KR20150128310A - flux for solder paste, solder paste and manufacturing method of solder bump - Google Patents
flux for solder paste, solder paste and manufacturing method of solder bump Download PDFInfo
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- KR20150128310A KR20150128310A KR1020140055475A KR20140055475A KR20150128310A KR 20150128310 A KR20150128310 A KR 20150128310A KR 1020140055475 A KR1020140055475 A KR 1020140055475A KR 20140055475 A KR20140055475 A KR 20140055475A KR 20150128310 A KR20150128310 A KR 20150128310A
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- triethylene glycol
- solder paste
- solder
- ethylhexanoate
- flux
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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Abstract
Description
The present invention relates to a flux for a solder paste, a solder paste and a method of manufacturing the solder bump.
In the field of integrated circuit technology, a solder bump is formed on a substrate such as a printed circuit board (PCB) and used as an external connection terminal. These solder bumps are generally formed by screen printing using a mask (plate). However, if the screen printing is used, the mask must be printed while being aligned on the substrate, which lowers the productivity and lowers the alignment characteristics of the solder bumps.
A method has been proposed in which a dry film resist having a pattern is formed on a substrate and the solder paste is directly applied to form a solder bump. However, when the solder paste is directly applied to the dry film resist, the dry film resist may be dissolved or swelled by the solder paste, the constituent material of the dry film resist may remain on the substrate, and the substrate may be contaminated.
It is an object of one embodiment of the present invention to provide a method of manufacturing a solder paste flux, a solder paste and a solder bump.
An embodiment of the present invention provides a flux for a solder paste comprising a binder, an activator, a thixotropic agent, a solvent, and a triethylene glycol-based compound.
The triethylene glycol-based compound is preferably selected from the group consisting of triethylene glycol bis (2-ethylhexanoate) and triethylene glycol bis (2-ethylhexanoate) )). ≪ / RTI >
Another embodiment of the present invention provides a solder paste comprising the solder paste flux and the solder powder.
According to another aspect of the present invention, there is provided a method of forming a solder bump using the solder paste, the method including: preparing a substrate; forming a dry film resist having an opening on the substrate Filling the openings with a solder paste, reflowing the solder paste, and developing the dry film.
According to an embodiment of the present invention, there can be provided a flux for a solder paste in which reaction with a dry film resist is suppressed, a solder paste containing the flux, and a method for manufacturing a solder bump using the same.
1 is a flowchart of a method of manufacturing a solder bump according to an embodiment of the present invention.
2A to 2E are cross-sectional views schematically showing steps of a method of manufacturing a solder bump according to an embodiment of the present invention.
3 is a cross-sectional view schematically showing a method for filling a solder bump according to an embodiment of the present invention.
4A and 4B are photographs before the dry film is removed in the process of forming the solder bumps in the production example and the comparative example.
The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity. The elements denoted by the same reference numerals in the drawings are the same elements.
Hereinafter, flux and solder paste for solder paste according to embodiments of the present invention will be described, and then a method for manufacturing solder bumps using the solder paste will be described.
Solder For paste Flux And Solder Paste
A solder paste according to an embodiment of the present invention includes solder powder and flux.
The flux included in the solder paste may be a flux for solder paste according to an embodiment of the present invention described below and the solder paste and flux for solder paste may be applied to the manufacture of a solder bump using a dry film resist .
A variety of solder powders suitable for forming solder bumps can be used as the solder powder. For example, a lead-free solder powder containing tin (Sn) may be used as the solder powder. Lead-free solder powder does not contain lead and can prevent environmental and human impacts.
The solder powder may include at least one of silver (Ag) and copper (Cu) together with tin (Sn) to improve thermal shock resistance and reflow resistance. For example, the solder powder may include 0.1 to 5 wt% of silver (Ag), 0.1 to 1 wt% of copper (Cu), and the balance of tin (Sn) to improve the above characteristics. However, the present invention is not limited thereto, and solder powders having various materials and compositions can be used.
