KR20160038245A - Floating coater apparatus with high accuracy of substrate alignment - Google Patents

Floating coater apparatus with high accuracy of substrate alignment Download PDF

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Publication number
KR20160038245A
KR20160038245A KR1020140130725A KR20140130725A KR20160038245A KR 20160038245 A KR20160038245 A KR 20160038245A KR 1020140130725 A KR1020140130725 A KR 1020140130725A KR 20140130725 A KR20140130725 A KR 20140130725A KR 20160038245 A KR20160038245 A KR 20160038245A
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KR
South Korea
Prior art keywords
substrate
alignment
floating
alignment column
column
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KR1020140130725A
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Korean (ko)
Inventor
백승현
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주식회사 케이씨텍
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Priority to KR1020140130725A priority Critical patent/KR20160038245A/en
Publication of KR20160038245A publication Critical patent/KR20160038245A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a floating-type substrate coater apparatus for coating a chemical liquid on a surface of a substrate while transferring the substrate while floating the substrate on a floating stage, the floating-type substrate coater apparatus comprising: And an inclined surface is formed at a portion contacting the substrate, Alignment column moving means for moving the alignment column to a predetermined first position when the substrate reaches a predetermined area on the floating stage; The edge of the substrate moves downward along the inclined surface in accordance with the movement of the alignment column toward the first position so that the edge of the substrate is moved horizontally by the inclined surface by the inclined surface formed on the alignment column, The suction force is applied to the gripping member in a state in which the gripping member and the bottom surface of the substrate are brought into close contact or contact with each other by being moved downwardly and aligned at a predetermined position and height so as to precisely fix the substrate without any distortion, And a substrate coater.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate coater,

The present invention relates to an abrasive type substrate coater apparatus, and more particularly, to an abrasive type substrate coater apparatus for accurately grasping a position of a substrate on a plane, as well as a height in a vertical direction, To an adjustable substrate coater apparatus.

In a process for manufacturing a flat panel display such as an LCD, a coating process for applying a chemical liquid such as a resist solution onto the surface of a substrate to be processed, which is made of glass or the like, is involved. Conventionally, a spin coating method for applying a chemical liquid to the surface of a substrate to be processed by rotating a substrate while applying a chemical liquid to a central portion of the substrate has been used.

However, as the size of the LCD screen becomes larger, the spin coating method is scarcely used, and a slit-shaped slit nozzle having a length corresponding to the width of the substrate to be processed and a slit nozzle A coating method of coating the surface of the substrate is used.

A long time ago, the substrate coater apparatus fixed the substrate on the rotating table, coated the chemical liquid on the substrate, and applied the chemical liquid by the centrifugal force by the rotation of the substrate. However, as the size of the substrate is increased, the substrate is sucked into the substrate chuck to fix the position, and the slit nozzle formed with a width as long as the width of the substrate is moved relative to the substrate while applying the chemical solution.

 Recently, as shown in FIG. 1A, in order to apply the chemical liquid within a shorter period of time, the substrate W is moved on the floating stage 20 on which the floating force is applied while holding the substrate G with the holding member 40 An inline type floating type coater equipment 1 for applying a chemical solution in such a form that the chemical solution PR is applied from the stationary slit nozzle 30 has been proposed. This configuration is advantageous in that a coating process for a larger number of substrates G can be performed within a predetermined time since the chemical solution is applied while the target substrate G is continuously supplied in one direction.

When the substrate to be processed G is supplied to the floating type coater apparatus 1, the substrate to be processed G is coated on the gripping member 40 from the slit nozzle 30 in a position and posture alignment state The chemical liquid PR is accurately applied to the application region of the substrate G to be processed. 1B, when the target substrate G is supplied 88d1 onto the floating stage 20 of the floating type substrate coater apparatus 1, the two surfaces of the target substrate G Is moved in the diagonal direction (70d1) from the edge of the target substrate (G) to push the defective position and posture of the target substrate to a predetermined position and posture, The position and posture of the target substrate G are aligned. The gripping member 40 is lifted up to the lifting stage 20 after a suction pressure is applied to the suction hole formed on the upper surface of the gripping member 40 to fix the target substrate G to the upper surface of the gripping member 40. Then, The target substrate G is moved by the movement of the slit nozzle 30 in the longitudinal direction of the slit nozzle 30 and the chemical liquid PR is applied from the slit nozzle 30 during the movement of the target substrate.

