KR20160041488A - Optical system for focusing laser beam - Google Patents
Optical system for focusing laser beam Download PDFInfo
- Publication number
- KR20160041488A KR20160041488A KR1020140135533A KR20140135533A KR20160041488A KR 20160041488 A KR20160041488 A KR 20160041488A KR 1020140135533 A KR1020140135533 A KR 1020140135533A KR 20140135533 A KR20140135533 A KR 20140135533A KR 20160041488 A KR20160041488 A KR 20160041488A
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- South Korea
- Prior art keywords
- laser beam
- laser
- cutting
- focus
- focused
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a laser beam focusing optical system device, and more particularly, to a laser beam focusing optical system device that includes a plurality of beam expanders that enlarge a width of a laser beam incident from one side and output the laser beam to the other side, And a curvilinear focusing mirror for reflecting the laser beams output from the beam expander downward and concentrating the reflected laser beams so that a focus is formed at different positions in the vertical direction and the horizontal direction, respectively; And the laser beams focused by the curved surface focusing mirror are sequentially focused at the upper, middle, and lower heights of the cutting specimen in the up-and-down direction, respectively, and the backward, The focal point is formed in the forward position in order, so that the efficiency of the laser cutting can be increased, the thick plate can be processed quickly and precisely, and the laser beam focusing Optical system device.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser beam focusing optical system, and more particularly, to a laser beam focusing optical system that uses multiple beams to focus and focus at different positions, The present invention relates to a laser beam focusing optical system device capable of efficiently cutting a thick plate material by reducing an affected zone and allowing a plate material to be processed to effectively absorb the laser beam.
The laser cutting device is a device for cutting or cutting materials using the energy of a laser beam. It can be used for precision machining of various materials such as metal, wood, cloth, plastic and glass do.
However, since the conventional laser processing cutting apparatus uses a single laser beam to focus the laser beam to cut the laser beam, the focus of the laser beam deviates from the upper and lower ends of the plate during high power laser processing such as cutting of thick plate, The laser beam is not focused, so that the cutting efficiency due to melting is lowered. As a result, the heat affected zone (HAZ: Heat Affected Zone), which is a region affected by heat, The precision is lowered and the laser beam is prevented from being transmitted to the lower side by the melt on the upper surface portion of the plate material melted by the laser beam. In addition, when a single laser beam is condensed to form a single focal point, the laser beam is not efficiently absorbed by the gas generated in the melted portion or the plate material cut by the plume, have.
In order to solve this problem, US Pat. No. 2003-0006221 (entitled Method and apparatus for cutting a muli-layer substrate by a dual laser irradiation) or a Korean patent (KR 2011-0111608, A method of laser cutting a film) has been devised in which a laser beam is irradiated to a sample to be sequentially cut by dividing the laser beam into a plurality of laser beams and varying the focal position of each laser beam. However, There is a conceptual difference from the simultaneous cutting method in which the beam cuts a part of the specimen.
In addition, Korean Laid Open Patent Application (KR 2014-0020776, a laser processing apparatus using a Fresnel region element and a substrate cutting method using the same) and US Patent Application Publication No. 2013-0197634, Apparatus for Patterned Plasma-Mediated Laser Trephination of the Lens Capsule and three dimensinal phaco-segmentation), a method of increasing the efficiency of the cutting process by simultaneously irradiating a plurality of focal points of a single laser beam using a multi-focal point is also devised. However, in this method, it is difficult to arrange the focus of the plurality of laser beams in the depth direction so as to spatially separate or partially overlap the laser beams, and to solve the problem of the processing deterioration due to the plasma plume.
Accordingly, there is a need to develop a laser cutting apparatus capable of increasing the efficiency of laser cutting, making it possible to process a thick plate quickly and precisely, and reducing the area affected by heat to improve the quality of the cutting material.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a laser cutting method and a laser cutting method, And to improve the processing quality of the plate material to be cut by reducing the area affected by heat, and to provide a laser beam focusing optical system device capable of improving the quality of the plate material to be cut.
According to an aspect of the present invention, there is provided a laser beam focusing optical system, comprising: a plurality of beam expanders that enlarge a width of a laser beam incident from one side and output the laser beam to the other side and are arranged in parallel in a vertical direction; And a curvilinear focusing mirror for reflecting the laser beams output from the beam expander downward and concentrating the reflected laser beams so that a focus is formed at different positions in the vertical direction and the horizontal direction, respectively; And the laser beams focused by the curved surface focusing mirror are sequentially focused at the upper, middle, and lower heights of the cutting specimen in the up-and-down direction, respectively, and the backward, And focal points are formed in order at the front position.