The solder powder may include 85% by weight to 95% by weight based on the total weight of the solder paste, and the flux may be included as a weight percentage of the remainder.
When the solder powder is contained in an amount less than 85% by weight of the total weight of the solder paste, it is difficult to maintain the shape by increasing the flowability of the paste. When the solder powder contains more than 95% by weight of the total weight of the solder paste, May not be enough to wrap the solder powder. However, the content of the solder powder may be adjusted depending on the application, so that the present invention is not limited thereto.
The flux included in the solder paste is a flux for solder paste according to an embodiment of the present invention, including a binder, an activator, a tin agent, a solvent, and a triethylene glycol-based compound.
The triethylene glycol-based compound is preferably selected from the group consisting of triethylene glycol bis (2-ethylhexanoate) and triethylene glycol bis (2-ethylhexanoate) )). ≪ / RTI >
For example, the triethylene glycol-based compound may include triethylene glycol bis (2-ethylhexanoate) or may include derivatives of triethylene glycol bis (2-ethylhexanoate).
Or the triethylene glycol-based compound may include derivatives of triethylene glycol bis (2-ethylhexanoate) and triethylene glycol bis (2-ethylhexanoate).
The triethylene glycol-based compound can inhibit the reaction between the dry film and the solder paste, thereby preventing the solder paste from reacting with the dry film resist during the solder paste printing.
The dry film resist absorbs the solvent contained in the solder paste during the production of the solder bump using the dry film resist, thereby reducing the content of the solvent remaining in the solder paste and increasing the viscosity of the solder paste.
The flux for solder paste according to one embodiment of the present invention is prepared by dissolving triethylene glycol bis (2-ethylhexanoate) and triethylene glycol bis (2-ethylhexanoate) glycol bis (2-ethylhexanoate)), it is possible to prevent dissolution or swelling of the dry film resist due to the solder paste in the printing process of the solder paste And the viscosity change of the solder paste caused by the absorption of the solvent by the dry film resist can be suppressed.
The triethylene glycol-based compound can function as a swelling inhibitor of a dry film resist and a chemical impact inhibitor of a solder paste to a dry film resist upon solder paste printing.
The derivative of triethylene glycol bis (2-ethylhexanoate) is selected from the group consisting of triethylene glycol bisacetate, triethylene glycol bisheptanoate, triethylene glycol bisheptanoate, triethylene glycol bisheptanoate, bisethylene glycol dimethacrylate, bishexanoate, triethylene glycol dinonanoate, triethylene glycol caprate-caprylate, and triethylene glycol bispalmitate. .
In order to prevent the dissolution or swelling of the dry film resist due to the solder paste during solder paste printing and to suppress the viscosity change of the solder paste due to the absorption of the solvent of the dry film resist, the triethylene glycol- 1 to 7% by weight based on the total weight of the paste.
When the triethylene glycol-based compound is contained in an amount of more than 7% by weight based on the total weight of the solder paste, it may be difficult to maintain the shape of the solder after printing due to an increase in the flowability of the paste. However, there is a case in which it is not necessary to maintain the shape of the solder.
The binder may serve to fix the solder powder mixed with the solder flux and to impart a certain level of viscosity and sedimentation stability to the solder paste.
The binder may include one or more of synthetic resin, rosin, fatty acid, and oil. The synthetic resin may include at least one of acrylic, urethane, ester, ether, and epoxy, but is not limited thereto.
But are not limited to, the rosin may be selected from the group consisting of abietic acid, hydrogenated rosin ester, dehydrogenated rosin ester, and acrylated modified rosin Or more. The hydrogenated rosin ester and the hydrogen scavenger rosin ester may be formed by denaturation of the abietic acid, and the acrylated modified rosin may be formed by denaturation of the double bond contained in the rosin.