However, when the substrate G to be processed is supplied (88d1) onto the floating stage 20, the conventional floating coater apparatus 1 shown in Figs. 1A and 1B has the floating force Even when the horizontal position is precisely adjusted by the aligner 70, the high suction pressure is applied to the gripping member 40, so that the gripping member 40 The position and posture of the substrate G to be processed are changed and the substrate G can not be fixed to the gripping member 40 in the correct position and posture. 1C, an error that the chemical solution PR is not applied to the correct application region when the substrate G is transferred in a defective state is transferred to the processed substrate G with the holding member 40 There was a possibility of occurrence.

Therefore, there is a great demand for fixing the target substrate to the gripping member 40 in the correct posture so that the chemical solution can be applied only to the predetermined region.

An object of the present invention is to provide a floating substrate coater apparatus capable of precisely adjusting the position, orientation and height of a substrate to be processed before the substrate to be processed is fixed to the holding member in the floating type substrate coater apparatus .

Accordingly, it is an object of the present invention to precisely apply a chemical liquid to a predetermined application region of a substrate to be transferred to an inline type.

According to an aspect of the present invention, there is provided a floating substrate coater apparatus for coating a surface of a substrate with a chemical solution while transferring the substrate while floating the substrate on a floating stage, And an inclined surface is formed at a portion contacting the substrate; Alignment column moving means for moving the alignment column to a predetermined first position when the substrate reaches a predetermined area on the floating stage; Wherein an edge of the substrate moves downward along the inclined surface in accordance with movement of the alignment column toward the first position.

This is because not only the horizontal position of the substrate is guided by the alignment pillars while the plurality of alignment pillars are moved to the first predetermined position while the substrate is being supplied on the floating stage, The edge is moved downward by the inclined surface to be guided by the predetermined vertical height so that suction pressure is applied to the gripping member in a state in which the gripping member and the bottom surface of the substrate come close to or in contact with each other.

As a result, when the chemical liquid is applied from the slit nozzle while the holding member is conveyed while fixing the substrate, the holding member and the substrate are fixed in a precisely aligned state without being twisted, so that a favorable effect Can be obtained.

Therefore, it is preferable that the inclination of the inclined surface is determined so that the position and height of the substrate reach the alignment position and the alignment height, respectively, when the alignment column reaches the first position.

When the alignment column reaches the first position, suction pressure is applied to the holding member holding the substrate, and the substrate is fixed to the holding member.

In this case, it is preferable that the alignment pillars are vertically movable with respect to the floating stage. Thereby, when the substrate is brought into the floating stage, the alignment column is moved downward so as not to interfere with the inflow path of the substrate.

Meanwhile, according to another embodiment of the present invention, the alignment column may move horizontally out of the movement path of the substrate without being moved up and down.

Wherein the bottom surface of the groove is formed as a flat surface so that when the alignment column reaches the first position, the bottom surface of the substrate is aligned with the alignment column The flat surface may serve as a stopper for downward movement of the substrate. Accordingly, it is possible to prevent the bottom surface of the substrate from colliding with the holding member during downward movement of the substrate by the alignment pillars.

In addition, at least one of the sides of the substrate may be arranged with two or more alignment pillars.

The alignment pillars may have various shapes such as a circular shape, a flat shape, a rectangle, and a letter shape.