The laser beam focusing optical system of the present invention includes a beam expander for enlarging a width of a laser beam incident from one side and outputting the enlarged laser beam to the other side; And a curvilinear focusing mirror for reflecting the laser beam output from the beam expander downward so as to condense the reflected laser beam so as to form a continuous focal point in a height direction and a horizontal direction; Wherein the laser beams focused by the curved surface focusing mirror are continuously focused in the vertical direction from the upper portion to the lower portion of the cutting specimen and the laser beams focused from the rear to the front in the conveying direction of the cutting specimen And a focal point is continuously formed in the position.
The laser beam focusing optical system of the present invention has an advantage that it can improve the efficiency of laser cutting and can process a thick plate quickly and precisely and reduce the area affected by heat to improve the quality of the plate to be cut.
In addition, the focal point of the laser beams can be adjusted so that the position in the thickness direction of the plate material and the position of the plate material in the transport direction are formed differently. The focus height and position of the laser beams It is advantageous to perform optimized cutting.
1 is a front schematic view showing a laser beam focusing optical system according to a first embodiment of the present invention;
2 is a schematic cross-sectional view showing a beam expander according to the present invention;
3 is a schematic view showing a focus change according to an angle adjustment of a beam splitter and a reflecting mirror according to the present invention;
FIG. 4 is a schematic view showing a focus change according to an angle adjustment of a curved surface condensing mirror according to the present invention; FIG.
5 is a front schematic view showing a laser beam focusing optical system according to a second embodiment of the present invention;
Hereinafter, the laser beam focusing optical system of the present invention as described above will be described in detail with reference to the accompanying drawings.
≪ Example 1 >
1 is a schematic front view showing a laser beam focusing optical system according to a first embodiment of the present invention.
As shown in the drawing, the laser beam focusing
In the first embodiment of the laser beam focusing optical system according to the present invention, one
The beam expander 400 enlarges the width of the laser beam incident on one side and outputs the expanded laser beam to the other side. The
The curved
Here, the laser beams focused by the curved
That is, the first laser beam B1, which is reflected and condensed by the curved
The upper part of the
Accordingly, the upper, middle, and lower portions of the specimen can be sequentially melted and cut in the thickness direction while the cutting specimen is being fed, thereby improving the laser cutting efficiency. Thus, it is possible to rapidly and precisely process the thick plate material, The heat affected zone is reduced and the cutting quality of the cutting material is improved.
At this time, the laser beam incident on the beam expander 400 and the laser beam output through the
The
2, when the distance between the
Thus, the height of the focal point can be controlled by controlling the distance between the lenses of the beam expander 400, and the height and the position in the transport direction of each focal point can be adjusted. So that efficient cutting can be performed.
The apparatus may further include a plurality of beam splitters and a reflecting mirror for dividing and reflecting the generated laser beam and causing the beams to be incident on the respective beam expanders, wherein the beam splitters and the reflecting mirror are formed to be adjustable in angle, The beam expanders can be angularly and positively adjusted so as to be parallel to the respective incident laser beams.
This reflects the laser beam generated from one
That is, as shown in the figure, if the laser beams are reflected to be spread, the distance in the transport direction between the foci can be distanced. On the contrary, if the laser beams are reflected to converge, the distance in the transport direction between foci can be narrowed.
Thus, it is possible to adjust the position of the focal points on the cutting specimen in the transport direction, thereby optimizing the cutting by adjusting the focal position according to the thickness of the cutting specimen, the feed speed during cutting, and the material.
The curved
4, an
In this way, the angle of the curved
The focal points of the laser beam focused at the center and the lower portion of the
That is, as shown in FIG. 1, after the first laser beam B1 is condensed so that the first focus F1 is formed on the upper portion of the
Since foci are formed so as to overlap the laser beams, the efficiency of laser cutting can be increased.
≪ Example 2 >
5 is a front schematic view showing a laser beam focusing optical system according to a second embodiment of the present invention.
As shown in the drawing, the laser beam focusing
When the width of the laser beam is output through the
At this time, the focal point of the
That is, the first embodiment of the present invention is such that a plurality of foci are formed so as to be sequentially arranged, and the second embodiment is such that the foci are continuously formed.
Thus, the focus of the laser beam can be uniformly formed over the entire thickness of the cutting specimen, and the efficiency of laser cutting can be improved.
As in the first embodiment, the curvilinear focusing
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.