The binder may be included in an amount of 15 to 55% by weight based on the total weight of the flux for solder paste. When the binder is less than 15 wt%, the settling stability of the solder paste deteriorates and the uniform dispersion of the solder powder is difficult. When the binder is more than 55 wt%, printing of the solder paste is performed by reducing the ratio of the solvent in the flux for the solder paste and the triethylene glycol- And maintaining the thixotropic index (TI index) may be difficult.
The solvent is added to control the viscosity, and the boiling point of the solvent may be 150 ° C or more to prevent the viscosity change due to volatilization during the printing process of the solder paste.
The solvent may include one or more selected from the group consisting of glycol ethers and alcohols. The solvent of the glycol ethers may include, but is not limited to, propylene glycol mono butyl ether, ethylene glycol mono hexyl ether, di-ethylene glycol monohexyl ether, hexyl ether, di-ethylene glycol mono butyl ether, diethylene glycol dibutyl ether, benzyl glycols, ethylene glycol monobenzyl ether, benzyl diglycol Di-Glycol, Diethylene Glycol Monobenzyl Ether), 2-Ethyl Hexyl Di Glycol, Diethylene Glycol Mono 2-Ethylhexyl Ether.
The solvent may be included in an amount of 15 to 45% by weight based on the total weight of the flux for solder paste. When the solvent is contained in an amount less than 15% by weight, the solubility of the binder and the active agent is low, which may cause precipitation of components contained in the flux. When the solvent contains more than 45% by weight, Can melt or swell the dry film resistors, which can cause thickening of the solder paste and damage of the dry film resistors during the printing process.
The activator is added to remove the oxide layer of the metal and solder powder forming the substrate electrode and to prevent reoxidization during the bump formation process. The active agent can comprise, for example, an acid comprising at least one of a carboxylic acid, an anhydrous acid and a hydrogencarbonate.
The activator may comprise from 1.5 to 10% by weight based on the total weight of the flux for solder paste. When the active agent is contained in an amount of less than 1.5% by weight, bump formation is not smooth due to difficulty in removal of the oxidized layer of the solder powder and surface oxidation of the substrate electrode metal and prevention of reoxidation, and when the active agent is contained in an amount exceeding 10% There is a problem that the content of the solvent required for dissolution increases. When the active agent is contained in an amount exceeding 10% by weight, the content of the solvent contained in the flux for solder paste for dissolving the active agent increases, and in this case, the increase of the solvent content causes the dissolution and swelling of the dry film resist .
The activator may include at least one of a halogen-based compound containing a halogen element and a non-halogen-based compound containing no halogen element. For example, the activator may include both a halogen-based compound and a non-halogen-based compound.
The halogen-based compound has higher activity than a non-halogen-based compound, and is used for removing an oxide layer of a metal and a solder powder that forms a substrate electrode in an initial reflow process for bump formation. The halogen-based compound may include at least one of a halogen-based carboxylic acid, a halogen-based anhydrous acid, and a halogen-based hydrogencarbonate, though not limited thereto.
For example, the halogen compound may be DL-2-bromopropionic acid, 2,3-dibromopropionic acid, 2-bromo-2-methyl (2-bromo-2-methylpropionic acid), meso-2,3-dibromosuccinic acid, DL-2-bromohexanoic acid, N, N'-Diphenylguanidine Hydrobromide, Cyclohexylamine hydrobromide, Diethylamine hydrochloride, Triethanolamine hydrobromide, N, N'-diphenylguanidine hydrobromide, And monoethanolamine hydrobromide. [0033] The term " monoethanolamine "
The non-halogenated compound has lower activity than the halogen-based compound and is used for the purpose of preventing the reoxidation of the metal and the solder powder forming the substrate electrode in the mid and later stages of the reflow process for bump formation. The non-halogenated compound may include at least one of a carboxylic acid, an anhydrous acid and a hydrogencarbonate which does not contain a halogen element, but is not limited thereto.