According to another aspect of the present invention, there is provided a substrate transferring method of a floating type substrate coater apparatus for applying a chemical solution onto a surface of a substrate while transferring the substrate while floating the substrate on a floating stage, A substrate supplying step of supplying the substrate to the upper side of the stage; When the substrate is positioned on the floating stage, an alignment column having an inclined groove formed at a position in contact with the substrate is brought into contact with the four sides of the substrate, and the alignment column is moved to a predetermined position, A substrate guiding step of guiding an inclined surface of the groove to be moved to a predetermined height and position; A substrate fixing step of fixing the substrate to the holding member by applying a suction pressure to the holding member; A substrate carrying step of carrying the substrate by moving the holding member; The substrate transporting method of the in-plane type substrate coater apparatus according to the present invention is characterized by comprising:

As described above, according to the present invention, in aligning the position of a substrate in order to fix a substrate to a holding member in a floating type coater apparatus, an alignment column having an inclined surface formed at a portion in contact with the substrate is moved to a predetermined first position The substrate can be aligned to a predetermined horizontal position in accordance with the movement of the alignment column toward the first position and also the edge of the substrate can be moved downward by the inclined surface formed on the alignment column to guide the substrate to a predetermined height Thus, it is possible to obtain an advantageous effect that the horizontal position and height of the substrate can be precisely adjusted at one time by one operation of moving the alignment column alone.

Further, in the present invention, since the substrate is fixed by the suction pressure of the gripping member in a state in which the height of the substrate is adjusted to such a height that the suction pressure of the gripping member acts on the alignment column, It is possible to obtain an advantageous effect of preventing the substrate from being tilted during the fixing process.

Accordingly, since the position of the holding member is precisely aligned and accurately aligned with the holding member, the position of the holding member can be precisely adjusted so that the process of applying the chemical solution to the surface of the substrate while transferring the substrate by the holding member can be accurately The effect can be obtained.

FIGS. 1A to 1C are schematic views showing the configuration and operation of a conventional floating-type substrate coater apparatus,
FIG. 2 is a plan view showing a configuration of a floating type substrate coater apparatus according to an embodiment of the present invention, FIG.
FIGS. 3A to 3F sequentially illustrate a configuration in which substrates are aligned and transported using the floating type substrate coater apparatus of FIG. 2;
4 is a view showing an alignment column of a floating-edge substrate coater apparatus according to another embodiment of the present invention.

Hereinafter, an auxiliary substrate type coater apparatus 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, And the same or similar reference numerals will be used for the same or similar functions or configurations.

2, the substrate coater apparatus 100 according to an embodiment of the present invention includes a float stage 120 for generating a float force, a plurality of float- A slit nozzle 130 for applying a chemical liquid PR to the surface of the substrate G to be processed and a side portion of the substrate G floated by the floating force from the floating stage 120 are gripped and moved together An alignment column 110 for aligning the posture, position and height of the substrate G when the substrate G is carried into the floating stage 120; And a control unit (not shown) for controlling the discharge of the slit nozzle 130 and the transfer of the substrate to be processed.

A plurality of holes are formed on the surface of the floating stage 120 to generate air floating force to support the bottom surface of the target substrate G while air is being injected. According to another embodiment of the present invention, instead of spraying air, an ultrasonic wave may generate a float force to support the bottom surface of the target substrate G.

The slit nozzle 130 has a slit-shaped discharge port having a length corresponding to the width of the target substrate G. When the target substrate G passes under the discharge port of the slit nozzle 130, PR onto the surface of the substrate G to be processed or a preliminary ejection process is performed. The slit nozzle 130 is maintained in a fixed position during the transfer of the target substrate G but the slit nozzle 130 is moved at a speed different from the transfer speed of the target substrate G. However, May be moved.

The slit nozzle 130 is fixed to the cross bar 135 supported at both ends, and supplies the chemical solution PR to be applied to the surface of the substrate G from the chemical liquid supply pump.

The gripping member 140 is formed with a suction hole 140a for applying a suction pressure in a state where the bottom surface of one side or both sides of the target substrate G is held in contact with the suction hole 140a, And the bottom surface of the target substrate G is closely fixed to the target substrate G to be integrated with the target substrate G. [

The gripping member 140 moves in the substrate transfer direction along the rail 45 provided in the predetermined path to transfer the substrate G so that the substrate G passes under the slit nozzle 130. At this time, the rail 45 is provided so as to pass through the inside of the cross bar 135 for fixing the slit nozzle 130, so that the substrate G moves along the rail 145 while the holding member 140 moves along the slit nozzle 130 to pass through the lower side.

