layer is formed by a lamination method.
The features of each layer will be described in detail.
1) Heat-resistant substrate layer
The base material of the adhesive tape for electronic parts according to the present invention can use a polymer film excellent in heat resistance. In the case of such a heat-resistant substrate, it can be processed into a film form, and there is no physical-chemical change for a specific temperature and time so as to have excellent heat resistance and excellent die adhesion and wire bonding property.
The heat resistant substrate preferably has a temperature at which the weight reduction of 5% is observed is at least 300 ° C or more, and a thermal expansion coefficient at 50 to 200 ° C is preferably 1 to 35 ppm / ° C or so.
The heat-resistant base material preferably has a glass transition temperature of 110 to 450 캜.
By satisfying these requirements, stable and excellent high-temperature heat resistance can maintain flatness of the substrate during high-temperature lamination, uniform lamination and high wire-bonding can be ensured.
The dimensional stability of the film held even at a high temperature is not deformed in the molding die even during the resin sealing process, so that leakage of the resin can be suppressed.
In addition, the modulus of elasticity of the heat resistant base material is preferably 1 to 10 GPa at room temperature, and preferably 100 to 5000 MPa at 100 to 300 ° C. At this time, if a substrate film having too low elasticity or high folding is used, a main room may be generated in the process of handling the tape, loading the tape into the lamination equipment, or feeding the tape into the equipment , Which may cause delamination at a later stage and cause uneven wire bonding and resin bleed-out, which is undesirable.
As a substrate that satisfies these requirements, a heat-resistant polymer film is applicable, and a material selected from the group consisting of heat-resistant polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyester, polyamide and polyetherimide One processing film can be selected.
The thickness of the heat resistant substrate is not particularly limited, but is determined by the application limitations of the lamination equipment and the resin sealing equipment. Therefore, the thickness of the heat-resistant base material is preferably 5 to 100 占 퐉, more preferably 20 to 50 占 퐉 in view of ease of handling while suppressing the phenomenon of wrinkling due to external force and maintaining proper heat resistance.
2) Primer coating layer
In the adhesive tape for electronic parts of the present invention, a primer coating is performed to improve the adhesive force between the heat-resistant substrate and the pressure-sensitive adhesive, and a primer coating layer is additionally formed between the heat-resistant substrate layer and the pressure-sensitive adhesive layer.
The primer coating layer of the present invention is based on a phenoxy resin having excellent heat resistance and includes a silane coupling agent to increase the adhesion between the primer coating layer and the pressure-sensitive adhesive layer.
More specifically, a composition comprising 0.1 to 10 parts by weight of an epoxy silane coupling agent per 100 parts by weight of the phenoxy resin is thermally cured to form a primer coating layer.
At this time, the phenoxy resin, which is a thermoplastic resin used as a mainstay, is a mixture of bisphenol A type phenoxy, bisphenol A type / bisphenol F type phenoxy, brominated phenoxy, phosphorous phenoxy, bisphenol A / bisphenol S type phenoxy and caprolactone Modified phenoxy and the like. Of these, bisphenol A-type phenoxy resins are more preferable in terms of heat resistance, environment friendliness, compatibility of curing agent, and curing speed.
The weight average molecular weight of the phenoxy resin used as a main component of the primer coating layer of the present invention preferably has a weight average molecular weight of 1,000 to 500,000. If the weight average molecular weight is less than 1,000, On the other hand, if the weight average molecular weight is more than 500,000, the workability from the high viscosity is lowered, or the coating surface is difficult to come out evenly after the coating, and mixing with other raw materials is difficult to control.
The type of the silane coupling agent in the primer coating layer can be classified into a terminal reactor, and examples thereof include chlorosilane, alkylalkoxysilane, aminosilane, epoxy silane and olefinic silane. In the present invention, Particularly, an epoxy silane coupling agent having an epoxy group having a better bonding force with a phenoxy resin is used.