For example, the non-halogenated compound may be a malonic acid, succinic acid, maleic acid, glutaric acid, suberic acid, adipic acid, adipic acid, sebacic acid, and the like.
The weight ratio of the halogen-based compound and the non-halogen-based compound in the activator is preferably 1: 1 or more, more preferably 1: 1 or less, in the active agent in order to efficiently remove the oxidation layer of the metal forming the substrate electrode during the bump formation process, 1 to 1: 5.
The thixotropic agent is used for the purpose of rolling necessary to smoothly print the solder paste on the dry film resist in order to improve the printability of the solder paste. The thixotropic index (TI index) Can be increased.
For example, the thixotropic agent may include one or more of amide wax, hydrogenated castor wax, and hydrogenated castor oil.
The thixotropic agent may be contained in an amount of 2 to 10% by weight based on the total weight of the flux for solder paste. If the content of the tin agent is less than 2% by weight, the minimum TI index for securing the rolling property of the solder paste can not be ensured and unprinted bumps may occur. If the tin agent contains more than 10% by weight, The content of the solvent required for dissolving the tin scavenger in the flux increases, and when the solvent is increased, the dissolution and swelling of the dry film resist may be caused, thereby increasing the viscosity of the solder paste during the printing process or rendering the printing property difficult.
The flux for solder paste of the present invention may further include other additives such as a dispersing agent. The dispersant may be added so that various materials in the flux for solder paste are evenly dispersed. The dispersant may include, but is not limited to, sodium dioctyl sulfosuccinate.
Solder Bumpy Manufacturing method
FIG. 1 is a flow chart of a method of manufacturing a solder bump according to an embodiment of the present invention, and FIGS. 2A to 2E are cross-sectional views schematically showing steps of a method of manufacturing a solder bump according to an embodiment of the present invention.
Referring to FIG. 1, a method of manufacturing a solder bump according to an embodiment of the present invention includes a step S1 of preparing a substrate, a step S2 of forming a dry film resist having openings on the market, (S3) filling the solder paste, reflowing the solder paste (S4), and removing the dry film resist (S5).
In step S1 of preparing the substrate, as shown in Fig. 2A, a
In the step S2 of forming the dry film resist, a dry film resist 40 having an opening is formed as shown in Fig. 2B. The dry film resist 40 may include at least one of an acrylic material, a polyurethane, a polyester, a polyether, and a polymer derived from a bisphenol A or F structure. For example, acrylic materials may be acrylic acid-based polyfunctional monomers and oligomers. However, the present invention is not limited thereto, and a dry film composed of various materials may be used.
The openings of the dry film resist can be formed by exposing and developing a
2C, the
In the step S4 of reflowing the solder paste, as shown in Fig. 2D, the solder paste disposed in the opening portion is reflowed to form the
Next, step (S5) of removing the dry film resist is performed by removing the dry film resist 40 as shown in Fig. 2E. The dry film resist 40 may be removed by contact with a specific solvent suitable for removal of the dry film resist 40. The dry film resist 40 is removed by contacting the
The dry film resist 40 may include at least one of an acrylic material, a polyurethane, a polyester, a polyether, and a polymer derived from a bisphenol A or F structure. A filler (SiO 2 filler, glass fiber, etc.).
As in the case of the solder bump manufacturing method according to the embodiment of the present invention, when the solder paste is directly printed on the substrate without a mask different from the screen printing, the printing speed and the printing accuracy can be improved. In addition, the alignment property of the solder paste is improved and the stability can be improved. Further, according to the method of manufacturing a solder bump according to an embodiment of the present invention, productivity of a solder bump can be improved, a cost can be reduced, and a solder bump having a finer size than a conventional one can easily be formed.
However, since the solder paste is applied directly in contact with the dry film resist, the solder paste can dissolve or swell the dry film resist or react with the dry film resist. In addition, when the solder paste dissolves or swells the dry film, the viscosity of the solder paste may gradually increase in the printing process.