When the substrate G is supplied to the floating substrate coater apparatus 100 and enters the predetermined region E on the floating stage 120, the alignment column 110 not only moves the horizontal position of the substrate G but also the height And guiding the user to a predetermined position. The alignment pillars 110 are disposed around the predetermined area E so as to be capable of reciprocating horizontal movement 110d in the direction toward the substrate G and the alignment pillars 110 May be formed in the guide slit 122 for guiding horizontal reciprocating movement.

The end of the guide slit 122 defines a first position A1 that limits the horizontal movement of the alignment column 110 so that when the alignment column 110 reaches the first position A1, The horizontal position and the height respectively reach an alignment position (herein, the term 'alignment position' and similar terms refer to the posture, position, and height that the substrate is supposed to be fixed to the gripping member).

The alignment column 110 is installed to be movable in the vertical direction 110u so that the alignment column 110 moves downward in the course of the substrate G entering the predetermined region E on the floating stage 120 So as to prevent mutual interference between the alignment pillars 110 and the substrate G. FIG. Alternatively, according to another embodiment of the present invention, the guide slit 122 of the alignment column 110 is extended to a position deviating out of the carry-in path of the substrate G, The alignment pillars 110 may be moved outward.

The alignment pillars 110 are arranged in such a manner that at least one of the alignment pillars 110 is in contact with each side of the substrate G in order to guide the horizontal position of the substrate G to a predetermined alignment position. In some cases, two or more alignment pillars 110 may be disposed on one side of the substrate G. [

The alignment pillars 110 are formed with inclined surfaces 122a contacting the edge of the substrate G in the process of guiding the substrate G to the alignment position. The inclined surface 122a that contacts the edge of the substrate G during the alignment process of the substrate G as the inclined surface 122a approaches the edge Ge of the substrate G And the substrate G is moved downward (88y). In other words, the inclined surface 122a has a downward outward inclination in which the surface is formed on the outer side from the lower side as compared with the upper side.

The inclined surface 122a of the alignment column 110 may be formed as a groove shape 122 that receives the edge Ge of the substrate G and may be formed as a protrusion 122 on the surface of the alignment column 210, Shaped shape 212a. In any case, as the alignment column 110 moves toward the substrate G, the edge Ge of the substrate G contacts the inclined surfaces 122a and 212a and is guided to the downward direction 88y.

When the inclined surface 122a of the alignment column 110 is formed in the groove shape 122, the flat surface 112b is moved downwardly 88y of the substrate G in the groove 122 on the lower side of the inclined surface 122a, As a stopper. Thus, the substrate G is biased to any one of the alignment pillars 110 or the floating force from the floating stage 120 is formed at a specific portion at a low position, so that the alignment pillars 110 are moved to the first position A1 It is possible to suppress the phenomenon that the bottom surface of the substrate G is locally excessively lowered before it reaches the gripping member 140 and is not gripped by the gripping member 140.

When the substrate G is carried into the predetermined area E of the floating stage 120 as described above, the alignment pillars 110 are moved in the direction in which the alignment pillars 110 face the inside of the substrate G The inclined surface 112a of the alignment column 110 and the edge Ge of the substrate G are brought into contact with each other while the alignment column 110 is further moved toward the first position A1, The substrate G is guided to the horizontal alignment position in accordance with the horizontal movement of the alignment column 110 and at the same time the edge Ge of the substrate G is moved along the inclined surface 112a So that the horizontal position and height of the substrate G can be guided to the correct alignment position while being guided by the alignment height precisely while moving downward 88y. Since the gap Hy between the upper surface of the gripping member 140 and the lower surface of the substrate G is kept very small when the suction pressure is applied to the suction hole 140a of the gripping member 140, The substrate G can be attracted and fixed to the gripping member 140 while the posture of the gripping member 140 is changed within an allowable range.