The primer coating layer formed by the above composition is preferably formed to a thickness of 0.5 to 5 탆, and if it is formed to be less than 0.5 탆, the cohesive force between the pressure-sensitive adhesive layer and the heat-resistant base layer is undesirably low. On the other hand, , The thickness of the coating layer of the adhesive tape may increase, which may lead to a problem of the lead frame being rolled.
The adhesive tape for electronic parts of the present invention provides excellent cohesion between the heat-resistant substrate layer and the pressure-sensitive adhesive layer by the primer coating layer to improve the phenomenon of adhesive residue after detaching due to the plasma process during the manufacturing process of electronic parts have.
3) Pressure-sensitive adhesive layer
In the pressure-sensitive adhesive tape for electronic parts of the present invention, the pressure-sensitive adhesive layer is preferably made of a thermoplastic phenoxy resin having excellent heat resistance and excellent adhesive strength, and capable of maintaining heat resistance while controlling excessive curing shrinkage of the thermosetting agent for phenoxy resin and phenoxy resin (Energy ray curable acrylic resin) and a photoinitiator for the same.
Since the pressure-sensitive adhesive layer is cured by thermal curing and energy rays, it does not have an adhesive force at room temperature but exhibits adhesive force only during the heat lamination process, so that lamination can be performed on the lead frame, And provides excellent heat resistance against heat history in which the tape is exposed.
More specifically, the pressure-sensitive adhesive layer of the present invention is a pressure-sensitive adhesive layer comprising, based on 100 parts by weight of the phenoxy resin, 0.1 to 10 parts by weight of an acrylic resin, at least one of melamine, urea-formaldehyde, isocyanate functional prepolymer, phenol hardener and amino hardener 5 to 20 parts by weight of any one selected thermosetting agent, 5 to 30 parts by weight of an energy ray-curable acrylic compound having at least one carbon double bond structure in the molecule, and 5 to 30 parts by weight of a thermosetting and energy And is formed by optical rotation.
Examples of the phenoxy resin used as the main thermoplastic resin include bisphenol A phenoxy, bisphenol A / bisphenol F phenoxy, brominated phenoxy, phosphorus phenoxy, bisphenol A / bisphenol S phenoxy, Caprolactone-modified phenoxy and the like. Of these, bisphenol A-type phenoxy resins are particularly superior in terms of heat resistance, environment friendliness, compatibility of curing agent, and curing speed.
The phenoxy resin preferably has a weight average molecular weight of 1,000 to 500,000. In this case, the problem of residual adhesive residue during detaching can be minimized by improving heat resistance due to an increase in internal cohesive force.
The organic solvent capable of dissolving the phenoxy resin is preferably a ketone-based solvent, an alcohol-based solvent, a glycol ether-based solvent or an ester-based solvent. Concretely, cyclohexanone, methyl ethyl ketone, benzyl alcohol, A mixture of two or more selected from the group consisting of glycol alkyl ether, phenoxypropanol, propylene glycol methyl ether acetate, tetrahydrofuran and N-methylpyrrolidone can be used.
In the pressure-sensitive adhesive composition, 5 to 40 parts by weight, preferably 20 to 35 parts by weight, of the phenoxy resin is more preferable relative to 100 parts by weight of the organic solvent. If necessary, an aromatic hydrocarbon solvent such as toluene, xylene, aromatic 100 or hexane may be added as a diluent in order to improve the coating defects and adhesion to the substrate film. At this time, it is preferable that the amount of the diluent is not more than 40% by weight relative to the solvent.
The pressure-sensitive adhesive composition may be any of those capable of curing a resin having a functional group of a hydroxyl group as a crosslinking agent or a curing agent with respect to the phenoxy resin.
For example, it can be selected from thermosetting agents such as melamine, urea-formaldehyde, isocyanate functional prepolymer, phenol curing agent and amino-based curing agent.