However, the solder paste applied to the solder bump manufacturing method according to one embodiment of the present invention is a solder paste according to the above-described embodiment of the present invention in which triethylene glycol bis (2-ethylhexanoate) 2-ethylhexanoate), and derivatives of triethylene glycol bis (2-ethylhexanoate). Examples of triethylene glycol-based compounds containing at least one selected from the group consisting of One problem can be solved.
The detailed description of the solder paste applied to the method of manufacturing the solder bump according to the embodiment of the present invention will be omitted because it is the same as the description of the solder paste described above.
Manufacturing example
40 parts by weight of dehydrogenated rosin ester, 2.5 parts by weight of 2,3-dibromopropionic acid, 2.5 parts by weight of adipic acid, , 30 parts by weight of triethylene glycol bis (2-ethylhexanoate) and 5 parts by weight of hydrogenated castor wax were mixed and stirred to prepare a flux for solder paste .
Next, 110 g of flux for solder paste and 890 g of SAC 305 (solder powder) were mixed with a planetary mixer to prepare a solder paste.
Next, a substrate on which a dry film resist is formed is prepared according to an embodiment of the present invention, and a solder paste is filled to connect with the pad of the substrate using a blue stencil printing (BSP) method, The solder bumps were manufactured through the stripping and the degassing process of the dry film resist.
Comparative Example
40 parts by weight of dehydrogenated rosin ester, 2.5 parts by weight of 2,3-dibromopropionic acid, 2.5 parts by weight of adipic acid, DBDG), 30 parts by weight of dioctyl sebacate (DOS) and 5 parts by weight of hydrogenated castor wax were prepared.
Next, 110 g of flux for solder paste of comparative example and 890 g of SAC 305 (solder powder) were mixed with a flange mixer to prepare a solder paste.
Next, a substrate having a dry film resist formed thereon was prepared as described in Production Example, and a blue stencil printing (BSP) method was used to fill the solder paste so as to be connected to the pad of the substrate, and reflow was performed at 30 to 270 ° C After the dry film resist was peeled and degreased, a final solder bump was produced.
4A and 4B show photographs before the dry film resist is removed after the solder paste is applied in the process of forming the solder bumps in the production example and the comparative example. 4A is a photograph of a production example, and FIG. 4B is a photograph of a comparative example.
4A and 4B, it can be confirmed that the amount of solder paste remaining in the dry film resist after printing of the solder paste is small in the production example. In addition, in the comparative example, the dry film resist and the solder paste reacted with each other to cause unevenness around the openings, while in the production example, almost no unevenness was found.
In addition, since the influence of the solder paste remaining on the dry film resist increases as the size of the opening decreases, the application of the solder paste according to one embodiment of the present invention may be more effective in forming a fine bump.
When the solder bumps are formed by using the flux for solder paste and the solder paste according to an embodiment of the present invention, increase in the viscosity of the solder paste can be suppressed even in repetitive printing, and the solder paste remaining in the dry film resist It is possible to produce more bumps even if the same amount of solder paste is applied.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the invention. It will be obvious to those of ordinary skill in the art.
10: substrate
20: Pad
30: Insulation layer
40: dry film resist
50: Solder paste
60: Bump
70: squeegee
Claims (16)
Examples of the derivatives of the triethylene glycol bis (2-ethylhexanoate) include triethylene glycol bisacetate, triethylene glycol bisheptanoate, triethylene glycol bisheptanoate, Triethylene glycol diisocyanate, triethylene glycol bishexanoate, triethylene glycol dinonanoate, triethylene glycol caprate-caprylate and triethylene glycol dipentaerythritol triacrylate. bispalmitate). < / RTI >
Wherein the solvent has a boiling point of at least 150 ° C.
Wherein the solvent comprises at least one selected from the group consisting of glycol ethers and alcohols.
Wherein the binder comprises 15 to 55 wt% based on the total weight of the flux for solder paste.