Hereinafter, a method of transporting a substrate using the floating type substrate coater apparatus 100 according to an embodiment of the present invention will be described in detail.

Step 1 : As shown in FIG. 3A, when the substrate G is carried into the floating stage 120, the plurality of alignment pillars 110 are moved downward by the alignment column moving portion M So that the transfer of the substrate G and the alignment pillars 110 are prevented from interfering with each other. Although the alignment pillars 110 are illustrated as being moved downwardly below the upper surface of the floating stage 120 in the figure, the upper ends of the alignment pillars 110 can be moved downward Lt; / RTI >

The substrate G carried into the lifting stage 120 is separated from the upper surface of the holding member 140 by a sufficient distance H by the lifting force 120a of the lifting stage 120, It is possible to safely enter the floating stage 120 in a state in which the holding member 140 and the substrate G do not collide with each other while being transferred to the holding member 120.

Step 2 : Then, as shown in FIG. 3B, the alignment column 110 is moved upward by the alignment column moving portion M to move the alignment column 110 to a predetermined height of the inclined face 112a of the alignment column 110 Is positioned corresponding to the edge (Ge) of the substrate (G).

Step 3 : Then, as shown in FIG. 3C, the alignment column moving portion M simultaneously moves the plurality of alignment columns 110 toward the substrate G. Then, as shown in FIG. At this time, the moving direction of the alignment column 110 may be guided by the guide slit 122 formed in advance in the floating stage 120.

3C, the substrate G is pushed by the alignment pillars 110 and moves in the horizontal direction to move the gripping member 140 in the horizontal direction, as shown in FIG. 3C. Accordingly, when the alignment pillars 110 reach the predetermined first position A1, To a horizontal alignment position which is supposed to be gripped by the horizontal alignment position. At the same time, the substrate edge Ge which has been in contact with the inclined surface 112a of the alignment column 110 is pressed downward by the inclined surface 112a, and is separated from the gripping member 140 by a wide gap H of 2 mm or more The substrate G is moved downward 88y away from the upper surface of the holding member 140 by a distance Hy within 1 mm in spite of the lifting force 120a.

In other words, the substrate G is moved in the horizontal direction and the height direction, which are supposed to be fixed to the holding member 140, by one operation of moving the alignment column 110 formed with the inclined surface 112a toward the substrate G The alignment position can be reached at one time.

Step 4 : When the substrate G reaches the horizontal alignment position while keeping the upper surface of the substrate G and the gripping member 140 close to 1 mm or less (preferably 500 m or less) by Step 3, The suction pressure 140y is applied to the upper surface of the member 140 so that the substrate G can be integrally fixed to the grasping member 140 as it is at the alignment position without being displaced.

The alignment column 110 is then moved outward by the alignment column moving part M away from the substrate G and downward to a height that does not interfere with the conveyance of the substrate G. [

Step 5 : The gripping member 140 then transports the substrate G while moving in the horizontal direction and moves the slit nozzle 130 while the substrate G passes under the slit nozzle 130. [ (PR) onto the surface of the substrate (G).

The present invention having the above-described structure moves the alignment column 110 having the inclined face 112a formed at the portion contacting the substrate G to the first position A1 defined toward the substrate G, Not only can the substrate G be moved to the horizontal alignment position by being pushed by the alignment column 110 as the substrate G approaches the first position A1 but also the alignment column 110 pushes the substrate G toward the alignment position The edge Ge of the substrate G is downwardly moved downward by the inclined surface 112a of the alignment column 110 to guide the substrate G at an easy height for alignment. G can be guided to the alignment position precisely at a time and the suction force 140y acting on the gripping member 140 allows the gripping member 140 It is possible to obtain an effect that it can be fixed at

As described above, according to the present invention, the substrate G is positively fixed to the gripping member 140 in a precise posture without being jammed by a simpler control method, so that the substrate G is transported together with the movement of the gripping member 140 It is possible to obtain an effect that the step of applying the chemical liquid to the surface of the substrate can be accurately applied only to the predetermined application region of the substrate G. [

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And can be appropriately changed within the scope of the claims.