At this time, the content of the thermosetting agent selected above is preferably 5 to 20 parts by weight based on 100 parts by weight of the phenoxy resin. When the content of the thermosetting agent is less than 5 parts by weight, the pressure-sensitive adhesive layer is retracted due to an excessively small amount (relative glass transition temperature is decreased and the loss elastic modulus is increased) The pressure sensitive adhesive pushed by the adhesive layer is raised around the die pad or the land portion of the lead frame so that the adhesive residue may be generated during detaching of the adhesive between the sealing resin and the lead frame during the resin sealing process. On the other hand, if the content of the thermosetting agent exceeds 20 parts by weight, the adhesive strength and wettability of the pressure-sensitive adhesive layer may be lowered, which may cause a problem of delamination, and the adhesive layer may be broken during lamination due to excessively increased strength. In addition, the tape is warped due to excessive curing shrinkage during the drying and curing process after the application of the pressure-sensitive adhesive to the heat-resistant substrate layer, thereby lowering the lamination workability.
Further, the pressure-sensitive adhesive composition contains a photo-curing resin (energy ray curable acrylic resin) for forming a crosslinking structure in addition to the crosslinking structure of the phenoxy resin.
The energy ray-curable acrylic compound has a structure having at least one carbon-carbon double bond structure in the molecule, and may be an acrylic polymer, an acryl oligomer, an acrylic monomer, or the like, and has at least one unsaturated bond. The acrylic group functions as a functional group that forms a crosslinked structure through a free radical reaction, and the reactivity, crosslinking structure and degree of curing can be controlled according to the number of functional groups. As the number of functional groups increases, the reaction (crosslinking) speed increases, the glass transition temperature increases, and the heat resistance increases, but the flexibility and adhesion of the pressure-sensitive adhesive layer decrease.
In selecting an acrylic resin having an appropriate number of functional groups, a balance between adhesive strength and rigidity should be used as well as selection of a thermosetting agent for curing the phenoxy resin. Examples of acrylic compounds used in energy ray curing that meet these requirements include acrylic acid-based compounds selected from the group consisting of epoxy acrylates, aromatic urethane acrylates, aliphatic urethane acrylates, polyether acrylates, polyester acrylates and acrylic acrylates They can be used alone or in combination of two or more different oligomers.
Among oligomers of each kind, oligomers having a functional group of about 2 to 9 can be used depending on the number of functional groups. In order to suppress the adhesion of the pressure-sensitive adhesive layer to the surface of the sealing resin and the lead frame at the time of detaching the wire bonding property due to the increase in the cohesive strength, strength and glass transition temperature of the pressure-sensitive adhesive layer through high curing density, Oscillating oligomers are preferred. The preferred content of such an energy ray-curable acrylic compound is 5 to 30 parts by weight based on 100 parts by weight of the phenoxy resin.
The photoinitiator used to initiate the curing by the energy ray of the energy ray curable acrylic compound may be selected from benzophenone, chitosan, alpha hydroxy ketone, alpha amino ketone, phenylglyoxylate, Takeover. The above photoinitiator may be used alone, but two or more photoinitiators may be mixed according to the efficiency and characteristics of the photoinitiator for the purpose of forming a uniform cross-linked structure depending on the thickness of the pressure-sensitive adhesive layer, the intensity of energy rays, The content of the photoinitiator may be 0.5 to 10 parts by weight, preferably 1 to 5 parts by weight based on 100 parts by weight of the energy ray curable acrylic resin.
The pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer contains an acrylic resin containing a hydroxyl group, a carboxyl group or an epoxy group. Examples of preferred acrylic resins include acrylonitrile, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, acrylic acid, 2-hydroxyethyl (meth) acrylate, methyl (meth) (Meth) acrylate, isooctyl acrylate, stearyl methacrylate, and the like, or by copolymerization of two or more kinds thereof.
The acrylic resin preferably has a weight average molecular weight of 100,000 to 3,000,000, and the preferable content of the acrylic resin is 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight, relative to 100 parts by weight of the phenoxy resin Of the total.
If the content of the acrylic resin is less than 0.1 parts by weight, the tape may be torn due to a high adhesive force with the sealing resin during the detaching step at room temperature. When the content of the acrylic resin exceeds 10 parts by weight, There is a problem that the adhesion with the lead frame deteriorates in addition to the adhesive force, which may cause problems of bleed-out or flash during the sealing resin sealing process.