Wherein the activator comprises an acid comprising at least one of a carboxylic acid, an anhydrous acid and a hydrogencarbonate.
Wherein the activator comprises from 1.5 to 10% by weight based on the total weight of the flux for solder paste.
Wherein the thixifying agent comprises at least one of amide wax, hydrogenated castor wax, and hydrogenated castor oil.
Wherein the thixotropic agent comprises 2 to 10% by weight based on the total weight of the flux for solder paste.
Solder powder; ≪ / RTI >
Wherein the triethylene glycol-based compound is contained in an amount of 1 to 7 wt% based on the total weight of the solder paste.
Examples of the derivatives of the triethylene glycol bis (2-ethylhexanoate) include triethylene glycol bisacetate, triethylene glycol bisheptanoate, triethylene glycol bisheptanoate, Triethylene glycol diisocyanate, triethylene glycol bishexanoate, triethylene glycol dinonanoate, triethylene glycol caprate-caprylate and triethylene glycol dipentaerythritol triacrylate. bispalmitate). < / RTI >
Forming a dry film resist having an opening on the substrate;
Filling the openings with a solder paste;
Reflowing the solder paste; And
Removing the dry film resist; Lt; / RTI >
Wherein the solder paste comprises a flux and a solder powder including a binder, an activator, a tin agent, a solvent, and a triethylene glycol-based compound,
The triethylene glycol-based compound is preferably selected from the group consisting of triethylene glycol bis (2-ethylhexanoate) and triethylene glycol bis (2-ethylhexanoate) )). ≪ / RTI >< RTI ID = 0.0 > 11. < / RTI >
Wherein the triethylene glycol-based compound is contained in an amount of 1 to 7 wt% based on the total weight of the solder paste.
Examples of the derivatives of the triethylene glycol bis (2-ethylhexanoate) include triethylene glycol bisacetate, triethylene glycol bisheptanoate, triethylene glycol bisheptanoate, Triethylene glycol diisocyanate, triethylene glycol bishexanoate, triethylene glycol dinonanoate, triethylene glycol caprate-caprylate and triethylene glycol dipentaerythritol triacrylate. bispalmitate). < / RTI >
Wherein filling the openings with the solder paste is performed by a blue stencil printing (BSP) method.
Priority Applications (2)
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KR1020140055475A KR20150128310A (en) | 2014-05-09 | 2014-05-09 | flux for solder paste, solder paste and manufacturing method of solder bump |
JP2014146690A JP2015213956A (en) | 2014-05-09 | 2014-07-17 | Flux for solder paste, solder paste and solder bump manufacturing method |
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KR1020140055475A KR20150128310A (en) | 2014-05-09 | 2014-05-09 | flux for solder paste, solder paste and manufacturing method of solder bump |
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KR1020140055475A KR20150128310A (en) | 2014-05-09 | 2014-05-09 | flux for solder paste, solder paste and manufacturing method of solder bump |
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JP6643692B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste |
JP6643693B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste |
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JPH05185283A (en) * | 1991-11-05 | 1993-07-27 | Metsuku Kk | Flux for soldering and cream solder |
JP3556922B2 (en) * | 2001-05-07 | 2004-08-25 | 富士通株式会社 | Bump forming method |
JP4790330B2 (en) * | 2005-06-22 | 2011-10-12 | 東亜ディーケーケー株式会社 | Gas concentration measuring device |
JP4249164B2 (en) * | 2005-08-11 | 2009-04-02 | ハリマ化成株式会社 | Solder paste composition |
JP4385061B2 (en) * | 2006-08-28 | 2009-12-16 | ハリマ化成株式会社 | Solder paste composition and use thereof |
JP5289328B2 (en) * | 2007-01-04 | 2013-09-11 | フライズ・メタルズ・インコーポレイテッド | Flux formulation |
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2014
- 2014-05-09 KR KR1020140055475A patent/KR20150128310A/en not_active Application Discontinuation
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