1000: laser beam focusing optical system device
100: laser oscillator
210: first reflection mirror 220: second reflection mirror
310: first beam splitter 320: second beam splitter
400: beam expander
401: first lens 402: second lens
403: Body
410: first beam expander 420: second beam expander
430: Third beam expander
500: Curved surface focusing mirror 510: Angle adjusting part
600: (Cutting process) Specimen
F1: first focus B1: first laser beam
F2: second focus B2: second laser beam
F3: Third focus B3: Third laser beam
Claims (7)
A curved surface focusing mirror for reflecting the laser beams output from the beam expander downward so as to focus the reflected laser beams so that focus is formed at different positions in the vertical direction and the horizontal direction; , ≪ / RTI >
The laser beams focused by the curved surface focusing mirror are sequentially focused on the upper, middle, and lower heights of the cutting specimen in the up-and-down direction, and are sequentially arranged in the rearward, And a focal point are formed on the surface of the laser beam converging optical system.
The beam expander includes:
Tubular body; A first lens coupled to one side of the body; And a second lens coupled to the other side of the body; And,
Wherein a distance between the first lens and the second lens is adjustable so that a height of a focus formed on the cutting specimen can be adjusted.
Further comprising a plurality of beam splitters and a reflecting mirror for dividing and reflecting the generated laser beam and making it incident on each of the beam expanders,
Wherein the beam splitters and the reflecting mirror are formed to be adjustable in angle, and the beam expanders are adjusted in angle and position so as to be parallel to the respective incident laser beams.
Wherein the curvilinear focusing mirror is configured to be adjustable in angle so that the angle of the curvilinear focusing mirror is adjusted to adjust the focus position of the cutting sample in the conveying direction.
Wherein the focal points of the laser beam focused on the center and the lower portion of the cutting specimen are formed at positions overlapping with the laser beam focused so as to focus on the upper or middle of the cutting specimen. Device.
A curved surface focusing mirror for reflecting the laser beam output from the beam expander downward so as to condense the reflected laser beam so as to form a continuous focal point in a height direction and a horizontal direction; , ≪ / RTI >
The laser beams focused by the curved surface condensing mirror are successively focussed to the height from the upper portion to the lower portion of the cutting specimen in the vertical direction and continuously focused on the position from the rear to the front in the conveying direction of the cutting specimen And wherein the laser beam converging optical system is a laser beam converging optical system.
Wherein the curvilinear focusing mirror is configured to be adjustable in angle so that the angle of the curvilinear focusing mirror is adjusted to adjust the focus position of the cutting sample in the conveying direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140135533A KR20160041488A (en) | 2014-10-08 | 2014-10-08 | Optical system for focusing laser beam |
Applications Claiming Priority (1)
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---|---|---|---|
KR1020140135533A KR20160041488A (en) | 2014-10-08 | 2014-10-08 | Optical system for focusing laser beam |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20180040744A (en) * | 2016-10-12 | 2018-04-23 | 주식회사 인스텍 | 3D Printing Laser Beam Irradiation Apparatus and 3D Printing Laser Beam Irradiation System compring the same |
KR20190115158A (en) * | 2018-03-30 | 2019-10-11 | 삼성디스플레이 주식회사 | Laser cutting device |
CN112705859A (en) * | 2020-12-14 | 2021-04-27 | 华虹半导体(无锡)有限公司 | Laser cutting ring-removing method for wafer |
CN113001015A (en) * | 2021-03-25 | 2021-06-22 | 连云港倍特超微粉有限公司 | Thick metal plate laser welding head based on double-focus reflector and welding method |
RU2753066C1 (en) * | 2021-01-14 | 2021-08-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева - КАИ" | Optical head for laser cutting |
CN115026412A (en) * | 2021-02-25 | 2022-09-09 | 深圳市大族半导体装备科技有限公司 | Laser processing device and method for brittle product |
-
2014
- 2014-10-08 KR KR1020140135533A patent/KR20160041488A/en not_active Application Discontinuation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180040744A (en) * | 2016-10-12 | 2018-04-23 | 주식회사 인스텍 | 3D Printing Laser Beam Irradiation Apparatus and 3D Printing Laser Beam Irradiation System compring the same |
KR20190115158A (en) * | 2018-03-30 | 2019-10-11 | 삼성디스플레이 주식회사 | Laser cutting device |
CN112705859A (en) * | 2020-12-14 | 2021-04-27 | 华虹半导体(无锡)有限公司 | Laser cutting ring-removing method for wafer |
RU2753066C1 (en) * | 2021-01-14 | 2021-08-11 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Казанский национальный исследовательский технический университет им. А.Н. Туполева - КАИ" | Optical head for laser cutting |
CN115026412A (en) * | 2021-02-25 | 2022-09-09 | 深圳市大族半导体装备科技有限公司 | Laser processing device and method for brittle product |
CN113001015A (en) * | 2021-03-25 | 2021-06-22 | 连云港倍特超微粉有限公司 | Thick metal plate laser welding head based on double-focus reflector and welding method |
CN113001015B (en) * | 2021-03-25 | 2024-05-28 | 连云港倍特超微粉有限公司 | Thick metal plate laser welding head based on double-focus reflector and welding method |
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