The pressure-sensitive adhesive composition having the above composition has a glass transition temperature of 80 to 150 ° C. If the glass transition temperature is less than 80 캜, the change in physical properties of the pressure-sensitive adhesive at high temperature becomes too severe due to thermal history during the QFN process. If the temperature exceeds 150 캜, the lamination temperature of the adhesive tape becomes 170 캜 or more, Warpage phenomenon becomes severe. This is due to the fact that the thermal expansion of the lead frame becomes worse and the degree of thermal expansion with the tape becomes larger, resulting in an increase in warpage.
Further, the pressure-sensitive adhesive layer formed of the above-described pressure-sensitive adhesive composition preferably has an ordinary-temperature cohesive force of 0 to 1 gf / 50 mm against a stainless steel material and does not have a cohesive force at room temperature. However, the cohesive force is developed during the heat lamination process, And provides excellent heat resistance against the thermal history in which the adhesive tape is exposed during the manufacturing process of the semiconductor device.
The thickness of the pressure-sensitive adhesive layer formed of the above-mentioned pressure-sensitive adhesive composition is preferably 2 to 10 占 퐉. If the thickness is less than 2 占 퐉, the pressure-sensitive adhesive force may be lowered to cause bleeding-out or flashing of the sealing resin, , The adhesive force is increased and the pressure-sensitive adhesive layer is left on the lead frame in the detaching process, which is not preferable.
The adhesive tape for electronic parts formed by laminating a primer coating layer and a pressure-sensitive adhesive layer formed by curing a coating liquid containing an epoxy silane coupling agent on at least one surface of the heat-resistant substrate layer and the heat- Thereby satisfying the necessary and corresponding characteristics required for the device manufacturing process.
That is, a thermoplastic phenoxy resin having excellent adhesion to metals such as a lead frame and excellent heat resistance is mainly used, and bleed-out of a sealing resin or flash flash), and the temperature at which the adhesive force is developed in the lead frame can be adjusted by adjusting the degree of curing. It is possible to solve the problem of residual adhesive residue remaining on the lead frame or the sealing resin surface of the pressure-sensitive adhesive after detaching by the excellent adhesive force between the heat-resistant substrate layer and the pressure-sensitive adhesive layer due to the formation of the primer coating layer.
In addition, although the adhesive tape of the present invention has been described by way of example of a semiconductor packaging process, it is to be understood that the present invention is not necessarily limited thereto, but may also be applied to a mask tape at the top of a high temperature manufacturing process of various electronic parts.
Hereinafter, the present invention will be described in more detail with reference to Examples.
The present invention is intended to more specifically illustrate the present invention, and the scope of the present invention is not limited by these examples.
≪ Example 1 >
80 g of phenoxy resin (YP50) was dissolved in 160 g of solvent cyclohexanone, and 10 g of epoxy silane coupling agent (Dow corning, Z-6040) was mixed and stirred for 1 hour. The agitated coating composition was applied to a corona-treated polyimide film (manufactured by SKC Kolon Co., Ltd.) at a thickness of about 2 占 퐉 and dried in a dryer at 120 占 폚 for about 3 minutes to form a primer coating layer.
100 g of phenoxy resin (YP50, Kukdo Chemical Co., Ltd.) as a main component of the pressure-sensitive adhesive was dissolved in 200 g of methyl ethyl ketone as a solvent. 15 g of polyisocyanate thermosetting agent, 20 g of polyurethane acrylate as an energy ray curable compound (Japan Synthesis, UV7600B80) And 1 g of a photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. A pressure-sensitive adhesive tape having a structure in which the agitated pressure-sensitive adhesive composition was applied on a primer coating layer formed on a polyimide film (manufactured by SKC Kolon) at about 3 占 퐉, dried in a dryer at 150 占 폚 for about 3 minutes and irradiated with ultraviolet rays to further form a pressure- .