100: substrate coater apparatus 110: alignment pole
112: groove 112a: inclined surface
112b: flat surface 120: floating stage
130: slit nozzle 140: grip member
G: substrate

Claims (8)

A floating type substrate coater apparatus for coating a surface of a substrate with a chemical liquid while transferring the substrate in a floating state on a floating stage,
A plurality of alignment pillars movably installed to contact the respective sides of the substrate, the alignment pillars being formed with inclined surfaces in contact with the substrate;
Alignment column moving means for moving the alignment column to a predetermined first position when the substrate reaches a predetermined area on the floating stage;
And an edge of the substrate moves downward along the inclined surface in accordance with movement of the alignment column toward the first position.
The method according to claim 1,
Wherein the alignment pillars are vertically movable with respect to the floating stage and are moved downward when the substrate is carried into the floating stage.
The method according to claim 1,
Wherein the inclination of the inclined surface is such that the position and height of the substrate reach the alignment position and the alignment height, respectively, when the alignment column reaches the first position.
The method of claim 3,
Wherein when the alignment column reaches the first position, a suction pressure is applied to a gripping member holding the substrate, and the substrate is fixed to the gripping member.
3. The method of claim 2,
Wherein the bottom surface of the groove is formed as a flat surface so that when the alignment column reaches the first position, the bottom surface of the substrate is aligned with the alignment column Wherein the flat surface serves as a stopper for downward movement of the substrate. ≪ RTI ID = 0.0 > 18. < / RTI >
6. The method according to any one of claims 1 to 5,
Wherein at least one of the sides of the substrate is arranged with two or more alignment pillars.
4. The method according to any one of claims 1 to 3,
Wherein the alignment pillars are formed in one of a circular shape, a flat shape, a rectangular shape, and a " a " shape in cross section.
There is provided a substrate carrying method of a floating type substrate coater apparatus for applying a chemical liquid to a surface of a substrate while transferring the substrate in a floating state on a floating stage,
A substrate supplying step of supplying a substrate to an upper side of a floating stage;
When the substrate is positioned on the floating stage, an alignment column having an inclined surface at a position in contact with the substrate is brought into contact with the four sides of the substrate, and the alignment column is moved to a predetermined position, A substrate guide step of guiding the substrate to be moved to a predetermined height and position;
A substrate fixing step of fixing the substrate to the holding member by applying a suction pressure to the holding member;
A substrate carrying step of carrying the substrate by moving the holding member;
Wherein the substrate carrier is a substrate carrier.
KR1020140130725A 2014-09-30 2014-09-30 Floating coater apparatus with high accuracy of substrate alignment KR20160038245A (en)

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Application Number Priority Date Filing Date Title
KR1020140130725A KR20160038245A (en) 2014-09-30 2014-09-30 Floating coater apparatus with high accuracy of substrate alignment

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Application Number Priority Date Filing Date Title
KR1020140130725A KR20160038245A (en) 2014-09-30 2014-09-30 Floating coater apparatus with high accuracy of substrate alignment

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KR20160038245A true KR20160038245A (en) 2016-04-07

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180017930A (en) * 2016-08-11 2018-02-21 주식회사 케이씨텍 Substrate treating apparatus
CN112133655A (en) * 2016-07-18 2020-12-25 圆益Ips股份有限公司 Alignment module
KR20210023079A (en) * 2019-08-22 2021-03-04 세메스 주식회사 Apparatus for treating substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112133655A (en) * 2016-07-18 2020-12-25 圆益Ips股份有限公司 Alignment module
CN112133655B (en) * 2016-07-18 2024-02-09 圆益Ips股份有限公司 Alignment module
KR20180017930A (en) * 2016-08-11 2018-02-21 주식회사 케이씨텍 Substrate treating apparatus
KR20210023079A (en) * 2019-08-22 2021-03-04 세메스 주식회사 Apparatus for treating substrate

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