≪ Comparative Example 1 &
100 g of phenoxy resin (YP50, Kukdo Chemical Co., Ltd.) as a main component of the pressure-sensitive adhesive was dissolved in 200 g of methyl ethyl ketone as a solvent. 15 g of polyisocyanate thermosetting agent, 20 g of polyurethane acrylate as an energy ray curable compound (Japan Synthesis, UV7600B80) And 1 g of a photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. The agitated pressure-sensitive adhesive composition was applied to a polyimide film (product of SKC Kolon) at a thickness of about 3 占 퐉, dried in a dryer at 150 占 폚 for about 3 minutes, and irradiated with ultraviolet rays to produce a pressure-sensitive adhesive tape.
≪ Comparative Example 2 &
An adhesive tape was prepared in the same manner as in Comparative Example 1, except that the pressure-sensitive adhesive composition prepared in Comparative Example 1 was applied to a thickness of 5 μm to form a pressure-sensitive adhesive layer.
≪ Comparative Example 3 &
80 g of phenoxy resin (YP50) was dissolved in 160 g of solvent cyclohexanone, and 10 g of a chlorosilane coupling agent (Dow corning, Z-1211) was mixed and stirred for 1 hour. The agitated coating composition was applied to a corona-treated polyimide film (manufactured by SKC Kolon Co., Ltd.) at a thickness of about 2 占 퐉 and dried in a dryer at 120 占 폚 for about 3 minutes to form a primer coating layer.
100 g of phenoxy resin (YP50, Kukdo Chemical Co., Ltd.) as a main component of the pressure-sensitive adhesive was dissolved in 200 g of methyl ethyl ketone as a solvent. 15 g of polyisocyanate thermosetting agent, 20 g of polyurethane acrylate as an energy ray curable compound (Japan Synthesis, UV7600B80) And 1 g of a photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. A pressure-sensitive adhesive tape having a structure in which the agitated pressure-sensitive adhesive composition was applied on a primer coating layer formed on a polyimide film (manufactured by SKC Kolon) at about 3 占 퐉, dried in a dryer at 150 占 폚 for about 3 minutes and irradiated with ultraviolet rays to further form a pressure- .
≪ Comparative Example 4 &
80 g of phenoxy resin (YP50) was dissolved in 160 g of solvent cyclohexanone, and 10 g of aminosilane coupling agent (Dow corning, Z-6020) was mixed and stirred for 1 hour. The agitated coating composition was applied to a corona-treated polyimide film (manufactured by SKC Kolon Co., Ltd.) at a thickness of about 2 占 퐉 and dried in a dryer at 120 占 폚 for about 3 minutes to form a primer coating layer.
100 g of phenoxy resin (YP50, Kukdo Chemical Co., Ltd.) as a main component of the pressure-sensitive adhesive was dissolved in 200 g of methyl ethyl ketone as a solvent. 15 g of polyisocyanate thermosetting agent, 20 g of polyurethane acrylate as an energy ray curable compound (Japan Synthesis, UV7600B80) And 1 g of a photoinitiator (CYTEC, DAROCUR TPO) were mixed and stirred for 1 hour. A pressure-sensitive adhesive tape having a structure in which the agitated pressure-sensitive adhesive composition was applied on a primer coating layer formed on a polyimide film (manufactured by SKC Kolon) at about 3 占 퐉, dried in a dryer at 150 占 폚 for about 3 minutes and irradiated with ultraviolet rays to further form a pressure- .
<Experimental Example>
The properties of the adhesive tape prepared in Example 1 and Comparative Examples 1 to 4 were evaluated for each of the following items, and the results are shown in Table 1 below.
Sample of adhesive tape for electronic parts
1. Plasma treatment
The fabricated sample was treated with microwave plasma at 200 W for 5 minutes.
2. Interfacial Adhesion Measurement
The plasma-treated fabricated sample was measured after lamination with a polyimide film in a hot press at 180 캜. If the adhesive force is 15 gf / cm or less, transfer occurs in which the pressure-sensitive adhesive layer remains on some of the polyimide films due to insufficient adhesive force between the pressure-sensitive adhesive layer and the base film. This transfer phenomenon can be easily judged by the naked eye, so it is not necessary to confirm a separate optical microscope.
3. Check the adhesive residue
The plasma-treated sample was peeled off from the 25 mu m-thick AgCu lead frame and laminated, and the surface of the lead frame was observed with an optical microscope to determine whether the adhesive residue remained. At this time, when there is a residue of the pressure-sensitive adhesive, it is possible to confirm whether or not the portion of the pressure-sensitive adhesive is peeled off from the substrate portion in the form of a point or a surface
4. Sealing resin leakage
The adhesive tape was peeled off from the lead frame after the sealing resin process, and the sealing resin and the lead frame portion were observed with a microscope. When a large amount of the sealing resin leaks, it can be confirmed by a microscope that a black sealing resin adheres to the die or the lead portion of the lead frame, and when a minute leak occurs, the sealing resin of gray or transparent color is leaked .
On the other hand, in Comparative Examples 1 and 2 in which no primer coating layer was formed, adhesive residue occurred. In the pressure-sensitive adhesive tapes prepared in Comparative Examples 3 and 4 depending on the type of silane coupling agent, It seems to be a lack of adhesion of layer. In Comparative Examples 1 and 2, the sealing resin leakage preventing effect was confirmed by the improvement of the adhesive force due to the increase of the thickness of the pressure-sensitive adhesive layer of 2 mu m.
As described above, the present invention provides an adhesive tape in which a primer coating layer is additionally formed between a heat-resistant substrate layer and a pressure-sensitive adhesive layer. Thus, the adhesive tape of the present invention provides an excellent adhesive strength between the heat-resistant substrate layer and the pressure-sensitive adhesive layer by forming a primer coating layer, thereby providing an adhesive tape meeting the requirements of a semiconductor manufacturing process with a plasma process. It is possible to prevent residues and improve sealing resin leakage and stains.
Further, in the adhesive tape of the present invention, the pressure-sensitive adhesive layer is made of a thermoplastic phenoxy resin, and the heat curing agent capable of improving the crosslinking structure of the phenoxy resin and the heat curing agent An adhesive composition containing an energy ray-curable acrylic compound for curing is cured by thermal curing and energy ray casting, so that it does not have an adhesive force at room temperature, but an adhesive force is exerted only during a heat lamination process.
Thus, the adhesive tape of the present invention enables lamination to the lead frame and provides excellent heat resistance against the thermal history in which the adhesive tape is exposed during the manufacturing process of the semiconductor device. In addition, it can improve the reliability during manufacturing of the semiconductor device with excellent adhesive force, prevent the leakage of the sealing material, and prevent appearance defects when the tape is removed after completion of the process.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art.
Claims (7)
A primer coating layer formed by curing a coating liquid containing an epoxy silane coupling agent on at least one surface of the heat resistant substrate layer,
Wherein the pressure-sensitive adhesive layer is formed by a lamination method.
0.1 to 10 parts by weight of an acrylic resin,
5 to 20 parts by weight of a thermosetting agent selected from the group consisting of melamine, urea-formaldehyde, isocyanate functional prepolymer, phenol hardener and amino hardener,
5 to 30 parts by weight of an energy ray curable acrylic compound having at least one carbon double bond structure in a molecule and
Wherein the pressure-sensitive adhesive composition in which the photoinitiator is contained in an organic solvent is cured by thermal curing and energy ray casting and is designed to exhibit an adhesive force during a heating process, not at room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140144957A KR20160049091A (en) | 2014-10-24 | 2014-10-24 | Adhesive tape for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140144957A KR20160049091A (en) | 2014-10-24 | 2014-10-24 | Adhesive tape for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160049091A true KR20160049091A (en) | 2016-05-09 |
Family
ID=56020174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140144957A KR20160049091A (en) | 2014-10-24 | 2014-10-24 | Adhesive tape for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20160049091A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102376882B1 (en) * | 2021-02-10 | 2022-03-21 | (주)이녹스첨단소재 | Adhesive sheet for display |
-
2014
- 2014-10-24 KR KR1020140144957A patent/KR20160049091A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102376882B1 (en) * | 2021-02-10 | 2022-03-21 | (주)이녹스첨단소재 | Adhesive sheet for display |
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